MCP6L1/1R/2/4 2.8 MHz, 200 µA Op Amps Features Description • • • • • • • The Microchip Technology Inc. MCP6L1/1R/2/4 family of operational amplifiers (op amps) supports generalpurpose applications. Battery powered circuits benefit from their low quiescent current, A/D converters from their wide bandwidth and anti-aliasing filters from their low input bias current. Supply Voltage: 2.7V to 6.0V Rail-to-Rail Output Input Range Includes Ground Available in SOT-23-5 package Gain Bandwidth Product: 2.8 MHz (typical) Supply Current: IQ = 200 µA/amplifier (typical) Extended Temperature Range: -40°C to +125°C Typical Applications • • • • • • Portable Equipment Photodiode Amplifier Analog Filters Data Acquisition Notebooks and PDAs Battery-Powered Systems This family has a 2.8 MHz Gain Bandwidth Product (GBWP) with a low 200 µA per amplifier quiescent current. These op amps operate on supply voltages between 2.7V and 6.0V, with rail-to-rail input and output swing. They are available in the extended temperature range. Package Types MCP6L1 MCP6L2 SOT-23-5 SOIC, MSOP VOUT 1 Design Aids • • • • VSS FilterLab® Software Microchip Advanced Part Selector (MAPS) Analog Demonstration and Evaluation Boards Application Notes Typical Application 2 VIN+ 3 4 VIN– R2 29.4 kΩ SOIC, MSOP C2 470 nF 7 VOUTB VINA+ 3 6 VINB– 5 VINB+ MCP6L4 SOIC, TSSOP 8 NC VIN– 2 7 VDD VOUTA 1 14 VOUTD 6 VOUT 5 NC VINA– 2 VINA+ 3 13 VIND– SOT-23-5 VOUT VIN VINA– 2 NC 1 VSS 4 MCP6L1 8 VDD MCP6L1 MCP6L1R R1 18.2 kΩ VOUTA 1 VSS 4 VIN+ 3 C1 1.0 µF 5 VDD VOUT 1 VDD 5 VSS VDD 4 VINB+ 5 VINB– 6 VOUTB 7 12 VIND+ 11 VSS 10 VINC+ 9 VINC– 8 VOUTC 2 VIN+ 3 4 VIN– Low-Pass Filter © 2009 Microchip Technology Inc. DS22135A-page 1 MCP6L1/1R/2/4 NOTES: DS22135A-page 2 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 1.0 1.1 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD – VSS .......................................................................7.0V Current at Input Pins ....................................................±2 mA Analog Inputs (VIN+, VIN–) †† ....... VSS – 1.0V to VDD + 1.0V All Inputs and Outputs ................... VSS – 0.3V to VDD + 0.3V Difference Input voltage ...................................... |VDD – VSS| Output Short Circuit Current ................................ Continuous Current at Output and Supply Pins ..........................±150 mA Storage Temperature ...................................-65°C to +150°C Max. Junction Temperature ........................................ +150°C ESD protection on all pins (HBM, MM) ................≥ 3 kV, 200V 1.2 †† See Section 4.1.2 “Input Voltage and Current Limits”. Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = 25°C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT ≈ VDD/2, VL = VDD/2, and RL = 10 kΩ to VL (refer to Figure 1-1). Parameters Sym Min (Note 1) Typ Max (Note 1) Units Conditions Input Offset Input Offset Voltage Input Offset Voltage Drift Power Supply Rejection Ratio VOS -3 ±1 +3 ΔVOS/ΔTA — ±2.5 — PSRR — 90 — mV µV/°C TA= -40°C to+125°C dB Input Current and Impedance IB — 1 — pA Across Temperature IB — 20 — pA TA= +85°C Across Temperature IB — 500 — pA TA= +125°C IOS — ±1 — pA Input Bias Current Input Offset Current Common Mode Input Impedance ZCM — 1013||5 — Ω||pF Differential Input Impedance ZDIFF — 1013||2 — Ω||pF Common-Mode Input Voltage Range VCMR -0.3 — 3.7 V Common-Mode Rejection Ratio CMRR — 90 — dB VCM = -0.3V to 5.3V AOL — 105 — dB VOUT = 0.2V to 4.8V Common Mode Open Loop Gain DC Open Loop Gain (large signal) Output Maximum Output Voltage Swing Output Short Circuit Current VOL — — 0.030 V G = +2, 0.5V Input Overdrive VOH 4.960 — — V G = +2, 0.5V Input Overdrive ISC — ±20 — mA VDD 2.7 — 6.0 V IQ 70 200 330 µA Power Supply Supply Voltage Quiescent Current per Amplifier Note 1: IO = 0 For design guidance only; not tested. © 2009 Microchip Technology Inc. DS22135A-page 3 MCP6L1/1R/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = 25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF (refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions AC Response Gain Bandwidth Product GBWP — 2.8 — MHz Phase Margin PM — 50 — ° Slew Rate SR — 2.3 — V/µs Input Noise Voltage Eni — 7 — Input Noise Voltage Density eni — 21 — nV/√Hz f = 10 kHz Input Noise Current Density ini — 0.6 — fA/√Hz G = +1 Noise TABLE 1-3: µVP-P f = 0.1 Hz to 10 Hz f = 1 kHz TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +2.7V to +6.0V, VSS = GND. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5L-SOT-23 θJA — 256 — °C/W Thermal Resistance, 8L-SOIC (150 mil) θJA — 163 — °C/W Thermal Resistance, 8L-MSOP θJA — 206 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W Conditions Temperature Ranges (Note 1) Thermal Package Resistances Note 1: 1.3 Operation must not cause TJ to exceed Maximum Junction Temperature specification (150°C). Test Circuit The circuit used for most DC and AC tests is shown in Figure 1-1. This circuit can independently set VCM and VOUT; see Equation 1-1. Note that VCM is not the circuit’s common mode voltage ((VP + VM)/2), and that VOST includes VOS plus the effects (on the input offset error, VOST) of temperature, CMRR, PSRR and AOL. CF 6.8 pF RG 100 kΩ VP G DM = R F ⁄ R G CB1 100 nF MCP6LX V CM = ( V P + V DD ⁄ 2 ) ⁄ 2 VDD/2 CB2 1 µF VIN– V OST = V IN– – V IN+ V OUT = ( V DD ⁄ 2 ) + ( V P – V M ) + V OST ( 1 + G DM ) Where: GDM = Differential Mode Gain (V/V) VCM = Op Amp’s Common Mode Input Voltage (V) DS22135A-page 4 VDD VIN+ EQUATION 1-1: VOST = Op Amp’s Total Input Offset Voltage RF 100 kΩ (mV) VM RG 100 kΩ RL 10 kΩ RF 100 kΩ CF 6.8 pF VOUT CL 60 pF VL FIGURE 1-1: AC and DC Test Circuit for Most Specifications. © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25°C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, 0.0 Representative Part VDD = 2.7V -40°C +25°C +85°C +125° C 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -0.2 1.4 -0.3 1.3 -0.4 -0.5 100 CMRR, PSRR (dB) CMRR (VCMRL to VCMRH) 95 90 PSRR (VCM = VSS) 85 80 75 70 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -40°C +25°C +85°C +125° C 0.0 1.0 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. -50 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-5: Temperature. 100 125 CMRR, PSRR vs. Ambient 100 Representative Part 90 CMRR, PSRR (dB) Input Offset Voltage (mV) 1.2 1.1 Common Mode Input Voltage (V) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 VDD – VCMRH VCMRL – VSS -50 Representative Part VDD = 5.5V -0.5 1.5 3.0 FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.7V. Input Offset Voltage (µV) -0.1 -0.6 0.0 0.5 1.0 1.5 2.0 2.5 Common Mode Input Voltage (V) 1.6 One Wafer Lot Common Mode Range; VDD – V CMRH (V) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -0.5 Common Mode Range; VCMRL – V SS (V) Input Offset Voltage (mV) RL = 10 kΩ to VL and CL = 60 pF. VDD = 5.5V VDD = 2.7V 80 PSRR+ 70 PSRR– 60 CMRR 50 40 30 -50 -25 0 25 50 75 Ambient Temperature (°C) 100 FIGURE 2-3: Input Offset Voltage vs. Ambient Temperature. © 2009 Microchip Technology Inc. 125 20 1 1.E+00 FIGURE 2-6: Frequency. 