CMOS Static RAM 1 Meg (64K x 16-Bit) Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT71016 Description 64K x 16 advanced high-speed CMOS Static RAM Equal access and cycle times – Commercial and Industrial: 12/15/20ns One Chip Select plus one Output Enable pin Bidirectional data inputs and outputs directly TTLcompatible Low power consumption via chip deselect Upper and Lower Byte Enable Pins Commercial and industrial product available in 44-pin Plastic SOJ package and 44-pin TSOP package The IDT71016 is a 1,048,576-bit high-speed Static RAM organized as 64K x 16. It is fabricated using IDT’s high-perfomance, high-reliability CMOS technology. This state-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high-speed memory needs. The IDT71016 has an output enable pin which operates as fast as 7ns, with address access times as fast as 12ns. All bidirectional inputs and outputs of the IDT71016 are TTL-compatible and operation is from a single 5V supply. Fully static asynchronous circuitry is used, requiring no clocks or refresh for operation. The IDT71016 is packaged in a JEDEC standard 44-pin Plastic SOJ and 44-pin TSOP Type II. Functional Block Diagram OE A0 - A15 Output Enable Buffer Address Buffers Row / Column Decoders I/O 15 CS 8 Chip Enable Buffer High Byte I/O Buffer , 8 I/O 8 WE Write Enable Buffer 16 64K x 16 Memory Array Sense Amps and Write Drivers I/O 7 8 Low Byte I/O Buffer 8 I/O 0 BHE Byte Enable Buffers BLE 3210 drw 01 JANUARY 2004 1 ©2004 Integrated Device Technology, Inc. DSC-3210/8 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Pin Configurations Pin Descriptions A0 - A15 Address Inputs Input A4 1 44 A5 CS Chip Select Input A3 2 43 A6 A2 3 A7 WE Write Enable Input 42 A1 4 41 OE OE Output Enable Input A0 5 40 BHE BHE High Byte Enable Input CS 6 39 BLE I/O 0 7 38 I/O 15 BLE Low Byte Enable Input I/O 1 8 37 I/O 14 I/O0 - I/O15 Data Input/Output I/O I/O 2 9 36 I/O 13 VCC 5.0V Power Pwr I/O 3 10 35 I/O 12 VCC 11 SO44-1 34 VSS VSS Ground Gnd VSS 12 SO44-2 33 VCC I/O 4 13 32 I/O 11 I/O 5 14 31 I/O 10 I/O 6 15 30 I/O 9 I/O 7 16 29 I/O 8 WE 17 28 NC A15 18 27 A8 A14 19 26 A9 A13 20 25 A10 A12 21 24 A11 NC 22 23 NC SOJ/TSOP Top View 3210 tbl 01 , 3210 drw 02 Truth Table (1) CS OE WE BLE BHE I/O0 - I/O7 I/O8 - I/O15 Function H X X X X High-Z High-Z Deselected - Standby L L H L H DATAOUT High-Z Low Byte Read L L H H L High-Z DATAOUT High Byte Read L L H L L DATAOUT DATAOUT` Word Read L X L L L DATAIN DATAIN Word Write L X L L H DATAIN High-Z Low Byte Write L X L H L High-Z DATAIN High Byte Write L H H X X High-Z High-Z Outputs Disabled L X X H H High-Z High-Z Outputs Disabled 3210 tbl 02 NOTE: 1. H = VIH, L = VIL, X = Don't care. 6.42 2 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Absolute Maximum Ratings(1) Symbol Rating Value Unit V VTERM (2) Terminal Voltage with Respect to GND -0.5 to +7.0 TA Operating Temperature 0 to +70 o Recommended Operating Temperature and Supply Voltage C TBIAS Temperature Under Bias -55 to +125 o TSTG Storage Temperature -55 to +125 o PT Power Dissipation 1.25 W IOUT DC Output Current 50 mA Grade Temperature GND VCC Commercial 0°C to +70°C 0V 5.0V ± 10% Industrial –40°C to +85°C 0V 5.0V ± 10% 3210 tbl 04 C Recommended DC Operating Conditions C Symbol Parameter Min. Typ. Max. Unit 4.5 5.0 5.5 V 0 0 0 V VCC Supply Voltage GND Ground VIH Input High Voltage 2.2 ____ VDD +0.5 V VIL Input Low Voltage -0.5(1) ____ 0.8 V 3210 tbl 03 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VCC + 0.5V. 3210 tbl 05 NOTE: 1. VIL (min.) = –1.5V for pulse width less than tRC/2, once per cycle. Capacitance (TA = +25° C, f = 1.0MHz, SOJ Package) Parameter(1) Symbol CIN