TI1 MSP430A090IPMR Mixed-signal microcontroller Datasheet

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MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
MSP430F42x Mixed-Signal Microcontrollers
1 Device Overview
1.1
Features
1
• Low Supply Voltage Range: 1.8 V to 3.6 V
• Ultra-Low Power Consumption:
– Active Mode: 400 µA at 1 MHz, 3 V
– Standby Mode: 1.6 µA
– Off Mode (RAM Retention): 0.1 µA
• Five Power-Saving Modes
• Wake up From Standby Mode in Less Than 6 µs
• Frequency-Locked Loop, FLL+
• 16-Bit RISC Architecture, 125-ns Instruction Cycle
Time
• Three Independent 16-Bit Sigma-Delta Analog-toDigital Converters (ADCs) With Differential PGA
Inputs
• 16-Bit Timer_A With Three Capture/Compare
Registers
• Integrated LCD Driver for 128 Segments
1.2
•
•
Applications
Handheld Metering Equipment
Weigh Scales
1.3
• Serial Communication Interface (USART),
Asynchronous UART or Synchronous SPI
Selectable by Software
• Brownout Detector
• Supply Voltage Supervisor and Monitor With
Programmable Level Detection
• Serial Onboard Programming, No External
Programming Voltage Needed, Programmable
Code Protection by Security Fuse
• Bootloader (BSL)
• Family Members Include:
– MSP430F423
8KB + 256 B of Flash Memory, 256 B of RAM
– MSP430F425
16KB + 256 B of Flash Memory, 512 B of RAM
– MSP430F427
32KB + 256 B of Flash Memory, 1KB of RAM
• Available in 64-Pin Quad Flat Pack (LQFP)
• For Complete Module Descriptions, See the
MSP430x4xx Family User's Guide
•
Energy Meters
Description
The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different
sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device
features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to
maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from lowpower modes to active mode in less than 6 µs.
The MSP430F42x series are microcontroller configurations with three independent 16-bit sigma-delta
ADCs, each with an integrated differential programmable gain amplifier input stage. Also included is a
built-in 16-bit timer, 128-segment LCD drive capability, hardware multiplier, and 14 I/O pins.
Typical applications include high-resolution applications such as handheld metering equipment, weigh
scales, and energy meters.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
www.ti.com
Device Information (1)
PACKAGE
BODY SIZE (2)
MSP430F427IPM
LQFP (64)
10 mm × 10 mm
MSP430F425IPM
LQFP (64)
10 mm × 10 mm
MSP430F423IPM
LQFP (64)
10 mm × 10 mm
PART NUMBER
(1)
(2)
1.4
For the most current part, package, and ordering information for all available devices, see the Package
Option Addendum in Section 8, or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 8.
Functional Block Diagram
Figure 1-1 shows the functional block diagram.
XIN
DVCC
XOUT
DVSS
AVCC
AVSS
P1
P2
8
6
Port 1
Port 2
8 I/Os
Interrupt
Capability
6 I/Os
Interrupt
Capability
ACLK
Oscillators
FLL+
Flash
RAM
32KB
16KB
8KB
1KB
512 B
256 B
USART0
Timer_A3
SMCLK
MCLK
3 CC Reg
UART
or SPI
MAB
8-MHz
CPU
Including
16 Registers
MDB
Emulation
Module
JTAG
Interface
Hardware
Multiplier
MPY, MPYS,
MAC,MACS
POR,
SVS,
Brownout
Watchdog
WDT+
15 or 16 Bit
SD16
Three 16-Bit
SIgma-Delta
ADCs
Basic
Timer 1
1 Interrupt
Vector
LCD
128
Segments
1,2,3,4 MUX
fLCD
RST/NMI
Copyright © 2016, Texas Instruments Incorporated
Figure 1-1. MSP430F42x Block Diagram
2
Device Overview
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Table of Contents
1
2
3
Device Overview ......................................... 1
5.20
SD16 Power Supply and Operating Characteristics 22
1.1
Features .............................................. 1
5.21
SD16 Analog Input Range .......................... 22
1.2
Applications ........................................... 1
5.22
SD16 Analog Performance.......................... 23
1.3
Description ............................................ 1
1.4
Functional Block Diagram ............................ 2
.................
...................
5.25 SD16 Built-in Reference Output Buffer .............
5.26 SD16 External Reference Input .....................
5.27 Flash Memory .......................................
5.28 JTAG Interface ......................................
5.29 JTAG Fuse .........................................
Detailed Description ...................................
6.1
CPU .................................................
6.2
Instruction Set .......................................
6.3
Operating Modes ....................................
6.4
Interrupt Vector Addresses..........................
6.5
Special Function Registers..........................
6.6
Memory Organization ...............................
6.7
Bootloader (BSL) ....................................
6.8
Flash Memory .......................................
6.9
Peripherals ..........................................
6.10 Input/Output Diagrams ..............................
Device and Documentation Support ...............
7.1
Getting Started and Next Steps .....................
7.2
Device Nomenclature ...............................
7.3
Tools and Software .................................
7.4
Documentation Support .............................
7.5
Related Links ........................................
7.6
Community Resources ..............................
7.7
Trademarks..........................................
7.8
Electrostatic Discharge Caution .....................
7.9
Export Control Notice ...............................
7.10 Glossary .............................................
Revision History ......................................... 4
Device Comparison ..................................... 5
3.1
4
Terminal Configuration and Functions .............. 6
.......................................... 6
4.2
Signal Descriptions ................................... 7
Specifications ........................................... 10
5.1
Absolute Maximum Ratings ........................ 10
5.2
ESD Ratings ........................................ 10
5.3
Recommended Operating Conditions ............... 10
4.1
5
Related Products ..................................... 5
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
Pin Diagram
6
Supply Current Into AVCC and DVCC Excluding
External Current .................................... 11
Thermal Resistance Characteristics, PM Package
(LQFP64) ............................................ 12
Schmitt-Trigger Inputs − Ports (P1 and P2),
RST/NMI, JTAG (TCK, TMS, TDI/TCLK,TDO/TDI) . 12
..............................
.............
Outputs − Ports (P1 and P2) ........................
Output Frequency ...................................
Typical Characteristics – Ports P1 and P2 ..........
Wake-up Time From LPM3 .........................
RAM .................................................
LCD..................................................
USART0 .............................................
POR, BOR ..........................................
SVS (Supply Voltage Supervisor and Monitor) .....
DCO .................................................
Crystal Oscillator, LFXT1 Oscillator ................
Inputs P1.x, P2.x, TAx
12
Leakage Current − Ports (P1 and P2)
12
7
13
13
14
15
15
15
15
16
17
19
21
8
5.23
SD16 Built-in Temperature Sensor
23
5.24
SD16 Built-in Voltage Reference
24
24
24
25
25
25
26
26
27
28
29
30
32
32
32
33
39
46
46
46
48
49
51
51
51
51
51
51
Mechanical, Packaging, and Orderable
Information .............................................. 52
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Table of Contents
3
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
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2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from June 2, 2007 to November 14, 2016
•
•
•
•
•
•
•
•
•
•
•
•
4
Page
Format and organization changes throughout document, including addition of section numbering ....................... 1
Added Section 3 ...................................................................................................................... 5
Added Section 5 and moved all electrical and timing specifications to it .................................................... 10
Added Section 5.2, ESD Ratings.................................................................................................. 10
Changed the MAX value of the I(LPM3) parameter at 85°C from 2.6 to 3.5 µA in Section 5.4, Supply Current Into
AVCC and DVCC Excluding External Current ..................................................................................... 11
Added Section 5.5, Thermal Resistance Characteristics, PM Package (LQFP-64) ........................................ 12
Changed all cases of "bootstrap loader" to "bootloader"....................................................................... 32
Changed all instances of Port/LCD to Port/LCD (added overline) ............................................................ 40
Changed the value of the Port/LCD column in Table 6-14, Port P1 (P1.2 to P1.7) Pin Functions ....................... 40
Changed the value of the Port/LCD column in Table 6-15, Port P2 (P2.0 and P2.1) Pin Functions ..................... 41
Added Section 7, Device and Documentation Support......................................................................... 46
Added Section 8, Mechanical, Packaging, and Orderable Information ...................................................... 52
Revision History
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
3 Device Comparison
Table 3-1 summarizes the available family members.