10 1.E+01 100 1k 1.E+02 1.E+03 Frequency (Hz) 10k 1.E+04 100k 1.E+05 CMRR, PSRR vs. DS22135A-page 5 MCP6L1/1R/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. 10m 1.E-02 1m 1.E-03 100µ 1.E-04 10µ 1.E-05 1µ 1.E-06 100n 1.E-07 10n 1.E-08 1n 1.E-09 100p 1.E-10 10p 1.E-11 1p 1.E-12 Input, Output Voltages (V) Input Current Magnitude (A) 6 +125°C +85°C +25°C -40°C 3 2 1 0 0.E+00 5.E-06 300 -30 250 80 -60 -90 40 Gain 20 -120 -150 0 -180 -20 0.1 1 10 1.E- 1.E+ 1.E+ 01 00 01 FIGURE 2-8: Frequency. Quiescent Current per amplifier (µA) 0 Phase 100 50 -40°C +25°C +85°C +125°C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. Short Circuit Current (mA) Input Noise Voltage Density (nV/Hz) 150 40 100 10 0.1 1 10 100 1.E+0 1k 10k 1.E+0 100k 1.E-01 1.E+0 1.E+0 1.E+0 1.E+0 0 1Frequency 2 (Hz) 3 4 5 DS22135A-page 6 3.E-05 0 1,000 FIGURE 2-9: vs. Frequency. 2.E-05 200 -210 100 1k 10k 100k 1M 10M 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ Frequency (Hz) 05 06 07 02 03 04 Open-Loop Gain, Phase vs. 2.E-05 FIGURE 2-10: The MCP6L1/1R/2/4 Show No Phase Reversal. 100 60 1.E-05 Time (5 µs/div) 120 Open-Loop Phase (°) Open-Loop Gain (dB) FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). VOUT 4 -1 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Voltage (V) VIN G = +2 V/V 5 Input Noise Voltage Density 30 20 10 0 -10 -40°C +25°C +85°C +125°C -20 -30 -40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. 3.0 VDD – VOH IOUT 60 2.5 Slew Rate (V/µs) Ratio of Output Headroom to Output Current (mV/mA) 70 50 40 VOL – VSS -IOUT 30 20 1.0 0.5 0.0 1m 1.E-03 Output Current Magnitude (A) -50 10m 1.E-02 FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-16: Temperature. 10 P-P ) G = +1 V/V Output Voltage Swing (V 2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 0.E+00 1.E-06 -25 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 Time (1 µs/div) FIGURE 2-14: Pulse Response. Small Signal, Non-Inverting 5.0 0 25 50 75 100 125 Ambient Temperature (°C) 2.58 Output Voltage (20 mV/div) Rising Edge 1.5 10 0 100µ 1.E-04 Slew Rate vs. Ambient VDD = 5.5V VDD = 2.7V 1 0.1 10k 1.E+04 FIGURE 2-17: Frequency. 100k 1.E+05 Frequency (Hz) 1M 1.E+06 Output Voltage Swing vs. G = +1 V/V 4.5 Output Voltage (V) Falling Edge 2.0 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.E+00 1.E-06 2. E-06 3.E-06 4.E-06 5. E-06 6.E-06 7. E-06 8.E -06 9.E-06 1. E-05 Time (1 µs/div) FIGURE 2-15: Pulse Response. Large Signal, Non-Inverting © 2009 Microchip Technology Inc. DS22135A-page 7 MCP6L1/1R/2/4 NOTES: DS22135A-page 8 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6L1 MCP6L1R MCP6L2 MCP6L4 SOIC-8, MSOP-8 SOT-23-5 SOIC-8, MSOP-8 SOIC-14, TSSOP-14 Symbol SOT-23-5 1 4 3 5 — — — — — — 2 — — — — 6 2 3 7 — — — — — — 4 — — — 1, 5, 8 1 4 3 2 — — — — — — 5 — — — — 1 2 3 8 5 6 7 — — — 4 — — — — 1 2 3 4 5 6 7 8 9 10 11 12 13 14 — VOUT, VOUTA VIN–, VINA– VIN+, VINA+ VDD VINB+ VINB– VOUTB VOUTC VINC– VINC+ VSS VIND+ VIND– VOUTD NC 3.1 Analog Outputs 3.3 Description Output (op amp A) Inverting Input (op amp A) Non-inverting Input (op amp A) Positive Power Supply Non-inverting Input (op amp B) Inverting Input (op amp B) Output (op amp B) Output (op amp C) Inverting Input (op amp C) Non-inverting Input (op amp C) Negative Power Supply Non-inverting Input (op amp D) Inverting Input (op amp D) Output (op amp D) No Internal Connection Power Supply Pins The analog output pins (VOUT) are low-impedance voltage sources. The positive power supply (VDD) is 2.7V to 6.0V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. 