Micrel MIC2076-1BM Dual-channel power distribution switch Datasheet

MIC2026/2076
Dual-Channel Power Distribution Switch
General Description
Features
The MIC2026 and MIC2076 are high-side MOSFET
switches optimized for general-purpose power distribution
requiring circuit protection.
The MIC2026/76 are internally current limited and have
thermal shutdown that protects the device and load.
The MIC2076 offers “smart” thermal shutdown that
reduces current consumption in fault modes. When a
thermal shutdown fault occurs, the output is latched off
until the faulty load is removed. Removing the load or
toggling the enable input will reset the device output.
Both devices employ soft-start circuitry that minimizes
inrush current in applications where highly capacitive loads
are employed.
A fault status output flag is asserted during overcurrent
and thermal shutdown conditions. Transient faults are
internally filtered.
The MIC2026/76 are available in 8-pin DIP or 8-pin SOIC.
All support documentation can be found on Micrel’s web
site at www.micrel.com.
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140mΩ maximum on-resistance per channel
2.7V to 5.5V operating range
500mA minimum continuous current per channel
Shortcircuit protection with thermal shutdown
Thermally isolated channels
Fault status flag with 3ms filter eliminates false
assertions
Undervoltage lockout
Reverse current flow blocking (no “body diode”)
Circuit breaker mode (MIC2076)
Logic-compatible inputs
Soft-start circuit
Low quiescent current
Pin compatible with MIC2526
UL File # E179633
Applications
• USB peripherals
• General purpose power switching
• ACPI power distribution
• Notebook PCs
• PDAs
• PC card hot swap
___________________________________________________________________________________________________________
Typical Application
VCC
2.7V to 5.5V
VCONT.
10k
10k
Logic Controller
VIN
MIC2026-2
ON/OFF
OVERCURRENT
OVERCURRENT
ENA
ON/OFF
ENB
FLGAI
FLGB
OUTA
N
GND
OUTB
Load
0.1µF
Load
UL Recognized Component
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
June 2010
M9999-060410-B
Micrel, Inc.
MIC2026/2076
Ordering Information
Part Number
Temperature
Range
Enable
Package
Standard
Pb-Free
MIC2026-1BM
MIC2026-1YM(1)
Active High
8-Pin SOIC
MIC2026-2BM
(1)
Active Low
8- Pin SOIC
MIC2026-2YM
MIC2026-1BN
—
Active High
8- Pin DIP
–40°C to +85°C
MIC2026-2BN
—
Active Low
MIC2076-1BM
MIC2076-1YM(1)
Active High
8- Pin SOIC
8- Pin DIP
MIC2076-2BM
MIC2076-2YM(1)
Active Low
8- Pin SOIC
MIC2076-1BN
—
Active High
8-Pin DIP
MIC2076-2BN
—
Active Low
8-Pin DIP
Note:
1. RoHS compliant and Halogen free.
Pin Configuration
ENA 1
8 OUTA
FLGA 2
7 IN
FLGB 3
6 GND
ENB 4
5 OUTB
8-Pin SOIC (M)
8-Pin DIP (N)
Pin Description
Pin Number
Pin Name
Pin Function
1
ENA
Switch A Enable (Input): Logic-compatible, enable input. Active high (-1) or
active low (-2).
2
FLGA
Fault Flag A (Output): Active-low, open-drain output. Indicates overcurrent or
thermal shutdown conditions. Overcurrent conditions must last longer than tD in
order to assert FLGA.
B
3
FLGB
B
Fault Flag B (Output): Active-low, open-drain output. Low indicates overcurrent
or thermal shutdown conditions. Overcurrent conditions must last longer than tD
in order to assert FLGB.
B
June 2010
Switch B Enable (Input): Logic-compatible enable input. Active-high (-1) or
active-low (-2).
4
ENB
5
OUTB
Switch B (Output)
6
GND
Ground
7
IN
8
OUTA
B
Input: Switch and logic supply input.
Switch A (Output)
2
M9999-060410-B
Micrel, Inc.
