HT16L21 RAM Mapping 32×4 LCD Driver Feature Applications • Logic operating voltage: 1.8V~5.5V • Leisure products • LCD operating voltage (VLCD): 2.4V~6.0V • Games • External VLCD pin to supply LCD operating voltage • Telephone display • Internal 32kHz RC oscillator • Audio combo display • Bias: 1/2 or 1/3; Duty:1/4 • Video player display • Internal LCD bias generation with voltage-follower buffers • Kitchen appliance display • Integrated regulator to adjust LCD operating voltage: 3.0V, 3.2V, 3.3V, 3.4V, 4.4V, 4.5V, 4.6V, 5.0V • Household appliance • Measurement equipment display • Consumer electronics • Integrated LED driver • Support I2C or SPI 3-wire serial interface controlled by IFS pin General Description The HT16L21 device is a memory mapping and multi-function LCD controller/driver. The display segments of the device are 128 patterns (32 segments and 4 commons) display. It can also support LED drive outputs on certain Segment pins. The software configuration feature of the HT16L21 device makes it suitable for multiple LCD applications including LCD modules and display subsystems. The HT16L21 device communicates with most microprocessors/microcontrollers via a two-wire bidirectional I2C or a three-wire SPI interface. • Four selectable LCD frame frequencies: 64Hz or 85.3Hz or 128Hz or 170.6Hz • 32×4 bits RAM for display data storage • Max. 32×4 pixel: 32 segments and 4 commons • Support two driver output mode segment/LED on SEG24~SEG31/LED7~LED0 • Versatile blinking modes: off, 0.5Hz, 1Hz, 2Hz • R/W address auto increment • Low power consumption • Manufactured in silicon gate CMOS process • Package types: 44LQFP Rev. 1.00 1 November 16, 2011 HT16L21 Block Diagram VDD voltage supported range RSTB VDD Power_on reset VSS SDA/DIO SCL/CLK CSB Internal RC Oscillator Timing generator I2C or 3-wire Controller 8 Display RAM Column /Segment driver output COM0 COM3 IFS VE bit VLCD Regulator SEG0 R － OP1 ＋ R LCD Voltage Selector Segment /LED driver output SEG23 SEG24/LED7 － OP0 ＋ R LCD bias generator SEG31/LED0 VLCD voltage supported range Rev. 1.00 2 November 16, 2011 HT16L21 Pin Assignment SEG23 LED7/SEG24 LED6/SEG25 LED5/SEG26 LED4/SEG27 LED3/SEG28 LED2/SEG29 LED1/SEG30 LED0/SEG31 VSS IFS CSB CLK/SCL DIO/SDA RSTB VDD VLCD COM0 COM1 COM2 COM3 SEG0 44 43 42 41 40 39 38 37 36 35 34 33 1 32 2 31 3 30 4 29 5 HT16L21 28 44 LQFP 6 27 7 26 8 25 9 24 10 23 11 12 13 14 15 16 17 18 19 20 21 22 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 Pin Description Pin Name Type Description SDA/DIO I/O Serial data input/output pin ●●Serial data (SDA) input/output for 2-wire I2C interface is an NMOS open drain structure. ●●Serial data (DIO) input/output for 3-wire SPI interface is a CMOS input/output structure. SCL/CLK I Serial clock input pin ●●Serial data (SCL) is clock input for 2-wire I2C interface. ●●Serial data (CLK) is clock input for 3-wire SPI interface CSB I Chip select pin This pin is available for 3-wire SPI interface and not used for I2C interface. IFS I Communication interface select pin This pin is used to select the communication interface. When this pin is connected to VDD, the device communicates with MCU or microprocessors via a 2-wire I2C interface. When this pin is connected to VSS, the device communicates with MCU or microprocessors using a 3-wire SPI interface. COM0~COM3 O LCD common outputs SEG0~SEG23 O LCD segment outputs SEG24/LED7~SEG31/LED0 O LCD segment/LED multiplexed driver outputs RSTB I Reset input pin 1. This pin is used to initialize all the internal registers and the commands pin. 2. If use internal power on reset circuit only, the RSTB pin must be connected to VDD. VDD — Positive power supply VSS — Negative power supply, ground. VLCD — LCD power supply pin Rev. 1.00 3 November 16, 2011 HT16L21 Approximate Internal Connections SCL, SDA (for schmit Trigger type) DIO (for Schmitt trigger type) COM0~COM4; SEG0~SEG31 VDD Vselect-on Vselect-off VSS VSS LED0~7 IFS, RSTB CSB, CLK (for schmit Trigger type) VDD VDD VSS VSS VSS Absolute Maximum Ratings Supply voltage .......................................................................................................................VSS−0.3V to VSS+6.6V Input voltage ......................................................................................................................... VSS−0.3V to VDD+0.3V LED driver output current (total)...................................................................................................................... 88mA Storage temperature ........................................................................................................................-55°C to +150°C Operating temperature ......................................................................................................................-40°C to +85°C Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings" may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 4 November 16, 2011 HT16L21 Timing Diagrams I2C timing SDA tBUF tSU:DAT tf tLOW tSP tHD:STA tr SCL tHD:STA tHD:DAT S tSU:STA tHIGH tAA tSU:STO S P Sr SDA OUT SPI timing tCSW 90% VDD 90% CSB 10% 10% tCSL VSS tSYS tCSH 90% CLK 90% tCW 10% tDS 90% VDD 90% tCW 10% 10% 10% VSS tHS 90% 90% 10% 10% VDD DIO (INPUT ) tPD VSS tPD 90% 90% 10% 10% VDD DIO (OUTPUT ) VSS Reset timing 80% tSR 0.9V VDD tRSON 0.9V tPOF tRW 50% RSTB Data transfer 50% tRSOFF 50% tRSOFF 50% 50% tRSOFF 50% 50% Note: 1. If the conditions of reset timing are not satisfied in power ON/OFF sequence, the internal power on reset (POR) circuit will not operate normally. 