3.2 Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. Analog Inputs The non-inverting and inverting inputs (VIN+, VIN–, …) are high-impedance CMOS inputs with low bias currents. © 2009 Microchip Technology Inc. DS22135A-page 9 MCP6L1/1R/2/4 NOTES: DS22135A-page 10 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 4.0 APPLICATION INFORMATION The MCP6L1/1R/2/4 family of op amps is manufactured using Microchip’s state of the art CMOS process. They are unity-gain stable and suitable for a wide range of general purpose applications. 4.1 Inputs 4.1.1 PHASE REVERSAL The MCP6L1/1R/2/4 op amps are designed to prevent phase inversion when the input pins exceed the supply voltages. Figure 2-10 shows an input voltage exceeding both supplies without any phase reversal. 4.1.2 4.1.3 NORMAL OPERATION The Common Mode Input Voltage Range (VCMR) includes ground in single-supply systems (VSS), but does not include VDD. This means that the amplifier input behaves linearly as long as the Common Mode Input Voltage (VCM) is kept within the VCMR limits (typically VSS – 0.3V to VDD – 1.2V at +25°C). Figure 4-3 shows a unity gain buffer. Since VOUT is the same voltage as the inverting input, VOUT must be kept below VDD – 1.2V (typically) for correct operation. V1 V2 MCP6LX INPUT VOLTAGE AND CURRENT LIMITS In order to prevent damage and/or improper operation of these amplifiers, the circuit they are in must limit the currents (and voltages) at the input pins (see Section 1.1 “Absolute Maximum Ratings †”). Figure 4-1 shows the recommended approach to protecting these inputs. The internal ESD diodes prevent the input pins (VIN+ and VIN–) from going too far below ground, and the resistors R1 and R2 limit the possible current drawn out of the input pins. Diodes D1 and D2 prevent the input pins (VIN+ and VIN–) from going too far above VDD, and dump any currents onto VDD. VDD D1 D2 V1 R1 MCP6LX V2 R2 R3 VSS – (minimum expected V1) 2 mA VSS – (minimum expected V2) R2 > 2 mA FIGURE 4-2: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output The output voltage range of the MCP6L1/1R/2/4 op amps is VDD – 35 mV (minimum) and VSS + 35 mV (maximum) when RL = 10 kΩ is connected to VDD/2 and VDD = 5.0V. Refer to Figure 2-13 for more information. 4.3 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. When driving large capacitive loads with these op amps (e.g., > 100 pF when G = +1), a small series resistor at the output (RISO in Figure 4-3) improves the feedback loop’s stability by making the output load resistive at higher frequencies; the bandwidth will usually be decreased. R1 > FIGURE 4-1: Inputs. RG RF VOUT CL Protecting the Analog A significant amount of current can flow out of the inputs (through the ESD diodes) when the common mode voltage (VCM) is below ground (VSS); see Figure 2-7. Applications that are high impedance may need to limit the usable voltage range. © 2009 Microchip Technology Inc. RISO RN MCP6LX FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads. Bench