MIC2026/2076
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VIN) ........................................ –0.3V to +6V
Fault Flag Voltage (VFLG) ................................................+6V
Fault Flag Current (IFLG) ..............................................25mA
Output Voltage (VOUT) ....................................................+6V
Output Current (IOUT) .................................Internally Limited
Enable Input (IEN) ..................................... –0.3V to VIN + 3V
Storage Temperature (TS) ........................–65°C to +150 °C
ESD Rating(3)
HBM ......................................................................... 1kV
MM .........................................................................200V
Supply Voltage (VIN) ..................................... +2.7V to +5.5V
Ambient Temperature (TA) .......................... –40°C to +85°C
Junction Temperature Range (TJ) ............. Internally Limited
Thermal Resistance
SOIC (θJA) ........................................................160°C/W
PDIP (θJA) ........................................................105°C/W
P
B
B
B
B
B
B
B
P
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
Electrical Characteristics(4)
P
VIN = +5V; TA = 25°C, bold values indicate –40°C ≤ TA ≤ +85°C; unless noted
B
B
B
B
B
B
Symbol
Parameter
Condition
IDD
Supply Current
B
B
Min
Typ
Max
Units
MIC20x6-1, VENA = VENB ≤ 0.8V
(switch off), OUT = open
0.75
5
µA
MIC20x6-2, VENA = VENB ≥ 2.4V
(switch off), OUT = open
9.5
20
µA
MIC20x6-1, VENA = VENB ≥ 2.4V
(switch on), OUT = open
100
160
µA
MIC20x6-2, VENA = VENB ≤ 0.8V
(switch on), OUT = open
100
160
µA
low-to-high transition
1.7
2.4
V
B
B
B
B
B
B
B
B
Enable Input Threshold
B
B
B
B
VEN
B
B
B
B
B
B
high-to-low transition
0.8
Enable Input Hysteresis
IEN
B
Enable Input Current
B
VEN = 0V to 5.5V
B
-1
B
Enable Input Capacitance
RDS(ON)
B
B
Switch Resistance
1.45
V
250
mV
0.01
1
1
µA
pF
VIN = 5V, IOUT = 500mA
90
140
mΩ
VIN = 3.3V, IOUT = 500mA
100
170
mΩ
10
µA
B
B
B
B
B
B
B
B
Output Leakage Current
MIC20x6-1, VENx ≤ 0.8V;
MIC20x6-1, VENx ≥ 2.4V, (output off)
OFF Current in Latched
Thermal Shutdown
MIC2076
(during thermal shutdown state)
50
tON
Output Turn-On Delay
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
1.3
5
ms
tR
Output Turn-On Rise Time
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
1.15
4.9
ms
B
B
B
B
B
B
B
B
B
B
B
B
0.5
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
1.75
B
B
B
B
µA
ms
tOFF
Output Turn-Off Delay
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
35
100
µs
tF
Output Turn-Off Fall Time
RL = 10Ω, CL = 1µF, see “Timing Diagrams”
32
100
µs
Short-Circuit Output Current
VOUT = 0V, enabled into short-circuit
0.5
0.9
1.25
A
Current-Limit Threshold
ramped load applied to output
0.65
1.0
1.25
A
Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT
(short applied to output)
B
B
B
B
ILIMIT
B
B
June 2010
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
3
B
20
µs
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Micrel, Inc.
MIC2026/2076
Symbol
Parameter
Condition
tD
Overcurrent Flag Response
Delay
VIN = 5V, apply VOUT = 0V until FLG low
B
B
B
B
Min
Typ
Max
Units
1.5
3
7
ms
VIN = 3.3V, apply VOUT = 0V until FLG low
B
Undervoltage Lockout
Threshold
B
B
2.2
2.4
2.7
V
VIN falling
2.0
2.15
2.5
V
IL = 10mA, VIN = 5V
10
25
Ω
IL = 10mA, VIN = 3.3V
15
40
Ω
10
µA
B
B
B
B
B
B
Error Flag Off Current
B
B
B
B
B
VFLAG = 5V
B
(5)
Overtemperature Threshold
P
P
ms
VIN rising
B
Error Flag Output Resistance
3
B
B
TJ increasing, each switch
TJ decreasing, each switch
140
120
°C
°C
TJ increasing, both switches
TJ decreasing, both switches
160
150
°C
°C
B
B
B
B
B
B
B
B
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions recommended.
4. Specification for packaged product only.
5. If there is a fault on one channel, that channel will shut down when the die reaches approximately 140°C. If the die reaches approximately 160°C,
both channels will shut down, even if neither channel is in current limit.
