G914X Global Mixed-mode Technology Inc. 300mA Low-Noise LDO Regulators Features General Description 30µV (rms) Ultra Low Output Noise Ultra Low 55µA No-Load Supply Current Ultra Low Dropout 70mV @ 50mA Load Guarantee 300mA Output Current Over-Temperature and Short-Circuit Protection Fixed: 2.70V (G914A), 2.80V (G914B) The G914X is a low supply current, low dropout linear regulator that comes in a space saving SOT23-5 package. The supply current at no-load is 55µA. In the shutdown mode, the maximum supply current is less than 1µA. Operating voltage range of the G914X is from 2.5V to 5.5V. The over-current protection limit is set at 500mA typical and 400mA minimum. An over-temperature protection circuit is built-in in the G914X to prevent thermal overload. These power saving features make the G914X ideal for use in the battery-powered applications such as notebook computers, cellular phones, and PDA’s. 3.00V (G914C), 3.30V (G914D) 2.50V (G914E), 2.85V (G914F) 1.50V(G914G), 1.80V(G914H) Max. Supply Current in Shutdown Mode < 1µA Stable with low cost ceramic capacitors Applications Ordering Information Notebook Computers Cellular Phones PDA Hand-Held Devices Battery-Powered Application ORDER MARKING VOLTAGE NUMBER G914A G914B G914C G914D G914E G914F G914G G914H Pin Configuration IN 1 GND 2 4Axx 4Bxx 4Cxx 4Dxx 4Exx 4Fxx 4Gxx 4Hxx 2.70V 2.80V 3.00V 3.30V 2.50V 2.85V 1.50V 1.80V 5 OUT IN ＋C IN G914X BATTERY 4 3 PACKAGE -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 Typical Operating Circuit _ 1µF G914X COUT 1µF SHDN BYP BYP SOT23-5 OUTPUT VOLTAGE OUT GND SHDN TEMP. RANGE CBYP 10nF Fixed mode TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 1 Global Mixed-mode Technology Inc. G914X Operating Temperature Range….…….-40°C to +85°C Junction Temperature……………………………+150°C (1) θJA …....……………….……………….…..240°C/Watt Storage Temperature Range…………-65°C to +160°C Lead Temperature (soldering, 10sec)...….……+260°C Absolute Maximum Ratings VIN to GND……..………………..….….………-0.3V to +7V Output Short-Circuit Duration.…..….……..…….….Infinite All Other Pins to GND……….……….-0.3V to (VIN + 0.3V) Continuous Power Dissipation (TA = +25°C) SOT 23-5 …………………………..…………...…..520 mW Note (1): See Recommended Minimum Footprint (Figure 2) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (VIN=VOUT(STD)+1V, V SHDN =VIN, TA=TJ =25°C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS Input Voltage (Note 2) VIN Output Voltage Accuracy VOUT Maximum Output Current Current Limit (Note 3) ILIM Ground Pin Current IQ MIN TYP MAX UNITS Note2 Variation from specified VOUT, IOUT=1mA,VOUT≥2.5V version -2 For G914H, IOUT=1mA -3 For G914G, IOUT=1mA -4 VIN =3.6V ILOAD = 0mA ILOAD = 50mA ILOAD = 300mA 5.5 V 2 % 3 4 300 mA 500 mA 55 120 µA 145 265 2 70 230 250 380 mV 510 450 600 500 660 760 960 910 1220 0.1 0.28 %/V 0.35 % 2 57 dB 30 ppm/°C 52 35 µVRMS 30 26 IOUT = 1mA IOUT = 50mA, VOUT ≥ 2.7V Version VO (NOM) ≥ 3.0V 2.5V≤VO (NOM) ≤2.85V IOUT = 150mA VO (NOM) = 1.8V Dropout Voltage (Note 4) VDROP VO (NOM) = 1.5V VO (NOM) ≥ 3.0V 2.5V≤VO (NOM) ≤2.85V IOUT =300mA VO (NOM) = 1.8V VO (NOM) = 1.5V Line Regulation ∆VLNR VIN=VOUT+100mV to 5.5V, IOUT = 1mA IOUT = 1mA to 150mA Load Regulation (Note 5) ∆VLDR IOUT = 1mA to 300mA Power Supply Rejection Ratio PSRR IOUT = 30mA CBYP = 10nF, f = 120HZ Output Voltage Temperature Coefficient ΔVO/ΔT IOUT = 50mA, TJ = 25°C to 125°C COUT = 1µF, IOUT = 150mA, CBYP=1nF Output Voltage Noise COUT = 1µF, IOUT = 150mA, CBYP=10nF (10Hz to 100kHz) en VIN=VOUT+1V COUT = 1µF, IOUT = 150mA, CBYP = 100nF (G914H) COUT = 1µF, IOUT = 1mA, CBYP = 10nF SHUTDOWN VIH Regulator enabled VIN- 0.7 SHDN Input Threshold Regulator shutdown VIL ISHDN V SHDN = VIN TA = +25°C 0.003 SHDN Input Bias Current Shutdown Supply Current IQ SHDN VOUT = 0V TA = +25°C THERMAL PROTECTION Thermal Shutdown Temperature TSHDN 150 Thermal Shutdown Hysteresis 15 ∆TSHDN 0.4 0.1 1 V µA °C °C Note 1: Limits is 100% production tested at T A = +25°C. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note 2: VIN (min)=VOUT (STD)+VDROPOUT Note 3: Not tested. For design purposes, the current limit should be considered 400mA minimum to 600mA maximum. Note 4: The dropout voltage is defined as (VIN - VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +1V. The performance of every G914X version, see “Typical Performance Characteristics”. Note 5: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 1mA to 300mA. Changes in output due to heating effects are covered by the thermal regulation specification. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 2 G914X Global Mixed-mode Technology Inc. Typical Performance Characteristics (VIN = V O+1V, CIN=1µF, COUT=1µF, V SHDN = VIN, G914D, TA =25°C, unless otherwise noted.) Output Voltage vs. Load Current Ground Current vs. Load Current 3.340 400 3.330 G914D 350 Ground Current (µA) Output Voltage (V) 3.320 3.310 3.300 3.290 3.280 3.270 3.260 VIN=3.6V No Load 300 250 200 150 100 50 3.250 3.240 0 0 50 100 150 200 250 300 0 50 Output Voltage vs. Input Voltage 150 200 250 300 Supply Current vs. Input Voltage 3.5 400 350 3.0 No Load 2.0 1.5 1.0 250 200 100 50 0.0 0 1 2 3 4 5 ILOAD=50mA 150 0.5 0 ILOAD=300mA 300 2.5 Supply Current (µA) Output Voltage (V) 100 Load Current (mA) Load Current (mA) ILOAD=0mA 0 6 1 2 3 4 5 6 Input Voltage (V) Input Voltage (V) Dropout Voltage vs. Load Current Ouptut Noise 10HZ to 100KHZ 1000 TA=25°C Dropout Voltage (mV) 900 800 G914H 700 600 G914E G914G 500 400 Top to down G914A G914B G914F G914C G914D 300 200 100 0 0 50 100 150 200 250 300 Loading (mA) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 3 G914X Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) SHDN Input Bias Current vs. Temperature Ground Current vs. Temperature 80 0.20 G914D VIN = 4.3V IOUT =0A SHDN Input Bias Current (µA) Ground Current (µA) 100 60 40 20 0.10 0.00 -0.10 -0.20 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0 0 0 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0 0 0 0 Junction Temperature TJ (°C) Junction Temperature TJ (°C) Shutdown Supply Current vs. Temperature Output Voltage vs. Temperature 3.36 G914D VIN = 4.3V 3.34 Output Voltage (V) Shutdown Supply Current(µA) 1.00 0.60 G914D VIN=4.3V VSHDN=VIN 0.20 -0.20 -0.60 G914D ILOAD=1mA VIN=5.5V 3.32 3.30 VIN=4.3V 3.28 VIN=3.4V 3.26 3.24 -1.00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0 0 0 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0 0 0 0 Junction Temperature TJ (°C) Junction Temperature TJ (°C) Dropout Voltage vs. Temperature 400 Dropout Voltage (mV) 350 G914D 300 250 ILOAD=150mA 200 150 100 ILOAD=50mA 50 ILOAD=0mA 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0 0 0 0 Junction Temperature TJ (°C) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 4 G914X Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Line Transient Load Transient Load Transient Power Supply Rejection Ripple 80 G914F VIN=5V +2V(p-p) RL=100Ω CBYP=10nF Power Supply Rejection Ratio(db) 70 60 50 40 30 20 10 0 0.1 1 10 100 Frequency(KHZ) Output Noise vs. Bypass Capacitance Output Noise vs. Load Current 70 70 50 G914H VIN=2.8V TA=25°C COUT=1µF 40 30 20 10 0 0.001 G914H VIN=2.8V TA=25°C 60 Output Noise (µVrms) Output Noise (µVrms) 60 50 COUT=1µF 40 30 20 10 0 0.01 0.1 1 10 100 1000 Load Current (mA) Bypass Capacitance (µF) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 5 G914X Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Power On Response Waveform Power Off Response Waveform Shutdown Delay Waveform Shutdown Delay Waveform Turn-On Time vs. Bypass Capacitance Turn-Off Time vs. Bypass Capacitance 100000 1000 Propagation Delay Time Propagation Delay Time Time (µs) Time (µs) 10000 1000 G914D ILOAD =150mA CIN=COUT=1µF VIN=4.3V power already VSHDN=0 to 4.3V 100 10 Rise Time 100 Fall Time 10 1 G914D ILOAD =150mA CIN=COUT=1µF VIN=4.3V power already VSHDN=4.3V to 0V 1 0.1 1 10 Bypass Capactor (nF) 100 0.1 1 10 100 Bypass Capacitor (nF) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 6 Global Mixed-mode Technology Inc. G914X Pin Description PIN NAME FUNCTION 1 IN 2 GND 3 SHDN 4 BYP 5 OUT Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1µF to GND. Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to maximize thermal dissipation. Active-High Enable Input. A logic low reduces the supply current to less than 1µA. Connect to IN for normal operation. This is a reference bypass pin. It should connect external 10nF capacitor to GND to reduce output noise. Bypass capacitor must be no less than 1nF. (CBYP≥ 1nF) Regulator Output. Sources up to 150mA. Bypass with a 1µF, ＜0.2Ω typical ESR capacitor to GND. Detailed Description Similarly, when the feedback voltage is less than 1.25V, the error amplifier causes the output PMOS to conduct more current to pull the feedback voltage up to 1.25V. Thus, through this feedback action, the error amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback voltage force to be the same as the 1.25V bandgap reference. The output voltage, VOUT, is then given by the following equation: VOUT = 1.25 (1 + R1/R2). (1) Alternatively, the relationship between R1 and R2 is given by: R1 = R2 (VOUT / 1.25 + 1). (2) For the output voltage versions of G914X, the output voltages are 2.7V for G914A, 2.8V for G914B, 3.0V for G914C, 3.3V for G914D, and 2.5V for G914E, 2.85V for G914F, 1.50V for G914G and 1.80V for G914H. The block diagram of the G914X is shown in Figure 1. It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, shutdown logic, over current protection circuit, and over temperature protection circuit. The internal feedback voltage divider’s central tap is connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input with the 1.25V bandgap reference. If the feedback voltage is higher than 1.25V, the error amplifier’s output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (VGS). This reduces the current carrying capability of the PMOS output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V. IN SHDN － ERROR AMP SHUTDOWN LOGIC ＋ OVER CURRENT PROTECT & DYNAMIC FEEDBACK OUT BYP R1 OVER TEMP. PROTECT CBYP 1.25V Vref R2 GND Figure 1. Functional Diagram TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 7 G914X Global Mixed-mode Technology Inc. Over Current Protection The G914X use a current mirror to monitor the output current. A small portion of the PMOS output transistor’s current is mirrored onto a resistor such that the voltage across this resistor is proportional to the output current. This voltage is compared against the 1.25V reference. Once the output current exceeds the limit, the PMOS output transistor is turned off. Once the output transistor is turned off, the current monitoring voltage decreases to zero, and the output PMOS is turned on again. If the over current condition persist, the over current protection circuit will be triggered again. Thus, when the output is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical over current limit of the G914X is set to 500mA. Note that the input bypass capacitor of 1µF must be used in this case to filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating. The die attachment area of the G914X’s lead frame is connected to pin 2, which is the GND pin. Therefore, the GND pin of G914X can carry away the heat of the G914X die very effectively. To improve the power dissipation, connect the GND pin to ground using a large ground plane near the GND pin. Applications Information Capacitor Selection and Regulator Stability Normally, use a 1µF capacitor on the input and a 1µF capacitor on the output of the G914X. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A highervalue input capacitor (10µF) may be necessary if large, fast transients are anticipated and the device is located several inches from the power source. For stable operation over the full temperature range, with load currents up to 120mA, a minimum of 1µF is recommended. Power-Supply Rejection and Operation from Sources Other than Batteries The G914X is designed to deliver low dropout voltages and low quiescent currents in battery powered systems. Power-supply rejection is 57dB at low frequencies as the frequency increases above 20kHz; the output capacitor is the major contributor to the rejection of power-supply noise. Over Temperature Protection To prevent abnormal temperature from occurring, the G914X has a built-in temperature monitoring circuit. When it detects the temperature is above 150oC, the output transistor is turned off. When the IC is cooled down to below 135oC, the output is turned on again. In this way, the G914X will be protected against abnormal junction temperature during operation. When