measurements are helpful in choosing RISO. Adjust RISO so that a small signal step response (see Figure 2-14) has reasonable overshoot (e.g., 4%). DS22135A-page 11 MCP6L1/1R/2/4 4.4 Supply Bypass Guard Ring With this family of operational amplifiers, the power supply pin (VDD for single supply) should have a local bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good high frequency performance. It also needs a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other nearby analog parts. FIGURE 4-5: 4.5 1. Unused Op Amps An unused op amp in a quad package (e.g., MCP6L4) should be configured as shown in Figure 4-4. These circuits prevent the output from toggling and causing crosstalk. Circuit A sets the op amp at its minimum noise gain. The resistor divider produces any desired reference voltage within the output voltage range of the op amp; the op amp buffers that reference voltage. Circuit B uses the minimum number of components and operates as a comparator, but it may draw more current. ¼ MCP6L4 (A) ¼ MCP6L4 (B) VDD VDD R1 VDD R2 2. VIN– VIN+ Example guard ring layout. Inverting Amplifiers (Figure 4-5) and Transimpedance Gain Amplifiers (convert current to voltage, such as photo detectors). a) Connect the guard ring to the non-inverting input pin (VIN+); this biases the guard ring to the same reference voltage as the op amp’s input (e.g., VDD/2 or ground). b) Connect the inverting pin (VIN–) to the input with a wire that does not touch the PCB surface. Non-inverting Gain and Unity-Gain Buffer. a) Connect the guard ring to the inverting input pin (VIN–); this biases the guard ring to the common mode input voltage. b) Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface. VREF R2 V REF = V DD ⋅ -----------------R1 + R2 FIGURE 4-4: 4.6 Unused Op Amps. PCB Surface Leakage In applications where low input bias current is critical, PCB (printed circuit board) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012Ω. A 5V difference would cause 5 pA of current to flow; this is greater than this family’s bias current at 25°C (1 pA, typical). The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. Figure 4-5 shows an example of this type of layout. DS22135A-page 12 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 4.7 Application Circuits 4.7.1 ACTIVE LOW-PASS FILTER Figure 4-6 shows a second-order Butterworth filter, with a 10 Hz cutoff frequency and a gain of +1 V/V, using a Sallen Key topology. Microchip’s FilterLab® software designed the filter, then the capacitors were reduced in value (using the same program). R1 18.2 kΩ C1 R2 29.4 kΩ 1.0 µF VOUT VIN C2 470 nF FIGURE 4-6: MCP6L1 Sallen Key Topology. Figure 4-7 shows a filter with the same requirements, except the gain is -1 V/V, in a Multiple Feedback topology. It was designed in a similar fashion using FilterLab®. R2 25.5 kΩ R1 54.9 kΩ C1 220 nF R3 25.5 kΩ MCP6L1 VOUT VIN C2 820 nF FIGURE 4-7: VDD/2 Multiple Feedback Topology. © 2009 Microchip Technology Inc. DS22135A-page 13 MCP6L1/1R/2/4 NOTES: DS22135A-page 14 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 5.0 DESIGN AIDS Microchip provides the basic design aids needed for the MCP6L1/1R/2/4 family of op amps. 5.1 FilterLab® Software 5.4 Application Notes The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. Microchip’s FilterLab® software is an innovative software tool that simplifies analog active filter (using