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MIC2026/2076
Test Circuit
VOUT
Device
Under OUT
Test
RL
CL
Timing Diagrams
tR
tF
90%
90%
VOUT
10%
10%
Output Rise and Fall Times
VEN
50%
tOFF
tON
90%
VOUT
10%
Active-Low Switch Delay Times (MIC20x6-2)
VEN
50%
tOFF
tON
VOUT
90%
10%
Active-High Switch Delay Time (MIC20x6-1)
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MIC2026/2076
Typical Characteristics
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MIC2026/2076
Typical Characteristics (continue)
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MIC2026/2076
Functional Characteristics
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MIC2026/2076
Functional Characteristics (continue)
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MIC2026/2076
Functional Characteristics (continue)
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MIC2026/2076
Block Diagram
FLGA
FLAG
RESPONSE
DELAY
OUTA
ENA
CHARGE
PUMP
OSC.
GATE
CONTROL
THERMAL
SHUTDOWN
1.2V
REFERENCE
UVLO
CHARGE
PUMP
GATE
CONTROL
ENB
CURRENT
LIMIT
IN
CURRENT
LIMIT
FLAG
RESPONSE
DELAY
OUTB
FLGB
MIC2026/2076
GND
MIC2026/2076 Block Diagram
Input and Output
IN is the power supply connection to the logic circuitry
and the drain of the output MOSFET. OUT is the source
of the output MOSFET. In a typical circuit, current flows
from IN to OUT toward the load. If VOUT is greater than
VIN, current will flow from OUT to IN, since the switch is
bidirectional when enabled. The output MOSFET and
driver circuitry are also designed to allow the MOSFET
source to be externally forced to a higher voltage than
the drain (VOUT > VIN) when the switch is disabled. In this
situation, the MIC2026/76 prevents undesirable current
flow from OUT to IN.
activated. This allows the output latch to automatically
reset when the load (such as a USB device) is removed.
The output can also be reset by toggling EN. Refer to
Figure 1 for timing details.
The MIC2026 will automatically reset its output when the
die temperature cools down to 120°C. The MIC2026
output and FLG signal will continue to cycle on and off
until the device is disabled or the fault is removed.
Figure 2 depicts typical timing.
Depending on PCB layout, package, ambient
temperature, etc., it may take several hundred
milliseconds from the incidence of the fault to the output
MOSFET being shut off. This time will be shortest in the
case of a dead short on the output.
Thermal Shutdown
Thermal shutdown is employed to protect the device
from damage should the die temperature exceed safe
margins due mainly to short circuit faults. Each channel
employs its own thermal sensor. Thermal shutdown
shuts off the output MOSFET and asserts the FLG
output if the die temperature reaches 140°C and the
overheated channel is in current limit. The other channel
is not affected. If however, the die temperature exceeds
160°C, both channels will be shut off. Upon determining
a thermal shutdown condition, the MIC2076 will latch the
output off. In this case, a pull-up current source is
Power Dissipation
The device’s junction temperature depends on several
factors such as the load, PCB layout, ambient
temperature, and package type. Equations that can be
used to calculate power dissipation of each channel and
junction temperature are found below:
PD = RDS(on) × IOUT2
Total power dissipation of the device will be the
summation of PD for both channels. To relate this to
junction temperature, the following equation can be
used:
Functional Description
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MIC2026/2076
TJ = PD × θJA + TA
where:
Current-Limit Response—Ramped Load
The MIC2026/76 current-limit profile exhibits a small
foldback effect of about 200mA. Once this current-limit
threshold is exceeded the device switches into a
constant current mode. It is important to note that the
device will supply current up to the current-limit
threshold.
TJ = junction temperature
TA = ambient temperature
θJA = is the thermal resistance of the package
Current Sensing and Limiting
The current-limit threshold is preset internally. The
preset level prevents damage to the device and external
load but still allows a minimum current of 500mA to be
delivered to the load.
The current-limit circuit senses a portion of the output
MOSFET switch current. The current-sense resistor
shown in the block diagram is virtual and has no voltage
drop. The reaction to an overcurrent condition varies
with three scenarios:
Fault Flag
The FLG signal is an N-channel open-drain MOSFET
output. FLG is asserted (active-low) when either an
overcurrent or thermal shutdown condition occurs. In the
case of an overcurrent condition, FLG will be asserted
only after the flag response delay time, tD, has elapsed.
This ensures that FLG is asserted only upon valid
overcurrent conditions and that erroneous error reporting
is eliminated. For example, false overcurrent conditions
can occur during hot plug events when a highly
capacitive load is connected and causes a high transient
inrush current that exceeds the current-limit threshold for
up to 1ms. The FLG response delay time tD is typically
3ms.
