IS31AP2121 2X20W STEREO / 1X 40W MONO DIGITAL AUDIO AMPLIFIER WITH 20 BANDS EQ FUNCTIONS, DRC AND 2.1CH MODE Preliminary Information October 2014 GENERAL DESCRIPTION FEATURES The IS31AP2121 is a digital audio amplifier capable of driving 20W (BTL) each to a pair of 8Ω speakers and 40W (PBTL) to a 4Ω speaker operating at 24V supply without external heat-sink or fan. The IS31AP2121 is also capable of driving 4Ω, 10W (SE)x2 + 8Ω, 20W (BTL)x1 at 24V supply for 2.1CH application. The IS31AP2121 can provide advanced audio processing functions, such as volume control, 20 EQ bands, audio mixing, 3D surround sound and Dynamic Range Control (DRC). These are fully programmable via a simple I2C control interface. Robust protection circuits are provided to protect the IS31AP2121 from damage due to accidental erroneous operating condition. The full digital circuit design of IS31AP2121 is more tolerant to noise and PVT (Process, Voltage, and Temperature) variation than the analog Class-AB or Class-D audio amplifier counterpart implemented by analog circuit design. IS31AP2121 is pop free during instantaneous power on/off or mute/shut down switching because of its robust built-in anti-pop circuit. APPLICATIONS TV audio Boom-box, CD and DVD receiver, docking system Powered speaker Wireless audio Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 16/18/20/24-bits input with I2S, Left-alignment and Right-alignment data format PSNR & DR (A-weighting) Loudspeaker: 104dB (PSNR), 110dB (DR) @24V Multiple sampling frequencies (FS) - 32kHz / 44.1kHz / 48kHz and - 64kHz / 88.2kHz / 96kHz and - 128kHz / 176.4kHz / 192kHz System clock = 64x, 128x, 192x, 256x, 384x, 512x, 576x, 768x, 1024x Fs - 64x~1024x FS for 32kHz / 44.1kHz / 48kHz - 64x~512x FS for 64kHz / 88.2kHz / 96kHz - 64x~256x FS for 128kHz / 176.4kHz / 192kHz Supply voltage - 3.3V for digital circuit - 10V~26V for speaker driver Supports 2.0CH/2.1CH/Mono configuration Loudspeaker output power for at 24V - 10W × 2CH into 8Ω @0.16% THD+N for stereo - 15W × 2CH into 8Ω @0.19% THD+N for stereo - 20W × 2CH into 8Ω @0.25% THD+N for stereo Sound processing including: - 20 bands parametric speaker EQ - Volume control (+24dB ~ -103dB, 0.125dB/step), - Dynamic range control (DRC) - Dual band dynamic range control - Power clipping - 3D surround sound - Channel mixing - Noise gate with hysteresis window - Bass/Treble tone control - Bass management crossover filter - DC-blocking high-pass filter Anti-pop design Short circuit and over-temperature protection Supports I2C control without MCLK I2C control interface with selectable device address Support BCLK system Support hardware and software reset Internal PLL LV Under-voltage shutdown and HV Under-voltage detection Power saving mode 1 IS31AP2121 TYPICAL APPLICATION CIRCUIT Figure 1 Typical Application Circuit (For Stereo) VCC 2 470 F 0.1 F 0.1 F 47 48 VDD 1M 1M 3,44 4.7k 4.7k 23 24 25 Micro Controller 19 1 F 1 F 14 15 21 Digital Audio Source 20 22 VCCLA VCCRA VCCLB VCCRB GNDL 34,41 37 38 0.1 F 0.1 F GNDR 8 PBTL SDA DVDD SCL DGND RSTB PDB VCC 35 VDD 470 F OUTLA 330pF 13,27 9,28 1 46 OUTLB 330pF 39 OUTRB SDATA BEAD Speaker 4 *Note 4 15 H 6A 18 36 1nF 220nF 330pF LRCIN 100nF BEAD OUTLB OUTRA MCLK OUTRA *Note 2 0.1 F 18 OUTLA BCLK *Note 4 15 H 6A 18 IS31AP2121 ERRORB BEAD 100nF 1nF 18 330pF BEAD OUTRB Figure 2 Typical Application Circuit (For Mono) Pin Logic 0 1 PDB Power Down Normal RSTB Reset Normal PBTL Stereo Mono Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 2 IS31AP2121 Figure 3 Typical Application Circuit (For 2.1CH) (Note 5) Pin Logic 0 1 PDB Power Down Normal RSTB Reset Normal PBTL X X Note 1: When concerning about short-circuit protection or performance, it is suggested using the choke with its IDC larger than 7A. Note 2: These capacitors should be placed as close to speaker jack as possible, and their values should be determined according to EMI test results. Note 3: The snubber circuit can be removed while the VCC ≤20V. Note 4: When concerning about short-circuit protection or performance, it is suggested using the choke with its IDC larger than 14A. Note 5: 2.1CH configuration, it programs by I2C via register address 0x11, D4 bit SEM. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 3 IS31AP2121 PIN CONFIGURATION Pin Configuration (Top View) 48 47 46 45 44 43 42 41 40 39 38 37 GNDL GNDL OUTLB NC VCCLB NC NC VCCRB NC OUTRB GNDR GNDR Package DVDD ERRORB MCLK NC NC NC PDB LRCIN BCLK SDATA SDA SCL 13 14 15 16 17 18 19 20 21 22 23 24 eLQFP-48 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 4 IS31AP2121 PIN DESCRIPTION No. Pin Description 1 OUTLA Left channel output A. 2 VCCLA Left channel supply A. 3,44 VCCLB Left channel supply B. 4~6,10~12 NC Not connected. 7 CLK_OUT PLL ratio setting pin during power up, this pin is monitored on the rising edge of reset. PMF register will be default set at 1 or 4 times PLL ratio. Low: PMF [3:0]=[0000], 1 time of PLL ratio to TTL output buffer, internal pull low with avoid system MCLK over flow. High: PMF an 80kΩ resistor. [3:0]=[0100], 4 times of PLL ratio. This pin could be clock output pin also during normal operating if EN_CLK_OUT register bit is enabled. 8 PBTL Stereo/mono configuration pin (Low: Stereo; High: Mono). 9,28 DGND Digital ground. 13,27 DVDD Digital power. 14 ERRORB ERRORB pin is a dual function pin. One is I2C address setting during power up. The other one is error status report (low active). It sets by register of A_SEL_FAULT at address 0x13 D6 to enable it. This pin is monitored on the rising edge of reset. A value of Low (15kΩ pull down) sets the I2C device address to 0x30 and a value of High (15kΩ pull up) sets it to 0x31. 15 MCLK Master clock input. Schmitt trigger TTL input buffer, internal pull Low with an 80kΩ resistor. 16~18,26 NC Not connected. 19 PDB Power down, low active. Schmitt trigger TTL input buffer, internal pull High with a 330kΩ resistor. 20 LRCIN Left/Right clock input (FS). Schmitt trigger TTL input buffer, internal pull Low with an 80kΩ resistor. 21 BCLK Bit clock input (64FS). Schmitt trigger TTL input buffer, internal pull Low with an 80kΩ resistor. 