op amps) design. Available at no cost from the Microchip web site at www.microchip.com/filterlab, the FilterLab design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. ADN003: “Select the Right Operational Amplifier for your Filtering Circuits”, DS21821 5.2 AN990: “Analog Sensor Conditioning Circuits – An Overview”, DS00990 Microchip Advanced Part Selector (MAPS) AN722: “Operational Amplifier Topologies and DC Specifications”, DS00722 AN723: “Operational Amplifier AC Specifications and Applications”, DS00723 AN884: “Driving Capacitive Loads With Op Amps”, DS00884 MAPS is a software tool that helps efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip website at www.microchip.com/maps, the MAPS is an overall selection tool for Microchip’s product portfolio that includes Analog, Memory, MCUs and DSCs. Using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-by-side technical comparison reports. Helpful links are also provided for Data sheets, Purchase and Sampling of Microchip parts. 5.3 Analog Demonstration and Evaluation Boards Microchip offers a broad spectrum of Analog Demonstration and Evaluation Boards that are designed to help customers achieve faster time to market. For a complete listing of these boards and their corresponding user’s guides and technical information, visit the Microchip web site at www.microchip.com/analog tools. Some boards that are especially useful are: • • • • • • • MCP6XXX Amplifier Evaluation Board 1 MCP6XXX Amplifier Evaluation Board 2 MCP6XXX Amplifier Evaluation Board 3 MCP6XXX Amplifier Evaluation Board 4 Active Filter Demo Board Kit P/N VSUPEV2: 5/6-Pin SOT-23 Evaluation Board P/N SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board • P/N SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board © 2009 Microchip Technology Inc. DS22135A-page 15 MCP6L1/1R/2/4 NOTES: DS22135A-page 16 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SOT-23 (MCP6L1/1R) 5 4 Device XXNN Code MCP6L1 WCNN MCP6L1R WDNN 5 4 WC25 Note: Applies to 5-Lead SOT-23. 1 2 3 1 3 Example: 8-Lead MSOP XXXXXX 6L2E YWWNNN 908256 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: 2 Example: MCP6L2E e3 SN^^0908 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2009 Microchip Technology Inc. DS22135A-page 17 MCP6L1/1R/2/4 Package Marking Information (Continued) 14-Lead SOIC (150 mil) (MCP6L4) Example: MCP6L4 e3 E/SL^^ 0908256 XXXXXXXXXX XXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6L4) Example: XXXXXXXX YYWW 6L4E 0908 NNN 256 DS22135A-page 18 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 .# #$ # / ## +22--- 2 ! - / 0 # 1 / % # # ! # b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 3# 4# 5$8 %1 4 44"" 5 5 7 ( !1# 6$# ! 4 56 ()* !1# 6, 9 # ! !1 / / # !%% 6, <!# ! !1 / 6, 4 # <!# )* : ; : ( : ( " : " : ; : .#4 # 4 : = .# # 4 ( : ; .# > : > 4 ; : = !/ 4 !<!# 8 : ( !"!#$! !% #$ !% #$ # & ! !# "'( )*+ ) # & #, $ --#$## ! - * ) © 2009 Microchip Technology Inc. DS22135A-page 19 MCP6L1/1R/2/4 !" .# #$ # / ## +22--- 2 ! - / 0 # 1 / % # # ! # D N E E1 NOTE 1 1 2 e b A2 A c φ L L1 A1 3# 4# 5$8 %1 44"" 5 5 =()* 6, 9 # / # !%% 6, <!# ! !1 / 6, 4 # 7 ; 1# ! !1 / 56 : : ( ;( ( : ( " <!# )* " )* )* .#4 # 4 .# # 4 .# > : ;> 4 ; : !/ = ; (". 4 !<!# 8 : 1, $ ! &% #$ , 08$#$ #8 # !-## # ! !"!#$! !% #$ !% #$ # & !( !# "'( )*+ ) # & #, $ --#$## ".+ % 0$ $ -#$## 0%% # $ ! - * ) DS22135A-page 20 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 #$%&'()*+, .