19-5307; Rev 0; 6/10 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch Features The MAX19993 dual-channel downconverter is designed to provide 6.4dB of conversion gain, +27dBm input IP3, 15.4dBm 1dB input compression point, and a noise figure of 9.8dB for 1200MHz to 1700MHz diversity receiver applications. With an optimized LO frequency range of 1000MHz to 1560MHz, this mixer is ideal for low-side LO injection architectures. High-side LO injection is supported by the MAX19993A, which is pinpin and functionally compatible with the MAX19993. S 1200MHz to 1700MHz RF Frequency Range In addition to offering excellent linearity and noise performance, the MAX19993 also yields a high level of component integration. This device includes two double-balanced passive mixer cores, two LO buffers, a dual-input LO selectable switch, and a pair of differential IF output amplifiers. Integrated on-chip baluns allow for single-ended RF and LO inputs. The device requires a nominal LO drive of 0dBm and a typical supply current of 337mA at VCC = +5.0V or 275mA at VCC = +3.3V. S 72dBc Typical 2RF - 2LO Spurious Rejection at The MAX19993 is pin compatible with the MAX9985/ MAX19985A/MAX9995/MAX19993A/MAX19994/ MAX19994A/MAX19995/MAX19995A series of 700MHz to 2200MHz mixers and pin similar to the MAX19997A/ MAX19999 series of 1850MHz to 4000MHz mixers, making this entire family of downconverters ideal for applications where a common PCB layout is used across multiple frequency bands. The device is available in a 6mm x 6mm, 36-pin TQFN package with an exposed pad. Electrical performance is guaranteed over the extended temperature range, from TC = -40NC to +85NC. Applications WCDMA/LTE Base Stations S 1000MHz to 1560MHz LO Frequency Range S 50MHz to 500MHz IF Frequency Range S 6.4dB Typical Conversion Gain S 9.8dB Typical Noise Figure S +27dBm Typical Input IP3 S 15.4dBm Typical Input 1dB Compression Point PRF = -10dBm S Dual Channels Ideal for Diversity Receiver Applications S 47dB Typical Channel-to-Channel Isolation S Low -6dBm to +3dBm LO Drive S Integrated LO Buffer S Internal RF and LO Baluns for Single-Ended Inputs S Built-In SPDT LO Switch with 57dB LO-to-LO Isolation and 50ns Switching Time S Pin Compatible with the MAX9985/19985A/ MAX9995/MAX19993A/MAX19994/MAX19994A/ MAX19995/MAX19995A Series of 700MHz to 2200MHz Mixers S Pin Similar to the MAX19997A/MAX19999 Series of 1850MHz to 4000MHz Mixers S Single +5V or +3.3V Supply S External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/ReducedPerformance Mode Wireless Local Loop Ordering Information Fixed Broadband Wireless Access Private Mobile Radios Military Systems PART TEMP RANGE PIN-PACKAGE MAX19993ETX+ MAX19993ETX+T 36 TQFN-EP* -40NC to +85NC 36 TQFN-EP* -40NC to +85NC +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. T = Tape and reel. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX19993 General Description MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS Continuous Power Dissipation (Note 1)...............................8.7W BJA (Notes 2, 3)............................................................ +38NC/W BJC (Notes 1, 3)..............................................................7.4NC/W Operating Temperature Range (Note 4).... TC = -40NC to +85NC Junction Temperature......................................................+150NC Storage Temperature Range............................. -65NC to +150NC Lead Temperature (soldering, 10s).................................+300NC Soldering Temperature (reflow).......................................+260NC VCC to GND...........................................................-0.3V to +5.5V LO1, LO2 to GND............................................................... Q0.3V LOSEL to GND.......................................... -0.3V to (VCC + 0.3V) RFMAIN, RFDIV, and LO_ Input Power......................... +15dBm RFMAIN, RFDIV Current (RF is DC shorted to GND through a balun)..............................................................50mA TAPMAIN, TAPDIV...................................................-0.3V to +2V Any Other Pins to GND............................. -0.3V to (VCC + 0.3V) Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150NC. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.82kI. Typical values are at VCC = 5.0V, TC = +25NC, unless otherwise noted. All parameters are production tested.