HI-SINCERITY Spec. No. : HE6112 Issued Date : 1992.09.30 Revised Date : 2001.08.13 Page No. : 1/3 MICROELECTRONICS CORP. HE8050 NPN EPITAXIAL PLANAR TRANSISTOR Description The HE8050 is designed for use in 2W output amplifier of portable radios in class B push-pull operation. Features • High total power dissipation (PT: 2W, TC=25°C) • High collector current (IC: 1.5A) Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ...................................................................................... 1 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ 40 V VCEO Collector to Emitter Voltage ..................................................................................... 25 V VEBO Emitter to Base Voltage ............................................................................................. 6 V IC Collector Current ........................................................................................................... 1.5 A IB Base Current ............................................................................................................. 500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) VBE(on) *hFE1 *hFE2 *hFE3 fT Min. 40 25 6 45 85 40 100 Typ. -- Max. 100 100 0.5 1.2 1 500 - Unit V V V nA nA V V V MHz Test Conditions IC=100uA IC=2mA IE=100uA VCB=35V VEB=6V IC=0.8A, IB=80mA IC=0.8A, IB=80mA VCE=1V, IC=10mA VCE=1V, IC=5mA VCE=1V, IC=100mA VCE=1V, IC=800mA VCE=10V, IC=50mA *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification on hFE2 Rank Range HE8050 B 85-160 C 120-200 D 160-320 E 250-500 HSMC Product Specification HI-SINCERITY Spec. No. : HE6112 Issued Date : 1992.09.30 Revised Date : 2001.08.13 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 10000 Saturation Voltage (mV) hFE 1000 VCE=1V 100 1000 VBE(sat) @ IC=10IB 100 VCE(sat) @ IC=100IB VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 1000 10000 0.1 1 10 Collector Current (mA) On Voltage & Collector Current 1000 10000 Cutoff Frequency & Collector Current 1000 Cutoff Frequency (MHz) 10000 On Voltage (mV) 100 Collector Current (mA) 1000 VBE(on) @ VCE=1V 100 VCE=10V 100 10 10 100 1000 10000 1 10 Collector Current (mA) 100 1000 Collector Current (mA) Capacitance & Reverse-Biased Voltage Safe Operating Area 100 10000 PT=1ms Collector Current-IC (mA) Capacitance (pF) PT=100ms Co 10 1000 PT=1s 100 10 1 1 0.1 1 10 100 Reverse Biased Voltage (V) HE8050 1000 1 10 100 Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6112 Issued Date : 1992.09.30 Revised Date : 2001.08.13 Page No. : 3/3 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank α3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark α1 Style : Pin 1.Emitter 2.Collector 3.Base E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HE8050 HSMC Product Specification