22 SDATA I2S serial audio data input. Schmitt trigger TTL input buffer 23 SDA I2C serial data. Schmitt trigger TTL input buffer 24 SCL I2C serial clock input. Schmitt trigger TTL input buffer 25 RSTB Reset, low active. Schmitt trigger TTL input buffer, internal pull High with a 330kΩ resistor. 29~33,40 NC Not connected. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 Characteristics 5 IS31AP2121 PIN DESCRIPTION (CONTINUE) No. Pin Description 34,41 VCCRB Right channel supply B. 35 VCCRA Right channel supply A. 36 OUTRA Right channel output A. 37,38 GNDR Right channel ground. 39 OUTRB Right channel output B. 42,43,45 NC Not connected. 46 OUTLB Left channel output B. 47,48 GNDL Left channel ground. Thermal Pad Connect to DGND. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 Characteristics 6 IS31AP2121 ORDERING INFORMATION INDUSTRIAL RANGE: 0°C TO +70°C Order Part No. Package QTY IS31AP2121-LQLS1 e-LQFP-48, Lead-free 250/Tray Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 7 IS31AP2121 ABSOLUTE MAXIMUM RATINGS Supply for driver stage (VCCR, VCCL), VCC Supply for digital circuit (DVDD), VDD Input voltage (SDA,SCL,RSTB,PDB,ERRORB,MCLK, BCLK,LRCIN,SDATA,PBTL), VIN Thermal resistance, θJA Junction temperature range, TJ Storage temperature range, TSTG ESD (HBM) ESD (CDM) -0.3V ~ +30V -0.3V ~ +3.6V -0.3V ~ +3.6V 27.4°C/W 0°C ~ 150°C -65°C ~ +150°C TBD Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply for driver stage to VCCR/L VDD Supply for digital circuit Condition Min. Typ. Max. Unit 10 26 V 3.15 3.45 V TJ Junction operating temperature 0 125 °C TA Ambient operating temperature 0 70 °C Typ. Max. Unit DC ELECTRICAL CHARACTERISTICS TA=25°C, unless otherwise noted. Symbol Parameter Condition Min. IPDH VCC supply current during power down VCC = 24V 10 200 µA IPDL DVDD supply current during power down VDD = 3.3V, PBTL=Low 13 20 µA ICCH Quiescent current for VCC (50%/50% PWM duty) VCC = 24V 37 mA ICCL Quiescent current for DVDD (Un-mute) VDD = 3.3V, PBTL=Low 70 mA VUVH Under-voltage disabled (For DVDD) 2.8 V VUVL Under-voltage enabled (For DVDD) 2.7 V RDS(ON) ISC TS Static drain-to-source on-state resistor, PMOS Static drain-to-source on-state resistor, NMOS L/R channel over-current protection Mono channel over-current protection 260 VCC =24V, ID = 500mA mΩ 230 VCC =24V, ID =500mA (Note 1) 7 14 A Junction temperature for driver shutdown 158 °C Temperature hysteresis for recovery from shutdown 33 °C Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 8 IS31AP2121 DC ELECTRICAL CHARACTERISTICS (CONTINUE) TA=25°C, unless otherwise noted. Symbol Parameter Condition Min. Typ. Max. Unit Logic Electrical Characteristics VIH High level input voltage VDD =3.3V VIL Low level input voltage VDD =3.3V VOH High level output voltage VDD =3.3V VOL Low level output voltage VDD =3.3V CIN Input capacitance 2.0 V 0.8 2.4 V V 0.4 6.4 V pF Note 1: Loudspeaker over-current protection is only effective when loudspeaker drivers are properly connected with external LC filters. Please refer to the application circuit example for recommended LC filter configuration. AC ELECTRICAL CHARACTERISTICS TA=25°C, VCC=24V, VDD = 3.3V, fS = 48kHz, RL=8Ω with passive LC lowpass filter (L= 15µH, RDC= 63mΩ, C=220nF), input is 1kHz sinewave, volume is 0dB unless otherwise specified. Symbol PO Parameter RMS output power (Note 2) Condition Min. Typ. THD+N=0.25%, +8dB volume 20 THD+N=0.19%, +8dB volume 15 THD+N=0.16%, +8dB volume 10 Max. Unit W Total harmonic distortion + noise PO = 7.5W 0.15 % VNO Output noise 20Hz ~ 20kHz (Note 3) 120 µV SNR Signal-to-noise ratio +8dB volume, input level is -9dB (Note 3) 104 dB Dynamic range +8dB volume, input level is -68dB (Note 3) 110 dB Power supply ripple rejection VRIPPLE = 1VRMS at 1kHz -71 dB Channel separation -81 dB THD+N DR PSRR 1W @1kHz Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 9 IS31AP2121 I2C DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 4) Standard Mode Symbol Fast Mode Parameter Unit Min. Max. Min. Max. 0 100 0 400 fSCL Serial-Clock frequency tBUF Bus free time between a STOP and a START condition 4.7 1.3 μs tHD, STA Hold time (repeated) START condition 4.0 0.6 μs tSU, STA Repeated START condition setup time 4.7 0.6 μs tSU, STO STOP condition setup time 4.0 0.6 μs tHD, DAT Data hold time 0 tSU, DAT Data setup time 250 100 ns tLOW SCL clock low period 4.7 1.3 μs tHIGH SCL clock high period 4.0 0.6 μs 3.45 0 0.9 kHz μs tR Rise time of both SDA and SCL signals, receiving 1000 20+0.1Cb 300 ns tF Fall time of both SDA and SCL signals, receiving 300 20+0.1Cb 300 ns Cb Capacitive load for each bus line 400 400 pF VNL Noise margin at the low level for each connected device (including hysteresis) 0.1VDD 0.1VDD V VNH Noise margin at the high level for each connected device (including hysteresis) 0.2VDD 0.2VDD V I2S DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 4) Symbol Parameter Condition Min. 10.41 Typ. Max. Unit 31.25 μs tLR LRCIN period (1/FS) tBL BCLK rising edge to LRCIN edge 50 ns tLB LRCIN edge to BCLK rising edge 50 ns tBCC BCLK period (1/64FS) 162.76 488.3 ns tBCH BCLK pulse width high 81.38 244 ns tBCL CBLK pulse width low 81.38 244 ns tDS SDATA set up time 50 ns tDH SDATA hold time 50 ns Note 2: Thermal dissipation is limited by package type and PCB design. The external heat-sink or system cooling method should be adopted for maximum power output. Note 3: Measured with A-weighting filter. Note 4: Guaranteed by design. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 10 IS31AP2121 Figure 4 I2C Timing Figure 5 I2S Figure 6 Left-Alignment Figure 7 Right-Alignment Figure 8 System Clock Timing Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 11 IS31AP2121 Figure 9 Timing Relationship (Using I2S format as an example) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 12 IS31AP2121 TYPICAL PERFORMANCE CHARACTERISTICS 20 20 VCC = 24V RL = 8Ω Strero 10 5 2 THD+N(%) THD+N(%) 5 RL = 8Ω VCC = 24V Strereo 10 1 0.5 10kHz 0.2 0.1 2 PO = 10W 1 PO = 5W 0.5 PO = 1W 0.2 0.1 0.05 1kHz 20Hz PO = 0.25W 0.05 0.02 PO = 0.5W 0.02 0.01 1m 5m 10m 50m 100m 500m 1 2 5 10 20 0.01 20 50 50 100 200 Output Power(W) 1k 2k 20k 5k Frequency(Hz) Figure 10 THD+N vs. Output Power Figure 11 THD+N vs. Frequency +2 +0 VCC = 24V RL = 8Ω PO = 1W Stereo +1.5 VCC = 24V RL = 8Ω Stereo -20 Crosstalk(dB) +1 +0.5 dBr 500 +0 -0.5 -40 -60 -80 Left to Right 1 -100 -1.5 -2 20 Right to Left 50 100 200 500 1k 2k 5k 10k -120 20 20k 50 100 200 Frequency(Hz) 10k 20k 16k 18k 20k VCC = 24V RL = 8Ω Stereo +0 -20 -20 -30 -40 -40 dBV dBV 5k +20 VCC = 24V RL = 8Ω Stereo -10 2k Figure 13 Cross-Talk +20 +0 1k Frequency(Hz) Figure 12 Frequency Response +10 500 -50 -60 -60 -80 -70 -80 -100 -90 -100 -110 -120 -120 0k 2k 4k 6k 8k 10k 12k 14k 16k Frequency(Hz) Figure 14 Spectrum at Peak SNR at -1dB Signal Input Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 18k 20k -140 0k 2k 4k 6k 8k 10k 12k 14k Frequency(Hz) Figure 15 Spectrum at -60dB Signal Input Level 13 IS31AP2121 100 VCC=12V VCC=8V 90 Efficiency(%) 80 VCC=15V 70 60 VCC=18V 50 VCC=24V 40 30 20 RL = 8Ω Stereo 10 0 0 5 10 15 20 25 30 35 40 45 50 Output Power(W) Figure 16 Efficiency vs. Output Power (Power Saving Mode) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 14 IS31AP2121 FUNCTIONAL BLOCK DIAGRAM Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 15 IS31AP2121 APPLICATIONS INFORMATION IS31AP2121 has a built-in PLL internally, the default volume is muted. IS31AP2121 will activate while the de-mute command via I2C is programmed. PDB PDB OPERATION MODES Without I2C Control The default settings, Bass, Treble, EQ, Volume, DRC, PLL, Subwoofer Bandwidth, …, and Subwoofer gain are applied to register table content when using IS31AP2121 without I2C control. The more information about default settings, please refer to the highlighted column of register table section. -103dB Figure 17 Power Down Timing Diagrams With Mute With I2C Control When using I2C control, user can program suitable parameters into IS31AP2121 for their specific applications. Please refer to the register table section to get the more detail. PDB PDB INTERNAL PLL IS31AP2121 has a built-in PLL internally. The MCLK/FS ratio will be fixed at 1024x, 512x, or 256x with a sample frequency of 48kHz, 96kHz, or 192kHz respectively. A carrier clock frequency is the frequency divided by 128 of master clock. -103dB Table 1 MCLK/FS Ratio FS MCLK Frequency 48kHz 49.152MHz 44.1kHz 45.158MHz 32kHz 32.768MHz RESET When the RSTB pin is lowered, IS31AP2121 will clear the stored data and reset the register table to default values. IS31AP2121 will exit reset state at the 256th MCLK cycle after the RSTB pin is raised to high. POWER DOWN CONTROL IS31AP2121 has a built-in volume fade-in/fade-out design for power down and mute function. The relative power down timing diagrams for loudspeakers are shown below. Figure 18 Power Down Timing Diagrams The volume level will be decreased to -∞dB in several LRCIN cycles. Once the fade-out procedure is finished, IS31AP2121 will turn off the power stages, stop clock signals (MCLK, BCLK) from feeding into digital circuit and turn off the current of the internal analog circuits. After PDB pin is pulled low, IS31AP2121 needs up to 256 LRCIN clocks to finish the above works before entering power down state. Users can’t program IS31AP2121 during power down state, but all the settings of register table will still be kept except that DVDD is removed. If the PD function is disabled in the midway of the fade-out procedure, IS31AP2121 will also execute the fade-in procedure. In addition, IS31AP2121 will establish the analog circuits’ bias current and feed the clock signals (MCLK, BCLK) into digital circuits. Then, IS31AP2121 will return to its normal operation without power down. SELF-PROTECTION CIRCUITS IS31AP2121 has built-in protection circuits including thermal, short-circuit and under-voltage detection circuits. Thermal Protection When the internal junction temperature is higher than 158°C, power stages will be turned off and IS31AP2121 will return to normal operation once the Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 16 IS31AP2121 temperature drops to 125°C. The temperature values may vary around 10%. Low indicates an I2C address of 0x30, and high an address of 0x31. Short-Circuit Protection OUTPUT CONFIGURATION The short-circuit protection circuit protects the output stage when the wires connected to loudspeakers are shorted to each other or GND/VDD. For normal 24V operations, the current flowing through the power stage will be less than 7A for stereo configuration or less than 14A for mono configuration. Otherwise, the short-circuit detectors may pull the ERRORB pin to DGND, disabling the output stages. When the overtemperature or short-circuit condition occurs, the open-drain ERRORB pin will be pulled low and latched into ERROR state. The bit 4 [SEM] of address 0X11 and PBTL pin defines the configuration mode. IS31AP2121 can be configured to stereo, mono via PBTL pin (the bit 4 [SEM] of address 0X11 default is low). 2.1CH output mode configuration, user can via I2C to program it from the bit 4 [SEM] of address 0X11. Table 2 provides a reference of available configuration. Once the over-temperature or short-circuit condition is removed, IS31AP2121 will exit ERROR state when one of the following conditions is met: (1) RSTB pin is pulled low. (2) PDB pin is pulled low. (3) Master mute is enabled through the I2C interface. Table 2 Output Configurations [SEM] PBTL Configuration Mode 0 0 Stereo 0 1 Mono 1 x 2.1CH Under-voltage Protection Once the VDD voltage is lower than 2.7V, IS31AP2121 will turn off its loudspeaker power stages and cease the operation of digital processing circuits. When VDD becomes larger than 2.8V, IS31AP2121 will return to normal operation. ANTI-POP DESIGN IS31AP2121 will generate appropriate control signals to suppress pop sounds during initial power on/off, power down/up, mute, and volume level changes. 3D SURROUND SOUND IS31AP2121 provides the virtual surround sound technology with greater separation and depth voice quality for stereo signals. I2C CHIP SELECT Figure 19 Output Configurations ERRORB is an input pin during power. It can be pulled High (15kΩ pull up) or Low (15kΩ pull down). Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 17 IS31AP2121 POWER ON SEQUENCE Hereunder is IS31AP2121’s power on sequence. Give a de-mute command via I2C when the whole system is stable. Figure 20 Power On Sequence Table 2 Power On Sequence Symbol Condition POWER OFF SEQUENCE Hereunder is IS31AP2121’s power off sequence. Min. Max. Unit t1 0 - ms VCC t2 0 - ms VDD t3 10 - ms t4 0 - ms MCLK t5 10 - ms BCLK LRCIN t6 10 - ms RSTB t7 0 - ms t8 200 - ms t9 20 - ms I2C OUT t10 DEF=L - 0.1 ms t11 DEF=H - 0.1 ms t12 25 - ms t13 25 - ms t14 - 22 ms - 0.1 ms t15 DEF=L or H Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 PDB t4 t5 t3 t2 t1 Don’t Care Figure 21 Power Off Sequence 18 IS31AP2121 Table 3 Power Off Sequence Symbol Min. t1 (With I2C Control) 35ms t1 (Without I2C Control) 5ms t2 0ms (Note) t3 0ms t4 1ms t5 1ms Note: When t2 is less than 0.1ms, pop noise may occur. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 19 IS31AP2121 I2C-BUS TRANSFER PROTOCOL INTRODUCTION IS31AP2121 employs I2C-bus transfer protocol. Two wires, serial data and serial clock carry information between the devices connected to the bus. Each device is recognized by a unique 7-bit address and can operate as either a transmitter or a receiver. The master device initiates a data transfer and provides the serial clock on the bus. IS31AP2121 is always an I2C slave device. PROTOCOL START and STOP Condition START is identified by a high to low transition of the SDA signal. A START condition must precede any command for data transfer. A STOP is identified by a low to high transition of the SDA signal. A STOP condition terminates communication between IS31AP2121 and the master device on the bus. In both START and STOP, the SCL is stable in the high state. only occurs when SCL signal is low. IS31AP2121 samples the SDA signal at the rising edge of SCL signal. Device Addressing The master generates 7-bit address to recognize slave devices. When IS31AP2121 receives 7-bit address matched with 0110000 or 0110001 (ERRORB pin state during power up), IS31AP2121 will acknowledge at the 9th bit (the 8th bit is for R/W bit). The bytes following the device identification address are for IS31AP2121 internal sub-addresses. Data Transferring Each byte of SDA signaling must consist of 8 consecutive bits, and the byte is followed by an acknowledge bit. Data is transferred with MSB first, as shown in the figure below. In both write and read operations, IS31AP2121 supports both single-byte and multi-byte transfers. Refer to the figure below for detailed data-transferring protocol. Data Validity The SDA signal must be stable during the high period of the clock. The high or low change of SDA Figure 22 Data Transferring REGISTER DEFINITIONS The IS31AP2121’s audio signal processing data flow is shown below. Users can control these functions by programming appropriate settings in the register table. In this section, the register table is summarized first. The definition of each register follows in the next section. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 20 IS31AP2121 Dual Band DRC Enable (Only for stereo mode, PBTL=Low) Dual Bands DRC Disable L LRCIN ASRC PreScal BCLK M11 EQ1 EQ2 EQ7 EQ8 LCH EQ1 EQ2 EQ7 EQ8 RCH EQ1 EQ2 EQ3 EQ4 M12 SDATA I2S M21 R MCLK ASRC PreScal PLL M22 M31 SUB M32 LCH HPF RCH HPF RCH LPF Surround Surroun DRC1 Clipping 1 HPFdc PostScal 2 FIR S/H2 SDM Volume DRC1 Clipping 1 HPFdc PostScal 2 FIR S/H2 SDM Volume DRC2 Clipping 2 HPFdc PostScal 2 FIR S/H2 SDM Volume OUTLA PWM OUTLB Power OUTRA Stage OUTRB I2C SCL Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 SDA 21 IS31AP2121 Table 4 Register Function Address Name Table Default 00h State Control 1 Register 5 000x 0100 01h State Control 2 Register 6 x000 0100 02h State Control 3 Register 7 0xxx 1111 03h Master Volume Control Register 8 0001 1000 04h~06h Channel 1~3 Volume Register 9 0001 0100 07h,08h Bass/Treble Tone Register 10 xxx1 0000 09h Bass Management Crossover Frequency Register 11 xxxx 0010 0Ah State Control 4 Register 12 1001 0000 Channel 1~2 Configuration Register 13 xxx1 0010 0Dh Channel 3 Configuration Register 14 xxx1 0000 0Eh DRC Limiter Attack/Release Rate Register 15 0110 1010 - - 0Bh~0Ch 0Fh~10h Reserved 11h State Control 5 Register 16 xx11 0010 12h VCC Under-voltage Selection Register 17 1xxx 0001 13h Noise Gate Gain Register 18 x000 xx00 14h Coefficient RAM Base Address Register 19 x000 0000 20~24 - 25 xxxx 0000 - - 15h~23h 24h 25h~29h User-Defined Coefficients Register Coefficients Control Register Reserved 2Ah Power Saving Mode Switching Level Register 26 xxx0 1101 2Bh Volume Fine Tune Register 27 0011 1111 Note: The reserved registers are not allowed to write any bits in them, or the IC will be abnormal. Table 5 00h State Control 1 Register Bit D7:D5 D4 D3 Name IF - PWML_X Default 000 x 0 Bit D2 D1 D0 Name PWMR_X LV_UVSEL LREXC Default 1 0 0 IS31AP2121 supports multiple serial data input formats including I2S, Left-alignment and Rightalignment. These formats are selected by users via D7~D5 of address 00h. The left/right channels can be exchanged to each other by programming to address 00h/D0, LREXC. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 IF 000 001 010 011 100 101 Others Input Format I2S 16-24 bits Left-alignment 16-24 bits Right-alignment 16 bits Right-alignment 18 bits Right-alignment 20 bits Right-alignment 24 bits Not available PWML_X 0 1 OUTLA/B exchange No exchanged L/R exchanged PWMR_X 0 1 OUTRA/B exchange L/R exchanged No exchanged 22 IS31AP2121 LV_UVSEL 0 1 LV Under-voltage Selection 2.7V 3.0V LREXC 0 1 Left/Right Channel Exchanged No exchange L/R exchange Table 6 01h State Control 2 Register Bit D7: D6 D5:D4 D3:D0 Name - BCLK_SEL FS PMF Default x 0 00 0100 IS31AP2121 has a built-in PLL and multiple MCLK/Fs ratios are supported. Detail setting is shown in the following table. BCLK_SEL 0 1 MCLK-less (BCLK system) Disabled Enable FS 00 01 1x Sampling Frequency 32/44.1/48kHz 64/88.2/96kHz 128/176.4/192kHz Multiple MCLK/FS Ratio Setting 1024x(FS=00)/ 512x(FS=01)/ 256x(FS=1x) 0001 64x 0010 128x 0011 192x 0100 256x 0101 384x (Not available when FS=1x) 0110 512x (Not available when FS=1x) 0111 576x (Not available when FS=01,1x) 1000 768x (Not available when FS=01,1x) 1001 1024x (Not available when