Table 3-1. Device Comparison (1) (2)
FLASH
(KB)
RAM
(B)
FREQUENCY
(MHz)
BSL
SD16
(CHANNELS)
I/Os
PACKAGE
MSP430F427
32
1K
8
UART
3
14
PM 64
MSP430F425
16
512
8
UART
3
14
PM 64
MSP430F423
8
256
8
UART
3
14
PM 64
DEVICE
(1)
(2)
3.1
For the most current package and ordering information, see the Package Option Addendum in Section 8, or see the TI website at
www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Related Products
For information about other devices in this family of products or related products, see the following links.
TI Microcontrollers Product Selection TI's low-power and-high performance MCUs, with wired and
wireless connectivity options, are optimized for a broad range of applications.
Products for MSP430 Ultra-Low-Power Microcontrollers One platform. One ecosystem. Endless
possibilities. Enabling the connected world with innovations in ultra-low-power
microcontrollers with advanced peripherals for precise sensing and measurement.
Products for MSP430F2x/4x Ultra-Low-Power Microcontrollers
MSP430F2x/4x
microcontrollers
(MCUs) from the MSP ultra-low-power MCU series are general-purpose 16-bit
microcontrollers used for a wide range of applications including consumer electronics, data
logging applications, portable medical instruments, and low-power metering. MSP430F4x
MCUs feature an integrated LCD controller, while select MSP430F2x devices feature
extended temperature ranges.
Companion Products for MSP430F427 Review products that are frequently purchased or used with this
product.
Reference Designs The TI Designs Reference Design Library is a robust reference design library that
spans analog, embedded processor, and connectivity. Created by TI experts to help you
jump start your system design, all TI Designs include schematic or block diagrams, BOMs,
and design files to speed your time to market.
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Device Comparison
5
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
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4 Terminal Configuration and Functions
4.1
Pin Diagram
AVCC
DVSS
AVSS
P2.3/SVSIN
P2.4/UTXD0
P2.5/URXD0
RST/NMI
TCK
TMS
TDI/TCLK
TDO/TDI
P1.0/TA0
P1.1/TA0/MCLK
P1.2/TA1/S31
P1.3/SVSOUT/S30
P1.4/S29
Figure 4-1 shows the pinout for the 64-pin PM package.
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
DVCC
A0.0+
A0.0−
A1.0+
A1.0−
A2.0+
A2.0−
XIN
XOUT
VREF
P2.2/STE0
S0
S1
S2
S3
S4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
2
3
4
5
6
7
8
9
10
11
12
13
14
15
34
33
P1.5/TACLK/ACLK/S28
P1.6/SIMO0/S27
P1.7/SOMI0/S26
P2.0/TA2/S25
P2.1/UCLK0/S24
R33
R23
R13
R03
COM3
COM2
COM1
COM0
S23
S22
S21
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
NOTE: TI recommends leaving all unused analog inputs open.
Figure 4-1. 64-Pin PM Package (Top View)
6
Terminal Configuration and Functions
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4.2
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Signal Descriptions
Table 4-1 describes the signals for all device variants
Table 4-1. Terminal Functions
SIGNAL NAME
PIN NO.
I/O
DESCRIPTION
DVCC
1
Digital supply voltage, positive terminal
A0.0+
2
I
Internal connection to SD16 channel 0, input 0 + (1)
A0.0−
3
I
Internal connection to SD16 channel 0, input 0 − (1)
A1.0+
4
I
Internal connection to SD16 channel 1, input 0 + (1)
A1.0−
5
I
Internal connection to SD16 channel 1, input 0 − (1)
A2.0+
6
I
Internal connection to SD16 channel 2, input 0 + (1)
A2.0−
7
I
Internal connection to SD16 channel 2, input 0 − (1)
XIN
8
I
Input port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT
9
O
Output terminal of crystal oscillator XT1
VREF
10
I/O
Input for an external reference voltage, internal reference voltage output (can be used as
mid-voltage)
P2.2/STE0
11
I/O
General-purpose digital I/O
Slave transmit enable for USART0 in SPI mode
S0
12
O
LCD segment output 0
S1
13
O
LCD segment output 1
S2
14
O
LCD segment output 2
S3
15
O
LCD segment output 3
S4
16
O
LCD segment output 4
S5
17
O
LCD segment output 5
S6
18
O
LCD segment output 6
S7
19
O
LCD segment output 7
S8
20
O
LCD segment output 8
S9
21
O
LCD segment output 9
S10
22
O
LCD segment output 10
S11
23
O
LCD segment output 11
S12
24
O
LCD segment output 12
S13
25
O
LCD segment output 13
S14
26
O
LCD segment output 14
S15
27
O
LCD segment output 15
S16
28
O
LCD segment output 16
S17
29
O
LCD segment output 17
S18
30
O
LCD segment output 18
S19
31
O
LCD segment output 19
S20
32
O
LCD segment output 20
S21
33
O
LCD segment output 21
S22
34
O
LCD segment output 22
S23
35
O
LCD segment output 23
COM0
36
O
Common output, COM0−COM3 are used for LCD backplanes.
COM1
37
O
Common output, COM0−COM3 are used for LCD backplanes.
COM2
38
O
Common output, COM0−COM3 are used for LCD backplanes.
COM3
39
O
Common output, COM0−COM3 are used for LCD backplanes.
R03
40
I
Input port of fourth positive (lowest) analog LCD level (V5)
R13
41
I
Input port of third most positive analog LCD level (V4 or V3)
R23
42
I
Input port of second most positive analog LCD level (V2)
(1)
TI recommends open connection for all unused analog inputs.
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
SIGNAL NAME
R33
PIN NO.
I/O
43
O
DESCRIPTION
Output port of most positive analog LCD level (V1)
General-purpose digital I/O
P2.1/UCLK0/S24
44
I/O
External clock input for USART0 in UART or SPI mode or
clock output for USART0 in SPI mode
LCD segment output 24 (2)
General-purpose digital I/O
P2.0/TA2/S25
45
I/O
Timer_A Capture: CCI2A input, Compare: Out2 output
LCD segment output 25 (2)
General-purpose digital I/O
P1.7/SOMI0/S26
46
I/O
Slave out/master in for USART0 in SPI mode
LCD segment output 26 (2)
General-purpose digital I/O
P1.6/SIMO0/S27
47
I/O
Slave in/master out for USART0 in SPI mode
LCD segment output 27 (2)
General-purpose digital I/O
Timer_A and SD16 clock signal TACLK input
P1.5/TACLK/ACLK/S28
48
I/O
ACLK output (divided by 1, 2, 4, or 8)
LCD segment output 28 (2)
General-purpose digital I/O
P1.4/S29
49
I/O
LCD segment output 29 (2)
General-purpose digital I/O
P1.3/SVSOUT/S30
50
I/O
SVS: output of SVS comparator
LCD segment output 30 (2)
General-purpose digital I/O
P1.2/TA1/S31
51
I/O
Timer_A, Capture: CCI1A, CCI1B input, Compare: Out1 output
LCD segment output 31 (2)
General-purpose digital I/O
Timer_A, Capture: CCI0B input. Note: TA0 is only an input on this pin.