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LOSEL Input High Voltage VIH LOSEL Input Low Voltage VIL LOSEL Input Current CONDITIONS MIN 4.75 Total supply current TYP MAX 5 5.25 V 337 400 mA 2 IIH and IIL UNITS V -10 0.8 V +10 FA 3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = 3.0V to 3.6V, no input AC signals. TC = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical values are at VCC = 3.3V, TC = +25NC, unless otherwise noted. Parameters are guaranteed by design and not production tested.) PARAMETER Supply Voltage SYMBOL VCC CONDITIONS TYP 3.3 MAX 3.6 UNITS V Supply Current ICC 275 mA LOSEL Input High Voltage VIH 2 V LOSEL Input Low Voltage VIL 0.8 V 2 Total supply current (Note 5) MIN 3.0 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency fRF (Note 6) 1200 1700 MHz LO Frequency fLO (Note 6) 1000 1560 MHz Using Mini-Circuits TC4-1W-17 4:1 transformer as defined in the Typical Application Circuit, IF matching components affect the IF frequency range (Note 6) 100 500 IF Frequency LO Drive Level MHz fIF PLO MAX19993 RECOMMENDED AC OPERATING CONDITIONS Using Mini-Circuits TC4-1W-7A 4:1 transformer as defined in the Typical Application Circuit, IF matching components affect the IF frequency range (Note 6) 50 250 (Note 6) -6 +3 dBm 5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO, TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7) PARAMETER Conversion Gain (Note 5) SYMBOL GC CONDITIONS MIN TYP MAX 7.4 4.5 6.4 TC = +25NC 5.1 6.4 7.0 TC = +25NC, fRF = 1427MHz to 1463MHz 5.2 6.4 6.9 Conversion Gain Flatness DGC fRF = 1427MHz to 1463MHz Gain Variation Over Temperature TCCG TC = -40NC to +85NC Input Compression Point IP1dB fRF = 1450MHz (Notes 5, 8) 12.9 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone 24.0 27.0 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, fRF = 1427MHz to 1463MHz, TC = +25NC (Note 5) 24.8 27.0 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, fRF = 1427MHz to 1463MHz (Note 5) 24.4 27.0 Input Third-Order Intercept Point Input Third-Order Intercept Point Variation Over Temperature Noise Figure (Note 9) IIP3 TCIIP3 NFSSB fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, TC = -40NC to +85NC UNITS dB Q0.03 dB -0.009 dB/NC 15.4 dBm dBm dBm Q0.5 Single sideband, no blockers present 9.8 12.7 fRF = 1427MHz to 1463MHz, TC = +25NC, PLO = 0dBm, single sideband, no blockers present 9.8 11.0 fRF = 1427MHz to 1463MHz, PLO = 0dBm, single sideband, no blockers present 9.8 12.0 dB 3 MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued) (Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO, TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7) PARAMETER Noise Figure Temperature Coefficient Noise Figure with Blocker SYMBOL CONDITIONS Single sideband, no blockers present, TC = -40NC to +85NC 0.016 NFB PBLOCKER = +8dBm, fRF = 1450MHz, fLO = 1310MHz, fBLOCKER = 1550MHz, PLO = 0dBm, VCC = 5.0V, TC = +25oC (Notes 9, 10) 21.0 2x2 fRF = 1450MHz, fLO = 1310MHz, fSPUR = 1380MHz, PLO = 0dBm, VCC = 5.0V, TC = +25oC fRF = 1450MHz, fLO = 1310MHz, fSPUR = 1356.67MHz 3RF - 3LO Spur Rejection (Note 9) TYP TCNF fRF = 1450MHz, fLO = 1310MHz, fSPUR = 1380MHz 2RF - 2LO Spur Rejection (Note 9) MIN 3x3 fRF = 1450MHz, fLO = 1310MHz, fSPUR = 1356.67MHz, PLO = 0dBm, VCC = 5.0V, TC = +25oC PRF = -10dBm 58 72 PRF = -5dBm 53 67 PRF = -10dBm 61 72 MAX UNITS dB/NC 22.8 dB dBc dBc PRF = -5dBm 56 67 PRF = -10dBm 77 93 PRF = -5dBm 67 83 PRF = -10dBm 82 93 dBc dBc PRF = -5dBm 72 83 LO and IF terminated into matched impedance, LO on 21 LO port selected, RF and IF terminated into matched impedance 24 LO port unselected, RF and IF terminated into matched impedance 27 Nominal differential impedance of the IF outputs 200 I IF Output Return Loss RF terminated into 50I, LO driven by 50I source, IF transformed to 50I using external components shown in the Typical Application Circuit 15 dB RF-to-IF Isolation (Note 5) RF Input Return Loss LO Input Return Loss IF Output Impedance ZIF dB dB 33 dB LO Leakage at RF Port -38 dBm 2LO Leakage at RF Port -27 dBm 4 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch (Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO, TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7) PARAMETER SYMBOL LO Leakage at IF Port CONDITIONS MIN (Note 5) TYP MAX -18 UNITS dBm RFMAIN converted power measured at IFDIV relative to IFMAIN, all unused ports terminated to 50I 43 RFDIV converted power measured at IFMAIN relative to IFDIV, all unused ports terminated to 50I 43 47 LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm, fLO1 = 1310MHz, fLO2 = 1311MHz (Note 5) 47 57 dB LO Switching Time 50% of LOSEL to IF settled within 2 degrees 50 ns Channel Isolation (Note 5) 47 dB 3.3V SUPPLY, LOW SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC, unless otherwise noted.) (Note 7) PARAMETER SYMBOL CONDITIONS TYP MAX UNITS 6.2 dB Conversion Gain Flatness DGC fRF = 1427MHz to 1463MHz Q0.05 dB Gain Variation Over Temperature TCCG TC = -40NC to +85NC -0.009 dB/NC Input Compression Point IP1dB (Note 8) 12.8 dBm fRF1 - fRF2 = 1MHz 24.4 dBm Q0.8 dBm Conversion Gain GC (Note 5) MIN Input Third-Order Intercept Point IIP3 Input Third-Order Intercept Point Variation Over Temperature TCIIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone, TC = -40NC to +85NC Noise Figure NFSSB Single sideband, no blockers present 9.8 dB Noise Figure Temperature Coefficient TCNF Single sideband, no blockers present, TC = -40NC