HSMC HE8050 Npn epitaxial planar transistor Datasheet

HI-SINCERITY
Spec. No. : HE6112
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 1/3
MICROELECTRONICS CORP.
HE8050
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HE8050 is designed for use in 2W output amplifier of portable
radios in class B push-pull operation.
Features
• High total power dissipation (PT: 2W, TC=25°C)
• High collector current (IC: 1.5A)
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ...................................................................................... 1 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ 40 V
VCEO Collector to Emitter Voltage ..................................................................................... 25 V
VEBO Emitter to Base Voltage ............................................................................................. 6 V
IC Collector Current ........................................................................................................... 1.5 A
IB Base Current ............................................................................................................. 500 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
VBE(on)
*hFE1
*hFE2
*hFE3
fT
Min.
40
25
6
45
85
40
100
Typ.
--
Max.
100
100
0.5
1.2
1
500
-
Unit
V
V
V
nA
nA
V
V
V
MHz
Test Conditions
IC=100uA
IC=2mA
IE=100uA
VCB=35V
VEB=6V
IC=0.8A, IB=80mA
IC=0.8A, IB=80mA
VCE=1V, IC=10mA
VCE=1V, IC=5mA
VCE=1V, IC=100mA
VCE=1V, IC=800mA
VCE=10V, IC=50mA
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification on hFE2
Rank
Range
HE8050
B
85-160
C
120-200
D
160-320
E
250-500
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6112
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 2/3
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
10000
Saturation Voltage (mV)
hFE
1000
VCE=1V
100
1000
VBE(sat) @ IC=10IB
100
VCE(sat) @ IC=100IB
VCE(sat) @ IC=10IB
10
10
0.1
1
10
100
1000
10000
0.1
1
10
Collector Current (mA)
On Voltage & Collector Current
1000
10000
Cutoff Frequency & Collector Current
1000
Cutoff Frequency (MHz)
10000
On Voltage (mV)
100
Collector Current (mA)
1000
VBE(on) @ VCE=1V
100
VCE=10V
100
10
10
100
1000
10000
1
10
Collector Current (mA)
100
1000
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
100
10000
PT=1ms
Collector Current-IC (mA)
Capacitance (pF)
PT=100ms
Co
10
1000
PT=1s
100
10
1
1
0.1
1
10
100
Reverse Biased Voltage (V)
HE8050
1000
1
10
100
Forward Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6112
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 3/3
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking :
HSMC Logo
B
1 2
Product Series
Part Number
3
Date Code
Rank
α3
C
Laser Mark
HSMC Logo
Product Series
D
Part Number
H
I
G
Ink Mark
α1
Style : Pin 1.Emitter 2.Collector 3.Base
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HE8050
HSMC Product Specification
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