P1.1/TA0/MCLK
52
I/O
MCLK output
BSL receive
General-purpose digital I/O
P1.0/TA0
53
I/O
Timer_A, Capture: CCI0A input, Compare: Out0 output
BSL transmit
TDO/TDI
54
I/O
TDI/TCLK
55
I
Test data output port, TDO/TDI data output or programming data input terminal
Test data input or test clock input. The device protection fuse is connected to TDI.
TMS
56
I
Test mode select. TMS is used as an input port for device programming and test.
TCK
57
I
Test clock. TCK is the clock input port for device programming and test.
RST/NMI
58
I
Reset input
Nonmaskable interrupt input port
General-purpose digital I/O
P2.5/URXD0
59
I/O
Receive data in for USART0 in UART mode
General-purpose digital I/O
P2.4/UTXD0
60
I/O
Transmit data out for USART0 in UART mode
(2)
8
The LCD function is selected automatically when the applicable LCD module control bits are set, not with PxSEL bits.
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
SIGNAL NAME
PIN NO.
I/O
DESCRIPTION
General-purpose digital I/O
P2.3/SVSIN
61
I/O
Analog input to brownout, supply voltage supervisor
AVSS
62
Analog supply voltage, negative terminal. Supplies SD16, SVS, brownout, oscillator, and
LCD resistive divider circuitry.
DVSS
63
Digital supply voltage, negative terminal
AVCC
64
Analog supply voltage, positive terminal. Supplies SD16, SVS, brownout, oscillator, and
LCD resistive divider circuitry. Do not power up before DVCC.
Terminal Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
Voltage applied at VCC to VSS
–0.3
4.1
Voltage applied to any pin (2)
–0.3
VCC + 0.3
Diode current at any device terminal
(2)
V
V
±2
Storage temperature range, Tstg
(1)
UNIT
Unprogrammed device
–55
150
Programmed device
–40
85
mA
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS.The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TDI/TCLK pin when blowing the JTAG fuse.
5.2
ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
V
±250
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.3
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Supply voltage during program
execution (1) (AVCC = DVCC = VCC)
VCC
VSS
Supply voltage (AVSS = DVSS = VSS)
TA
Operating free-air temperature range
f(LFXT1)
LFXT1 crystal frequency (3)
f(System)
Processor frequency (signal
MCLK) (also see Figure 5-1)
(1)
(2)
(3)
10
NOM
MAX
UNIT
SD16 disabled
1.8
3.6
SVS enabled, PORON = 1 (2), SD16 disabled
2.0
3.6
SD16 enabled or during programming of flash
memory
2.7
3.6
0
0
V
85
°C
450
8000
kHz
–40
LF selected, XTS_FLL = 0
Watch crystal
XT1 selected, XTS_FLL = 1
Ceramic resonator
XT1 selected, XTS_FLL = 1
Crystal
V
32.768
1000
8000
VCC = 1.8 V
DC
4.15
VCC = 3.6 V
DC
8
MHz
TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the supply voltage is raised above the minimum supply voltage plus the hysteresis of the SVS
circuitry.
In LF mode, the LFXT1 oscillator requires a watch crystal.
Specifications
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fSystem − Maximum Processor Frequency − MHz
f (MHz)
Supply voltage range with SD16
enabled or during programming
of the flash memory
8 MHz
Supply voltage range
during program execution
6 MHz
4.15 MHz
1.8 V
2.7 V
3V
3.6 V
VCC − Supply Voltage − V
Figure 5-1. Frequency vs Supply Voltage
Supply Current Into AVCC and DVCC Excluding External Current (1)
5.4
over recommended operating free-air temperature range (unless otherwise noted)
TA
VCC
I(AM)
Active mode (AM)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0,
program executes in flash
PARAMETER
–40°C to 85°C
I(LPM0)
Low-power mode 0 or 1 (LPM0 or LPM1) (2)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0,
FN_8 = FN_4 = FN_3 = FN_2 = 0
I(LPM2)
Low-power mode 2 (LPM2) (2)
I(LPM3)
I(LPM4)
Low-power mode 3 (LPM3)
(2)
Low-power mode 4 (LPM4) (2)
TYP
MAX
UNIT
3V
400
500
µA
–40°C to 85°C
3V
130
150
µA
–40°C to 85°C
3V
10
22
µA
–40°C
1.5
2.0
25°C
1.6
2.1
1.7
2.2
85°C
2.0
3.5
–40°C
0.1
0.5
0.1
0.5
0.8
2.5
60°C
25°C
3V
3V
85°C
(1)
(2)
MIN
µA
µA
All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. The current consumption in LPM2, LPM3, and LPM4 are
measured with active Basic Timer1 and LCD (ACLK selected). The current consumption of the SD16 and the SVS module are specified
in their respective sections. LPMx currents measured with WDT+ disabled. The currents are characterized with a KDS Daishinku DT-38
(6 pF) crystal.
Current consumption for brownout is included.
Current consumption of active mode versus system frequency:
I(AM) = I(AM) [at 1 MHz] × f(System) [MHz]
Current consumption of active mode versus supply voltage:
I(AM) = I(AM) [at 3 V] + 170 µA/V × (VCC – 3 V)
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11
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
5.5
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Thermal Resistance Characteristics, PM Package (LQFP64)
VALUE
UNIT
RθJA
Junction-to-ambient thermal resistance, still air (1)
PARAMETER
55.7
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance (2)
16.7
°C/W
RθJB
Junction-to-board thermal resistance (3)
27.1
°C/W
ΨJB
Junction-to-board thermal characterization parameter
26.8
°C/W
Junction-to-top thermal characterization parameter
0.8
°C/W
ΨJT
(1)
(2)
(3)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
Schmitt-Trigger Inputs − Ports (P1 and P2), RST/NMI, JTAG (TCK, TMS,
TDI/TCLK,TDO/TDI)
5.6
over recommended operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
UNIT
VIT+
Positive-going input threshold voltage
PARAMETER
3V
1.5
1.98
V
VIT-
Negative-going input threshold voltage
3V
0.9
1.3
V
Vhys
Input voltage hysteresis (VIT+ - VIT- )
3V
0.45
1
V
5.7
Inputs P1.x, P2.x, TAx
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX
UNIT
1.5
cycle
50
ns
50
ns
t(int)
External interrupt timing
Port P1, P2: P1.x to P2.x, external trigger signal
for the interrupt flag (1)
t(cap)
Timer_A capture timing
TAx
3V
f(TAext)
Timer_A clock frequency externally
applied to pin
TAxCLK, INCLK t(H) = t(L)
3V
10
MHz
f(TAint)
Timer_A clock frequency
SMCLK or ACLK signal selected
3V
10
MHz
(1)
3V
The external signal sets the interrupt flag every time the minimum t(int) parameters are met. It may be set even with trigger signals
shorter than t(int). Both the cycle and timing specifications must be met to ensure the flag is set. t(int) is measured in MCLK cycles.
Leakage Current − Ports (P1 and P2) (1)
5.8
over recommended operating free-air temperature range (unless otherwise noted)
MAX
UNIT
Ilkg(P1.x)
Leakage current, Port P1.x
PARAMETER
Port 1: V(P1.x)
(2)
3V
±50
nA
Ilkg(P2.x)
Leakage current, Port P2.x
Port 2: V(P2.x)
(2)
3V
±50
nA
(1)
(2)
12
TEST CONDITIONS
VCC
MIN
The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
The port pin must be selected as input.
Specifications
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Outputs − Ports (P1 and P2)
5.9
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VOL
Low-level output voltage
(1)
(2)
IOH(max) = –1.5 mA
(1)
VCC
MIN
MAX
3V
VCC – 0.25
VCC
IOH(max) = –6 mA (2)
3V
VCC – 0.6
VCC
IOL(max) = 1.5 mA (1)
3V
VSS
VSS + 0.25
IOL(max) = 6 mA (2)
3V
VSS
VSS + 0.6
UNIT
V
V
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±12 mA to satisfy the maximum specified
voltage drop.
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±48 mA to satisfy the maximum specified
voltage drop.
5.10 Output Frequency
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
f(Px.y)
TEST CONDITIONS
Output frequency
(1 ≤ × ≤ 2, 0 ≤ y ≤ 7)
CL = 20 F, IL = ±1.5 mA, VCC = 3 V
P1.1/TA0/MCLK,
P1.5/TACLK/ACLK/S28
CL = 20 pF, VCC = 3 V
MIN
TYP
DC
MAX
UNIT
12
MHz
12
MHz
f(ACLK),
f(MCLK),
f(SMCLK)
t(Xdc)
Duty cycle of output
frequency
P1.5/TACLK/ACLK/S28,
CL = 20 pF, VCC = 3 V
fACLK = fLFXT1 = fXT1
40%
fACLK = fLFXT1 = fLF
30%
fACLK = fLFXT1
P1.1/TA0/MCLK, CL = 20 pF, VCC = 3 V,
fMCLK = fDCOCLK
60%
70%
50%
50% –
15 ns
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50%
50% +
15 ns
Specifications
13
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
www.ti.com
5.11 Typical Characteristics – Ports P1 and P2
Figure 5-2 through Figure 5-5 show the typical output currents of Ports P1 and P2. One output loaded at a
time.
50
30
VCC = 3 V
P2.1
TA = 25°C
25
TA = 85°C
20
15
10
5
IOL − Typical Low-Level Output Current − mA
IOL − Typical Low-Level Output Current − mA
VCC = 2.2 V
P2.1
40
TA = 85°C
30
20
10
0
0
0.0
0.5
1.0
1.5
2.0
0.0
2.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOL − Low-Level Output Voltage − V
VOL − Low-Level Output Voltage − V
Figure 5-2. Typical Low-Level Output Current vs
Low-Level Output Voltage
Figure 5-3. Typical Low-Level Output Current vs
Low-Level Output Voltage
0
0
VCC = 2.2 V
P2.1
IOH − Typical High-Level Output Current − mA
IOH − Typical High-Level Output Current − mA
TA = 25°C
−5
−10
−15
TA = 85°C
−20
−25
TA = 25°C
VCC = 3 V
P2.1
−10
−20
−30
TA = 85°C
−40
TA = 25°C
−50
−30
0.0
0.5
1.0
1.5
2.0
2.5
VOH − High-Level Output Voltage − V
Figure 5-4. Typical High-Level Output Current vs
High-Level Output Voltage
14
Specifications
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH − High-Level Output Voltage − V
Figure 5-5. Typical High-Level Output Current vs
High-Level Output Voltage
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
5.12 Wake-up Time From LPM3
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
f = 1 MHz
td(LPM3)
Delay time
f = 2 MHz
MAX
UNIT
6
VCC = 3 V
6
f = 3 MHz
µs
6
5.13 RAM
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
CPU halted (1)
VRAMh
MAX
1.6
UNIT
V
This parameter defines the minimum supply voltage when the data in program memory RAM remain unchanged. No program execution
should take place during this supply voltage condition.
5.14 LCD
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
V(33)
TEST CONDITIONS
V(23)
VCC = 3 V
V(13)
Voltage at R13
V(33) – V(03)
Voltage at R33 to R03
R03 = VSS
Input leakage
I(R23)
R23 = 2 × VCC / 3
2.5
±20
±20
V(03)
V(03) – 0.1
V(13)
V(13) – 0.1
V(23)
V(23) – 0.1
V(33)
V(33) + 0.1
I(Sxx) = –3 µA, VCC = 3 V
V(Sxx3)
nA
±20
V(Sxx1)
Segment line voltage
V
VCC + 0.2
V(Sxx0)
V(Sxx2)
UNIT
[V(33) – V(03)] ×
1/3 + V(03)
No load at all
segment and
common lines,
VCC = 3 V
R13 = VCC / 3
MAX
VCC + 0.2
[V(33) – V(03)] ×
2/3 + V(03)
Voltage at R23
I(R03)
TYP
2.5
Analog voltage
I(R13)
MIN
Voltage at R33
V
5.15 USART0 (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
t(τ)
(1)
USART0 deglitch time
TEST CONDITIONS
VCC = 3 V, SYNC = 0, UART mode
MIN
TYP
MAX
UNIT
150
280
500
ns
The signal applied to the USART0 receive signal/terminal (URXD0) should meet the timing requirements of t(τ) to ensure that the URXS
flip-flop is set. The URXS flip-flop is set with negative pulses meeting the minimum-timing condition of t(τ). The operating conditions to
set the flag must be met independently from this timing constraint. The deglitch circuitry is active only on negative transitions on the
URXD0 line.
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Specifications
15
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
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5.16 POR, BOR (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
td(BOR)
Brownout (2)
V(B_IT–)
dVCC/dt ≤ 3 V/s (see Figure 5-6 through Figure 5-8)
dVCC/dt ≤ 3 V/s (see Figure 5-6)
t(reset)
Pulse duration needed at RST/NMI pin to accept
reset internally, VCC = 3 V
(2)
2000
µs
V
V(B_IT– )
Vhys(B_IT–)
(1)
UNIT
0.7 ×
dVCC/dt ≤ 3 V/s (see Figure 5-6)
VCC(start)
MAX
70
130
1.71
V
180
mV
2
µs
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level V(B_IT–) +
Vhys(B_IT–) ≤ 1.8 V.
During power up, the CPU begins code execution following a period of td(BOR) after VCC = V(B_IT–)+ Vhys(B_IT–). The default FLL+ settings
must not be changed until VCC ≥ VCC(min), where VCC(min) is the minimum supply voltage for the desired operating frequency. See the
MSP430x4xx Family User's Guide for more information on the brownout and SVS circuit.
VCC
Vhys(B_IT−)
V(B_IT−)
VCC(start)
1
0
td(BOR)
Figure 5-6. POR and BOR vs Supply Voltage
VCC
2
VCC = 3 V
Typical Conditions
tpw
3V
VCC(drop) − V
1.5
1
VCC(drop)
0.5
0
0.001
1
1000
tpw − Pulse Width − µs
1 ns
1 ns
tpw − Pulse Width − µs
Figure 5-7. VCC(drop) Level With a Rectangular Voltage Drop to Generate a POR or BOR Signal
16
Specifications
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
VCC
2
tpw
3V
VCC = 3 V
Typical Conditions
VCC(drop) − V
1.5
1
VCC(drop)
0.5
tf = tr
0
0.001
1
tf
1000
tpw − Pulse Width − µs
tr
tpw − Pulse Width − µs
Figure 5-8. VCC(drop) Level With a Triangular Voltage Drop to Generate a POR or BOR Signal
5.17 SVS (Supply Voltage Supervisor and Monitor) (1)
over recommended operating free-air temperature range (unless otherwise noted) (also see Figure 5-10)
PARAMETER
t(SVSR)
TEST CONDITIONS
MIN
dVCC/dt > 30 V/ms (see Figure 5-9)
SVS on, switch from VLD = 0 to VLD ≠ 0, VCC = 3 V
tsettle
VLD ≠ 0 (2)
V(SVSstart)
VLD ≠ 0, VCC/dt ≤ 3 V/s (see Figure 5-9)
2000
20
1.55
VLD = 1
VCC/dt ≤ 3 V/s (see Figure 5-9)
Vhys(SVS_IT–)
VCC/dt ≤ 3 V/s (see Figure 5-9), external voltage
applied on P2.3
VCC/dt ≤ 3 V/s (see Figure 5-9)
V(SVS_IT–)
VCC/dt ≤ 3 V/s (see Figure 5-9), external voltage
applied on P2.3
(1)
(2)
(3)
MAX
150
dVCC/dt ≤ 30 V/ms
td(SVSon)
ICC(SVS) (1)
TYP
5
VLD = 2 to 14
VLD = 15
70
120
µs
12
µs
1.7
V
155
mV
V(SVS_IT–)
× 0.008
4.4
10.4
VLD = 1
1.8
1.9
2.05
VLD = 2
1.94
2.1
2.25
VLD = 3
2.05
2.2
2.37
VLD = 4
2.14
2.3
2.48
VLD = 5
2.24
2.4
2.6
VLD = 6
2.33
2.5
2.71
VLD = 7
2.46
2.65
2.86
VLD = 8
2.58
2.8
3
VLD = 9
2.69
2.9
3.13
VLD = 10
2.83
3.05
3.29
VLD = 11
2.94
3.2
3.42
VLD = 12
3.11
3.35
3.61 (3)
VLD = 13
3.24
3.5
3.76 (3)
VLD = 14
3.43
(3)
3.99 (3)
VLD = 15
1.1
1.2
1.3
10
15
VLD ≠ 0, VCC = 2.2 V or 3 V
µs
150
V(SVS_IT–)
× 0.004
3.7
UNIT
mV
V
µA
The current consumption of the SVS module is not included in the ICC current consumption data.
tsettle is the settling time that the comparator o/p must have a stable level after VLD is switched from VLD ≠ 0 to a different VLD value
between 2 and 15. The overdrive is assumed to be greater than 50 mV.
The recommended operating voltage range is limited to 3.6 V.
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Specifications
17
MSP430F427, MSP430F425, MSP430F423
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Software Sets VLD > 0:
SVS is Active
VCC
V
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V hys(SVS_IT−)
(SVS_IT−)
V(SVSstart)
V hys(B_IT−)
V(B_IT−)
VCC(start)
Brownout
Region
Brownout
Region
Brownout
1
0
t d(BOR)
SVS out
t d(BOR)
SVS Circuit is Active From VLD > to VCC < V(B_IT−)
1
0
t d(SVSon)
Set POR
1
t d(SVSR)
Undefined
0
Figure 5-9. SVS Reset (SVSR) vs Supply Voltage
VCC
t pw
3V
2
Rectangular Drop
1.5
VCC(drop)
V CC(drop) − V
Triangular Drop
1
1 ns
0.5
1 ns
VCC
t pw
3V
0
1
10
100
1000
t pw − Pulse Width − µs
VCC(drop)
tr = tf
tf
tr
t − Pulse Width − µs
Figure 5-10. VCC(drop) With a Rectangular Voltage Drop and a Triangular Voltage Drop to Generate an SVS
Signal
18
Specifications
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SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
5.18 DCO
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5-11 through Figure 5-13)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
f(DCOCLK)
N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 = FN_2 = 0, D = 2,
DCOPLUS = 0, fCrystal = 32.768 kHz
3V
f(DCO = 2)
FN_8 = FN_4 = FN_3 = FN_2 = 0, DCOPLUS = 1
3V
0.3
0.7
1.3
MHz
f(DCO = 27)
FN_8 = FN_4 = FN_3 = FN_2 = 0, DCOPLUS = 1
3V
2.7
6.1
11.3
MHz
f(DCO = 2)
FN_8 = FN_4 = FN_3 = FN_2 = 1, DCOPLUS = 1
3V
0.8
1.5
2.5
MHz
f(DCO = 27)
FN_8 = FN_4 = FN_3 = FN_2 = 1, DCOPLUS = 1
3V
6.5
12.1
20
MHz
f(DCO = 2)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x, DCOPLUS = 1
3V
1.3
2.2
3.5
MHz
f(DCO = 27)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x, DCOPLUS = 1
3V
10.3
17.9
28.5
MHz
f(DCO = 2)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x, DCOPLUS = 1
3V
2.1
3.4
5.2
MHz
f(DCO = 27)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x, DCOPLUS = 1
3V
16
26.6
41
MHz
f(DCO = 2)
FN_8 = 1, FN_4 = 1 = FN_3 = FN_2 = x, DCOPLUS = 1
3V
4.2
6.3
9.2
MHz
f(DCO = 27)
FN_8 = 1, FN_4 = 1 = FN_3 = FN_2 = x, DCOPLUS = 1
30
46
70
MHz
Sn
Step size (ratio) between adjacent DCO taps:
Sn = fDCO(Tap n+1)/fDCO(Tap n) (see Figure 5-12 for taps 21 to 27)
Dt
Temperature drift, N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 =
FN_2 = 0, D = 2, DCOPLUS = 0
DV
Drift with VCC variation, N(DCO) = 01Eh, FN_8 = FN_4 = FN_3
= FN_2 = 0, D = 2, DCOPLUS = 0
1
3V
MHz
1 < TAP ≤ 20
1.06
1.11
TAP = 27
1.07
1.17
3V
–0.2
–0.3
–0.4
%/°C
0
5
15
%/V
f(DCO)
f(DCO)
f(DCO3V)
f(DCO20°C)
1.0
1.0
0
1.8
2.4
3.0
3.6
−40
−20
0
20
40
60
85
VCC − V
TA – °C
Figure 5-11. DCO Frequency vs Supply Voltage (VCC) and vs Ambient Temperature
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19
MSP430F427, MSP430F425, MSP430F423
Sn – Step-Size Ratio Between DCO Taps
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
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1.17
Max
1.11
1.07
1.06
Min
1
20
27
DCO Tap
Figure 5-12. DCO Tap Step Size
f (DCO)
Legend
Tolerance at Tap 27
DCO Frequency
Adjusted by Bits
29 to 25 in SCFI1 {N {DCO} }
Tolerance at Tap 2
Overlapping DCO Ranges:
Uninterrupted Frequency Range
FN_2 = 0
FN_3 = 0
FN_4 = 0
FN_8 = 0
FN_2 = 1
FN_3 = 0
FN_4 = 0
FN_8 = 0
FN_2 = x
FN_3 = 1
FN_4 = 0
FN_8 = 0
FN_2 = x
FN_3 = x
FN_4 = 1
FN_8 = 0
FN_2 = x
FN_3 = x
FN_4 = x
FN_8 = 1
Figure 5-13. Five Overlapping DCO Ranges Controlled by FN_x Bits
20
Specifications
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5.19 Crystal Oscillator, LFXT1 Oscillator (1)
(2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
CXIN
TEST CONDITIONS
Integrated input capacitance (3)
VCC
MIN
OSCCAPx = 0h
0
OSCCAPx = 1h
10
OSCCAPx = 2h
3V
0
OSCCAPx = 1h
10
3V
VIH
(1)
(2)
(3)
(4)
Input levels at XIN (4)
pF
pF
14
OSCCAPx = 3h
VIL
UNIT
18
OSCCAPx = 0h
OSCCAPx = 2h
MAX
14
OSCCAPx = 3h
CXOUT Integrated output capacitance (3)
TYP
18
3V
VSS
0.2 × VCC
0.8 × VCC
VCC
V
The parasitic capacitance from the package and board may be estimated to be 2 pF. The effective load capacitor for the crystal is
(CXIN × CXOUT) / (CXIN + CXOUT). This is independent of XTS_FLL.
To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines should be observed.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
• Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
TI recommends external capacitance for precision real-time clock applications; OSCCAPx = 0h.
Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
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5.20 SD16 Power Supply and Operating Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
AVCC
ISD16
fSD16
TEST CONDITIONS
Analog supply voltage
VCC
AVCC = DVCC, AVSS = DVSS = 0 V
Analog supply current: 1 active SD16
channel including internal reference
Analog front-end input clock frequency
SD16LP = 0,
fSD16 = 1 MHz,
SD16OSR = 256
SD16LP = 1,
fSD16 = 0.5 MHz,
SD16OSR = 256
MIN
TYP
MAX
650
950
2.7
GAIN: 1, 2
GAIN: 4, 8, 16
3.6
730
1100
1050
1550
GAIN: 1
620
930
GAIN: 32
700
1060
GAIN: 32
3V
SD16LP = 0 (low-power mode disabled)
1
SD16LP = 1 (low-power mode enabled)
0.5
UNIT
V
µA
MHz
5.21 SD16 Analog Input Range (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VID
TEST CONDITIONS
Differential input voltage range for
specified performance (2)
VCC
MIN
TYP
SD16GAINx = 1, SD16REFON = 1
±500
SD16GAINx = 2, SD16REFON = 1
±250
SD16GAINx = 4, SD16REFON = 1
±125
SD16GAINx = 8, SD16REFON = 1
±62
SD16GAINx = 16, SD16REFON = 1
±31
SD16GAINx = 32, SD16REFON = 1
±15
MAX
UNIT
mV
ZI
Input impedance
(one input pin to AVSS)
fSD16 = 1 MHz, SD16GAINx = 1
ZID
Differential input impedance
(IN+ to IN−)
fSD16 = 1 MHz, SD16GAINx = 1
VI
Absolute input voltage range
AVSS –
1
AVCC
V
VIC
Common-mode input voltage range
AVSS –
1
AVCC
V
(1)
(2)
22
fSD16 = 1 MHz, SD16GAINx = 32
fSD16 = 1 MHz, SD16GAINx = 32
200
3V
3V
kΩ
75
300
400
100
150
kΩ
All parameters pertain to each SD16 channel.
The analog input range depends on the reference voltage applied to VREF. If VREF is sourced externally, the full-scale range is defined
by VFSR+ = +(VREF / 2) / GAIN and VFSR− = −(VREF / 2) / GAIN. The analog input range should not exceed 80% of VFSR+ or VFSR−.
Specifications
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5.22 SD16 Analog Performance
fSD16 = 1 MHz, SD16OSRx = 256, SD16REFON = 1, over operating free-air temperature range (unless otherwise noted)
PARAMETER
SINAD
G
Signal-to-noise +
distortion ratio
Nominal gain
EOS
Offset error
dEOS/dT
Offset error
temperature
coefficient
CMRR
Common-mode
rejection ratio
AC PSRR
AC power-supply
rejection ratio
XT
Crosstalk
TEST CONDITIONS
MIN
TYP
SD16GAINx = 1, signal amplitude = 500 mV
83.5
85
SD16GAINx = 2, signal amplitude = 250 mV
81.5
84
SD16GAINx = 4, signal amplitude = 125 mV
76
79.5
73
76.5
SD16GAINx = 16, signal amplitude = 31 mV
69
73
SD16GAINx = 32, signal amplitude = 15 mV
62
69
SD16GAINx = 1
0.97
1.00
1.02
SD16GAINx = 2
1.90
1.96
2.02
SD16GAINx = 4
3.76
3.86
3.96
7.36
7.62
7.84
SD16GAINx = 16
14.56
15.04
15.52
SD16GAINx = 32
27.20
28.35
29.76
SD16GAINx = 8, signal amplitude = 62 mV
VCC
fIN = 50 Hz
or 100 Hz
3V
3V
SD16GAINx = 8
SD16GAINx = 1
±1.5
SD16GAINx = 1
±4
3V
SD16GAINx = 32
SD16GAINx = 1, Common-mode input signal:
VID = 500 mV, fIN = 50 Hz or 100 Hz
SD16GAINx = 32, Common-mode input signal:
VID = 16 mV, fIN = 50 Hz or 100 Hz
SD16GAINx = 1, VCC = 3 V ±100 mV, fVCC = 50 Hz
±20
UNIT
dB
±0.2
3V
SD16GAINx = 32
MAX
%FSR
±20
ppm
±100 FSR/°C
>90
3V
dB
>75
3V
>80
dB
3V
<–100
dB
5.23 SD16 Built-in Temperature Sensor (1)
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
TCSensor
PARAMETER
Sensor temperature coefficient
TEST CONDITIONS
VCC
1.18
1.32
1.46
mV/K
VOffset,sensor
Sensor offset voltage
–100
100
mV
VSensor
Sensor output voltage (2)
Temperature sensor voltage at TA = 85°C
Temperature sensor voltage at TA = 25°C
3V
Temperature sensor voltage at TA = 0°C
(1)
(2)
435
475
515
355
395
435
320
360
400
mV
The following formula can be used to calculate the temperature sensor output voltage:
VSensor,typ = TCSensor (273 + T [°C] ) + VOffset,sensor [mV]
Results based on characterization or production test, no TCSensor or VOffset,sensor.
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5.24 SD16 Built-in Voltage Reference
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
1.14
1.20
1.26
V
175
260
µA
20
50
ppm/K
VREF
Internal reference voltage
SD16REFON = 1, SD16VMIDON = 0
3V
IREF
Reference supply current
SD16REFON = 1, SD16VMIDON = 0
3V
TC
Temperature coefficient
SD16REFON = 1, SD16VMIDON = 0
3V
CREF
VREF load capacitance
SD16REFON = 1 SD16VMIDON = 0 (1)
ILOAD
VREF(I) maximum load current
SD16REFON = 0, SD16VMIDON = 0
3V
tON
Turnon time
SD16REFON = 0 → 1, SD16VMIDON = 0,
CREF = 100 nF
3V
DC PSR
DC power supply rejection,
ΔVREF/ΔVCC
SD16REFON = 1, SD16VMIDON = 0,
VCC = 2.5 V to 3.6 V
(1)
100
UNIT
nF
±200
5
nA
ms
200
µV/V
No capacitance is required on VREF. However, TI recommends a capacitance of at least 100 nF to reduce any reference voltage noise.
5.25 SD16 Built-in Reference Output Buffer
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VREF,BUF
Reference buffer output voltage
SD16REFON = 1, SD16VMIDON = 1
3V
1.2
IREF,BUF
Reference supply and reference
output buffer quiescent current
SD16REFON = 1, SD16VMIDON = 1
3V
385
CREF(O)
Required load capacitance on VREF SD16REFON = 1, SD16VMIDON = 1
ILOAD,Max
Maximum load current on VREF
SD16REFON = 1, SD16VMIDON = 1
3V
Maximum voltage variation versus
load current
|ILOAD| = 0 to 1 mA
3V
Turnon time
SD16REFON = 0 → 1, SD16VMIDON = 0,
CREF = 100 nF
3V
tON
MAX
UNIT
V
600
470
A
nF
–15
±1
mA
+15
mV
100
µs
5.26 SD16 External Reference Input
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
1.0
1.25
1.5
V
50
nA
VREF(I)
Input voltage
SD16REFON = 0
3V
IREF(I)
Input current
SD16REFON = 0
3V
24
Specifications
UNIT
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5.27 Flash Memory
over recommended operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
VCC(PGM/
VCC
MIN
TYP
MAX
UNIT
Program and erase supply voltage
2.7
3.6
V
fFTG
Flash timing generator frequency
257
476
kHz
IPGM
Supply current from DVCC during program
2.7 V, 3.6 V
3
5
mA
IERASE
Supply current from DVCC during erase
2.7 V, 3.6 V
3
7
mA
tCPT
Cumulative program time (1)
2.7 V, 3.6 V
10
ms
ERASE)
tCMErase
Cumulative mass erase time
(2)
2.7 V, 3.6 V
200
104
Program and erase endurance
tRetention
Data retention duration
tWord
Word or byte program time (3)
35
Block program time for first byte or word (3)
30
tBlock, 1–63
Block program time for each additional byte or word (3)
21
tBlock, End
Block program end-sequence wait time (3)
tMass Erase
Mass erase time (3)
5297
tSeg Erase
Segment erase time (3)
4819
tBlock,
(1)
(2)
(3)
0
TJ = 25°C
ms
105
cycles
100
years
tFTG
6
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word or byte write mode and block write mode.
The mass erase duration generated by the flash timing generator is at least 11.1 ms ( = 5297 × (1 / fFTG,max) = 5297 × (1 / 476 kHz)).
To achieve the required cumulative mass erase time, the mass erase operation of the flash controller can be repeated until this time is
met (a worst case minimum of 19 cycles is required).
These values are hardwired into the state machine of the flash controller (tFTG = 1 / fFTG).
5.28 JTAG Interface
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTCK
TCK input frequency
See
(1)
RInternal
Internal pullup resistance on TMS, TCK, TDI/TCLK
See
(2)
(1)
(2)
VCC
MIN
TYP
MAX
2.2 V
0
5
3V
0
10
2.2 V, 3 V
25
60
90
UNIT
MHz
kΩ
fTCK may be restricted to meet the timing requirements of the module selected.
TMS, TDI/TCLK, and TCK pullup resistors are implemented in all versions.
5.29 JTAG Fuse (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
VFB
Voltage level on TDI/TCLK for fuse-blow
IFB
Supply current into TDI/TCLK during fuse blow
tFB
Time to blow fuse
(1)
TEST CONDITIONS
TA = 25°C
MIN
MAX
2.5
6
UNIT
V
7
V
100
mA
1
ms
After the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched to
bypass mode.
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6 Detailed Description
6.1
CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and
constant generator, respectively. The remaining registers are general-purpose registers (see Figure 6-1).
Peripherals are connected to the CPU using data, address, and control buses. Peripherals can be
manged with all instructions.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Figure 6-1. CPU Registers
26
Detailed Description
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6.2
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Instruction Set
The instruction set consists of the original 51 instructions with three formats and seven address modes.
Each instruction can operate on word and byte data. Table 6-1 lists examples of the three types of
instruction formats, and Table 6-2 lists the address modes.
Table 6-1. Instruction Word Formats
INSTRUCTION FORMAT
EXAMPLE
OPERATION
Dual operands, source and destination
ADD
R4,R5
R4 + R5 → R5
Single operand, destination only
CALL
R8
PC→(TOS), R8 →PC
Relative jump, unconditional or conditional
JNE
Jump-on-equal bit = 0
Table 6-2. Address Mode Descriptions
S (1)
D (1)
SYNTAX
EXAMPLE
Register
●
●
MOV Rs, Rd
MOV R10, R11
R10 → R11
Indexed
●
●
MOV X(Rn), Y(Rm)
MOV 2(R5), 6(R6)
M(2+R5)→ M(6+R6)
Symbolic (PC relative)
●
●
MOV EDE, TONI
Absolute
●
●
MOV & MEM, & TCDAT
Indirect
●
MOV @Rn, Y(Rm)
MOV @R10, Tab(R6)
M(R10) → M(Tab+R6)
Indirect autoincrement
●
MOV @Rn+, Rm
MOV @R10+, R11
M(R10) → R11
R10 + 2→ R10
Immediate
●
MOV #X, TONI
MOV #45, TONI
#45 → M(TONI)
ADDRESS MODE
(1)
OPERATION
M(EDE) → M(TONI)
M(MEM) → M(TCDAT)
S = source, D = destination
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Operating Modes
The MSP430F42x has one active mode and five software-selectable low-power modes of operation. An
interrupt event can wake up the device from any of the five low-power modes, service the request, and
restore back to the low-power mode on return from the interrupt program.
Software can configure the following operating modes:
• Active mode (AM)
– All clocks are active.
• Low-power mode 0 (LPM0)
– CPU is disabled.
– ACLK and SMCLK remain active, MCLK available to modules.
– FLL+ loop control remains active.
• Low-power mode 1 (LPM1)
– CPU is disabled.
– ACLK and SMCLK remain active, MCLK available to modules.
– FLL+ loop control is disabled.
• Low-power mode 2 (LPM2)
– CPU is disabled.
– MCLK, FLL+ loop control, and DCOCLK are disabled.
– DC generator of the DCO remains enabled.
– ACLK remains active.
• Low-power mode 3 (LPM3)
– CPU is disabled.
– MCLK, FLL+ loop control, and DCOCLK are disabled.
– DC generator of the DCO is disabled.
– ACLK remains active.
• Low-power mode 4 (LPM4)
– CPU is disabled.
– ACLK is disabled.
– MCLK, FLL+ loop control, and DCOCLK are disabled.
– DC generator of the DCO is disabled.
– Crystal oscillator is stopped.
28
Detailed Description
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6.4
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Interrupt Vector Addresses
The interrupt vectors and the power-up starting address are in the address range 0FFFFh to 0FFE0h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence. Table 6-3 lists
the interrupt sources, flags, and vectors.