Switch Enabled into Short-Circuit
If a switch is enabled into a heavy load or short-circuit,
the switch immediately enters into a constant-current
mode, reducing the output voltage. The FLG signal is
asserted indicating an overcurrent condition.
Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the output
MOSFET from turning on until VIN exceeds
approximately 2.5V. Undervoltage detection functions
only when the switch is enabled.
Short-Circuit Applied to Enabled Output
When a heavy load or short-circuit is applied to an
enabled switch, a large transient current may flow until
the current-limit circuitry responds. Once this occurs, the
device limits current to less than the short-circuit current
limit specification.
Short-Circuit Fault
VEN
Load and Fault Removed
(Output Reset)
VOUT
ILIMIT
ILOAD
IOUT
VFLG
Thermal
Shutdown
Reached
3ms typ.
delay
Figure 1. MIC2076-2 Fault Timing: Output Reset by Removing Load
Short-Circuit Fault
VEN
Load/Fault
Removed
VOUT
ILIMIT
ILOAD
IOUT
VFLG
Thermal
Shutdown
Reached
3ms typ.
delay
Figure 2. MIC2026-2 Fault Timing
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MIC2026/2076
Universal Serial Bus (USB) Power Distribution
The MIC2026/76 are ideally suited for USB (Universal
Serial Bus) power distribution applications. The USB
specification defines power distribution for USB host
systems such as PCs and USB hubs. Hubs can either
be self-powered or bus-powered (that is, powered from
the bus). Figure 5 shows a typical USB Host application
that may be suited for mobile PC applications employing
USB. The requirement for USB host systems is that the
port must supply a minimum of 500mA at an output
voltage of 5V ±5%. In addition, the output power
delivered must be limited to below 25VA. Upon an
overcurrent condition, the host must also be notified. To
support hot-plug events, the hub must have a minimum
of 120µF of bulk capacitance, preferably low ESR
electrolytic or tantulum. Please refer to Application Note
17 for more details on designing compliant USB hub and
host systems.
For bus-powered hubs, USB requires that each
downstream port be switched on or off under control by
the host. Up to four downstream ports each capable of
supplying 100mA at 4.4V minimum are allowed. In
addition, to reduce voltage droop on the upstream VBUS,
soft-start is necessary. Although the hub can consume
up to 500mA from the upstream bus, the hub must
consume only 100mA max at start-up, until it
enumerates with the host prior to requesting more
power. The same requirements apply for bus-powered
peripherals that have no downstream ports. Figure 6
shows a bus-powered hub.
Application Information
Supply Filtering
A 0.1µF to 1µF bypass capacitor positioned close to VIN
and GND of the device is strongly recommended to
control supply transients. Without a bypass capacitor, an
output short may cause sufficient ringing on the input
(from supply lead inductance) to damage internal control
circuitry.
Printed Circuit Board Hot-Plug
The MIC2026/76 are ideal inrush current-limiters for hot
plug applications. Due to their integrated charge pumps,
the MIC2026/76 present a high impedance when off and
slowly become a low impedance as their integrated
charge pumps turn on. This “soft-start” feature effectively
isolates power supplies from highly capacitive loads by
reducing inrush current. Figure 3 shows how the
MIC2076 may be used in a card hot-plug application.
In cases of extremely large capacitive loads (>400µF),
the length of the transient due to inrush current may
exceed the delay provided by the integrated filter. Since
this inrush current exceeds the current-limit delay
specification, FLG will be asserted during this time. To
prevent the logic controller from responding to FLG
being asserted, an external RC filter, as shown in Figure
4, can be used to filter out transient FLG assertion. The
value of the RC time constant should be selected to
match the length of the transient, less tD(min) of the
MIC2026/76.
USB
Controller
SPN010012
VBUS
4.7
µF
to "Hot"
Receptacle
1
ENA
OUTA
8
2
FLGA
IN
7
3
FLGB
GND
6
4
ENB
OUTB
5
USB
Function
CBULK
USB
Function
CBULK
GND
Cable
USB Peripheral
Figure 3. Hot-Plug Application
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MIC2026/2076
Figure 4. Transient Filter
Figure 5. USB Two-Port Host Application
Figure 6. USB Two-Port Bus-Powered Hub
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MIC2026/2076
Package Information
8-Pin SOIC (M)
8-Pin DIP (N)
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MIC2026/2076
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2006 Micrel, Incorporated.
June 2010
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