FS=01,1x) Others Not available Note: The FS × PMF should be lower than 49.152MHz, or the system will be error. PMF 0000 EN_CLK_OUT PLL Clock Output 0 Disabled 1 Enable MUTE 0 1 Master Mute All channel not muted All channel muted CMx 0 1 Channel x Mute Channel x not muted Only channel x muted Table 8 03h Master Volume Control Register Bit D7:D0 Name MV Default 0001 1000 IS31AP2121 supports both master-volume (03h Register) and channel-volume control (04h, 05h and 06h Registers) modes. Both volume control settings range from +12dB ~ -103dB and 0.5dB per step. Note that the master volume control is added to the individual channel volume control as the total volume control. For example, if the master volume level is set at, Level A (in dB unit) and the channel volume level is set at Level B (in dB unit), the total volume control setting is equal to Level A plus with Level B. -103dB ≤ Total volume (Level A + Level B) ≤ +24dB. MV 0000 0000 0000 0001 0000 0010 … 0001 1000 … 1110 0110 1110 0111 Others Master Volume +12.0dB +11.5dB +11.0dB 0dB -103.0dB -∞ -∞ Table 7 02h State Control 3 Register Bit D7 D6:D4 Name EN_CLK_OUT - Default 0 xxx D3 D2:D0 MUTE CM1:CM3 1 111 IS31AP2121 has mute function including master mute and channel mute. When master mute is enabled, all 3 processing channels are muted. User can mute these 3 channels individually by channel mute. When the mute function is enabled or disabled, the fade-out or fade-in process will be initiated. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 23 IS31AP2121 Table 9 04h~06h Channel 1~3 Volume Registers Bit D7:D0 Name CxV Default 0001 0100 CxV 0000 0000 0000 0001 … 0001 0100 … 1110 0110 1110 0111 Others XO 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Channel x Volume +12.0dB +11.5dB +2dB -103.0dB -∞ -∞ Bass Management Crossover Frequency 80Hz 100Hz 120Hz 140Hz 160Hz 180Hz 200Hz 300Hz 400Hz 500Hz 600Hz 700Hz 800Hz 900Hz 1000Hz Reserved Table 10 07h/08h Bass/Treble Tone Registers Bit D7:D5 D6:D0 Name - BTC/TTC Default xxx 10000 Last two sets of EQ can be programmed as bass/treble tone boost and cut. When, 0Ah Register, D6, BTE is set to high, the EQ-7 and EQ-8 will perform as bass and treble respectively. The -3dB corner frequency of bass is 360Hz, and treble is 7kHz. The gain range for both filters is +12db ~ 12dB with 1dB per step. BTC/TTC 00000 … 00100 00101 … 10000 10001 … 111xx Bass/Treble Gain Setting +12dB +12dB +11dB Table 12 0Ah State Control 4 Register Bit D7 D6 D5 D4 Name SRBP BTE TBDRCE NGE Default 1 0 0 1 Bit D3 D2 D1 D0 Name EQL PSL DSPB HPB Default 0 0 0 0 The IS31AP2121 provides several DSP setting as following. SRBP Surround Bypass 0 Surround enable 1 Surround bypass BTE 0 1 0dB -1dB -12dB Table 11 09h Bass Management Crossover Frequency Register Bit D7:D4 D3:D0 Name - XO Default xxxx 0010 The IS31AP2121 provides bass management crossover frequency selection. A 1st order high-pass filter (Channel 1 and 2) and a 2nd order low-pass filter (Channel 3) at selected frequency are performed. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 Bass/Treble Selection Bypass Bass/treble disable Bass/treble enable TBDRCE Two Band DRC Enable 0 Two band DRC disable 1 Two band DRC enable NGE 0 1 Noise Gate Enable Noise gate disable Noise gate enable EQL 0 1 EQ Link Each channel uses individual EQ Channel-2 uses channel-1 EQ PSL 0 1 Post-Scale Link Each channel uses individual post-scale Use channel-1 post-scale 24 IS31AP2121 DSPB EQ Bypass 0 EQ enable 1 EQ bypass HPB 0 1 Table 14 0Dh Channel 3 Configuration Register DC Blocking HPF Bypass HPF DC enable HPF DC bypass Table 13 0Bh~0Ch Channel 1~2 Configuration Registers Bit D7:D5 D4 D3 Name - CxDRCM CxPCBP Default xxx 1 0 Bit D2 D1 D0 Name CxDRCBP CxHPFBP CxVBP Default 0 1 0 The IS31AP2121 can configure each channel to enable or bypass DRC and channel volume and select the limiter set. IS31AP2121 support two mode of DRC, RMS and PEAK detection which can be selected via D4. Bit D7:D5 D4 D3 Name - C3DRCM C3PCBP Default xxx 1 0 Bit D2 D1 D0 Name C3DRCBP C3HPFBP C3VBP Default 0 0 0 The IS31AP2121 can configure each channel to enable or bypass DRC and channel volume and select the limiter set. IS31AP2121 support two mode of DRC, RMS and PEAK detection which can be selected via D4. C3DRCM 0 1 Channel 3 DRC Mode Peak detection RMS detection C3PCBP 0 1 Channel 3 Power Clipping Bypass Channel 3 PC enable Channel 3 PC bypass C3DRCBP 0 1 Channel 3 DRC Bypass Channel 3 DRC enable Channel 3 DRC bypass C3HPFBP 0 1 Channel 3 Bass Management LPF Bypass Channel 3 LPF enable Channel 3 LPF bypass Channel 3 Volume Bypass Channel 3 volume operation Channel 3 volume bypass CxDRCM 0 1 Channel 1/2 DRC Mode Peak detection RMS detection CxPCBP 0 1 Channel 1/2 Power Clipping Bypass Channel 1/2 PC enable Channel 1/2 PC bypass CxDRCBP 0 1 Channel 1/2 DRC Bypass Channel 1/2 DRC enable Channel 1/2 DRC bypass C3VBP 0 1 CxHPFBP Channel 1/2 Bass Management HPF Bypass Table 15 0Eh DRC Limiter Attack/Release Rate Register 0 1 Channel 1/2 HPF enable Channel 1/2 HPF bypass CxVBP 0 Channel 1/2 Volume Bypass Channel 1/2’s master volume operation Channel 1/2’s master volume bypass 1 Bit D7:D5 D6:D0 Name LA LR Default 0110 1010 The IS31AP2121 defines a set of limiter. The attack/release rates are defines as following table. LA 0000 0001 0010 0011 0100 0101 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 DRC Attack Rate 3dB/ms 2.667dB/ms 2.182dB/ms 1.846dB/ms 1.333dB/ms 0.889dB/ms 25 IS31AP2121 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0.4528dB/ms 0.2264dB/ms 0.15dB/ms 0.1121dB/ms 0.0902dB/ms 0.0752dB/ms 0.0645dB/ms 0.0563dB/ms 0.0501dB/ms 0.0451dB/ms LR 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 DRC Release Rate 0.5106dB/ms 0.1371dB/ms 0.0743dB/ms 0.0499dB/ms 0.0360dB/ms 0.0299dB/ms 0.0264dB/ms 0.0208dB/ms 0.0198dB/ms 0.0172dB/ms 0.0147dB/ms 0.0137dB/ms 0.0134dB/ms 0.0117dB/ms 0.0112dB/ms 0.0104dB/ms DIS_MCLK_DET Disable MCLK Detect Circuit 0 Enable MCLK detect circuit 1 Disable MCLK detect circuit D7:D6 Name - Default xx Power Saving Mode Disable Enable PWM_SEL 0 1 PWM Modulation Qua-ternary Ternary Table 17 12h VCC Under-voltage Selection Register Bit D7 D6:D4 D3:D0 Name