TECHNICAL DATA IW4050B Hex Buffer/Converter High-Voltage Silicon-Gate CMOS The IW4050B is noninverting hex buffers and feature logic-level conversion using only one supply (voltage (VCC). The input-signal high level (VIH) can exceed the VCC supply voltage when these devices are used for logic-level conversions. These devices are intended for use as CMOS to DTL/TTL converters. • Operating Voltage Range: 3.0 to 18 V • Maximum input current of 1 μA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C • Noise margin (over full package temperature range): 1.0 V min @ 5.0 V supply 2.0 V min @ 10.0 V supply 2.5 V min @ 15.0 V supply • High-to-low level conversion ORDERING INFORMATION IW4050BN Plastic IW4050BD SOIC TA = -55° to 125° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT NC = NO CONNECTION FUNCTION TABLE PINS 13, 16 = NO CONNECTION PIN 1 =VCC PIN 8 = GND Inputs Output A Y L L H H Rev. 00 IW4050B MAXIMUM RATINGS* Symbol VCC VIN VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) Value Unit -0.5 to +20 V VCC** to +18 V -0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±10 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW PD Power Dissipation per Output Transistor 100 mW -65 to +150 °C 260 °C Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C ** The IW4050B has high-to-low level voltage conversion capability but not low-to-high level; therefore it is recommended that VIN ≥ VCC RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) Operating Temperature, All Package Types Min Max Unit 3.0 18 V VCC** 18 V 0 VCC V -55 +125 °C ** The IW4050B has high-to-low level voltage conversion capability but not low-to-high level; therefore it is recommended that VIN ≥ VCC This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IW4050B DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Guaranteed Limit V ≥-55°C 25°C ≤125 °C Unit VOUT= VCC - 0.5V VOUT= VCC - 1.0 V VOUT= VCC - 1.5V 5.0 10 15 3.5 7 11 3.5 7 11 3.5 7 11 V Maximum Low Level Input Voltage VOUT= 0.5V VOUT= 1.0 V VOUT= 1.5V 5.0 10 15 1.5 3 4 1.5 3 4 1.5 3 4 V VOH Minimum High-Level Output Voltage VIN= VCC 5.0 10 15 4.95 9.95 14.95 4.95 9.95 14.95 4.95 9.95 14.95 V VOL Maximum Low-Level Output Voltage VIN=GND 5.0 10 15 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 V IIN Maximum Input Leakage Current VIN= GND or VCC 18 ±0.1 ±0.1 ±1.0 μA ICC Maximum Quiescent Supply Current (per Package) VIN= GND or VCC 5.0 10 15 20 1 2 4 20 1 2 4 20 30 60 120 600 μA IOL Minimum Output Low (Sink) Current VIN= GND or VCC UOL=0.4 V UOL=0.4 V UOL=0.5 V UOL=1.5 V 4.5 5 10 15 3.3 4 10 26 2.6 3.2 8 24 1.8 2.4 5.6 18 Minimum Output VIN= GND or VCC High (Source) Current UOH=2.5 V UOH=4.6 V UOH=9.5 V UOH=13.5 V 5.0 5.0 10 15 -2.6 -0.81 -2.0 -5.2 -2.1 -0.65 -1.65 -4.3 -1.55 -0.48 -1.18 -3.1 Symbol Parameter VIH Minimum High-Level Input Voltage VIL IOH Test Conditions mA mA Rev. 00 IW4050B AC ELECTRICAL CHARACTERISTICS (CL=50pF, RL=200kΩ, Input tr=tf=20 ns) VIN VCC Guaranteed Limit Symbol Parameter V V ≥-55°C 25°C ≤125°C Unit tPLH Maximum Propagation Delay, Input A to Output Y (Figure 1) 5 10 10 15 15 5 10 5 15 5 140 80 90 60 80 140 80 90 60 80 280 160 180 120 160 ns tPHL Maximum Propagation Delay, Input A to Output Y (Figure 1) 5 10 10 15 15 5 10 5 15 5 110 55 100 30 100 110 55 100 30 100 220 110 200 60 200 ns tTLH Maximum Output Transition Time, Any Output (Figure 1) 5 10 15 5 10 15 160 80 60 160 80 60 320 160 120 ns tTHL Maximum Output Transition Time, Any Output (Figure 1) 5 10 15 5 10 15 60 40 30 60 40 30 120 80 60 ns CIN Maximum Input Capacitance - - 7.5 pF Figure 1. Switching Waveforms EXPANDED LOGIC DIAGRAM (1/6 of the Device) Rev. 00 IW4050B N SUFFIX PLASTIC (MS - 001BB) A 9 16 Dimensions, mm B 1 8 F C -T- SEATING PLANE N K M J H D MIN MAX A 18.67 19.69 B 6.10 7.11 C L G Symbol 0.25 (0.010) M T NOTES: 1. imensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. 5.33 D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.20 0.36 N 0.38 D SUFFIX SOIC (MS - 012AC) A 16 9 H Dimensions, mm B 1 G P 8 R x 45 C -TK D SEATING PLANE J F 0.25 (0.010) M T C M NOTES: 1.Dimensions A and B do not include mold flash or protrusion. 2.Maximum mold flash or protrusion 0.15 mm (0.006) per side for A, for B - 0.25 mm (0.010) per side. M Symbol. MIN MAX A 9.80 10.0 B 3.80 4.00 C 1.35 1.75 D 0.33 0.51 F 0.40 1.27 G 1.27 H 5.72 J 0° 8° K 0.10 0.25 M 0.19 0.25 P 5.80 6.20 R 0.25 0.50 Rev. 00