to +85NC 0.016 dB/NC 2RF - 2LO Spur Rejection 2x2 3RF - 3LO Spur Rejection 3x3 RF Input Return Loss LO Input Return Loss PRF = -10dBm 73 PRF = -5dBm 68 PRF = -10dBm 80 PRF = -5dBm 70 LO and IF terminated into matched impedance, LO on 21 LO port selected, RF and IF terminated into matched impedance 24 LO port unselected, RF and IF terminated into matched impedance 27 dBc dBc dB dB 5 MAX19993 5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 3.3V SUPPLY, LOW SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued) (Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC, unless otherwise noted.) (Note 7) PARAMETER IF Output Return Loss SYMBOL CONDITIONS RF terminated into 50I, LO driven by 50I source, IF transformed to 50I using external components shown in the Typical Application Circuit MIN TYP 15 MAX UNITS dB RF-to-IF Isolation 33 dB LO Leakage at RF Port -45 dBm 2LO Leakage at RF Port -27 dBm LO Leakage at IF Port -22 dBm RFMAIN converted power measured at IFDIV relative to IFMAIN, all unused ports terminated to 50I 47 RFDIV converted power measured at IFMAIN relative to IFDIV, all unused ports terminated to 50I 47 LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm, fLO1 = 1310MHz, fLO2 = 1311MHz 57 dB LO Switching Time 50% of LOSEL to IF settled within 2 degrees 50 ns Channel Isolation dB Note 5: 100% production tested for functionality. Note 6: Not production tested. Operation outside this range is possible, but with degraded performance of some parameters. See the Typical Operating Characteristics section. Note 7: All limits reflect losses of external components, including a 0.5dB loss at fIF = 140MHz due to the 4:1 transformer. Output measurements were taken at IF outputs of the Typical Application Circuit. Note 8: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50I source. Note 9: Not production tested. Note 10: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021: Specifications and Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers. 6 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch TC = +85°C 5 4 6 PLO = -6dBm, -3dBm, 0dBm, +3dBm 5 4 1400 1500 1600 1700 1300 RF FREQUENCY (MHz) 1400 MAX19993 toc04 28 1500 1600 5 1700 1200 1300 TC = -40°C PLO = 0dBm PLO = -3dBm 26 28 PRF = -5dBm/TONE 27 VCC = 5.0V 26 1400 1500 1600 1700 25 1200 1300 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 1700 12 10 PLO = -6dBm, -3dBm, 0dBm, +3dBm 7 1500 RF FREQUENCY (MHz) 1600 1700 1700 12 11 10 9 VCC = 4.75V, 5.0V, 5.25V 7 7 1400 1600 8 8 TC = -40°C 1500 NOISE FIGURE vs. RF FREQUENCY 11 9 1400 13 NOISE FIGURE (dB) 9 1300 1300 RF FREQUENCY (MHz) MAX19993 toc08 MAX19993 toc07 10 1200 1200 NOISE FIGURE vs. RF FREQUENCY TC = +25°C 8 1600 13 NOISE FIGURE (dB) NOISE FIGURE (dB) TC = +85°C 11 1500 RF FREQUENCY (MHz) 13 12 1400 MAX19993 toc09 1300 1700 VCC = 4.75V 25 1200 1600 VCC = 5.25V PLO = -6dBm 25 1500 INPUT IP3 vs. RF FREQUENCY PRF = -5dBm/TONE 27 1400 RF FREQUENCY (MHz) PLO = +3dBm INPUT IP3 (dBm) INPUT IP3 (dBm) TC = +25°C 26 VCC = 4.75V, 5.0V, 5.25V INPUT IP3 vs. RF FREQUENCY PRF = -5dBm/TONE TC = +85°C 27 6 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY 28 7 4 1200 INPUT IP3 (dBm) 1300 MAX19993 toc05 1200 MAX19993 toc03 7 CONVERSION GAIN (dB) 6 CONVERSION GAIN vs. RF FREQUENCY 8 MAX19993 toc02 MAX19993 toc01 CONVERSION GAIN (dB) CONVERSION GAIN (dB) TC = -40°C TC = +25°C 7 CONVERSION GAIN vs. RF FREQUENCY 8 MAX19993 toc06 CONVERSION GAIN vs. RF FREQUENCY 8 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 1600 1700 RF FREQUENCY (MHz) 7 MAX19993 Typical Operating Characteristics (Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) TC = +25°C TC = -40°C 60 70 60 PLO = -6dBm PRF = -5dBm MAX19993 toc12 PLO = 0dBm MAX19993 toc11 PRF = -5dBm PLO = +3dBm 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 2RF - 2LO RESPONSE (dBc) TC = +85°C 70 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 2RF - 2LO RESPONSE (dBc) 2RF - 2LO RESPONSE (dBc) PRF = -5dBm MAX19993 toc10 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 70 VCC = 4.75V, 5.0V, 5.25V 60 PLO = -3dBm 50 1500 1600 1700 50 1200 1300 RF FREQUENCY (MHz) TC = -40°C 75 TC = +25°C 65 PLO = 0dBm 55 1700 1200 PRF = -5dBm 85 PLO = -3dBm 75 1400 1500 1600 PLO = +3dBm PLO = -6dBm 65 1700 1300 1400 1500 1600 VCC = 5.0V TC = -40°C 14 13 15 PLO = -6dBm, -3dBm, 0dBm, +3dBm 1400 1500 RF FREQUENCY (MHz) 1600 1700 VCC = 4.75V 65 1200 1300 1400 1500 1600 1700 17 VCC = 5.25V 16 15 VCC = 4.75V VCC = 5.0V 14 13 1300 VCC = 5.25V INPUT P1dB vs. RF FREQUENCY 14 1200 75 1700 MAX19993 toc17 16 INPUT P1dB (dBm) 15 PRF = -5dBm 85 INPUT P1dB vs. RF FREQUENCY TC = +25°C 1700 RF FREQUENCY (MHz) 17 MAX19993 toc16 TC = +85°C 1600 3RF - 3LO RESPONSE vs. RF FREQUENCY RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 16 1500 55 1200 RF FREQUENCY (MHz) 17 1400 95 INPUT P1dB (dBm) 1300 1300 RF FREQUENCY (MHz) 55 1200 8 1600 3RF - 3LO RESPONSE vs. RF FREQUENCY 95 3RF - 3LO