Dis_HVUV - HV_UVSEL Default 1 xxx 0001 IS31AP2121 can disable HV under-voltage detection via D7. IS31AP2121 support multi-level HV undervoltage detection via D3~ D0, using this function, IS31AP2121 will fade out signal to avoid pop sounds if high voltage supply disappear before low voltage supply. Table 16 11h State Control 5 Register Bit QT_EN 0 1 D5 D4 D3 SW_RSTB LVUV_FADE 1 SEM 1 0 Bit D2 D1 D0 Name DIS_MCLK_DET QT_EN PWM_SEL Default 0 1 0 SW_RSTB 0 1 Software Reset Reset Normal operation LVUV_FADE 0 1 Low Under-voltage Fade No fade fade SEM 0 1 Single End Mode 2.0 mode (2BTL or 1PBTL) 2.1 mode (2SE+1BTL) Dis_HVUV 0 1 Disable HV Under-voltage Selection Enable Disable HV_UVSEL 0000 0001 0011 0100 1100 Others UV Detection Level 8.2V 9.7V 13.2V 15.5V 19.5V 9.7V Table 18 13h Noise Gate Gain Register Bit D7 D6 D5 Name - A_SEL_FAULT D_MOD Default x 0 0 Bit D4 D3:D2 D1:D0 Name DIS_NG_FADE - NG_GAIN Default 0 xx 00 The ERRORB pin of IS31AP2121 is a dual function pin. It is treated as an I2C device address selection input when D6 is set as low. It will become as an ERROR output pin when D6 is set as high. IS31AP2121 provide noise gate function if receiving 2048 signal sample points smaller than noise gate attack level. User can change noise gate gain via Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 26 IS31AP2121 D1~ D0. When noise gate function occurs, input signal will multiply noise gate gain (x1/8, x1/4 x1/2, x0). User can select fade out or not via D4. A_SEL_FAULT I2C Address Selection or ERROR output 0 I2C address selection 1 ERROR output D_MOD 0 1 Delta Quaternary Modulation Disable Enable DIS_NG_FADE Disable Noise Gate Fade 0 Fade 1 No fade NG_GAIN 00 01 10 11 Noise Gate Gain x1/8 x1/4 x1/2 Mute Table 19 14h Coefficient RAM Base Address Register Bit D7 D6:D0 Name - CFA Default x 000 0000 An on-chip RAM in IS31AP2121 stores user-defined EQ and mixing coefficients. The content of this coefficient RAM is indirectly accessed via coefficient registers, which consist of one base address register (14h), five sets of registers (15h ~ 23h) of three consecutive 8-bit entries for each 24-bit coefficient, and one control register (24h) to control access of the coefficients in the RAM. CFA Coefficient RAM Base Address Table 20 15h~17h User-Defined Coefficients Registers (Top/Middle/Bottom 8-bits of coefficients A1) Bit D7:D0 Name C1B Default - Table 21 18h~1Ah User-Defined Coefficients Registers (Top/Middle/Bottom 8-bits of coefficients A2) Bit D7:D0 Name C2B Default - Table 22 1Bh~1Dh User-Defined Coefficients Registers (Top/Middle/Bottom 8-bits of coefficients A1) Bit D7:D0 Name C3B Default - Table 23 1Eh~20h User-Defined Coefficients Registers (Top/Middle/Bottom 8-bits of coefficients B2) Bit D7:D0 Name C4B Default - Table 24 21h~23h User-Defined Coefficients Registers (Top/Middle/Bottom 8-bits of coefficients A0) Bit D7:D0 Name C5B Default - Table 25 24h Coefficients Control Register Bit D7:D4 D3 D2 D1 D0 Name - RA R1 WA W1 Default xxxx 0 0 0 0 RA 0 1 R1 0 1 WA 0 1 W1 0 1 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 Enable of Reading a Set of Coefficients from RAM Read complete Read enable Enable of Reading a Single Coefficient from RAM Read complete Read enable Enable of Writing a Set of Coefficients to RAM Write complete Write enable Enable of Writing a Single Coefficient to RAM Write complete Write enable 27 IS31AP2121 Table 26 2Ah Power Saving Mode Switching Level Register Bit D7:D5 D4:D0 Name QT_SW_WINDOW QT_SW_LEVEL Default 000 01101 If the PWM exceeds the programmed switching power level (default 26×40ns), the modulation algorithm will change from quaternary into power saving mode. It results in higher power efficiency during larger power output operations. If the PWM drops below the programmed switching power level power saving mode hysteresis window, the modulation algorithm will change back to quaternary modulation. QT_SW_WINDOW 000 001 010 011 100 101 110 111 Power Saving Mode Hysteresis Window 2 3 4 5 6 7 8 9 MV_FT 00 01 10 11 Master Volume Fine Tune 0dB -0.125dB -0.25dB -0.375dB C1V_FT 00 01 10 11 Channel 1 Volume Fine Tune 0dB -0.125dB -0.25dB -0.375dB C2V_FT 00 01 10 11 Channel 2 Volume Fine Tune 0dB -0.125dB -0.25dB -0.375dB C3V_FT 00 01 10 11 Channel 3 Volume Fine Tune 0dB -0.125dB -0.25dB -0.375dB RAM ACCESS QT_SW_LEVEL 00000 4 00001 4 … 01101 26 01110 28 01111 30 … 11110 60 11111 62 The procedure to read/write coefficient(s) from/to RAM is as followings: Switching Level Read A Single Coefficient From RAM: 1. Write 7-bits of address to I2C address-0X14 2. Write 1 to R1 bit in address-0X24 3. Read top 8-bits of coefficient in I2C address-0X15 4. Read middle 8-bits of coefficient in I2C address0X16 5. Read bottom 8-bits of coefficient in I2C address0X17 Read A Set Of Coefficients From RAM: Table 27 2Bh Volume Fine Tune Register Bit D7:D6 D5:D4 D3:D2 D1:D0 Name MV_FT C1V_FT C2V_FT C3V_FT Default 00 11 11 11 IS31AP2121 supports both master-volume fine tune and channel-volume control fine tune modes. Both volume control settings range from 0dB ~ -0.375dB and 0.125dB per step. Note that the master volume fine tune is added to the individual channel volume fine tune as the total volume fine tune. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 1. Write 7-bits of address to I2C address-0X14 2. Write 1 to RA bit in address-0X24 3. Read top 8-bits of coefficient A1 in I2C address0X15 4. Read middle 8-bits of coefficient A1in I2C address-0X16 5. Read bottom 8-bits of coefficient A1 in I2C address-0X17 6. Read top 8-bits of coefficient A2 in I2C address0X18 7. Read middle 8-bits of coefficient A2 in I2C address-0X19 8. Read bottom 8-bits of coefficient A2 in I2C address-0X1A 9. Read top 8-bits of coefficient B1 in I2C address0X1B 28 IS31AP2121 10. Read middle 8-bits of coefficient B1 in I2C address-0X1C 11. Read bottom 8-bits of coefficient B1 in I2C address-0X1D 12. Read top 8-bits of coefficient B2 in I2C address0X1E 13. Read middle 8-bits of coefficient B2 in I2C address-0X1F 14. Read bottom 8-bits of coefficient B2 in I2C address-0X20 15. Read top 8-bits of coefficient A0 in I2C address0X21 16. Read middle 8-bits of coefficient A0 in I2C