2. If the VDD drops lower than the minimum operating voltage during operating, the conditions of power on reset timing must also be satisfied. That is the VDD drop to 0.9V and keep at 0.9V for 10ms (min.) before rising to the normal operating voltage. 3. Data transfers on the I2C interface or SPI 3-wire serial interface should at least be delayed for 1ms after the power-on sequence to ensure that the reset operation is complete. Rev. 1.00 5 November 16, 2011 HT16L21 D.C. Characteristics Symbol Parameter VSS=0V; VDD=1.8V to 5.5V; Ta=-40~85°C Test Condition VDD Condition Min. Typ. Max. Unit VDD Operating Voltage — — 1.8 — 5.5 V VLCD LCD Operating Voltage — — 2.4 — 6.0 V VIH Input High Voltage — CSB, CLK, DIO, RSTB 0.7VDD — VDD V VIL Input Low Voltage — CSB, CLK, DIO, RSTB 0 — 0.3VDD V IIL Input Leakage Current — VIN=VSS or VDD -1 — 1 μA High Level Output Current 2.0V -2 — — mA IOH 3.3V VOH=0.9VDD for DIO pin -6 — — mA 5.0V -12 — — mA 2.0V 3 — — mA 3.3V VOL=0.4V for SDA/DIO pin 6 — — mA 5.0V 9 — — mA — 1 2.5 μA Operating Current 2.0V No load, fLCD=64Hz, 1/3bias, LCD 3.3V display on, Internal system oscillator on, VLCD pin input voltage=5V, disable 5.0V integrated regulator — 2 5 μA — 4 10 μA ILCD1 Operating Current No load, fLCD=64Hz, 1/3bias, LCD display on, Internal system oscillator 2.0V on, VLCD pin input voltage=5V, disable integrated regulator — 25 40 μA ILCD2 Operating Current 2.0V No load, fLCD=64Hz, 1/3bias, LCD display on, Internal system oscillator on, VLCD pin input voltage=5.5V, regulator output is set to 5V — 30 52 μA 3.3V No load, 1/3bias, LCD display off, internal system oscillator off — — 1 μA 5.0V VLCD pin input voltage =5V, disable integrated regulator — — 2 μA 3.3V No load, 1/3bias, LCD display off, internal system oscillator off — — 1 μA 5.0V VLCD pin input voltage =5V, disable integrated regulator — — 2 μA VLCD pin input voltage=5.5V, regulator output is set to 4.5V, Ta=-40°C~85°C 4.35 4.5 4.65 V VLCD pin input voltage=5.5V, regulator output is set to 4.5V, Ta=25°C 4.42 4.5 4.58 V VLCD=3.3V, VOL=0.33V, disable integrated regulator 250 400 — μA VLCD=5V, VOL=0.5V, disable integrated regulator 500 800 — μA VLCD=3.3V, VOH=2.97V, disable integrated regulator -140 -230 — μA VLCD=5V, VOH=4.5V, disable integrated regulator -300 -500 — μA VLCD=3.3V, VOL=0.33V, disable integrated regulator 250 400 — μA VLCD=5V, VOL=0.5V, disable integrated regulator 500 800 — μA VLCD=3.3V, VOH=2.97V, disable integrated regulator -140 -230 — μA VLCD=5V, VOH=4.5V, disable integrated regulator -300 -500 — μA IOL IDD ISTB1 ISTB2 Vreg IOL1 IOH1 IOL2 IOH2 Rev. 1.00 Low Level Output Current Standby Current for VDD Standby Current for VLCD Regulator Output LCD Common Sink Current LCD Common Source Current LCD Segment Sink Current LCD Segment Source Current — — — — — 6 November 16, 2011 HT16L21 Symbol IOL3 Parameter LED Sink Current Test Condition VDD — Min. Typ. Max. Unit VLCD=3.3V, VOL=1V, when SP1 bit is set to “1” 10 — — mA VLCD=5.0V, VOL=2V, when SP1 bit is set to “1” 20 — — mA Condition Note: 1. Please use the integrated regulator when the regulator output voltage is less than (VLCD−0.5V). 2. If 8 LEDs turn on at the same time, total current of LED drivers can not be allowed more than 80mA. Rev. 1.00 7 November 16, 2011 HT16L21 A.C. Characteristics Unless otherwise specified, VDD =1.8 to 5.5V; VSS = 0 V; Ta =-40~85°C Symbol Parameter fLCD1 fLCD2 Test Condition — LCD Frame Frequency fLCD3 — — tSR VDD Slew Rate tPOF VDD Off Times RSTB Input Time RSTB Pulse Width tRSOFF Wait Time for Data Transfers Max. Frame frequency is set to 64Hz 57.6 64 70.4 Frame frequency is set to 85.3Hz 76 85.3 94.0 Frame frequency is set to 128Hz 115.2 128 140.8 Frame frequency is set to170.6Hz 152 170.6 188.0 Frame frequency is set to 64Hz 51.2 64 83.0 Frame frequency is set to 85.3Hz 68 85.3 111 Frame frequency is set to 128Hz 102.4 128 166 Frame frequency is set to170.6Hz 136 170.6 222 Frame frequency is set to 64Hz 45.0 — 64 Frame frequency is set to 85.3Hz 59.0 — 85.3 Frame frequency is set to 128Hz 90.0 — 128 Frame frequency is set to170.6Hz 118.0 — 170.6 0.05 — — V/ms VDD drop down to 0.9V 10 — — ms When RSTB signal is externally input from a microcontroller etc. 250 — — ns — 100 — ms 400 — — ns 1 — — ms Ta=25°C, VDD=3.3V Ta=-40~85°C, VDD=2.5~5.5V Ta=-40~85°C VDD=1.8~2.5V — 5.0 3.3 5.0 5.0 3.3 5.0 tRW Typ. Condition 3.3 3.3 tRSON Min. VDD 3.3 5.0 3.3 5.0 R=100kΩ and C=0.1μF (see application circuit) When RSTB signal is externally input from a microcontroller etc. 2-wire I2C or 3-wire SPI interface Unit Hz Hz Hz Note: fLCD = 1/tLCD Rev. 1.00 8 November 16, 2011 HT16L21 A.C. Characteristics – I2C Interface Unless otherwise specified, VSS=0V; VDD=1.8V to 5.5V; Ta=-40~85°C Symbol fSCL Parameter VDD=1.8V to 5.5V VDD=3.0V to 5.5V Condition Clock Frequency — Unit Min. Max. Min. Max. — 100 — 400 kHz 4.7 — 1.3 — μs 4 — 0.6 — μs tBUF Bus Free Time Time in which the bus must be free before a new transmission can start tHD: STA Start Condition Hold Time After this period, the first clock pulse is generated tLOW SCL Low Time — 4.7 — 1.3 — μs tHIGH SCL High Time — 4 — 0.6 — μs tSU: STA Start Condition Setup Time 4.7 — 0.6 — μs tHD: DAT Data Hold Time — 0 — 0 — ns tSU: DAT Data Setup Time — 250 — 100 — ns tR SDA and SCL Rise Time Note — 1 — 0.3 μs tF SDA and SCL Fall Time Note — 0.3 — 0.3 μs tSU: STO Stop Condition Set-Up Time — 4 — 0.6 — μs tAA Output Valid from Clock — — 3.5 — 0.9 μs tSP Input Filter Time Constant Noise suppression time (SDA and SCL pins) — 20 — 20 ns Only relevant for repeated START condition Note: These parameters are periodically sampled but not 100% tested. A.C. Characteristics – SPI Interface Unless otherwise specified, VSS=0V; VDD=1.8V to 5.5V; Ta=-40~85°C Symbol tSYS Parameter Clock Cycle Time Test Condition Min. Typ. Max. Unit For write data 250 — — ns For read data 1000 — — ns — For write data 50 — — ns — For read data 400 — — ns VDD — Condition tCW Clock Pulse Width tDS Data Setup Time — For write data 50 — — ns tDH Data Hold Time — For write data 50 — — ns tCSW “H” CSB Pulse Width — tCSL CSB Setup Time (CSB↓―CLK↑) — tCSH CS Hold Time (CLK↑―CSB↑) — tPD DATA Output Delay Time (CLK―DIO) — Rev. 1.00 50 — — ns For write data — 50 — — ns For read data 400 — — ns 2 — — μs — — 350 ns — CO=15pF 9 tPD=10% to 90% tPD=90% to 10% November 16, 2011 HT16L21 Characteristics Curves – fLCD vs. VDD vs. Temperature LCD frame frequency fLCD is set to 64Hz LCD frame frequency fLCD is set to 85.3Hz 100 80 90 60 LCD frame frequency (Hz) LCD frame frequency (Hz) 70 -40℃ -20℃ 50 0℃ 40 25℃ 30 65℃ 20 85℃ 10 80 -40℃ 70 -20℃ 60 0℃ 50 25℃ 40 65℃ 30 85℃ 20 10 0 0 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 1.2 1.5 1.8 2.1 2.4 2.7 3 VDD (V) LCD frame frequency fLCD is set to 170.6Hz LCD frame frequency fLCD is set to 128Hz 200 160 180 120 LCD frame frequency (Hz) 140 LCD frame frequency (Hz) 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 VDD (V) -40℃ 100 -20℃ 0℃ 80 25℃ 60 65℃ 85℃ 40 20 160 140 -40℃ 120 -20℃ 0℃ 100 25℃ 80 65℃ 60 85℃ 40 20 0 0 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 1.2 1.5 1.8 2.1 2.4 2.7 3 VDD (V) Rev. 1.00 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 VDD (V) 10 November 16, 2011 HT16L21 Functional Description Power-On Reset When the power is applied, the device is initialized by an internal power-on reset circuit. The status of the internal circuits after initialization is as follows: • All common outputs are set to VLCD. • All segment outputs are set to VLCD. • The 1/3 bias drive mode is selected. • The system oscillator and the LCD bias generator are off state. • LCD display is off state. • Integrated regulator is disabled. • Internal voltage adjustment function is enabled. • The segment/LED shared pins are set as the segment pins. • Frame frequency is set to 64Hz. • Blinking function is switched off. Reset Function When the RSTB pin is pulled to a low level, a reset operation is executed and it will initialize all functions. The status of the internal circuits after initialization is as follows: • All common outputs are set to VLCD. • All segment outputs are set to VLCD. • The 1/3 bias drive mode is selected. • The system oscillator and the LCD bias generator are off state. • LCD display is off state. • Integrated regulator is disabled. • The segment/LED shared pin is set as the segment pin. • Frame frequency is set to 64Hz. • Blinking function is switched off. Rev. 1.00 11 November 16, 2011 HT16L21 Display Memory – RAM Structure The display RAM is static 32×4-bits RAM which stores the LCD data. Logic “1” in the RAM bit-map indicates the “on” state of the corresponding LCD segment; similarly, logic 0 indicates the “off” state. The contents of the RAM data are directly mapped to the LCD data. The first RAM column corresponds to the segments operated with respect to COM0. In multiplexed LCD applications the segment data of the second, third and fourth column of the display RAM are time-multiplexed with COM1, COM2 and COM3 respectively. The following diagram is a data transfer format for I2C or SPI interface. MSB LCD D7 LSB D6 D5 D4 D3 D2 D1 D0 LED LED7 LED6 LED5 LED4 LED3 LED2 LED1 LED0 LCD Display or LED output data transfer format for I2C or SPI interface 32×4 Display Mode When the SP1 bit is set to “0” and the SP0 bit is set to “0” or “1”, the drive mode is selected as 32 segments by 4 commons. This drive mode is also the default setting after a reset. Output COM3 COM2 COM1 COM0 Output COM3 COM2 COM1 COM0 Address SEG1 — — — — SEG0 — — — — 00H SEG3 — — — — SEG2 — — — — 01H SEG5 — — — — SEG4 — — — — 02H ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ SEG31 — — — — SEG30 — — — — 0FH — D7 D6 D5 D4 — D3 D2 D1 D0 Data RAM mapping of 32×4 display mode 28×4 Display Mode When the SP1 bit is set to “1” and the SP0 bit is set to “0”, the drive mode is selected as 28 segments by 4 commons together with 4 LED driving outputs. Output COM3 COM2 COM1 COM0 Output COM3 COM2 COM1 COM0 Address SEG1 — — — — SEG0 — — — — 00H SEG3 — — — — SEG2 — — — — 01H SEG5 — — — — SEG4 — — — — 02H ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ SEG27 — — — — SEG26 — — — — 0DH — D7 D6 D5 D4 — D3 D2 D1 D0 Data RAM mapping of 28×4 display mode Rev. 1.00 12 November 16, 2011 HT16L21 24×4 Display Mode When the SP1 bit is set to “1” and the SP0 bit is set to “1”, the drive mode is selected as 24 segments by 4 commons together with 8 LED driving outputs. Output COM3 COM2 COM1 COM0 Output COM3 COM2 COM1 COM0 Address SEG1 — — — — SEG0 — — — — 00H SEG3 — — — — SEG2 — — — — 01H SEG5 — — — — SEG4 — — — — 02H ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ SEG23 — — — — SEG22 — — — — 0BH — D7 D6 D5 D4 — D3 D2 D1 D0 Data RAM mapping of 24×4 display mode System Oscillator The timing for the internal logic and the LCD drive signals are generated by an internal oscillator. The System Clock frequency (fSYS) determines the LCD frame frequency. During initial system power on the System Oscillator will be in the stop state. LCD Bias Generator The LCD supply power can come from the external VLCD pin or the internal regulator output voltage determined using the Internal Voltage Adjustment (IVA) setting command. The device provides an external VLCD pin and also