operating from sources other than batteries, improve supply-noise rejection and transient response by increasing the values of the input and output capacitors, and using passive filtering techniques. Shutdown Mode When the SHDN pin is connected a logic low voltage, the G914X enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has no load at all, the output voltage will be discharged to ground through the internal resistor voltage divider. Load Transient Considerations The G914X load-transient response graphs show two components of the output response: a DC shift of the output voltage due to the different load currents, and the transient response. Typical overshoot for step changes in the load current from 0mA to 100mA is 12mV. Increasing the output capacitor's value and decreasing its ESR attenuates transient spikes. Operating Region and Power Dissipation Since the G914X is a linear regulator, its power dissipation is always given by P = IOUT (VIN – VOUT). The maximum power dissipation is given by: Input-Output (Dropout) Voltage A regulator's minimum input-output voltage differential (or dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful end-of-life battery voltage. Because the G914X use a P-channel MOSFET pass transistor, their dropout voltage is a function of RDS(ON) multiplied by the load current cause the G914X use a P-channel MOSFET pass transistor, their dropout voltage is a function of RDS(ON) multiplied by the load current. PDMAX = (TJ – TA)/θJA = (150-25) / 240 = 520mW Where (TJ – TA) is the temperature difference the G914X die and the ambient air, θJA, is the thermal resistance of the chosen package to the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. In the case of a SOT23-5 package, the thermal resistance is typically 240oC/Watt. (See Recommended Minimum Footprint) [Figure 2]. Refer to Figure 3 is the G914X valid operating region (Safe Operating Area) & refer to Figure 4 is maximum power dissipation of SOT 23-5. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 8 G914X Global Mixed-mode Technology Inc. Layout Guide An input capacitance of ≅ 1µF is required between the G914X input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than 1cm from the input and return to a clean analog ground. routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating. The output capacitor also must be located a distance of not more than 1cm from output to a clean analog ground. Because it can filter out the output spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s routing wire. Figure 5 is G914X PCB recommended layout. Input capacitor can filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board’s Figure 2. Recommended Minimum Footprint Safe Operating Area [Power Dissipation Limit] Maximum Power Dissipation of SOT-23-5 400 0.7 Maximum Recommended Output Current 350 Still air 300 0.5 Power Dissipation (W) Output Current (mA) Still Air 1oz Copper on SOT-23-5 Package Mounted on recommended mimimum footprint (RθJA=240°C/W) 0.6 250 TA=85°C 200 TA=55°C 150 TA=25°C 100 1oz Copper on SOT-23-5 Package Mounted on recommended mimimum footprint (RJA=240°C/W) 50 0.4 0.3 0.2 0.1 0 0 0.1 0.4 0.7 1.0 1.3 1.6 1.9 25 2.2 35 45 Input-Output Voltage Differential VIN-VOUT (V) 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Note: VIN(max) <= 5.5V Figure 3. Safe Operating Area Figure 4. Power Dissipation vs. Temperature Figure 4 Safe Operating Area Figure 5. Fixed Mode *Distance between pin & capacitor must no more than 1cm TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 9 G914X Global Mixed-mode Technology Inc. Package Information C D L E H θ1 e1 e A A2 A1 b Note: 1. Package body sizes exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1000 mm (4mil) unless otherwise specified 3. Coplanarity: 0.1000mm 4. Dimension L is measured in gage plane SYMBOLS A A1 A2 b C D E e e1 H L θ1 MIN DIMENSIONS IN MILLIMETERS NOM 1.00 0.00 0.70 0.35 0.10 2.70 1.40 --------2.60 0.37 1º 1.10 ----0.80 0.40 0.15 2.90 1.60 1.90(TYP) 0.95 2.80 -----5º MAX 1.30 0.10 0.90 0.50 0.25 3.10 1.80 --------3.00 ----9º Taping Specification Feed Direction SOT23-5 Package Orientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.2 Jun 30, 2002 10