address-0X22 17. Read bottom 8-bits of coefficient A0 in I2C address-0X23 16. Write bottom 8-bits of coefficient A0 in I2C address-0X23 17. Write 1 to WA bit in address-0X24 Note: the read and write operation on RAM coefficients works only if LRCIN (Pin 15) switching on rising edge. And, before each writing operation, it is necessary to read the address-0X24 to confirm whether RAM is writable current in first. If the logic of W1 or WA is high, the coefficient writing is prohibited. USER-DEFINED EQUALIZER The IS31AP2121 provides 20 parametric Equalizer (EQ). Users can program suitable coefficients via I2C control interface to program the required audio band frequency response for every EQ. The transfer function Write A Single Coefficient From RAM: 1. Write 7-bis of address to I2C address-0X14 2. Write top 8-bits of coefficient in I2C address-0X15 3. Write middle 8-bits of coefficient in I2C address0X16 4. Write bottom 8-bits of coefficient in I2C address0X17 5. Write 1 to W1 bit in address-0X24 Write A Set Of Coefficients From RAM: 1. Write 7-bits of address to I2C address-0X14 2. Write top 8-bits of coefficient A1 in I2C address0X15 3. Write middle 8-bits of coefficient A1 in I2C address-0X16 4. Write bottom 8-bits of coefficient A1 in I2C address-0X17 5. Write top 8-bits of coefficient A2 in I2C address0X18 6. Write middle 8-bits of coefficient A2 in I2C address-0X19 7. Write bottom 8-bits of coefficient A2 in I2C address-0X1A 8. Write top 8-bits of coefficient B1 in I2C address0X1B 9. Write middle 8-bits of coefficient B1 in I2C address-0X1C 10. Write bottom 8-bits of coefficient B1 in I2C address-0X1D 11. Write top 8-bits of coefficient B2 in I2C address0X1E 12. Write middle 8-bits of coefficient B2 in I2C address-0X1F 13. Write bottom 8-bits of coefficient B2 in I2C address-0X20 14. Write top 8-bits of coefficient A0 in I2C address0X21 15. Write middle 8-bits of coefficient A0 in I2C address-0X22 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 H (z) A0 A1 z 1 A2 z 2 1 B1 z 1 B2 z 2 The data format of 2’s complement binary code for EQ coefficient is 3.21. i.e., 4-bits for integer (MSB is the sign bit) and 21-bits for mantissa. Each coefficient range is from 0x800000 (-4) to 0x7FFFFF (+3.999999523). These coefficients are stored in User Defined RAM and are referenced in following manner: CHxEQyA0=A0 CHxEQyA1=A1 CHxEQyA2=A2 CHxEQyB1=-B1 CHxEQyB2=-B2 Where x and y represents the number of channel and the band number of EQ equalizer. All user-defined filters are path-through, where all coefficients are defaulted to 0 after being powered up, except the A0 that is set to 0x200000 which represents 1. MIXER The IS31AP2121 provides mixers to generate the extra audio source from the input left and right channels. The coefficients of mixers are defined in range from 0x800000 (-1) to 0x7FFFFF (0.9999998808). The function block diagram is as following figure: 29 IS31AP2121 ATTACK THRESHOLD The IS31AP2121 provides power limited function. When the input RMS exceeds the programmable attack threshold value, the output power will be limited by this threshold power level via gradual gain reduction. Two sets of power limit are provided. One is used of channel 1 and channel 2, while the other is used for channel 3. Attack threshold is defined by 24-bit representation and is stored in RAM address 0X71 and 0X72. RELEASE THRESHOLD Figure 23 Mixer Function Block Diagram PRE-SCALE For each audio channel, IS31AP2121 can scale input signal level prior to EQ processing which is realized by a 24-bit signed fractional multiplier. The pre-scale factor, ranging from -1 (0x800000) to 0.9999998808 (0x7FFFFF), for this multiplier, can be loaded into RAM. The default values of the prescaling factors are set to 0x7FFFFF. Programming of RAM is described in RAM access. POST-SCALE The IS31AP2121 provides an additional multiplication after equalizing and before interpolation stage, which is realized by a 24-bit signed fractional multiplier. The post-scaling factor, ranging from -1 (0x800000) to 0.9999998808 (0x7FFFFF), for this multiplier, can be loaded into RAM. The default values of the post-scaling factors are set to 0x7FFFFF. All channels can use the channel-1 post-scale factor by setting the post-scale link. Programming of RAM is described in RAM access. After IS31AP2121 has reached the attack threshold, its output power will be limited to that level. The output power level will be gradually adjusted to the programmable release threshold level. Two sets of power limit are provided. One is used of channel 1 and channel 2, while the other is used for channel 3. Release threshold is defined by 24-bit representation and is stored in RAM address 0X73 and 0X74. The following table shows the attack and release threshold’s numerical representation. Table 29 Sample Calculation For Attack And Release Threshold Hex Power dB Linear Decimal (3.21 Format) (VCC^2)/R 0 1 2097152 200000 (VCC^2)/2R -3 0.5 1048576 100000 (VCC^2)/4R -6 0.25 524288 80000 (VCC^2)/R ×L x L= D= 10(x/10) 2097152×L H= dec2hex(D) To best illustrate the power limit function, please refer to the following figure. POWER CLIPPING The IS31AP2121 provides power clipping function to avoid excessive signal that may destroy loud speaker. Two sets of power clipping are provided. One is used for both channel 1 and channel 2, while the other is used for channel 3. The power clipping level is defined by 24-bit representation and is stored in RAM address 0X6F and 0X70. The following table shows the power clipping level’s numerical representation. Table 28 Sample Calculation for Power Clipping Max. Hex dB Linear Decimal Amplitude (3.21 Format) VCC 0 1 2097152 200000 VCC×0.707 -3 0.707 1482686 169FBE VCC×0.5 -6 0.5 1048576 100000 VCC×L x D= H= L= 10(x/20) 2097152×L dec2hex(D) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 30 IS31AP2121 Attack Threshold Release Threshold Input Release Threshold Attack Threshold Gain ∆gain2 ∆gain1 ∆t1 Touch Attack Threshold Attack rate=∆gain1/∆t1 Release rate=∆gain2/∆t2 ∆t2 Under Release Threshold Attack Threshold Release Threshold Output Release Threshold Attack Threshold Figure 24 Attack And Release Threshold NOISE