HSDL-3000#007/017 IrDA® Data Compliant 115.2 kbps Infrared Transceiver Data Sheet Features Description The HSDL-3000 is a small form factor infrared (IR) transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Physical Layer Specifications 1.3 and is IEC 825-Class 1 eye safe. The HSDL-3000 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery-operated handheld products. The HSDL-3000 has two front packaging type options (HSDL-3000#007/017). Both options have an integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3000 infrared transceiver module. You can contact them through your local sales representatives for additional details. • Fully compliant to IrDA 1.3 specifications: – 2.4 kbps to 115.2 kbps – Excellent nose-to-nose operation – Typical link distance > 1.5 m • Guaranteed temperature performance, –20 to 70 °C – Critical parameters are guaranteed over temperature and supply voltages • Low power consumption – Low shutdown current (10 nA typical) – Complete shutdown for TXD, RXD, and PIN diode • Small module size – 2.70 x 9.10 x 3.65 mm (HxWxD) • Withstands >100 mVp-p power supply ripple typically • VCC supply 2.7 to 5.5 volts • LED stuck-high protection • IEC 825-Class 1 eye safe • Designed to accommodate light loss with cosmetic windows Applications • Data communication – PDAs – Notebooks – Printers • Mobile telecom – Cellular phones – Pagers – Smart phones • Digital imaging – Digital cameras – Photo-imaging printers • Electronic wallet • Medical and industry data collection HSDL-3000 Ordering Information Part Number Packaging Type Package Quantity HSDL-3000#007 Tape/Reel Front View 2500 HSDL-3000#017 Strip Front View 10 Functional Block Diagram Pinout VCC (5) CX2 CX1 REAR VIEW GND (6) SD (4) 5 4 3 2 1 RECEIVER 6 RXD (3) HSDL-3xxx TXD (2) SHIELD TRANSMITTER LEDA (1) R1 VCC I/O Pins Configuration Table Pin Symbol Description 1 LED A LED Anode 2 TXD Transmitter Data Input. Active High. 3 RXD Receiver Data Output. Active Low. 4 SD Shutdown. Active High. 5 VCC Supply Voltage 6 GND Ground – SHIELD EMI Shield Notes Tied through external resistor, R1, to regulated VCC from 2.7 to 5.5 volts. Logic High turns on the LED. If held high longer than ~ 50 µs, the LED is turned off. TXD must be either driven high or low. Do NOT float the pin. Output is a low pulse response when a light pulse is seen. Complete shutdown TXD, RXD, and PIN diode. Regulated, 2.7 to 5.5 volts. Connect to system ground. Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part. Recommended Application Circuit Components Component Recommended Value R1 2.2 Ω ± 5%, 0.25 Watt, for 2.7 ≤ VCC ≤ 3.3 V operation 2.7 Ω ± 5%, 0.25 Watt, for 3.0 ≤ VCC ≤ 3.6 V operation 6.8 Ω ± 5%, 0.25 Watt, for 4.5 ≤ VCC ≤ 5.5 V operation CX1[1] 0.47 µF ± 20%, X7R Ceramic CX2[2] 6.8 µF ± 20%, Tantalum Marking Information The HSDL-3000#007/017 is marked with a number “0” and “YWWLL” on the shield where ‘Y’ indicates the unit’s manufacturing year, ‘WW’ refers to the work week and ‘LL’ is the lot information. Notes: 1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity. 2. In environments with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2. Caution: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken during handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD. Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Symbol Min. Max. Units Storage Temperature TS –40 100 °C Operating Temperature TA –20 70 °C LED Supply Voltage VLED 0 7 V Supply Voltage VCC 0 7 V Output Voltage: RXD VO –0.5 7 V Conditions LED Current Pulse Amplitude ILED 500 mA ≤ 90 µs Pulse Width ≤ 20% Duty Cycle Recommended Operating Conditions Parameter Symbol Min. Max. Operating Temperature –20 70 °C Supply Voltage VCC 2.7 5.5 V Logic Input Voltage for TXD Logic High Logic Low VIH VIL 2/3 VCC 0 VCC 1/3 VCC V V Receiver Input Irradiance Logic High Logic Low EIH 0.0036 EIL 500 0.3 mW/cm2 µW/cm2 TXD Pulse Width (SIR) tTPW (SIR) 1.5 1.6 µs tPW (TXD) = 1.6 µs at 115.2 kbps 2.4 115.2 kbps TA Receiver Data Rate Ambient Light See Test Methods on page 16 for details. Units Conditions For in-band signals ≤ 115.2 kbps[1] For in-band signals[1] Electrical & Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Viewing Angle 2φ1/2 30 Peak Sensitivity Wavelength λp Units Conditions Receiver 875 ° nm RXD Output Voltage Logic High VOH VCC –0.2 VCC V IOH = –200 µA, EI ≤ 0.3 µW/cm2 Logic Low VOL 0 0.4 V 7.5 µs θ1/2 ≤ 15°, CL = 9 pF 25 100 ns CL = 9 pF tL 25 50 µs tRW 18 100 µs RXD Pulse Width (SIR)[2] tRPW (SIR) RXD Rise and Fall Times tr, tf Receiver Latency Time[3] Receiver Wake Up Time[4] 1 EI = 10 mW/cm2 Transmitter Radiant Intensity IEH 44 75 mW/sr Viewing Angle 2θ1/2 30 Peak Wavelength λp 60 875 ILEDA = 350 mA, θ1/2 ≤ 15°, TXD ≥ VIH, TA = 25°C ° nm TXD Logic Levels High VIH 2/3 VCC VCC V Low VIL 0 1/3 VCC V TXD Input Current High Low IH IL –1 0.02 –0.02 1 1 µA µA VI ≥ VIH 0 ≤ VI ≤ VIL LED Current Shutdown IVLED 20 1000 NA VI (SD) ≥ VIH, TA = 25°C Wakeup Time[5] tTW 30 100 ns Maximum Optical Pulse Width[6] tPW(Max) 25 50 µs TXD Rise and Fall Time (Optical) tr, tf 600 ns LED Anode on State Voltage VON (LEDA) 2.2 V ILEDA = 350 mA, VI (TXD) ≤ VIL Electrical & Optical Specifications (Continued) Parameter Symbol Min. Typ. Max. Units Conditions Transceiver Input Current High IH 0.01 1 µA VI ≥ VIH Low IL –1 -0.02 1 µA 0 ≤ VI ≤ VIL Supply Current Shutdown ICC1 0.01 1 µA VSD ≥ VCC – 0.5, TA = 25°C Idle ICC2 290 450 µA VI(TXD) ≤ VIL, EI = 0 Active ICC3 2 8 mA VI(TXD) ≥ VIL Notes: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 2. For in-band signals 2.4 kbps to 115.2 kbps where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2. 3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity. 4. Receiver wake up time is measured from VCC power on to valid RXD output. 5. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse. 6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED. 2.2 Ω 470 410 6.8 Ω 380 ILED (mA) ILED (mA) 440 2.7 Ω 500 110 470 100 440 90 IEH (mW/sr) 500 410 380 70 350 350 60 320 320 50 290 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 290 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 40 1.80 220 260 300 340 380 420 460 500 VCC (V) HSDL-3000 Graph 1 ILED (mA) VON (LEDA) ILED vs. VON (LEDA). ILED vs. VCC. 80 HSDL-3000 Graph 2 IEH vs. ILED. HSDL-3000 Graph 3 HSDL-3000#007 and HSDL-3000#017 Package Outline with Dimension and Recommended PC Board Pad Layout 9.10 ± 0.15 2.70 ± 0.15 1.35 2.65 2.60 1.25 5.80 1.55 0.70 3.65 2.95 1 2 3 4 5 6 0.60 (2 PLACES) PITCH 1.55 (5X) 0.425 DIMENSIONS HEIGHT: 2.70 ± 0.15 mm WIDTH: 9.10 ± 0.15 mm DEPTH: 3.65 ± 0.20 mm 0.55 0.65 (4 PLACES) UNLESS OTHERWISE STATED, TOLERANCES ± 0.2 mm RECOMMENDED LAND PATTERN 3.13 3.05 1.10 0.50 2.30 1.20 6 5 4 3 0.25 1.55 8.60 2 1 0.85 HSDL-3000#007 and HSDL-3000#017 Tape and Reel Dimensions 4.00 ± 0.10 5.00 (MAX.) 1.75 ± 0.10 1.13 ± 0.10 1.55 ± 0.05 POLARITY 9.50 ± 0.10 1 2 3 4 5 6 PIN 6: GND +0.10 3.46 0 + 7.50 ± 0.10 16.00 ± 0.30 +0.10 3.30 0 PIN 1: VLED 8.00 ± 0.10 0.40 ± 0.10 3.00 ± 0.10 8.00 (MAX.) MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC 3.40 ± 0.20 METHOD OF COVER: HEAT ACTIVATED ADHESIVE 4.20 ± 0.20 PROGRESSIVE DIRECTION (40 mm MIN.) EMPTY (40 mm MIN.) LEADER PARTS MOUNTED EMPTY (40 mm MIN.) "B" "C" 330 QUANTITY 80 2500 UNIT: mm DETAIL A DIA. 13.00 ± 0.50 R 1.00 B C 2.00 ± 0.50 LABEL 16.40 + 2.00 0 21.00 ± 0.80 DETAIL A 2.00 ± 0.50 Moisture Proof Packaging Time from Unsealing to Soldering The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins. After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. Baking Recommended Storage Conditions Storage Temperature 10°C to 30°C Relative Humidity Below 60% RH If the parts are not stored in a dry environment, they must be baked before reflow process to prevent damage to parts. Baking should be done only once. Packaging Baking Temperature Baking Time In Reel 60°C ≥ 48 hours In Bulk 100°C ≥ 4 hours 125°C ≥ 2 hours 150°C ≥ 1 hour Recommended Reflow Profile MAX 260°C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 150 sec Above 217°C 150 R5 R1 120 80 25 0 P1 HEAT UP Process Zone Heat Up Solder Paste Dry Solder Reflow 50 100 150 P2 SOLDER PASTE DRY Symbol P1, R1 P2, R2 P3, R3P3, R4 Cool Down P4, R5 Time maintained above 217°C Peak Temperature Time within 5°C of actual Peak Temperature Time 25°C to Peak Temperature P3 SOLDER REFLOW T 25°C to 150°C 150°C to 200°C 200°C to 255°C 255°C to 200°C 200°C to 25°C > 217°C 260°C > 255°C 25°C to 260°C The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates or duration. The ∆T/∆time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3000 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and HSDL-3000 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The 200 250 P4 COOL DOWN 300 t-TIME (SECONDS) Maximum DT/ time or Duration 3°C/s 60s to 180s 3°C/s-6°C/s -6°C/s 60s to 150s 20s to 40s 8mins max. dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3000 pins to change dimensions evenly, putting minimal stresses on the HSDL-3000. It is recommended to perform reflow soldering no more than twice. Appendix A : HSDL-3000#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3000 DIM. mm INCHES a 2.30 0.091 b 0.85 0.034 c (PITCH) 1.55 0.061 d 1.10 0.043 e 3.05 0.120 f 2.20 0.087 g 2.42 0.095 h 0.20 0.008 SHIELD SOLDER PAD Rx LENS Tx LENS e d g b Y f h a FIDUCIAL 6x PAD Figure 2. Top view of land pattern. HSDL-3000 fig 2.0 Land Pattern 10 X theta c FIDUCIAL 1.2 Adjacent Land Keep-out and Solder Mask Areas 2.1 Recommended Metal Solder Stencil Aperture Dim. h j k l It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: mm min. 0.40 10.1 3.85 3.2 Inches min. 0.016 0.40 0.15 0.126 • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. • “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. • It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. t, Nominal Stencil Thickness See Fig. 4. l, Length of Aperture mm inches mm inches 0.152 0.006 2.3 ± 0.05 0.091 ± 0.002 0.127 0.005 2.75 ± 0.05 0.108 ± 0.002 w, the width of aperture, is fixed at 0.85 mm (0.034 inches). Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land dimension. APERTURES AS PER LAND DIMENSIONS 2.0 Recommended Solder Paste/Cream Volume for Castellation Joints t (STENCIL THICKNESS) The recommended printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). SOLDER PASTE w l Figure 4. Solder paste stencil aperture. HSDL-300 Solder Stencil j Rx LENS Tx LENS k LAND SOLDER MASK h Y X l Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask. HSDL-3000 fig 3.0 PCBA Land Keep-Out 11 Appendix B: HSDL-3000#007/#017 – Recommended Optical Port Design To insure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 degrees, the maximum, to a cone angle of 60 degrees. Z X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3000 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.80 mm. The equations for the size of the window are as follows: Y X = 5.80 +2(Z + D) tan θ Y = 2(Z + D) tan θ Where θ is the required half angle for viewing. For the IrDA minimum, it is 15 degrees, for the IrDA maximum it is 30 degrees. (D is the depth of the LED image inside the part, 3.2 mm from the Tx lens vertex). These equations result in the following tables and graphs: X 18 Depth (Z) mm X min. 0 7.34 1 7.88 2 8.42 3 8.95 4 9.49 5 10.02 6 10.56 7 11.10 8 11.63 9 12.17 10 12.70 11 13.24 12 13.77 13 14.31 14 14.85 15 15.38 16 15.92 17 16.46 18 16.99 19 17.53 20 18.06 Dimensions are in mm. 12 Y min. 1.71 2.25 2.79 3.32 3.86 4.39 4.93 5.47 6.00 6.54 7.07 7.61 8.14 8.68 9.22 9.75 10.29 10.83 11.36 11.90 12.43 X max. 9.33 10.48 11.63 12.79 13.94 15.10 16.25 17.41 18.56 19.72 20.87 22.03 23.18 24.34 25.49 26.65 27.80 28.95 30.11 31.26 32.42 Y max. 3.70 4.85 6.00 7.16 8.31 9.47 10.62 11.78 12.93 14.09 15.24 16.40 17.55 18.71 19.86 21.01 22.17 23.32 24.48 25.63 26.79 Y MAX. 14 12 10 ACCEPTABLE RANGE 8 Y MIN. 6 4 2 0 0 2 4 6 8 10 MODULE DEPTH Z – mm Window height Y vs. module depth Z. 25 WINDOW WIDTH X – mm Minimum and Maximum Window Sizes WINDOW HEIGHT Y – mm 16 HSDL-3000 Window Ht vs Module Depth X MAX. 20 15 X MIN. 10 5 0 0 2 4 6 8 MODULE DEPTH Z – mm Window width X vs. module depth Z. HSDL-3000 Width vs Depth 10 Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical design reasons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. HSDL-3000 Curved/Flat Window Flat Window (first choice) HSDL-3000 Flat Window CurvedHSDL-3000 Front and Back Curved Window (second choice) Curved Front, Flat Back (do not use) Test Methods 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. Background Light and Electro-magnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 4. Fluorescent Lighting: 3 V/m maximum (please refer to IEC 61000-4-3 severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 µW/ cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate For company and product information, please go to our web site: WWW.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved. 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 µW/cm2 minimum and 0.3 µW/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circum- stances. It will provide a common floor for IrDA operation.