Input Capacitance CI/O I/O Capacitance Conditions Max. Unit VIN = 3dV 6 pF VOUT = 3dV 7 pF 3210 tbl 06 NOTE: 1. This parameter is guaranteed by device characterization, but not production tested. DC Electrical Characteristics (VCC = 5.0V ± 10%, Commercial and Industrial Temperature Range) Symbol |ILI| |ILO| Parameter Test Conditions Min. Max. Unit Input Leakage Current VCC = Max., VIN = GND to VCC ___ 5 µA Output Leakage Current VCC = Max., CS = VIH, VOUT = GND to VCC ___ 5 µA 0.4 V ___ V VOL Output Low Voltage IOL = 8mA, VCC = Min. ___ VOH Output High Voltage IOH = -4mA, VCC = Min. 2.4 3210 tbl 07 DC Electrical Characteristics(1) (VCC = 5.0V ± 10%, VLC = 0.2V, VHC = VCC–0.2V) 71016S12 Symbol Parameter 71016S15 71016S20 Com'l. Ind. Com'l. Ind. Com'l. Ind. Unit ICC Dynamic Operating Current CS < VIL, Outputs Open, V CC = Max., f = fMAX(2) 210 210 180 180 170 170 mA ISB Standby Power Supply Current (TTL Level) CS > VIH, Outputs Open, V CC = Max., F = fMAX(2) 60 60 50 50 45 45 mA ISB1 Standby Power Supply Current (CMOS Level) CS > VHC, Outputs Open, VCC = Max., f = 0(2) VIN < VLC or VIN > VHC 10 10 10 10 10 10 mA NOTES: 1. All values are maximum guaranteed values. 2. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing . 6.42 3 3210 tbl 08 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges AC Test Conditions Input Pulse Levels GND to 3.0V Input Rise/Fall Times 1.5ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V AC Test Load See Figure 1, 2 and 3 3210 tbl 09 AC Test Loads 5V 5V 480Ω 480Ω DATA OUT 30pF* DATA OUT 255Ω 5pF* 255Ω , 3210 drw 03 3210 drw 04 *Including jig and scope capacitance. Figure 2. AC Test Load (for tCLZ, tOLZ, tCHZ, tOHZ , tOW, and tWHZ) Figure 1. AC Test Load 7 • 6 ∆tAA, tACS (Typical, ns) 5 4 • 3 • 2 • 1 • • • , 8 20 40 60 80 100 120 140 160 180 200 CAPACITANCE (pF) Figure 3. Output Capacitive Derating 6.42 4 3210 drw 05 , IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges AC Electrical Characteristics (VCC = 5.0V ± 10%, Commercial and Industrial Range) 71016S12 Symbol Parameter 71016S15 71016S20 Min. Max. Min. Max. Min. Max. Unit Read Cycle Time 12 ____ 15 ____ 20 ____ ns Address Access Time ____ 12 ____ 15 ____ 20 ns Chip Select Access Time ____ 12 ____ 15 ____ 20 ns 5 ____ 5 ____ ns 6 ____ 8 ns 10 ns READ CYCLE tRC tAA tACS (1) Chip Select Low to Output in Low-Z 4 ____ tCHZ(1) Chip Select High to Output in High-Z ____ 6 ____ tOE Output Enable Low to Output Valid ____ 7 ____ 8 ____ tOLZ (1) Output Enable Low to Output in Low-Z 0 ____ 0 ____ 0 ____ ns tOHZ (1) Output Enable High to Output in High-Z ____ 6 ____ 6 ____ 8 ns tOH Output Hold from Address Change 4 ____ 4 ____ 5 ____ ns tBE Byte Enable Low to Output Valid ____ 7 ____ 8 ____ 10 ns tBLZ(1) Byte Enable Low to Output in Low-Z 0 ____ 0 ____ 0 ____ ns tBHZ(1) Byte Enable High to Output in High-Z ____ 6 ____ 6 ____ 8 ns Write Cycle Time 12 ____ 15 ____ 20 ____ ns 9 ____ 10 ____ 12 ____ ns 9 ____ 10 ____ 12 ____ ns 10 ____ 12 ____ ns tCLZ WRITE CYCLE tWC tAW Address Valid to End of Write Chip Select Low to End of Write tCW tBW Byte Enable Low to End of Write 9 ____ tAS Address Set-up Time 0 ____ 0 ____ 0 ____ ns tWR Address Hold from End of Write 0 ____ 0 ____ 0 ____ ns tWP Write Pulse Width 9 ____ 10 ____ 12 ____ ns tDW Data Valid to End of Write 7 ____ 8 ____ 10 ____ ns 0 ____ 0 ____ 0 ____ ns 1 ____ 1 ____ ns ____ 6 ____ 8 ns Data Hold Time tDH (1) tOW Write Enable High to Output in Low-Z 1 ____ tWHZ(1) Write Enable Low to Output in High-Z ____ 6 3210 tbl 10 NOTE: 1. This parameter is guaranteed with the AC Load (Figure 2) by device characterization, but is not production tested. Timing Waveform of Read Cycle No. 1(1,2,3) tRC ADDRESS tAA tOH DATAOUT tOH DATAOUT VALID PREVIOUS DATAOUT VALID 3210 drw 06 NOTES: 1. WE is HIGH for Read Cycle. 