# #$ # / ## +22--- 2 ! - / 0 # 1 / % # # ! # D e N E E1 NOTE 1 1 2 3 α h b h A2 A c φ L A1 L1 3# 4# 5$8 %1 44"" 5 5 7 )* 6, 9 # / # !%%? 6, <!# ! !1 / 56 ; 1# ! !1 / β : : ( : : : ( " <!# 6, 4 # ( =)* " )* )* * % @ # A ( : ( .#4 # 4 : .# # 4 .# > : ;> 4 !/ : ( 4 !<!# ". 8 : ( ! %# (> : (> ! %# )## (> : (> 1, $ ! &% #$ , 08$#$ #8 # !-## # ! ? % #* # # !"!#$! !% #$ !% #$ # & !( !# "'( )*+ ) # & #, $ --#$## ".+ % 0$ $ -#$## 0%% # $ ! - * () © 2009 Microchip Technology Inc. DS22135A-page 21 MCP6L1/1R/2/4 #$%&'()*+, .# #$ # / ## +22--- 2 DS22135A-page 22 ! - / 0 # 1 / % # # ! # © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 -. #$%&'()*+, .# #$ # / ## +22--- 2 ! - / 0 # 1 / % # # ! # D N E E1 NOTE 1 1 2 3 e h b A2 A c φ L A1 β L1 3# 4# 5$8 %1 44"" 5 5 7 )* 6, 9 # / # !%%? 6, <!# ! !1 / 56 1# ! !1 / α h : : ( : : : ( " <!# 6, 4 # ( =)* " )* ;=()* * % @ # A ( : ( .#4 # 4 : .# # 4 .# > : ;> 4 !/ : ( 4 !<!# ". 8 : ( ! %# (> : (> ! %# )## (> : (> 1, $ ! &% #$ , 08$#$ #8 # !-## # ! ? % #* # # !"!#$! !% #$ !% #$ # & !( !# "'( )*+ ) # & #, $ --#$## ".+ % 0$ $ -#$## 0%% # $ ! - * =() © 2009 Microchip Technology Inc. DS22135A-page 23 MCP6L1/1R/2/4 .# #$ # / ## +22--- 2 DS22135A-page 24 ! - / 0 # 1 / % # # ! # © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 / / ! #.&.)* .# #$ # / ## +22--- 2 ! - / 0 # 1 / % # # ! # D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 3# 4# 5$8 %1 44"" 5 5 7 ; 1# =()* 6, 9 # ! !1 / 56 / # !%% 6, <!# : : ; ( ( : ( " =)* ! !1 / <!# " ! !1 / 4 # .#4 # 4 ( = ( .# # 4 .# I > : ;> 4 : !/ ( ". 4 !<!# 8 : 1, $ ! &% #$ , 08$#$ #8 # !-## # ! !"!#$! !% #$ !% #$ # & !( !# "'( )*+ ) # & #, $ --#$## ".+ % 0$ $ -#$## 0%% # $ ! - * ;=) © 2009 Microchip Technology Inc. DS22135A-page 25 MCP6L1/1R/2/4 NOTES: DS22135A-page 26 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 APPENDIX A: REVISION HISTORY Revision A (March 2009) • Original Release of this Document. © 2009 Microchip Technology Inc. DS22135A-page 29 MCP6L1/1R/2/4 NOTES: DS22135A-page 30 © 2009 Microchip Technology Inc. MCP6L1/1R/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package Examples: a) MCP6L1T-E/OT: b) MCP6L1T-E/MS: Device: MCP6L1T: MCP6L1RT: MCP6L2T: MCP6L4T: Single Op Amp (Tape and Reel) (SOT-23, MSOP, SOIC) Single Op Amp (Tape and Reel) (SOT-23) Dual Op Amp (Tape and Reel) (SOIC, MSOP) Quad Op Amp (Tape and Reel) (SOIC, TSSOP) Temperature Range: E = -40°C to +125°C Package: OT MS SN SL ST = = = = = c) MCP6L1T-E/SN: a) MCP6L1RT-E/OT: Tape and Reel, Extended Temperature, 5LD SOT-23 package. a) MCP6L2T-E/MS: Tape and Reel, Extended Temperature, 8LD MSOP package. Tape and Reel, Extended Temperature, 8LD SOIC package. b) MCP6L2T-E/SN: Plastic Small Outline Transistor (SOT-23), 5-lead Plastic MSOP, 8-lead Plastic SOIC, (3.99 mm body), 8-lead Plastic SOIC (3.99 mm body), 14-lead Plastic TSSOP (4.4mm body), 14-lead a) MCP6L4T-E/SL: b) MCP6L4T-E/ST: © 2009 Microchip Technology Inc. Tape and Reel, Extended Temperature, 5LD SOT-23 package Tape and Reel, Extended Temperature, 8LD MSOP package. Tape and Reel, Extended Temperature, 8LD SOIC package. Tape and Reel, Extended Temperature, 14LD SOIC package. Tape and Reel, Extended Temperature, 14LD TSSOP package. DS22135A-page 31 MCP6L1/1R/2/4 NOTES: DS22135A-page 32 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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