BAS116 SURFACE MOUNT LOW LEAKAGE DIODE Features • • • • Mechanical Data Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current Lead Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 1 and 2) Qualified to AEC-Q101 Standards for High Reliability • • • • • • Case: SOT23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Weight: 0.008 grams (approximate) SOT23 Top View Internal Schematic Top View Ordering Information (Note 3) Part Number BAS116-7-F BAS116-13-F BAS116Q-7-F BAS116Q-13-F Notes: Qualification Commercial Commercial Automotive Automotive Case SOT23 SOT23 SOT23 SOT23 Packaging 3,000/Tape & Reel 10,000/Tape & Reel 3,000/Tape & Reel 10,000/Tape & Reel 1. No purposefully added lead. Halogen and Antimony Free. 2. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information YM XXX Date Code Key Year Code Month Code XXX = Product Type Marking Code; K50, K54 YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) 2001 M 2002 N ….. ….. 2009 W 2010 X 2011 Y 2012 Z 2013 A 2014 B 2015 C 2016 D 2017 E Jan 1 Feb 2 Mar 3 Apr 4 May 5 Jun 6 Jul 7 Aug 8 Sep 9 Oct O Nov N Dec D BAS116 Document number: DS30233 Rev. 10 - 2 1 of 4 www.diodes.com November 2011 © Diodes Incorporated BAS116 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 4) Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current Symbol VRRM VRWM VR VR(RMS) IFM IFRM @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFSM Value Unit 85 V 60 215 500 4.0 1.0 0.5 V mA mA A Thermal Characteristics Characteristic Power Dissipation (Note 4) @TA = 25°C Symbol PD Value 250 Unit mW Thermal Resistance Junction to Ambient Air (Note 4) @TA = 25°C Operating and Storage Temperature Range RθJA TJ, TSTG 500 -65 to +150 °C/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Symbol V(BR)R Min 85 Typ ⎯ Max ⎯ Unit V V Forward Voltage VF ⎯ ⎯ 0.90 1.0 1.1 1.25 Leakage Current (Note 5) IR ⎯ ⎯ 5.0 80 Total Capacitance CT ⎯ 2 ⎯ nA nA pF Reverse Recovery Time trr ⎯ ⎯ 3.0 μs Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect. 300 300 250 RθJA = 500°C/W 200 150 100 50 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve BAS116 Document number: DS30233 Rev. 10 - 2 Note 4 250 IF, FORWARD CURRENT (mA) PD, POWER DISSIPATION (mW) Test Condition IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, Tj = 150°C VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 150 2 of 4 www.diodes.com 200 150 100 50 0 0 50 100 150 TA, AMBIENT TEMPERATURE (° C) Fig. 2 Current Derating Curve 200 November 2011 © Diodes Incorporated 1,000 10 VR = 75V 100 10 IR, REVERSE CURRENT (nA) IF, INSTANTANEOUS FORWARD CURRENT (mA) BAS116 TA = 150°C TA = 125°C 1 T A = 85°C TA = 25°C 0.1 0.01 1 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 3 Typical Forward Characteristics 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) Fig. 4 Typical Reverse Characteristics 200 Package Outline Dimensions A SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00 K1 0.400 L 0.45 0.61 0.55 M 0.085 0.18 0.11 0° 8° α All Dimensions in mm B C H K M K1 D J F L G Suggested Pad Layout Y Z C X BAS116 Document number: DS30233 Rev. 10 - 2 Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35 E 3 of 4 www.diodes.com November 2011 © Diodes Incorporated BAS116 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com BAS116 Document number: DS30233 Rev. 10 - 2 4 of 4 www.diodes.com November 2011 © Diodes Incorporated