integrates an internal regulator. The LCD voltage may be temperature compensated externally through the Voltage supply to the VLCD pin. The internal regulator can also provide the LCD operating voltage. Therefore, the full-scale LCD voltage (VOP) is obtained from (VLCD–VSS) or (Vreg–VSS). Fractional LCD biasing voltages, known as 1/2 or 1/3 bias voltage, are obtained from an internal voltage divider of four series resistors connected between VLCD and VSS. The centre resistor can be switched out of circuits to provide a 1/2 bias voltage level configuration. Rev. 1.00 13 November 16, 2011 HT16L21 LCD Drive Mode Waveforms • When the LCD drive mode is selected as 1/4 duty and 1/2 bias, the waveform and LCD display is shown as follows: tLCD VLCD VLCD COM0 COM0 State1 State1 (on) (on) (VLCD+VSS)/2 (VLCD+VSS)/2 LCD segment LCD segment VSS VSS VLCD VLCD COM1 COM1 State2 State2 (off) (off) (VLCD+VSS)/2 (VLCD+VSS)/2 VSS VSS VLCD VLCD COM2 COM2 (VLCD+VSS)/2 (VLCD+VSS)/2 VSS VSS VLCD VLCD COM3 COM3 (VLCD+VSS)/2 (VLCD+VSS)/2 VSS VSS VLCD VLCD SEG n SEG n (VLCD+VSS)/2 (VLCD+VSS)/2 VSS VSS VLCD VLCD (VLCD+VSS)/2 SEG n+1 (VLCD+VSS)/2 SEG n+1 VSS VSS VLCD VLCD (VLCD+VSS)/2 SEG n+2 (VLCD+VSS)/2 SEG n+2 VSS VSS VLCD VLCD SEG n+3 SEG n+3 (VLCD+VSS)/2 (VLCD+VSS)/2 VSS VSS Waveforms for 1/4 duty drive mode with1/2 bias (VOP=VLCD−VSS) Note: tLCD = 1/fLCD Rev. 1.00 14 November 16, 2011 HT16L21 • When the LCD drive mode is selected as 1/4 duty and 1/3 bias, the waveform and LCD display is shown as follows: tLCD VLCD VLCD COM0 COM0 State1 State1 (on) (on) VLCD- Vop/3 VLCD- Vop/3 LCD segment LCD segment VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD COM1 COM1 State2 State2 (off) (off) VLCD- Vop/3 VLCD- Vop/3 VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD COM2 COM2 VLCD- Vop/3 VLCD- Vop/3 VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD COM3 COM3 VLCD- Vop/3 VLCD- Vop/3 VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD VLCD- Vop/3 VLCD- Vop/3 SEG n SEG n VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD VLCD- Vop/3 VLCD- Vop/3 SEG n+1 SEG n+1 VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD VLCD- Vop/3 VLCD- Vop/3 SEG n+2 SEG n+2 VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS VLCD VLCD VLCD- Vop/3 VLCD- Vop/3 SEG n+3 SEG n+3VLCD- 2Vop/3 VLCD- 2Vop/3 VSS VSS Waveforms for 1/4 duty drive mode with 1/2 bias (VOP=VLCD−VSS) Note: tLCD = 1/fLCD Rev. 1.00 15 November 16, 2011 HT16L21 Segment Driver Outputs The LCD drive section includes 32 segment outputs SEG0~SEG31 or 24 segment outputs SEG0~SEG23 which should be connected directly to the LCD panel. The segment output signals are generated in accordance with the multiplexed LED signals and with the data resident in the display latch. The unused segment outputs should be left open-circuit when less than 32 or 24 segment outputs are required. Column Driver Outputs The LCD drive section includes 4 column outputs COM0~COM3 which should be connected directly to the LCD panel. The column output signals are generated in accordance with the selected LCD drive mode. The unused column outputs should be left open-circuit if less than 4 column outputs are required. Address Pointer The addressing mechanism for the display RAM is implemented using the address pointer. This allows the loading of an individual display data byte, or a series of display data bytes, into any location of the display RAM. The sequence commences with the initialization of the address pointer by the Display Data Input command. Blinking Function The device contains versatile blinking capabilities. The whole display can be blinked at frequencies selected by the Blinking Frequency command. The blinking frequency is a subdivided ratio of the system frequency. The ratio between the system oscillator and blinking frequencies depends on the blinking mode in which the device is operating, as shown in the following table: Blinking Mode Blinking Frequency (Hz) 0 Blink off 1 2 2 1 3 0.5 Frame Frequency The device provides four frame frequencies selected with Frame Frequency command known as 64Hz, 85.3Hz, 128Hz and 170.6Hz respectively. LED Function The LED pins are NMOS-structured output pins. The Data for the LED output is contained in the LED output setting command, starting from the most significant bit. When a written data bit for a LED pin is set to 1, the corresponding driving LED lights up while the LED is switched off when the written data bit is 0. The LED pins are pin-shared with the LCD segment pins and can be selected using the SP1 and SP0 bits in the Drive Mode command. Rev. 1.00 16 November 16, 2011 HT16L21 I2C Serial Interface I2C Operation The device supports I2C serial interface. The I2C bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line, SDA, and a serial clock line, SCL. Both lines are connected to the positive supply via pull-up resistors with a typical value of 4.7KΩ. When the bus is free, both lines are high. Devices connected to the bus must have open-drain or open-collector outputs to implement a wiredor function. Data transfer is initiated only when the bus is not busy. Data validity The data on the SDA line must be stable during the high period of the serial clock. The high or low state of the data line can only change when the clock signal on the SCL line is Low as shown in the diagram. SDA SCL Data line stable; Data valid Change of data allowed START and STOP conditions • A high to low transition on the SDA line while SCL is high defines a START condition. • A low to high transition on the SDA line while SCL is high defines a STOP condition. • START