PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L PACKAGE SCHEMATIC ANODE 1 6 DRAIN CATHODE 2 6 6 5 N/C 3 4 DRAIN 1 1 DESCRIPTION The HSR312 and HSR412 devices consist of a AlGaAs infrared emitting diode optically coupled to a power MOSFET detector which is driven by a photovoltaic generator. The devices are housed in a 6-pin dual-in-line package. The HSR312L and HSR412L employ an active current limit circuitry enabling the device to withstand current surge transients. FEATURES • 4,000 VRMS Isolation • Wide operating voltage range – 250 V (HSR312, HSR312L) – 400 V (HSR412, HSR412L) • Solid-State Reliability • Bounce-Free Operation • 4000 V ESD Rating (HBM) • UL, CSA and BABT approval pending APPLICATIONS • On/Off Hook Switch • Dial Out Relay • General Switching • • • Replacement for Mechanical Relays Ring Injection Relay Ground Start ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Parameters Symbol Device Value Units Storage Temperature TSTG All -40 to +100 °C Operating Temperature TOPR All -40 to +85 °C Lead Solder Temperature TSOL All 260 for 10 sec °C Isolation Surge Voltage VISO All 4000 Vac(RMS) Maximum Input/Output Capacitance CIO All 1.0 pF All 1012 Ω TOTAL DEVICE Maximum Input/Output Resistance © 2003 Fairchild Semiconductor Corporation RIO Page 1 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L ELECTRICAL CHARACTERISTICS (TA = -40°C to +85°C Unless otherwise specified) INPUT CHARACTERISTICS Parameters/Test Conditions Connection Symbol Limit HSR312 HSR312L HSR412 HSR412L Units Control Current Series or Parallel IF(ON) Max 2.0 2.0 3.0 3.0 mA Control Current for Off-State Resistance Series or Parallel IF(OFF) Min 0.4 0.4 0.4 0.4 mA Control Current Range Series or Parallel IF Min Max 2.0 25 2.0 25 3.0 25 3.0 25 mA Reverse Voltage Series or Parallel VR Min 7 7 7 7 V Forward Voltage (IF=10 mA) Series or Parallel VF Max 1.6 1.6 1.6 1.6 V Symbol Limit HSR312 HSR312L HSR412 HSR412L Units OUTPUT CHARACTERISTICS Parameters / Test Conditions Operating Voltage Range Connection Series or Parallel Load Current Series TA = +40°C, 5mA control Parallel (see fig. 1 & 2) On-State Resistance Series TA = 25°C, 50mA pulsed load, Parallel 5mA control Off-State Leakage Current TA = 25°C, ±250V for HSR312/L, Series or Parallel ±400V for HSR412/L VOPR 250 250 400 400 Max 190 170 140 120 Max 320 300 210 200 Max 10 15 27 35 Max 3 4.25 7 9 — Max 1.0 1.0 1.0 1.0 µA ILMT Min Max Min Max N/A N/A N/A N/A 190 300 330 560 N/A N/A N/A N/A 130 220 260 440 mA IL RON Series Current Limit TA = +25°C, 5mA control VDC or VAC(PEAK) Max Parallel mA Ω Turn-On Time TA = +25°C for 50mA, 100VDC load, 5mA control Series or Parallel TON Max 3.0 3.0 2.0 2.0 mS Turn-Off Time TA = +25°C for 50mA, 100VDC load, 5mA control Series or Parallel TOFF Max 0.5 0.5 0.5 0.5 mS Series or Parallel — Max N/A N/A 0.5 0.5 mV Series or Parallel CO Max 50 50 12 12 pF Thermal Offset Voltage 5mA control Output Capacitance 5VDC ISOLATION CHARACTERISTICS Characteristics Test Conditions Input-Output Isolation Voltage © 2003 Fairchild Semiconductor Corporation Symbol Limit HSR312 HSR312L HSR412 HSR412L Units VISO Max 4000 4000 4000 4000 V Page 2 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 Figure 1. Forward Current vs. Forward Voltage Figure 2. Normalized on Resistance vs. Ambient Temperature 20.0 NORMALIZED ON RESISTANCE, R ON (Ω) 2 FORWARD CURRENT, IF (mA) 17.5 15.0 12.5 85°C 25°C -40°C 10.0 7.5 5.0 2.5 Series Connection 5mA Control ID = 10mA Normalized at 25°C 1.0 HSR312 1 1.1 1.2 1.3 1.4 -40 1.5 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (°C) FORWARD VOLTAGE, VF (V) Figure 4. Load Current vs. Voltage Drop Figure 3. Normalized on Resistance vs. Ambient Temperature 250 2 Series Connection 5mA Control ID = 10mA Series Connection 5mA Control @25°C, pulsed 200 HSR412L Normalized at 25°C HSR412 1 LOAD CURRENT, IDD (mA) NORMALIZED ON RESISTANCE, R ON (Ω) HSR312L 0 0.0 HSR312 150 100 HSR312L 50 0 -50 -100 -150 -200 -250 0 -40 -20 0 20 40 60 80 -3 100 -2 -1 AMBIENT TEMPERATURE, TA (°C) Series Connection 5mA Control @25°C, pulsed Maximum Load Current, I dd (mA) 100 0 HSR412L 2 3 Series Connection HSR312 Vdd = 4V 200 HSR412 -100 1 Figure 6. Maximum Load Current Vs Ambient Temperature 202 200 0 VOLTAGE DROP, VDD (V) Figure 5. Load Current vs. Voltage Drop LOAD CURRENT, IDD (mA) HSR412L 198 196 194 192 190 IF = 5mA 188 IF = 2mA 186 184 -200 182 -4 -2 0 2 4 0 © 2003 Fairchild Semiconductor Corporation 20 40 60 80 Ambient Temperature, TA (°C) VOLTAGE DROP, VDD (V) Page 3 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 Figure 7. Maximum Load Current Vs Ambient Temperature Vdd = 4V Figure 8. Maximum Load Current Vs Ambient Temperature 145 Series Connection HSR312L Maximum Load Current, I dd (mA) Maximum Load Current, I dd (mA) 200 180 160 IF = 5mA 140 IF = 2mA 120 HSR412L Vdd = 4V Series Connection HSR412 140 135 130 125 IF = 5mA 120 115 IF = 3mA 110 100 105 0 20 40 60 80 100 0 20 Ambient Temperature, TA (°C) Figure 9. Maximum Load Current Vs Ambient Temperature 60 80 Figure 10. Off State Current vs. Ambient Temperature 1000 Vdd = 4V Series Connection HSR412L OFF STATE CURRENT, IOFF (nA) Maximum Load Current, I dd (mA) 125 40 Ambient Temperature, TA (°C) 120 115 110 IF = 5mA 105 IF = 3mA 100 100 HSR312/L 10 1 95 0 20 40 60 80 -40 -20 Ambient Temperature, TA (°C) 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (°C) Figure 12. Normalized Off State Leakage vs. Ambient Temperature Figure 11. Off State Current vs. Ambient Temperature 1000 ID-OFF/ID-OFF @25°C OFF STATE CURRENT, IOFF (nA) 100 100 HSR412/L 10 1 HSR312/L 10 1 0.1 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (°C) © 2003 Fairchild Semiconductor Corporation -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (°C) Page 4 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L Figure 13. Normalized Off State Leakage vs. Ambient Temperature ID-OFF/ID-OFF @25°C 100 10 HSR412/L 1 0.1 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (°C) Series Connection AC or DC 1 6 2 5 + 3 LOAD 4 Parallel Connection 1 6 + + LOAD © 2003 Fairchild Semiconductor Corporation 2 5 3 4 Page 5 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 Package Dimensions (Through Hole) HSR412L Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.200 (5.08) 0.115 (2.93) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.390 (9.90) 0.332 (8.43) 0.012 (0.30) 0.008 (0.20) 0.025 (0.63) 0.020 (0.51) 0.100 (2.54) 0.100 [2.54] 15° 0.035 (0.88) 0.006 (0.16) 0.020 (0.50) 0.016 (0.41) 0.012 (0.30) Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.060 (1.52) 0.425 (10.79) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) NOTE All dimensions are in inches (millimeters) © 2003 Fairchild Semiconductor Corporation Page 6 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L ORDERING INFORMATION Option Order Entry Identifier Description S S Surface Mount Lead Bend SR2 SR2 Surface Mount; Tape and reel Carrier Tape Specifications (“D” Tapin Orientation) 12.0 ± 0.1 4.5 ± 0.20 2.0 ± 0.05 4.0 ± 0.1 0.30 MAX Ø1.5 MIN 1.75 ± 0.10 11.5 ± 1.0 21.0 ± 0.1 9.1 ± 0.20 10.1 ± 0.20 0.1 MAX 24.0 ± 0.3 Ø1.5 ± 0.1/-0 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile Temperature (°C) 300 230°C, 10–30 s 250 245°C peak 200 150 Time above 183°C, 120–180 sec 100 Ramp up = 2–10°C/sec 50 • Peak reflow temperature: 245°C (package surface temperature) • Time of temperature higher than 183°C for 120–180 seconds • One time soldering reflow is recommended 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (Minute) © 2003 Fairchild Semiconductor Corporation Page 7 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2003 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 8 of 8 1/28/03