NL17SG32 Single 2-Input OR Gate The NL17SG32 MiniGatet is an advanced high−speed CMOS 2−input OR gate in ultra−small footprint. The NL17SG32 input structures provides protection when voltages up to 4.6 V are applied. http://onsemi.com Features • • • • • • Wide Operating VCC Range: 0.9 V to 3.6 V MARKING DIAGRAM High Speed: tPD = 2.4 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C 4.6 V Overvoltage Tolerant (OVT) Input Pins SOT−953 CASE 527AE Ultra−Small Packages 3M 1 These are Pb−Free and Halide−Free Devices 3 M = Specific Device Code = Month Code PIN ASSIGNMENT 1 IN A VCC 5 2 GND 4 3 IN B 1 IN A 2 GND 3 IN B 4 OUT Y 5 VCC OUT Y FUNCTION TABLE Inputs Figure 1. Pinout (Top View) IN A IN B ≥1 OUT Y Output A B Y L L H H L H L H L H H H Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2013 January, 2013 − Rev. 2 1 Publication Order Number: NL17SG32/D NL17SG32 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current Value Unit −0.5 to +5.5 V −0.5 to +4.6 V −0.5 to VCC +0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND Output at High or Low State Power−Down Mode (VCC = 0 V) IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Latchup Performance Above VCC and Below GND at 125°C (Note 4) >2000 >200 V ±100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 0.9 4.6 V VIN Digital Input Voltage 0.0 4.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise or Fail Rate VCC = 3.3 V ± 0.3 V http://onsemi.com 2 NL17SG32 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VIH High-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL Min VCC (V) Max TA = -555C to +1255C Min 0.9 VCC VCC 1.1 to 1.3 0.7xVCC 0.7xVCC 1.4 to 1.6 0.65xVCC 0.65xVCC 1.65 to 1.95 0.65xVCC 0.65xVCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 Max Unit V 0.9 GND GND 1.1 to 1.3 0.3xVCC 0.3xVCC 1.4 to 1.6 0.35xVCC 0.35xVCC 1.65 to 1.95 0.35xVCC 0.35xVCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 V V IOH = −20 mA 0.9 0.75 0.75 IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45 IOH = -4.0 mA 2.3 to 2.7 2.0 2.0 IOH = -8.0 mA 3.0 to 3.6 2.48 2.48 IOL = 20 mA 0.9 to 3.6 0.1 0.1 IOL = 1.1 mA 1.1 to 1.3 0.25xVCC 0.25xVCC IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA http://onsemi.com 3 NL17SG32 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns Symbol tPLH, tPHL Parameter Propagation Delay, A or B to Y Test Condition CL = 10 pF, RL = 1 MW CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW CIN Input Capacitance CPD Power Dissipation Capacitance (Note 5) Min Typ Max Min Max Unit 0.9 - 12.2 14.4 - 18.0 ns 1.1 to 1.3 - 8.8 12.4 - 16.2 1.4 to 1.6 - 5.0 8.5 - 10.0 1.65 to 1.95 - 3.6 6.2 - 6.7 2.3 to 2.7 - 2.7 3.9 - 4.4 3.0 to 3.6 - 2.1 3.1 - 3.7 0.9 - 13.0 16.0 - 18.0 1.1 to 1.3 - 7.8 12.0 - 16.0 1.4 to 1.6 - 5.9 9.3 - 11.2 1.65 to 1.95 - 4.5 6.9 - 7.1 2.3 to 2.7 - 3.0 4.4 - 5.0 3.0 to 3.6 - 2.4 3.4 - 3.9 0.9 - 14.0 17.2 - 20.0 1.1 to 1.3 - 11.0 14.1 - 17.8 1.4 to 1.6 - 8.0 12.1 - 15.9 1.65 to 1.95 - 6.0 9.2 - 9.6 2.3 to 2.7 - 3.9 5.7 - 6.1 3.0 to 3.6 - 3.0 4.4 - 4.8 3 - - - pF 4 - - - pF 0 to 3.6 f = 10 MHz TA = -555C to +1255C TA = 255 C VCC (V) 0.9 to 3.6 - ns ns 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 NL17SG32 Input A or B 50% 50% VCC GND tPLH Output Y tPHL VOH 50% VCC VOL Figure 3. Switching Waveforms VCC OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit ORDERING INFORMATION Device NL17SG32P5T5G Package Shipping† SOT−953 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL17SG32 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D Y PIN ONE INDICATOR 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A 4 HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). 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