and STOP conditions are always generated by the master. The bus is considered to be busy after the START condition. The bus is considered to be free again a certain time after the STOP condition. • The bus stays busy if a repeated START (Sr) is generated instead of a STOP condition. In some respects, the START(S) and repeated START (Sr) conditions are functionally identical. SDA SDA SCL SCL S P START condition STOP condition Byte format Every byte put on the SDA line must be 8-bit long. The number of bytes that can be transmitted per transfer is unrestricted. Each byte has to be followed by an acknowledge bit. Data is transferred with the most significant bit, MSB, first. P SDA Sr SCL Rev. 1.00 S or Sr 1 2 7 8 9 ACK 17 1 2 3-8 9 ACK P or Sr November 16, 2011 HT16L21 Acknowledge • Each bytes of eight bits is followed by one acknowledge bit. This Acknowledge bit is a low level placed on the bus by the receiver. The master generates an extra acknowledge related clock pulse. • A slave receiver which is addressed must generate an Acknowledge, ACK, after the reception of each byte. • The device that acknowledges must pull down the SDA line during the acknowledge clock pulse so that it remains stable low during the high period of this clock pulse. • A master receiver must signal an end of data to the slave by generating a not-acknowledge, NACK, bit on the last byte that has been clocked out of the slave. In this case, the master receiver must leave the data line high during the 9th pulse to not acknowledge. The master will generate a STOP or repeated START condition. Data Output by Transmitter not acknowledge Data Outptu by Receiver acknowledge SCL From Master 1 S 7 2 8 START condition 9 clock pulse for acknowledgement Slave Addressing • The slave address byte is the first byte received following the START condition form the master device. The first seven bits of the first byte make up the slave address. The eighth bit defines a read or write operation to be performed. When the R/W bit is “1”, then a read operation is selected. A “0” selects a write operation. • The HT16L21 device address bits are “0111000”. When an address byte is sent, the device compares the first seven bits after the START condition. If they match, the device outputs an Acknowledge on the SDA line. Slave Address MSB 0 Rev. 1.00 LSB 1 1 1 0 18 0 0 R/W November 16, 2011 HT16L21 I2C Interface Write Operation Byte Write Operation • Single Command Type A Single Command write operation requires a START condition, a slave address with an R/W bit, a command byte and a STOP condition for a single command write operation. Slave Address S 0 1 1 1 Command byte 0 0 0 0 P BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 Write ACK ACK 1st I2C Single Command Type Write Operation • Compound Command Type A Compound Command write operation requires a START condition, a slave address with an R/W bit, a command byte, a command setting byte and a STOP condition for a compound command write operation. Slave Address S 0 1 1 1 0 0 0 0 Command byte Command setting BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 Write ACK ACK 1st P ACK 2nd I2C Compound Command Type Write Operation • Display RAM Single Data Byte A display RAM data byte write operation requires a START condition, a slave address with an R/W bit, a display data input command byte, a valid Register Address byte, a Data byte and a STOP condition. Slave Address S 0 1 1 1 0 Command byte 0 0 0 1 Write ACK 0 0 0 0 1st 0 Register Address byte 0 0 X ACK X X X A3 2nd A2 Data byte A1 A0 D7 ACK D6 D5 D4 D3 D2 D1 P D0 ACK I2C Display RAM Single Data Byte Write Operation Rev. 1.00 19 November 16, 2011 HT16L21 Display RAM Page Write Operation After a START condition the slave address with the R/W bit is placed on the bus followed with a display data input command byte and the specified display RAM Register Address of which the contents are written to the internal address pointer. The data to be written to the memory will be transmitted next and then the internal address pointer will be incremented by 1 to indicate the next memory address location after the reception of an acknowledge clock pulse. After the internal address point reaches the maximum memory address, the address pointer will be reset to 00H. Slave Address S 0 1 1 1 Command byte 0 0 0 0 1 Write 0 0 0 D6 D5 D4 Register Address byte 0 0 0 X X X X A3 1st D2 D1 A1 A0 2nd ACK Data byte D3 A2 ACK ACK Data byte D7 0 D0 D7 D6 D5 D4 1st data Data byte D3 D2 D1 D0 D7 D6 D5 2nd data D4 D3 D2 D1 Nth data ACK ACK P D0 ACK ACK I2C Interface N Bytes Display RAM Data Write Operation SP1 SP0 0 X Maximum Memory Address 0FH 1 0 0DH 1 1 0BH I2C Interface Display RAM Read Operation In this mode, the master reads the HT16L21 data after setting the slave address. Following the R/W bit (="0") is an acknowledge bit, a command byte and the register address byte which is written to the internal address pointer. After the start address of the Read Operation has been configured, another START condition and the slave address transferred on the bus followed by the R/W bit (="1"). Then the MSB of the data which was addressed is transmitted first on the I2C bus. The address pointer is only incremented by 1 after the reception of an acknowledge clock. That means that if the device is configured to transmit the data at the address of AN+1, the master will read and acknowledge the transferred new data byte and the address pointer is incremented to AN+2. After the internal address pointer reaches the maximum memory address, the address pointer will be reset to 00H. This