2. Device is continuously selected, CS is LOW. 3. OE, BHE, and BLE are LOW. 6.42 5 , IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Timing Waveform of Read Cycle No. 2(1) tRC ADDRESS tAA tOH OE tOE tOLZ CS tCLZ (3) tOHZ , (3) (3) tACS (2) tCHZ (3) BHE, BLE (2) tBE tBLZ tBHZ (3) DATAOUT (3) DATA OUT VALID 3210 drw 07 NOTES: 1. WE is HIGH for Read Cycle. 2. Address must be valid prior to or coincident with the later of CS, BHE, or BLE transition LOW; otherwise tAA is the limiting parameter. 3. Transition is measured ±200mV from steady state. Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,2,4) tWC ADDRESS tAW CS tCW (2) tCHZ (5) tBW BHE , BLE tWR WE tAS tWHZ DATAOUT tBHZ (5) tWP PREVIOUS DATA VALID (5) tOW (3) (5) DATA VALID tDW DATAIN , tDH DATAIN VALID 3210 drw 08 NOTES: 1. A write occurs during the overlap of a LOW CS, LOW BHE or BLE, and a LOW WE. 2. OE is continuously HIGH. If during a WE controlled write cycle OE is LOW, tWP must be greater than or equal to t WHZ + tDW to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is as short as the specified tWP. 3. During this period, I/O pins are in the output state, and input signals must not be applied. 4. If the CS LOW or BHE and BLE LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state. 5. Transition is measured ±200mV from steady state. 6.42 6 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1,4) tWC ADDRESS tAW CS tCW (2) tAS tBW BHE , BLE tWP tWR WE , DATAOUT tDH tDW DATAIN DATAIN VALID 3210 drw 9 Timing Waveform of Write Cycle No. 3 (BHE, BLE Controlled Timing)(1,4) tWC ADDRESS tAW CS tAS tCW (2) tBW BHE , BLE tWP tWR WE DATAOUT tDW DATAIN tDH DATAIN VALID 3210 drw 10 , NOTES: 1. A write occurs during the overlap of a LOW CS, LOW BHE or BLE, and a LOW WE. 2. OE is continuously HIGH. If during a WE controlled write cycle OE is LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is as short as the specified tWP. 3. During this period, I/O pins are in the output state, and input signals must not be applied. 4. If the CS LOW or BHE and BLE LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state. 5. Transition is measured ±200mV from steady state. 6.42 7 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Ordering Information IDT 71016 Device Type S XX XXX Power Speed Package X X Process/ Temperature Range Blank I Commercial (0°C to +70°C) Industrial (-40°C to +85°C) G Restricted hazardous substance device. Y PH 400-mil SOJ (SO44-1) 400-mil TSOP Type II (SO44-2) 12 15 20 Speed in nanoseconds 3210 drw 11 6.42 8 IDT71016, CMOS Static RAM 1 Meg (64K x 16-bit) Commercial and Industrial Temperature Ranges Datasheet Document History 7/30/99 8/5/99 Pg. 3 Pg. 5 Pg. 6 Pg. 7 Pg. 8 8/13/99 9/30/99 08/09/00 02/01/01 01/30/04 Pg. 9 Pg. 3, 5, 8 Pg. 8 Updated to new format Expressed commercial and industrial ranges on DC Electrical table Removed Icc, ISB, and ISB1 values for S12 industrial speed Expressed commercial and industrial ranges on AC Electrical table Changed footnote #2 to commercial temperature only Revised footnotes on Write Cycle No. 1 diagram Revised footnotes on Write Cycle No. 2 and No. 3 diagrams Removed SCD 2752 footnote Added commercial only for 12ns speed Added Datasheet Document History Added 12ns industrial temperature speed grade offering Not recommended for new designs Removed "Not recommended for new designs" Added "Restricted hazardous substance device" to order information. CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. 6.42 9 for Tech Support: [email protected] 800-544-7726