RESPONSE (dBc) 3RF - 3LO RESPONSE (dBc) 85 MAX19993 toc13 PRF = -5dBm TC = +85°C 1500 RF FREQUENCY (MHz) 3RF - 3LO RESPONSE vs. RF FREQUENCY 95 1400 MAX19993 toc15 1400 3RF - 3LO RESPONSE (dBc) 1300 MAX19993 toc14 1200 MAX19993 toc18 50 INPUT P1dB (dBm) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 13 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 50 45 TC = -40°C, +25°C, +85°C 40 35 50 45 PLO = -6dBm, -3dBm, 0dBm, +3dBm 40 CHANNEL ISOLATION vs. RF FREQUENCY 55 1300 1400 1500 1600 1700 45 VCC = 4.75V, 5.0V, 5.25V 40 30 1200 1300 1400 1500 1600 1700 1200 1300 1400 1500 1600 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY TC = +85°C -30 PLO = -6dBm -20 PLO = 0dBm -30 PLO = +3dBm 1700 MAX19993 toc24 -10 0 VCC = 5.25V LO LEAKAGE AT IF PORT (dBm) TC = +25°C -10 0 MAX19993 toc23 TC = -40°C LO LEAKAGE AT IF PORT (dBm) MAX19993 toc22 0 -20 50 35 30 1200 MAX19993 toc21 60 35 30 LO LEAKAGE AT IF PORT (dBm) MAX19993 toc20 55 CHANNEL ISOLATION (dB) MAX19993 toc19 CHANNEL ISOLATION (dB) 55 CHANNEL ISOLATION vs. RF FREQUENCY 60 CHANNEL ISOLATION (dB) CHANNEL ISOLATION vs. RF FREQUENCY 60 -10 VCC = 4.75V -20 -30 VCC = 5.0V PLO = -3dBm -40 -40 1260 1360 1460 1560 -40 1060 1160 LO FREQUENCY (MHz) RF-TO-IF ISOLATION vs. RF FREQUENCY 1460 1560 RF-TO-IF ISOLATION vs. RF FREQUENCY TC = -40°C 20 40 30 PLO = -6dBm, -3dBm, 0dBm, +3dBm 20 1300 1400 1500 RF FREQUENCY (MHz) 1160 1600 1700 1260 1360 1460 1560 RF-TO-IF ISOLATION vs. RF FREQUENCY 50 MAX19993 toc26 MAX19993 toc25 30 1200 1060 LO FREQUENCY (MHz) 50 RF-TO-IF ISOLATION (dB) RF-TO-IF ISOLATION (dB) TC = +85°C TC = +25°C 1360 LO FREQUENCY (MHz) 50 40 1260 MAX19993 toc27 1160 RF-TO-IF ISOLATION (dB) 1060 40 30 VCC = 4.75V, 5.0V, 5.25V 20 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 1600 1700 RF FREQUENCY (MHz) 9 MAX19993 Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = -40°C -40 -50 TC = +85°C TC = +25°C -60 -70 PLO = 0dBm -40 -50 PLO = -6dBm PLO = -3dBm -60 1160 1270 1380 1490 1600 VCC = 4.75V, 5.0V, 5.25V -50 -60 -70 1050 1160 1270 1380 1490 1600 1160 1050 1270 1380 1490 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY -30 TC = +85°C -50 -30 PLO = -6dBm -40 PLO = -3dBm -50 VCC = 5.0V -60 1270 1380 1490 1600 1160 LO FREQUENCY (MHz) 1270 1380 1490 60 TC = +85°C 40 1600 1870 1380 LO FREQUENCY (MHz) -50 1050 LO SWITCH ISOLATION vs. LO FREQUENCY MAX19993 toc35 60 PLO = -6dBm, -3dBm, 0dBm, +3dBm 50 40 1160 VCC = 4.75V -40 1160 1490 1600 1270 1380 1490 1600 LO FREQUENCY (MHz) 70 LO SWITCH ISOLATION (dB) TC = -40°C MAX19993 toc34 LO SWITCH ISOLATION vs. LO FREQUENCY 50 -30 LO FREQUENCY (MHz) 70 TC = +25°C VCC = 5.25V -20 -60 1050 LO SWITCH ISOLATION vs. LO FREQUENCY 70 LO SWITCH ISOLATION (dB) 1160 MAX19993 toc33 MAX19993 toc32 -20 PLO = 0dBm 1600 MAX19993 toc36 -40 PLO = +3dBm -10 2LO LEAKAGE AT RF PORT (dBm) TC = +25°C -10 2LO LEAKAGE AT RF PORT (dBm) -20 MAX19993 toc31 LO FREQUENCY (MHz) -60 10 -40 LO FREQUENCY (MHz) TC = -40°C 1050 -30 LO FREQUENCY (MHz) -10 1050 MAX19993 toc30 PLO = +3dBm -70 1050 2LO LEAKAGE AT RF PORT (dBm) -30 -20 LO LEAKAGE AT RF PORT (dBm) -30 -20 LO LEAKAGE AT RF PORT (dBm) MAX19993 toc28 LO LEAKAGE AT RF PORT (dBm) -20 LO LEAKAGE AT RF PORT vs. LO FREQUENCY MAX19993 toc29 LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO SWITCH ISOLATION (dB) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 60 VCC = 4.75V, 5.0V, 5.25V 50 40 1050 1160 1870 1380 LO FREQUENCY (MHz) 1490 1600 1050 1160 1870 1380 LO FREQUENCY (MHz) 1490 1600 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch RF PORT RETURN LOSS vs. RF FREQUENCY 5 0 VCC = 4.75V, 5.0V, 5.25V 5 IF PORT RETURN LOSS (dB) 10 PLO = -6dBm, -3dBm, 0dBm, +3dBm 15 20 25 15 LO = 1310MHz 20 LO = 1060MHz 25 30 1300 1400 1500 1600 30 1700 320 410 500 LO SELECTED PORT RETURN LOSS vs. LO FREQUENCY LO UNSELECTED PORT RETURN LOSS vs. LO FREQUENCY PLO = +3dBm 20 PLO = -3dBm 30 PLO = -6dBm 1400 10 PLO = -6dBm, -3dBm, 0dBm, +3dBm 20 30 40 50 1600 1800 2000 1200 1000 LO FREQUENCY (MHz) 1400 1600 1800 2000 LO FREQUENCY (MHz) SUPPLY CURRENT vs. TEMPERATURE (TC) 370 360 SUPPLY CURRENT (mA) 1200 MAX19993 toc40 0 MAX19993 toc39 PLO = 0dBm 10 1000 230 IF FREQUENCY (MHz) 0 40 140 50 RF FREQUENCY (MHz) LO UNSELECTED PORT RETURN LOSS (dB) 1200 LO SELECTED PORT RETURN LOSS (dB) LO = 1560MHz 10 VCC = 5.25V VCC = 5.0V MAX19993 toc41 RF PORT RETURN LOSS (dB) IF = 140MHZ MAX19993 toc37 0 MAX19993 toc38 IF PORT RETURN LOSS vs. IF FREQUENCY 350 340 330 320 VCC = 4.75V 310 -40 -15 10 35 60 85 TEMPERATURE (°C) 11 MAX19993 Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless otherwise noted.) TC = +85°C 5 TC = +25°C 4 6 PLO = -6dBm, -3dBm, 0dBm, +3dBm 5 4 1400 1500 1600 1700 1300 RF FREQUENCY (MHz) 6 VCC = 3.0V 5 1500 1600 1700 1200 1300 VCC = 3.3V PRF = -5dBm/TONE TC = +25°C 24 23 PLO = +3dBm 26 25 PLO = 0dBm PLO = -6dBm 1500 1600 1700 INPUT IP3 vs. RF FREQUENCY VCC = 3.3V PRF = -5dBm/TONE 24 1400 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY INPUT IP3 (dBm) INPUT IP3 (dBm) 25 1400 27 MAX19993 toc45 TC = +85°C 26 VCC = 3.3V RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY 27 VCC = 3.6V 7 4 1200 27 23 VCC = 3.6V PRF = -5dBm/TONE 26 INPUT IP3 (dBm) 1300 MAX19993 toc46 1200 MAX19993 toc44 7 MAX19993 toc47 6 VCC = 3.3V CONVERSION GAIN vs. RF FREQUENCY 8 CONVERSION GAIN (dB) 7 MAX19993 toc42 VCC = 3.3V CONVERSION GAIN (dB) CONVERSION GAIN (dB) TC = -40°C CONVERSION GAIN vs. RF FREQUENCY 8 MAX19993 toc43 CONVERSION GAIN vs. RF FREQUENCY 8 VCC = 3.3V 25 24 VCC = 3.0V 23 TC = -40°C 22 22 22 PLO = -3dBm 21 21 1500 1600 1700 21 1200 1300 RF FREQUENCY (MHz) 13 MAX19993 toc48 11 10 9 11 10 9 PLO = -6dBm, -3dBm, 0dBm, +3dBm 8 TC = -40°C 7 1300 1400 1500 RF FREQUENCY (MHz) 1300 1600 1700 1400 1500 1600 1700 13 12 11 10 9 VCC = 3.0V, 3.3V, 3.6V 8 7 1200 1200 NOISE FIGURE vs. RF FREQUENCY VCC = 3.3V TC = +25°C 12 1700 RF FREQUENCY (MHz) 12 NOISE FIGURE (dB) TC = +85°C 8 1600 NOISE FIGURE vs. RF FREQUENCY VCC = 3.3V 12 1500 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 13 1400 MAX19993 toc50 1400 NOISE FIGURE (dB) 1300 MAX19993 toc49 1200 NOISE FIGURE (dB) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 7 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 50 60 PLO = 0dBm PLO = -3dBm PLO = -6dBm 1400 1500 1600 1700 1300 RF FREQUENCY (MHz) TC = +85°C 65 1400 1500 60 1600 1700 VCC = 3.0V 1200 1300 TC = -40°C 1400 1500 1600 1700 RF FREQUENCY (MHz) 3RF - 3LO RESPONSE vs. RF FREQUENCY 85 3RF - 3LO RESPONSE (dBc) MAX19993 toc54 VCC = 3.3V PRF = -5dBm 75 VCC = 3.3V RF FREQUENCY (MHz) 3RF - 3LO RESPONSE vs. RF FREQUENCY 85 70 50 1200 VCC = 3.3V PRF = -5dBm 75 65 PLO = -6dBm, -3dBm, 0dBm, +3dBm 3RF - 3LO RESPONSE vs. RF FREQUENCY 85 PRF = -5dBm VCC = 3.6V 3RF - 3LO RESPONSE (dBc) 1300 MAX19993 toc53 VCC = 3.6V 50 1200 3RF - 3LO RESPONSE (dBc) MAX19993 toc52 70 PRF = -5dBm MAX19993 toc56 60 TC = -40°C PLO = +3dBm 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 2RF - 2LO RESPONSE (dBc) TC = +25°C VCC = 3.3V PRF = -5dBm MAX19993 toc55 2RF - 2LO RESPONSE (dBc) 70 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 2RF - 2LO RESPONSE (dBc) VCC = 3.3V PRF = -5dBm TC = +85°C MAX19993 toc51 2RF - 2LO RESPONSE vs. RF FREQUENCY 80 75 VCC = 3.3V 65 TC = +25°C 55 1400 1500 1600 1700 1300 RF FREQUENCY (MHz) MAX19993 toc57 13 TC = -40°C 15 1600 1700 TC = +25°C 11 10 VCC = 3.3V 13 12 PLO = -6dBm, -3dBm, 0dBm, +3dBm 1400 1500 RF FREQUENCY (MHz) 1600 1700 1400 1500 1600 15 VCC = 3.6V VCC = 3.3V 14 1700 13 12 VCC = 3.0V 11 10 1300 1300 INPUT P1dB vs. RF FREQUENCY 11 1200 1200 RF FREQUENCY (MHz) 14 INPUT P1dB (dBm) INPUT P1dB (dBm) TC = +85°C 12 1500 INPUT P1dB vs. RF FREQUENCY VCC = 3.3V 14 1400 RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 15 VCC = 3.0V 55 1200 INPUT P1dB (dBm) 1300 MAX19993 toc58 1200 MAX19993 toc59 55 10 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 1600 1700 RF FREQUENCY (MHz) 13 MAX19993 Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless otherwise noted.) TC = +25°C 45 TC = +85°C 40 1300 1400 1500 1600 MAX19993 toc62 MAX19993 toc61 PLO = -6dBm, -3dBm, 0dBm, +3dBm 45 1700 50 VCC = 3.0V, 3.3V, 3.6V 45 40 1200 1300 1400 1500 1600 1700 1200 1300 1400 1500 1600 RF FREQUENCY (MHz) RF FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -20 TC = +85°C -30 VCC = 3.3V -20 -30 PLO = -6dBm, -3dBm, 0dBm, +3dBm -10 1700 MAX19993 toc65 TC = +25°C -10 LO LEAKAGE AT IF PORT (dBm) VCC = 3.3V LO LEAKAGE AT IF PORT (dBm) TC = -40°C MAX19993 toc64 RF FREQUENCY (MHz) MAX19993 toc63 LO LEAKAGE AT IF PORT (dBm) 50 40 1200 -10 VCC = 3.3V CHANNEL ISOLATION vs. RF FREQUENCY 55 CHANNEL ISOLATION (dB) TC = -40°C 50 CHANNEL ISOLATION vs. RF FREQUENCY 55 CHANNEL ISOLATION (dB) CHANNEL ISOLATION (dB) VCC = 3.3V MAX19993 toc60 CHANNEL ISOLATION vs. RF FREQUENCY 55 VCC = 3.6V -20 VCC = 3.3V -30 VCC = 3.0V -40 -40 1360 1460 1560 -40 1060 1160 LO FREQUENCY (MHz) RF-TO-IF ISOLATION (dB) TC = +85°C 30 TC = -40°C TC = +25°C 20 1560 1300 1400 1500 RF FREQUENCY (MHz) 1060 1160 1600 1700 1260 1360 1460 1560 LO FREQUENCY (MHz) VCC = 3.3V 40 30 PLO = -6dBm, -3dBm, 0dBm, +3dBm 20 1200 14 1460 RF-TO-IF ISOLATION vs. RF FREQUENCY 50 MAX19993 toc66 VCC = 3.3V 40 1360 LO FREQUENCY (MHz) RF-TO-IF ISOLATION vs. RF FREQUENCY 50 1260 RF-TO-IF ISOLATION vs. RF FREQUENCY 50 MAX19993 toc68 1260 RF-TO-IF ISOLATION (dB) 1160 MAX19993 toc67 1060 RF-TO-IF ISOLATION (dB) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 40 30 VCC = 3.0V, 3.3V, 3.6V 20 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 1200 1300 1400 1500 RF FREQUENCY (MHz) 1600 1700 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch TC = +25°C -40 -50 TC = -40°C -60 -30 PLO = +3dBm -40 PLO = 0dBm -50 PLO = -3dBm -60 -70 -70 1160 1270 1380 1490 1600 -40 VCC = 3.3V -50 VCC = 3.0V -60 -70 1050 1160 1270 1380 1490 1600 1050 1160 1270 1380 1490 LO FREQUENCY (MHz) 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY 2LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = +25°C -30 TC = +85°C -50 -20 PLO = -6dBm -30 PLO = -3dBm -40 PLO = +3dBm -50 -10 1600 MAX19993 toc74 VCC = 3.3V 2LO LEAKAGE AT RF PORT (dBm) TC = -40°C -20 -10 2LO LEAKAGE AT RF PORT (dBm) VCC = 3.3V MAX19993 toc73 LO FREQUENCY (MHz) -10 -40 VCC = 3.6V LO FREQUENCY (MHz) MAX19993 toc72 1050 -30 PLO = -6dBm TC = +85°C 2LO LEAKAGE AT RF PORT (dBm) -20 MAX19993 toc71 VCC = 3.3V LO LEAKAGE AT RF PORT (dBm) -30 -20 LO LEAKAGE AT RF PORT vs. LO FREQUENCY MAX19993 toc70 VCC = 3.3V LO LEAKAGE AT RF PORT (dBm) LO LEAKAGE AT RF PORT (dBm) -20 LO LEAKAGE AT RF PORT vs. LO FREQUENCY MAX19993 toc69 LO LEAKAGE AT RF PORT vs. LO FREQUENCY -20 VCC = 3.6V -30 VCC = 3.3V -40 VCC = 3.0V -50 PLO = 0dBm -60 -60 1380 1490 1600 -60 1050 1160 LO FREQUENCY (MHz) TC = -40°C 60 TC = +85°C 50 1490 1600 40 1160 1270 1380 LO FREQUENCY (MHz) 1160 VCC = 3.3V 60 PLO = -6dBm, -3dBm, 0dBm, +3dBm 50 1490 1600 1270 1380 1490 1600 LO FREQUENCY (MHz) 40 1050 1050 LO SWITCH ISOLATION vs. LO FREQUENCY 70 LO SWITCH ISOLATION (dB) MAX19993 toc75 LO SWITCH ISOLATION (dB) VCC = 3.3V TC = +25°C 1380 LO FREQUENCY (MHz) LO SWITCH ISOLATION vs. LO FREQUENCY 70 1270 LO SWITCH ISOLATION vs. LO FREQUENCY 70 MAX19993 toc77 1270 LO SWITCH ISOLATION (dB) 1160 MAX19993 toc76 1050 60 VCC = 3.0V, 3.3V, 3.6V 50 40 1050 1160 1270 1380 LO FREQUENCY (MHz) 1490 1600 1050 1160 1270 1380 1490 1600 LO FREQUENCY (MHz) 15 MAX19993 Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless otherwise noted.) RF PORT RETURN LOSS vs. RF FREQUENCY 5 0 IF PORT RETURN LOSS (dB) VCC = 3.3V IF = 140MHZ 10 PLO = -6dBm, -3dBm, 0dBm, +3dBm 15 20 VCC = 3.0V, 3.3V, 3.6V 5 10 MAX19993 toc79 IF PORT RETURN LOSS vs. IF FREQUENCY MAX19993 toc78 RF PORT RETURN LOSS (dB) 0 LO = 1560MHz 15 LO = 1310MHz 25 LO = 1060MHz 20 1300 1400 1500 1600 320 410 500 IF FREQUENCY (MHz) LO SELECTED PORT RETURN LOSS vs. LO FREQUENCY LO UNSELECTED PORT RETURN LOSS vs. LO FREQUENCY 0 LO UNSELECTED PORT RETURN LOSS (dB) VCC = 3.3V PLO = -6dBm, -3dBm, 0dBm, +3dBm 20 30 40 VCC = 3.3V 10 PLO = -6dBm, -3dBm, 0dBm, +3dBm 20 30 40 50 1000 1200 1400 1600 1800 2000 1000 1200 LO FREQUENCY (MHz) SUPPLY CURRENT vs. TEMPERATURE (TC) MAX19993 toc82 VCC = 3.6V 300 SUPPLY CURRENT (mA) 1400 1600 LO FREQUENCY (MHz) 310 290 280 270 260 250 VCC = 3.3V VCC = 3.0V 240 -40 -15 10 35 TEMPERATURE (°C) 16 230 RF FREQUENCY (MHz) 0 10 140 50 1700 MAX19993 toc80 1200 MAX19993 toc81 30 LO SELECTED PORT RETURN LOSS (dB) MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch 60 85 1800 2000 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch LO2 GND GND GND LOSEL GND VCC GND LO1 TOP VIEW 27 26 25 24 23 22 21 20 19 N.C. 28 18 N.C. LO_ADJ_M 29 17 LO_ADJ_D VCC 30 16 VCC IND_EXTM 31 15 IND_EXTD IFM- 32 14 IFD- IFM+ 33 13 IFD+ GND 34 12 GND IFM_SET 35 11 IFD_SET VCC 36 10 VCC 5 6 7 8 9 GND TAPDIV RFDIV GND 4 VCC 3 GND 2 VCC 1 TAPMAIN MAX19993 RFMAIN + EXPOSED PAD TQFN (6mm × 6mm) EXPOSED PAD ON THE BOTTOM OF THE PACKAGE 17 MAX19993 Pin Configuration MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch Pin Description PIN NAME 1 RFMAIN 2 TAPMAIN 3, 5, 7, 12, 20, 22, 24, 25, 26, 34 GND Ground 4, 6, 10, 16, 21, 30, 36 VCC Power Supply. Bypass to GND with capacitors as close as possible to the pin, as shown in the Typical Application Circuit. 8 TAPDIV 9 RFDIV 11 IFD_SET IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the diversity IF amplifier. See the Typical Application Circuit. 13, 14 IFD+, IFD- Diversity Mixer Differential IF Output +/-. Connect pullup inductors from each of these pins to VCC. See the Typical Application Circuit. 15 IND_EXTD Diversity External Inductor Connection. Connect to ground through a 0I resistor (0603) as close as possible to the pin. For improved RF-to-IF and LO-to-IF isolation, contact the factory for details. 17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the diversity LO amplifier. See the Typical Application Circuit. 18, 28 N.C. No Connection. Not internally connected. 19 LO1 Local Oscillator 1 Input. This input is internally matched to 50I. Requires an input DC-blocking capacitor. 23 LOSEL 27 LO2 29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the main LO amplifier. See the Typical Application Circuit. 31 IND_EXTM Main External Inductor Connection. Connect to ground through a 0I resistor (0603) as close as possible to the pin. For improved RF-to-IF and LO-to-IF isolation, contact the factory for details. 32, 33 IFM-, IFM+ Main Mixer Differential IF Output -/+. Connect pullup inductors from each of these pins to VCC. See the Typical Application Circuit. 35 IFM_SET IF Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for the main IF amplifier. See the Typical Application Circuit. — EP Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the noted RF performance. 