cycle of reading consecutive addresses will continue until the master sends a STOP condition. Command byte Slave Address S 0 1 1 1 0 0 0 0 1 Write 0 0 0 0 Register Address byte 0 0 0 X X X X 1st A3 A2 A1 P A0 2nd ACK ACK ACK 0 Slave Address S 0 1 1 1 0 Data byte Data byte 0 0 1 Read D7 D6 D5 D4 D3 D2 D1 D7 D0 D5 D4 D3 Data byte D2 D1 D0 D7 2nd data 1st data ACK D6 ACK D6 D5 D4 D3 Nth data ACK D2 D1 D0 P NACK ACK I2C Interface N Bytes Display RAM Data Read Operation Rev. 1.00 20 November 16, 2011 HT16L21 SPI Serial Interface SPI Operation The device also includes a 3-wire SPI serial interface. The SPI operations are described as follows: • The CSB pin is used to activate the data transfer. When the CSB pin is at a high level, the SPI operation will be reset and stopped. If the CSB pin changes state from high to low, data transmission will start. • The data is transferred from the MSB of each byte and is shifted into the shift register on each CLK rising edge. • The input data is automatically latched into the internal register for each 8-bit input data after the CSB signal goes low. • For read operations, the MCU should assert a high pulse on the CSB pin to change the data transfer direction from input mode to output mode on the DIO pin after sending the command byte and the setting values. If the MCU sets the CSB signal to a high level again after receiving the output data, the data direction on the DIO pin will be changed into input mode and the read operation will end. • For a read operation, the data is output on the DIO pin at the CLK falling edge. • For display RAM data read/write operations using the SPI interface, the read/write control bit is contained in the Display Data Input Command. Refer to the Display Data Input Command description for more details. SPI Interface Write Operation Byte Write Operation • Single Command Type A Single Command write operation is activated by the CSB signal going low. The 8-bit command byte is shifted from the MSB into the shift register at each CLK rising edge. CSB CLK Command byte DIO BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 SPI Single Command Type Write Operation • Compound Command Type For a compound command, an 8-bit command byte is first shifted into the shift register followed by an 8-bit command setting. Note that the CLK high pulse width, after the command byte has been shifted in, must remain at this level for at least 2μs after which the command setting data can be consecutively shifted in. CSB 2μs(min) CLK DIO Command byte Command setting Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SPI Compound Command Type Write Operation Rev. 1.00 21 November 16, 2011 HT16L21 • Display RAM Single Data Byte The display RAM single data write operation consists of a display data input (write) command, a register address and a write data byte. CSB 2μs(min) 2μs(min) CLK Display Data Input command byte 1 DIO 0 0 0 0 0 0 0 Data byte Register Address byte X X X X A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SPI Display RAM Single Data Byte Write Operation Display RAM Page Write Operation The display RAM Page write operation consists of a display data write command, a register address of which the contents are written to the internal address pointer followed by N bytes of written data. The data to be written to the memory will be transmitted next and then the internal address pointer will be automatically incremented by 1 to indicate the next memory address location. After the internal address point reaches the maximum memory address, the address pointer will be reset to 00H. CSB CLK 2μs(min) 2μs(min) Display Data Input Command byte DIO 1 0 0 0 0 0 X X X X A3 A2 2μs(min) A1 A0 D7 D6 D5 D4 D3 Data byte Data byte Data byte Register Address byte 0 0 2μs(min) D2 D1 D0 D7 D6 D5 1st data D4 D3 2nd data D2 D1 D0 D7 3rd data CSB CLK 2μs(min) Data byte DIO D0 (N-1)th data D7 D6 D5 D4 D3 D2 D1 D0 Nth data SPI Interface N Bytes Display RAM Data Write Operation Rev. 1.00 SP1 SP0 Maximum Memory Address 0 X 0FH 1 0 0DH 1 1 0BH 22 November 16, 2011 HT16L21 SPI Interface Display RAM Read Operation In this mode, the master reads the device data after sending the Display Data Input command when the CSB pin changes state from high to low. Following the read/write control bit, which is contained in the Display Data Input command, is the register address byte which is written to the internal address pointer. After the start address of the Read Operation has been configured, another CSB high pulse is placed on the bus and then the MSB of the data which was addressed is transmitted first on the SPI bus. The address pointer is only incremented by 1 after the reception of each data byte. That means that if the device is configured to transmit the data at the address of AN+1, the master will read the transferred data byte and the address pointer is incremented to AN+2. After the internal address pointer reaches the maximum memory address, the address pointer will be reset to 00H. This cycle of reading consecutive addresses will continue until the master pulls the CSB line to a high level to terminate the data transfer. CSB CLK 2μs(min) 2μs(min) Display data Input command byte DIO 1 0 0 0 0 0 0 X X X X A3 A2 A1 A0 Data byte Data byte Data byte D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 1st data 2nd data Register Address byte 1 2μs(min) D7 3rd data CSB CLK 2μs(min) Data byte DIO D0 (N-1)th data D7 D6 D5 D4 D3 D2 D1 D0 Nth data SPI Interface N Bytes Display RAM Data Read Operation Rev. 1.00 23 November 16, 2011 HT16L21 Command Summary Software Reset Command This command is used to initialize the HT16L21 device. Function Byte Soft Reset Command 1 (MSB) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 (LSB) Bit0 Note R/W Def 1 0 1 0 1 0 1 0 — W — st Note: ●●When this software reset command is executed, all the command registers are initialized to the default values. ●●After the reset command is executed, the device will experience an internal initialization for 1ms. ●●Normal operation can be executed after the device initialization is complete. ●●During the initialization period, no commands can be executed. ●●If the programmed command is not defined, the function will not be affected. The status of the internal circuits after initialization is as follows: ●●All segment/common outputs are set to VLCD. ●●The 1/3 bias drive mode is selected. ●●The system oscillator and the LCD bias generator are in an off state. ●●The LCD display is in an off state and the integrated regulator is disabled. ●●The segment/LED shared pin is setup as a segment pin. ●●The frame frequency is set to 64Hz. ●●The blinking function is switched off. Drive Mode Command Function Byte Drive mode setting command 2 Bit4 Bit3 Bit2 Bit1 (LSB) Note R/W Bit0 Def st 1 0 0 0 0 0 1 0 — W — nd X X SP1 SP0 X X X Bias — W 00H 1 Duty, Bias and pin-shared setting (MSB) Bit6 Bit5 Bit7 Note: Bit0 Bias 0 1/3 bias 1 1/2 bias SP1 SP0 0 1 1 Segment/LED shared pin selected Segment 28~31/LED3~0 Segment 24~27/LED7~4 X Set as segment pins Set as segment pins 0 Set as LED pins Set as segment pins 1 Set as LED pins Set as LED pins ●●Power on status: The1/3 bias drive mode is selected and also the segment output pins are selected. ●●If the programmed command is not defined, the function will not be affected. Rev. 1.00 24 November 16, 2011 HT16L21 Display Data Input Command This command sends data from MCU to the memory MAP of the HT16L21 device. Function Byte Display Data Input/output Command 1st Address pointer 2nd (MSB) (LSB) Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit7 Bit0 1 0 0 0 0 0 0 Note R/W Def 0 Write operation W — R — W 00H R/W Def 1 0 0 0 0 0 0 1 Read operation for 3-wire SPI interface used only. X X X X A3 A2 A1 A0 Display data start address of memory map Note: SP1 SP0 0 X 0FH 1 0 0DH 1 1 0BH Maximum Memory Address ●●Power on status: The address is set to 00H. ●●If the programmed command is not defined, the function will not be affected. System Mode Command This command controls the internal system oscillator on/off and display on/off. Function Byte (MSB) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 (LSB) Note Bit0 System mode setting command 1st 1 0 0 0 0 1 0 0 — W — System oscillator and Display on/off Setting 2nd X X X X X X S E — W 00H Note: Bit Internal System Oscillator LCD Display X off off 0 on off 1 on on S E 0 1 1 ●●Power on status: Display off and disable the internal system oscillator. ●●If the programmed command is not defined, the function will not be affected. Rev. 1.00 25 November 16, 2011 HT16L21 Frame Frequency Command This command selects the frame frequency. (MSB) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 (LSB) Note R/W Bit0 Function Byte Def Frame frequency command 1st 1 0 0 0 0 1 1 0 — W — Frame frequency setting 2nd X X X X X X F1 F0 — W 02H R/W Def Note: Bit [1:0] Frame Frequency F1, F0 00 85.3Hz 01 170.6Hz 10 64Hz 11 128Hz ●●Power on status: Frame frequency is set to 64Hz. ●●If the programmed command is not defined, the function will not be affected. Blinking Frequency Command This command defines the blinking frequency of the display modes. Function Byte Blinking frequency command 2 Bit5 Bit4 Bit3 Bit2 Bit1 (LSB) Note Bit0 st 1 0 0 0 1 0 0 0 — W — nd X X X X X X BK1 BK0 — W 00H 1 Blinking frequency setting (MSB) Bit6 Bit7 Note: Bit Blinking Frequency BK1 BK0 0 0 Blinking off 0 1 2Hz 1 0 1Hz 1 1 0.5Hz ●●Power on status: Blinking function is switched off. ●●If the programmed command is not defined, the function will not be affected. LED Output Command This command defines the blinking frequency of the display modes. Function Byte LED output command 1st LED output data 2nd (MSB) Bit6 Bit7 Bit5 Bit4 Bit3 Bit2 Bit1 (LSB) Bit0 Note 1 1 0 0 — 1 0 0 0 X X X X R/W Def W LED3 LED2 LED1 LED0 When [SP1:SP0]=10 used LED7 LED6 LED5 LED4 LED3 LED2 LED1 LED0 When [SP1:SP0]=11 used — W 00H Note: ●●The LED registers and latches are cleared after a new configuration is written into the SP1 and SP0 bits in the Drive Mode command. ●●If the programmed command is not defined, the function will not be affected. Rev. 1.00 26 November 16, 2011 HT16L21 Internal Voltage Adjustment (IVA) Setting Command The internal voltage (VLCD) adjustment can provide sixteen kinds of regulator voltage adjustment options by setting the LCD operating voltage adjustment command. Function Byte Internal voltage adjustment (IVA) Setting 1st Internal voltage adjust control 2nd (MSB) (LSB) Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit7 Bit0 1 0 X X 0 X 0 VE 1 X 0 V2 1 V1 Note R/W Def 0 — W — V0 ●●The “VE” bit is used to enable or disable the internal regulator adjustment for the LCD voltage. ●●The V3~V0 bits can be used to adjust the VLCD voltage. W 00H Note: VE Regulator Adjustment 0 Off – bias voltage is supplied from VLCD pin 1 On – bias voltage is supplied from the internal regulator V2 V1 V0 Regulator Output Voltage (V) 0 0 0 3.0V 0 0 1 3.2V 0 1 0 3.3V 0 1 1 3.4V 1 0 0 4.4V 1 0 1 4.5V 1 1 0 4.6V 1 1 1 5.0V ●●Power on status: Disable the internal regulator. ●●When the VLCD voltage is lower than 3.5V, it is recommended to disable the internal regulator so that the VLCD voltage is directly connected to the internal bias voltage generator. ●●Caution: Use the internal regulator when the “Regulator output voltage<VLCD−0.5V” ●●If the programmed command is not defined, the function will not be affected. Rev. 1.00 27 November 16, 2011 HT16L21 Operation Flow Chart Access procedures are illustrated below using flowcharts. Initialization Power On Set Internal LCD bias and segment/LED share pin Set Internal LCD frame frequency Set LCD blinking frequency Next processing Display Data Read/Write (Address Setting) Start Address setting Display RAM data write Display on and enable internal system clock Next processing Rev. 1.00 28 November 16, 2011 HT16L21 Application Circuit I2C Interface • [SP1:SP0]=0x (1) RSTB pin is connected to a MCU. VDD LCD panel 4.7K 4.7K SCL MCU COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 SDA HT16L21 IFS VDD RSTB VDD VSS 0.1uF VLCD 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. VDD LCD panel 4.7K 4.7K SCL MCU COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 SDA HT16L21 IFS VDD RSTB 0.1uF VDD 100K VSS 0.1uF VLCD 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD VDD LCD panel 4.7K 4.7K SCL MCU COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 SDA VDD HT16L21 IFS RSTB VDD VSS 0.1uF VDD Rev. 1.00 29 VLCD 0.1uF VLCD November 16, 2011 HT16L21 • [SP1:SP0]=10 (1) RSTB pin is connected to a MCU. VDD LCD panel 4.7K COM0~COM3 4.7K SEG0~27 VLCD SCL MCU COM0~COM3 SDA RLED*4 LED*4 SEG0~27 LED0 LED1 HT16L21 LED2 IFS VDD RSTB LED3 VDD VSS 0.1uF VLCD 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. VDD LCD panel 4.7K COM0~COM3 4.7K SEG0~27 VLCD SCL MCU COM0~COM3 SDA RLED*4 LED*4 SEG0~27 LED0 LED1 HT16L21 LED2 IFS VDD LED3 RSTB 0.1uF VDD 100K VSS 0.1uF VLCD 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD VDD LCD panel 4.7K COM0~COM3 4.7K VLCD SCL MCU COM0~COM3 SDA VDD SEG0~27 SEG0~27 LED2 LED3 VDD VSS 0.1uF VDD Rev. 1.00 LED1 HT16L21 IFS RSTB RLED*4 LED*4 LED0 VLCD 0.1uF VLCD 30 November 16, 2011 HT16L21 • [SP1:SP0]=11 (1) RSTB pin is connected to a MCU. VDD LCD panel 4.7K 4.7K COM0~COM3 SEG0~23 COM0~COM3 SEG0~23 VLCD RLED*8 SCL LED*8 LED0 LED1 LED2 SDA MCU LED3 HT16L21 VDD LED4 IFS LED5 LED6 RSTB VDD VSS VLCD 0.1uF LED7 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. VDD LCD panel 4.7K 4.7K COM0~COM3 SEG0~23 COM0~COM3 SEG0~23 VLCD RLED*8 SCL LED*8 LED0 LED1 LED2 SDA MCU LED3 HT16L21 VDD LED4 IFS LED5 LED6 RSTB 0.1uF VDD 100K VSS 0.1uF VLCD LED7 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD VDD LCD panel 4.7K 4.7K COM0~COM3 SEG0~23 COM0~COM3 SEG0~23 VLCD RLED*8 SCL LED*8 LED0 LED1 LED2 SDA MCU LED3 HT16L21 VDD LED4 IFS LED5 LED6 RSTB VDD VSS 0.1uF VDD Rev. 1.00 VLCD LED7 0.1uF VLCD 31 November 16, 2011 HT16L21 SPI Interface • [SP1:SP0]=0x (1) RSTB pin is connected to a MCU. LCD panel CSB COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 CLK MCU HT16L21 DIO IFS RSTB VDD VSS 0.1uF VLCD 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. LCD panel CSB COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 CLK MCU HT16L21 DIO IFS RSTB 0.1uF VDD 100K VSS 0.1uF VLCD 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD LCD panel CSB COM0~COM3 SEG0~31 COM0~COM3 SEG0~31 CLK MCU HT16L21 DIO IFS RSTB VDD VSS 0.1uF VDD Rev. 1.00 32 VLCD 0.1uF VLCD November 16, 2011 HT16L21 • [SP1:SP0]=10 (1) RSTB pin is connected to a MCU. LCD panel COM0~COM3 SEG0~27 VLCD SCL COM0~COM3 SEG0~27 RLED*4 CLK MCU HT16L21 DIO LED1 LED2 IFS RSTB LED*4 LED0 LED3 VDD VSS VLCD 0.1uF 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. LCD panel COM0~COM3 SEG0~27 COM0~COM3 SEG0~27 VLCD CSB RLED*4 CLK MCU HT16L21 DIO LED1 LED2 IFS LED3 RSTB 0.1uF LED*4 LED0 VDD 100K VSS 0.1uF VLCD 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD LCD panel COM0~COM3 SEG0~27 VLCD CSB COM0~COM3 SEG0~27 RLED*4 CLK MCU HT16L21 DIO LED1 LED2 IFS RSTB LED3 VDD VSS 0.1uF VDD Rev. 1.00 LED*4 LED0 VLCD 0.1uF VLCD 33 November 16, 2011 HT16L21 • [SP1:SP0]=11 (1) RSTB pin is connected to a MCU. LCD panel COM0~COM3 SEG0~23 VLCD RLED*8 CSB COM0~COM3 SEG0~23 LED0 LED1 CLK MCU LED2 DIO LED3 HT16L21 LED4 LED5 IFS RSTB LED*8 LED6 VDD VSS VLCD 0.1uF LED7 0.1uF VDD VLCD (2) RSTB pin is connected to external resistor and capacitor. LCD panel COM0~COM3 SEG0~23 VLCD RLED*8 CSB COM0~COM3 LED*8 SEG0~23 LED0 LED1 CLK LED2 MCU LED3 HT16L21 DIO LED4 LED5 IFS LED6 RSTB 0.1uF VDD 100K VSS 0.1uF VLCD LED7 0.1uF VDD VLCD (3) Use internal power on reset circuit only, the RSTB pin must be connected to VDD LCD panel COM0~COM3 SEG0~23 VLCD RLED*8 CSB COM0~COM3 LED*8 SEG0~23 LED0 LED1 CLK LED2 MCU HT16L21 DIO LED3 LED4 IFS LED5 LED6 RSTB VDD VSS 0.1uF VDD Rev. 1.00 VLCD LED7 0.1uF VLCD 34 November 16, 2011 HT16L21 Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website (http://www.holtek.com.tw/english/ literature/package.pdf) for the latest version of the package information. 44-pin LQFP (10mm×10mm) (FP2.0mm) Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A 0.469 ― 0.476 B 0.390 ― 0.398 C 0.469 ― 0.476 D 0.390 ― 0.398 E ― 0.031 ― F ― 0.012 ― G 0.053 ― 0.057 H ― ― 0.063 I ― 0.004 ― J 0.018 ― 0.030 K 0.004 ― 0.008 α 0° ― 7° Symbol A Rev. 1.00 Dimensions in mm Min. Nom. Max. 11.90 ― 12.10 B 9.90 ― 10.10 C 11.90 ― 12.10 D 9.90 ― 10.10 E ― 0.80 ― F ― 0.30 ― G 1.35 ― 1.45 H ― ― 1.60 I ― 0.10 ― J 0.45 ― 0.75 K 0.10 ― 0.20 α 0° ― 7° 35 November 16, 2011 HT16L21 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-5631999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright © 2011 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www. holtek.com.tw. Rev. 1.00 36 November 16, 2011