CD74HC147, CD74HCT147 Data sheet acquired from Harris Semiconductor SCHS149 High Speed CMOS Logic 10-to-4 Line Priority Encoder September 1997 [ /Title (CD74 HC147 , CD74 HCT14 7) /Subject (High Speed CMOS Logic 10-to-4 Line Priority Encode r) /Autho r () /Keywords (High Speed CMOS Logic 10-to-4 Line Priority Encode r, High Speed CMOS Logic 10-to-4 Line Priority Features Description • Buffered Inputs and Outputs The Harris CD74HC147and CD74HCT147 are high speed silicon-gate CMOS devices and are pin-compatible with low power Schottky TTL (LSTTL). • Typical Propagation Delay: 13ns at VCC = 5V, CL = 15pF, TA = 25oC The CD74HC147 and CD74HCT147 9-input priority encoders accept data from nine active LOW inputs (l1 to l9) and provide binary representation on the four active LOW inputs (Y0 to Y3). A priority is assigned to each input so that when two or more inputs are simultaneously active, the input with the highest priority is represented on the output, with input line l9 having the highest priority. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times These devices provide the 10-line to 4-line priority encoding function by use of the implied decimal “zero”. The “zero” is encoded when all nine data inputs are HIGH, forcing all four outputs HIGH. • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V Ordering Information • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH PART NUMBER TEMP. RANGE (oC) PKG. NO. PACKAGE CD74HC147E -55 to 125 16 Ld PDIP E16.3 CD74HCT147E -55 to 125 16 Ld PDIP E16.3 CD74HC147M -55 to 125 16 Ld SOIC M16.15 CD74HCT147M -55 to 125 16 Ld SOIC M16.15 NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer or die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. Pinout CD74HC147, CD74HCT147 (PDIP, SOIC) TOP VIEW I4 1 16 VCC I5 2 15 NC I6 3 14 Y3 I7 4 13 I3 I8 5 12 I2 Y2 6 11 I1 Y1 7 10 I9 9 Y0 GND 8 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation 1997 1 File Number 1773.1 CD74HC147, CD74HCT147 Functional Diagram I1 11 9 12 Y0 I2 13 I3 7 1 Y1 I4 2 I5 6 3 I6 Y2 4 I7 14 5 I8 Y3 10 I9 GND = 8 VCC = 16 TRUTH TABLE INPUTS OUTPUTS I1 I2 I3 I4 I5 I6 I7 I8 I9 Y3 Y2 Y1 Y0 H H H H H H H H H H H H H X X X X X X X X L L H H L X X X X X X X L H L H H H X X X X X X L H H H L L L X X X X X L H H H H L L H X X X X L H H H H H L H L X X X L H H H H H H L H H X X L H H H H H H H H L L X L H H H H H H H H H L H L H H H H H H H H H H H L NOTE: H = High Logic Level, L = Low Logic Level, X = Don’t Care 2 CD74HC147, CD74HCT147 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 3) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θJA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD74HC147, CD74HCT147 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER VCC (V) 25oC -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS I1, I2, I3, I6, I7 1.1 I4, I5, I8, I9 1.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 160 - 200 - 240 ns 4.5 - - 32 - 40 - 48 ns 5 - 13 - - - - - ns 6 - - 27 - 34 - 41 ns 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns - - - 10 - 10 - 10 pF HC TYPES Propagation Delay, Input to Output (Figure 1) Transition Times (Figure 1) Input Capacitance tTLH, tTHL CIN CL = 50pF - 4 CD74HC147, CD74HCT147 Switching Specifications Input tr, tf = 6ns (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CPD - 5 - 32 - - - - - pF Propagation Delay, Input to Output (Figure 2) tPLH, tPHL CL = 50pF 4.5 - - 35 - 44 - 53 ns 5 - 14 - - - - - ns Transition Times (Figure 2) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns Input Capacitance CIN - - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 4, 5) CPD - 5 - 42 - - - - - pF PARAMETER Power Dissipation Capacitance (Notes 4, 5) HCT TYPES NOTES: 4. CPD is used to determine the dynamic power consumption, per gate. 5. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC 90% 50% 10% tTLH 90% 1.3V 10% INVERTING OUTPUT tPLH tPHL FIGURE 6. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 7. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated