ON CM1411 2-channel headset/speaker emi filter array with esd protection Datasheet

2-Channel Headset/Speaker EMI Filter
Array with ESD Protection
CM1411
Features
Product Description
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The CM1411 is a dual, low-pass filter array
integrating two pi-style filters (C-R-C) that reduce
EMI/RFI emissions while providing ESD protection.
This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB
attenuation in the 800 to 2700 MHz range. These pistyle filters support bidirectional filtering that control
EMI both to and from a speaker element. They also
support AC signals with a cutoff frequency of 31MHz,
enabling audio signals to pass through without
distortion.
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Functionally and pin compatible with the
CSPEMI201A
OptiGuard™ coated for improved reliability at
assembly
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network
Greater than 40dB attenuation at 1GHz
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+15kV ESD protection in each channel (HBM)
Supports AC signals—ideal for audio applications
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free RoHS compliant
Applications
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EMI filtering and ESD protection for
headset/speaker ports
Wireless handsets
Handheld PCs / PDAs
MP3 players
Digital camcorders
Notebooks
Desktop PCs
In addition, the CM1411 provides a very high level of
protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
The CM1411 can safely dissipate ESD strikes of
+8kV, the maximum requirement of the IEC 61000-42 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for
contact discharges to greater than +15kV.
The CM1411 is particularly well-suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight. The CM1411 incorporates OptiGuard™
coating which results in improved reliability at
assembly and is available in a space-saving, lowprofile Chip Scale Package with lead-free finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 3
Publication Order Number:
CM1411/D
CM1411
Block Diagram
Rev. 3 | Page 2 of 9 | www.onsemi.com
CM1411
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
SPKR_IN1
Speaker Input 1 (from audio circuitry)
A3
SPKR_IN2
Speaker Input 2 (from audio circuitry)
B2
GND
C1
SPKR_OUT1
Speaker Output 1 (to speaker)
C3
SPKR_OUT2
Speaker Output 2 (to speaker)
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Pins
Package
Ordering Part Number1
Part Marking
5
CSP
CM1411-03CP
CA
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
Storage Temperature Range
Rev. 3 | Page 3 of 9 | www.onsemi.com
CM1411
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
UNITS
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
R
CONDITIONS
Resistance
RMATCH
C
PARAMETER
Capacitance
VIN=5.0V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3 and 4
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 10Ω, C = 100pF
fC
MAX
UNITS
9
10
11
Ω
5
%
120
pF
1.0
μA
15
-5
V
V
80
Diode Leakage Current
VCL
TYP
Resistance Matching
ILEAK
VESD
MIN
5
-15
100
7
-10
±15
kV
±8
kV
+15
-19
V
V
31
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A1, then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open.
Rev. 3 | Page 4 of 9 | www.onsemi.com
CM1411
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Rev. 3 | Page 5 of 9 | www.onsemi.com
CM1411
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 6 of 9 | www.onsemi.com
260°C
CM1411
Mechanical Details
CSP Mechanical Specifications
The CM1411 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
5
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
0.905 0.950 0.995 0.0356 0.0374 0.0392
A2
1.365 1.410 1.455 0.0537 0.0555 0.0573
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.175 0.225 0.275 0.0069 0.0089 0.0108
C2
0.220 0.270 0.320 0.0087 0.0106 0.0126
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1411 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 3 | Page 7 of 9 | www.onsemi.com
CM1411
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1411
1.41 X 0.95 X
0.644
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
1.52 X 1.07 X 0.720
8mm
178mm (7")
3500
4mm
4mm
Figure 5. Tape and Reel Mechanical Data
Rev. 3 | Page 8 of 9 | www.onsemi.com
CM1411
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 3 | Page 9 of 9 | www.onsemi.com
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