GATE ATTACK LEVEL DRC ENERGY COEFFICIENT When both left and right signals have 2048 consecutive sample points less than the programmable noise gate attack level, the audio signal will multiply noise gate gain, which can be set at x1/8, x1/4, x1/2, or zero if the noise gate function is enabled. Noise gate attack level is defined by 24bit representation and is stored in RAM address 0X75. NOISE GATE RELEASE LEVEL After entering the noise gating status, the noise gain will be removed whenever IS31AP2121 receives any input signal that is more than the noise gate release level. Noise gate release level is defined by 24-bit representation and is stored in RAM address 0X76. The following table shows the noise gate attack and release threshold level’s numerical representation. Table 30 Sample Calculation for Noise Gate Attack and Release Level Input Hex Linear Decimal Amplitude (1.23 Format) 0dB -100dB -110dB xdB 1 8388607 7FFFFF -5 83 53 -5.5 26 1A D= 8388607×L H= dec2hex(D) 10 10 L= 10(x/20) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 Figure 25 Digital Processing of Calculating RMS Signal Power The above figure illustrates the digital processing of calculating RMS signal power. In this processing, a DRC energy coefficient is required, which can be programmed for different frequency range. Two sets of energy coefficients are provided. One is used of channel 1 and channel 2, while the other is used for channel3. Energy coefficient is defined by 24-bit representation and is stored in RAM address 0X77 and 0X78. The following table shows the DRC energy coefficient numerical representation. 31 IS31AP2121 Table 31 Sample Calculation for DRC Energy Coefficient DRC Energy Hex dB Linear Decimal Coefficient (1.23 Format) 1 0 1 8388607 7FFFFF 1/256 -48.2 1/256 32768 8000 1/1024 -60.2 1/1024 8192 2000 L x D= L= H= 10(x/20) 8388607×L dec2hex(D) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 32 IS31AP2121 THE USER DEFINED RAM The contents of user defined RAM is represented in following table. Table 32 User Defined RAM Address Name 0x00 0x01 0x02 Channel 1 EQ1 Coefficient Default Address CH1EQ1A1 0x000000 0x32 CH1EQ1A2 0x000000 0x33 Name Channel 2 EQ1 Coefficient Default CH2EQ1A1 0x000000 CH2EQ1A2 0x000000 CH2EQ1B1 0x000000 CH2EQ1B2 0x000000 CH1EQ1B1 0x000000 0x34 CH1EQ1B2 0x000000 0x35 0x04 CH1EQ1A0 0x200000 0x36 CH2EQ1A0 0x200000 0x05 CH1EQ2A1 0x000000 0x37 CH2EQ2A1 0x000000 CH1EQ2A2 0x000000 0x38 CH2EQ2A2 0x000000 CH2EQ2B1 0x000000 0x03 0x06 0x07 Channel 1 EQ2 Channel 2 EQ2 CH1EQ2B1 0x000000 0x39 0x08 CH1EQ2B2 0x000000 0x3A CH2EQ2B2 0x000000 0x09 CH1EQ2A0 0x200000 0x3B CH2EQ2A0 0x200000 0x0A CH1EQ3A1 0x000000 0x3C CH2EQ3A1 0x000000 CH1EQ3A2 0x000000 0x3D CH2EQ3A2 0x000000 CH2EQ3B1 0x000000 0x0B 0x0C Channel 1 EQ3 Channel 2 EQ3 CH1EQ3B1 0x000000 0x3E 0x0D CH1EQ3B2 0x000000 0x3F CH2EQ3B2 0x000000 0x0E CH1EQ3A0 0x200000 0x40 CH2EQ3A0 0x200000 0x0F CH1EQ4A1 0x000000 0x41 CH2EQ4A1 0x000000 CH1EQ4A2 0x000000 0x42 CH2EQ4A2 0x000000 CH2EQ4B1 0x000000 0x10 0x11 Channel 1 EQ4 Channel 2 EQ4 CH1EQ4B1 0x000000 0x43 0x12 CH1EQ4B2 0x000000 0x44 CH2EQ4B2 0x000000 0x13 CH1EQ4A0 0x200000 0x45 CH2EQ4A0 0x200000 0x14 CH1EQ5A1 0x000000 0x46 CH2EQ5A1 0x000000 CH1EQ5A2 0x000000 0x47 CH2EQ5A2 0x000000 CH2EQ5B1 0x000000 0x15 0x16 Channel 1 EQ5 Channel 2 EQ5 CH1EQ5B1 0x000000 0x48 0x17 CH1EQ5B2 0x000000 0x49 CH2EQ5B2 0x000000 0x18 CH1EQ5A0 0x200000 0x4A CH2EQ5A0 0x200000 0x19 CH1EQ6A1 0x000000 0x4B CH2EQ6A1 0x000000 CH1EQ6A2 0x000000 0x4C CH2EQ6A2 0x000000 CH2EQ6B1 0x000000 0x1A 0x1B Channel 1 EQ6 Channel 2 EQ6 CH1EQ6B1 0x000000 0x4D 0x1C CH1EQ6B2 0x000000 0x4E CH2EQ6B2 0x000000 0x1D CH1EQ6A0 0x200000 0x4F CH2EQ6A0 0x200000 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 33 IS31AP2121 Table 32 User Defined RAM (Continues) Address Name 0x1E 0x1F 0x20 Channel 1 EQ7 Coefficient Default Address CH1EQ7A1 0x000000 0x50 CH1EQ7A2 0x000000 0x51 Name Channel 2 EQ7 Coefficient Default CH2EQ7A1 0x000000 CH2EQ7A2 0x000000 CH2EQ7B1 0x000000 CH2EQ7B2 0x000000 CH1EQ7B1 0x000000 0x52 CH1EQ7B2 0x000000 0x53 0x22 CH1EQ7A0 0x200000 0x54 CH2EQ7A0 0x200000 0x23 CH1EQ8A1 0x000000 0x55 CH2EQ8A1 0x000000 CH1EQ8A2 0x000000 0x56 CH2EQ8A2 0x000000 CH2EQ8B1 0x000000 0x21 0x24 0x25 Channel 1 EQ8 Channel 2 EQ8 CH1EQ8B1 0x000000 0x57 0x26 CH1EQ8B2 0x000000 0x58 CH2EQ8B2 0x000000 0x27 CH1EQ8A0 0x200000 0x59 CH2EQ8A0 0x200000 0x28 CH1EQ9A1 0x000000 0x5A CH2EQ9A1 0x000000 CH1EQ9A2 0x000000 0x5B CH2EQ9A2 0x000000 CH2EQ9B1 0x000000 0x29 0x2A Channel 3 EQ1 Channel 3 EQ2 CH1EQ9B1 0x000000 0x5C 0x2B CH1EQ9B2 0x000000 0x5D CH2EQ9B2 0x000000 0x2C CH1EQ9A0 0x200000 0x5E CH2EQ9A0 0x200000 0x2D CH3EQ1A1 0x000000 0x5F CH3EQ2A1 0x000000 CH3EQ1A2 0x000000 0x60 CH3EQ2A2 0x000000 CH3EQ2B1 0x000000 0x2E 0x2F Channel 3 EQ3 Channel 3 EQ4 CH3EQ1B1 0x000000 0x61 0x30 CH3EQ1B2 0x000000 0x62 CH3EQ2B2 0x000000 0x31 CH3EQ1A0 0x200000 0x63 CH3EQ2A0 0x200000 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 34 IS31AP2121 Table 32 User Defined RAM (Continues) Address Name Coefficient Default 0x64 Channel 1 Mixer1 M11 0x7FFFFF 0x65 Channel 1 Mixer2 M12 0x000000 0x66 Channel 2 Mixer1 M21 0x000000 0x67 Channel 2 Mixer2 M22 0x7FFFFF 0x68 Channel 3 Mixer1 M31 0x400000 0x69 Channel 3 Mixer2 M32 0x400000 0x6A Channel 1 Prescale C1PRS 0x7FFFFF 0x6B Channel 2 Prescale C2PRS 0x7FFFFF 0x6C Channel 1 Postscale C1POS 0x7FFFFF 0x6D Channel 2 Postscale C2POS 0x7FFFFF 0x6E Channel 3 Postscale C3POS 0x7FFFFF 0x6F CH1.2 Power Clipping PC1 0x200000 0x70 CH3 Power Clipping PC2 0x200000 0x71 CH1.2 DRC Attack Threshold DRC1_ATH 0x200000 0x72 CH1.2 DRC Release Threshold DRC1_RTH 0x80000 0x73 CH3 DRC Attack Threshold DRC2_ATH 0x200000 0x74 CH3 DRC Release Threshold DRC2_RTH 0x80000 0x75 Noise Gate Attack Level NGAL 0x0001A 0x76 Noise Gate Release Level NGRL 0x000053 0x77 DRC1 Energy Coefficient DRC1_EC 0x8000 0x78 DRC2 Energy Coefficient DRC2_EC 0x2000 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 35 IS31AP2121 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Figure 26 Classification Profile Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 36 IS31AP2121 PACKAGE INFORMATION eLQFP-48 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0A, 10/17/2014 37