18 FUNCTION Main Channel RF Input. Internally matched to 50I. Requires an input DC-blocking capacitor. Main Channel Balun Center Tap. Bypass to GND with 39pF and 0.033FF capacitors as close as possible to the pin with the smaller value capacitor closer to the part. Diversity Channel Balun Center Tap. Bypass to GND with 39pF and 0.033FF capacitors as close as possible to the pin with the smaller value capacitor closer to the part. Diversity Channel RF Input. Internally matched to 50I. Requires an input DC-blocking capacitor. Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2. Local Oscillator 2 Input. This input is internally matched to 50I. Requires an input DC-blocking capacitor. Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch The MAX19993 is a dual-channel downconverter designed to provide up to 6.4dB of conversion gain, +27dBm input IP3, 15.4dBm 1dB input compression point, and a noise figure of 9.8dB. In addition to its high-linearity performance, the device achieves a high level of component integration. It integrates two double-balanced mixers for two-channel downconversion. Both the main and diversity channels include a balun and matching circuitry to allow 50I single-ended interfaces to the RF ports and the two LO ports. An integrated single-pole/double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 57dB of LO-to-LO isolation and -38dBm of LO leakage at the RF port. Furthermore, the integrated LO buffers provide a high drive level to each mixer core, reducing the LO drive required at the device‘s inputs to a range of -6dBm to +3dBm. The IF ports for both channels incorporate differential outputs for downconversion, which is ideal for providing enhanced 2RF - 2LO performance. The device is specified to operate over an RF input range of 1200MHz to 1700MHz, an LO range of 1000MHz to 1560MHz, and an IF range of 50MHz to 500MHz. The external IF components set the lower frequency range. See the Typical Operating Characteristics section for details. Operation beyond these ranges is possible; see the Typical Operating Characteristics section for additional information. Although this device is optimized for lowside LO injection applications, it can operate in highside LO injection modes as well. However, performance degrades as fLO continues to increase. Contact the factory for a variant with increased high-side LO performance. RF Port and Balun The RF input ports of both the main and diversity channels are internally matched to 50I, requiring no external matching components. A DC-blocking capacitor is required as the input is internally DC shorted to ground through the on-chip balun. The RF port input return loss is typically better than 19dB over the 1400MHz to 1700MHz RF frequency range. LO Inputs, Buffer, and Balun The device is optimized for a 1000MHz to 1560MHz LO frequency range. As an added feature, the device includes an internal LO SPDT switch for use in frequencyhopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically 50ns, which is more than adequate for typical GSM applications. If frequency hopping is not employed, simply set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL), where logic-high selects LO1 and logic-low selects LO2. LO1 and LO2 inputs are internally matched to 50I, requiring only 39pF DC-blocking capacitors. If LOSEL is connected directly to a logic source, then voltage MUST be applied to VCC before digital logic is applied to LOSEL to avoid damaging the part. Alternatively, a 1kI resistor can be placed in series at the LOSEL to limit the input current in applications where LOSEL is applied before VCC. The main and diversity channels incorporate a two-stage LO buffer that allows for a wide-input power range for the LO drive. The on-chip low-loss baluns, along with LO buffers, drive the double-balanced mixers. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. High-Linearity Mixer The core of the device’s dual-channel downconverter consists of two double-balanced, high-performance passive mixers. Exceptional linearity is provided by the large LO swing from the on-chip LO buffers. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF - 2LO rejection, and noise-figure performance are typically +27dBm, 72dBc, and 9.8dB, respectively. Differential IF The device has a 50MHz to 500MHz IF frequency range, where the low-end frequency depends on the frequency response of the external IF components. Note that these differential ports are ideal for providing enhanced IIP2 performance. Single-ended IF applications require a 4:1 (impedance ratio) balun to transform the 200I differential IF impedance to a 50I single-ended system. After the balun, the return loss is typically 15dB. The user can use a differential IF amplifier on the mixer IF ports, but a DC block is required on both IFD+/IFD- and IFM+/ IFM- ports to keep external DC from entering the IF ports of the mixer. 19 MAX19993 Detailed Description MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50I. No matching components are required. The RF port input return loss is typically better than 19dB over the 1400MHz to 1700MHz RF frequency range and return loss at the LO ports are typically better than 15dB over the entire LO range. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200I (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance to a 50I single-ended output. See the Typical Application Circuit. Reduced-Power Mode Each channel of the device has two pins (LO_ADJ_D/ LO_ADJ_M, IFD_SET/IFM_SET) that allow external resistors to set the internal bias currents. Nominal values for these resistors are given in Table 1. Larger value resistors can be used to reduce power dissipation at the expense of some performance loss. If Q1% resistors are not readily available, substitute with Q5% resistors. Significant reductions in power consumption can also be realized by operating the mixer with an optional 3.3V supply voltage. Doing so reduces the overall power consumption by approximately 46%. See the 3.3V Supply AC Electrical Characteristics table and the relevant 3.3V curves in the Typical Operating Characteristics section. IND_EXT_ Inductors The default application circuit calls for connecting IND_EXT_ (pins 15 and 31) to ground through a 0I resistor (0603) as close as possible to the pin. For improved RF-to-IF and LO-to-IF isolation, contact the factory for details. 20 Layout Considerations A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. The load impedance presented to the mixer must be such that any capacitance from both IF- and IF+ to ground does not exceed several picofarads. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PCB exposed pad MUST be connected to the ground plane of the PCB. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX19993 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAPMAIN/TAPDIV with the capacitors shown in the Typical Application Circuit. See Table 1 for component values. Place the TAPMAIN/TAPDIV bypass capacitors to ground within 100 mils of the pin. Exposed Pad RF/Thermal Considerations The exposed pad (EP) of the MAX19993’s 36-pin TQFNEP package provides a low thermal-resistance path to the die. It is important that the PCB on which the device is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PCB, either directly or through an array of plated via holes. Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch VCC T1 27 4:1 N.C. C19 C21 LO_ADJ_M C20 L1 L2 VCC VCC R2 VCC C17 R3 IND_EXTM IFMIFM+ GND IFM_SET VCC R1 VCC 26 24 IF DIV OUTPUT 23 22 21 LO1 GND C14 VCC GND 25 LO1 20 19 4:1 28 18 N.C. 29 17 30 16 EXPOSED PAD MAX19993 31 L3 GND LO2 GND C16 C15 GND IF MAIN OUTPUT LO SELECT LOSEL LO2 LO_ADJ_D IND_EXTD 15 32 14 33 13 34 12 35 11 36 10 IFD- C13 L6 R5 C12 L5 C10 L4 VCC R6 IFD+ GND IFD_SET VCC VCC C9 C18 C11 VCC VCC T2 R4 VCC 9 C7 VCC C3 8 RFDIV 7 TAPDIV 6 GND 5 C2 C1 L7 4 GND 3 GND RFMAIN 2 TAPMAIN 1 VCC + C8 VCC C4 RF MAIN INPUT C5 L8 C6 RF DIV INPUT Table 1. Component Values DESIGNATION QTY DESCRIPTION COMPONENT SUPPLIER C1, C2, C7, C8, C14, C16 6 39pF microwave capacitors (0402) Murata Electronics North America, Inc. C3, C6 2 0.033FF microwave capacitors (0603) Murata Electronics North America, Inc. C4, C5 2 0402, not used — C9, C13, C15, C17, C18 5 0.01FF microwave capacitors (0402) Murata Electronics North America, Inc. 21 MAX19993 Typical Application Circuit MAX19993 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch Table 1. Component Values (continued) DESIGNATION QTY C10, C11, C12, C19, C20, C21 6 150pF microwave capacitors (0603) Murata Electronics North America, Inc. L1, L2, L4, L5 4 330nH wire-wound high-Q inductors (0805) Coilcraft, Inc. L3, L6 2 0I resistors (0603). For improved RF-to-IF and LO-to-IF isolation, contact factory for details. Digi-Key Corp. L7, L8 2 Additional tuning elements (0402, not used) — 2 681I ±1% resistors (0402). Used for VCC = 5.0V applications. Larger values can be used to reduce power at the expense of some performance loss. Digi-Key Corp. R1, R4 DESCRIPTION COMPONENT SUPPLIER 681I ±1% resistors (0402). Used for VCC = 3.3V applications. R2, R5 2 1.82kI ±1% resistors (0402). Used for VCC = 5.0V applications. Larger values can be used to reduce power at the expense of some performance loss. Digi-Key Corp. 1.43kI ±1% resistors (0402). Used for VCC = 3.3V applications. R3, R6 2 0I resistors (1206) Digi-Key Corp. T1, T2 2 4:1 transformers (200:50) TC4-1W-7A Mini-Circuits U1 1 MAX19993 IC (36 TQFN-EP) Maxim Integrated Products, Inc. Chip Information PROCESS: SiGe BiCMOS 22 Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN 36 Thin QFN-EP T3666+2 21-0141 90-0049 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch REVISION NUMBER REVISION DATE 0 6/10 DESCRIPTION Initial release PAGES CHANGED — Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2010 Maxim Integrated Products 23 Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX19993 Revision History