Table 6-3. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD
ADDRESS
PRIORITY
Power up
External reset
Watchdog
Flash memory
PC out of range (1)
WDTIFG
KEYV (2)
Reset
0FFFEh
15, highest
NMI oscillator fault
Flash memory access violation
NMIIFG (2)
OFIFG (2)
ACCVIFG (2)
(Non)maskable (3)
(Non)maskable
(Non)maskable
0FFFCh
14
0FFFAh
13
0FFF8h
12
0FFF6h
11
SD16
SD16CCTLx SD16OVIFG,
SD16CCTLx SD16IFG (2) (4)
Watchdog timer
WDTIFG
Maskable
0FFF4h
10
USART0 receive
URXIFG0
Maskable
0FFF2h
9
USART0 transmit
UTXIFG0
Maskable
0FFF0h
8
0FFEEh
7
Timer_A3
TACCR0 CCIFG
Maskable
0FFECh
6
Timer_A3
Maskable
0FFEAh
5
I/O port P1 (8 flags)
P1IFG.0 to P1IFG.7 (2) (4)
Maskable
0FFE8h
4
0FFE6h
3
0FFE4h
2
P2IFG.0 to P2IFG.7
Basic Timer1
(2)
(3)
(4)
(4)
TACCR1 and TACCR2
CCIFGs, and TACTL TAIFG (2) (4)
I/O port P2 (8 flags)
(1)
Maskable
BTIFG
(2) (4)
Maskable
0FFE2h
1
Maskable
0FFE0h
0, lowest
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h−01FFh) or from
within unused address ranges (0600h–0BFFh).
Multiple source flags
(Non)maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable cannot.
Interrupt flags are in the module.
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Special Function Registers
Most interrupt and module-enable bits are collected in the lowest address space. Special-function register
bits not allocated to a functional purpose are not physically present in the device. This arrangement
provides simple software access.
Legend
rw
rw-0, rw-1
rw-(0), rw-(1)
Bit can be read and written.
Bit can be read and written. It is reset or set by PUC.
Bit can be read and written. It is reset or set by POR.
SFR bit is not present in device.
Figure 6-2 shows the Interrupt Enable Register 1, and Table 6-4 describes the bit fields.
Figure 6-2. Interrupt Enable Register 1 (Address = 00h)
7
UTXIE0
rw-0
6
URXIE0
rw-0
5
ACCVIE
rw-0
4
NMIIE
rw-0
3
2
1
OFIE
rw-0
0
WDTIE
rw-0
Table 6-4. Interrupt Enable Register 1 Description
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
UTXIE0
RW
0h
USART0: UART and SPI transmit interrupt enable
6
URXIE0
RW
0h
USART0: UART and SPI receive interrupt enable
5
ACCVIE
RW
0h
Flash access violation interrupt enable
4
NMIIE
RW
0h
(Non)maskable interrupt enable
1
OFIE
RW
0h
Oscillator fault interrupt enable
0
WDTIE
RW
0h
Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if
watchdog timer is configured in interval timer mode.
Figure 6-3 shows the Interrupt Enable Register 2, and Table 6-5 describes the bit fields.
Figure 6-3. Interrupt Enable Register 2 (Address = 01h)
7
BTIE
rw-0
6
5
4
3
2
1
0
Table 6-5. Interrupt Enable Register 2 Description
BIT
7
30
FIELD
TYPE
RESET
DESCRIPTION
BTIE
RW
0h
Basic Timer1 interrupt enable
Detailed Description
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Figure 6-4 shows the Interrupt Flag Register 1, and Table 6-6 describes the bit fields.
Figure 6-4. Interrupt Flag Register 1 (Address = 02h)
7
UTXIFG0
rw-1
6
URXIFG0
rw-0
5
4
NMIIFG
rw-0
3
2
1
OFIFG
rw-1
0
WDTIFG
rw-(0)
Table 6-6. Interrupt Flag Register 1 Description
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
UTXIFG0
RW
1h
USART0: UART and SPI transmit flag
6
URXIFG0
RW
0h
USART0: UART and SPI receive flag
4
NMIIFG
RW
0h
Set by the RST/NMI pin
1
OFIFG
RW
1h
Flag set on oscillator fault.
0
WDTIFG
RW
0h
Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCC power on or a reset condition at the RST/NMI pin in reset mode.
Figure 6-5 shows the Interrupt Flag Register 2, and Table 6-7 describes the bit fields.
Figure 6-5. Interrupt Flag Register 2 (Address = 03h)
7
BTIFG
rw-0
6
5
4
3
2
1
0
Table 6-7. Interrupt Flag Register 2 Description
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
BTIFG
RW
0h
Basic Timer1 interrupt flag
Figure 6-6 shows the Module Enable Register 1, and Table 6-8 describes the bit fields.
Figure 6-6. Module Enable Register 1 (Address = 04h)
7
UTXE0
rw-0
6
URXE0
USPIE0
rw-0
5
4
3
2
1
0
Table 6-8. Module Enable Register 1 Description
BIT
FIELD
TYPE
RESET
DESCRIPTION
7
UTXE0
RW
0h
USART0: UART mode transmit enable
6
URXE0
USPIE0
RW
0h
USART0: UART mode receive enable
USART0: SPI mode transmit and receive enable
Module Enable Register 2 is not defined for the MSP430F42x MCUs.
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Memory Organization
Table 6-9 summarizes the memory map of the MSP430F42x MCUs.
Table 6-9. Memory Organization
MSP430F423
MSP430F425
Size
8KB
16KB
32KB
Interrupt vector
Flash
0FFFFh–0FFE0h
0FFFFh–0FFE0h
0FFFFh–0FFE0h
Code memory
Flash
0FFFFh–0E000h
0FFFFh–0C000h
0FFFFh–08000h
Size
256 Byte
256 Byte
256 Byte
010FFh–01000h
010FFh–01000h
010FFh–01000h
Memory
Information memory
Boot memory
RAM
Size
Size
Peripherals
1KB
1KB
1KB
0FFFh–0C00h
0FFFh–0C00h
0FFFh–0C00h
256 Byte
512 Byte
1KB
02FFh–0200h
03FFh–0200h
05FFh–0200h
16-bit
01FFh–0100h
01FFh–0100h
01FFh–0100h
8-bit
0FFh–010h
0FFh–010h
0FFh–010h
0Fh–00h
0Fh–00h
0Fh–00h
8-bit SFR
6.7
MSP430F427
Bootloader (BSL)
The BSL lets users program the flash memory or RAM using a UART serial interface. Access to the MCU
memory through the BSL is protected by user-defined password. For complete description of the features
of the BSL and its implementation, see MSP430 Programming WIth the Bootloader (BSL).
6.8
BSL FUNCTION
PM PACKAGE PINS
Data transmit
53 - P1.0
Data receiver
52 - P1.1
Flash Memory
The flash memory (see Figure 6-7) can be programmed using the JTAG port, the bootloader, or in system
by the CPU. The CPU can perform single-byte and single-word writes to the flash memory. Features of
the flash memory include:
•
•
•
•
32
Flash memory has n segments of main memory and two segments of information memory (A and B) of
128 bytes each. Each segment in main memory is 512 bytes in size.
Segments 0 to n may be erased in one step, or each segment may be individually erased.
Segments A and B can be erased individually, or as a group with segments 0 to n. Segments A and B
are also called information memory.
New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory before the first use.
Detailed Description
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8KB
16KB
32KB
0FFFFh
0FFFFh
0FFFFh
0FE00h 0FE00h 0FE00h
0FDFFh 0FDFFh 0FDFFh
Segment 0
With Interrupt Vectors
Segment 1
0FC00h 0FC00h 0FC00h
0FBFFh 0FBFFh 0FBFFh
Segment 2
0FA00h
0F9FFh
0FA00h
0F9FFh
0FA00h
0F9FFh
Main Memory
0E400h 0C400h
0E3FFh 0C3FFh
083FFh
0E200h 0C200h
0E1FFh 0C1FFh
08200h
081FFh
0E000h
010FFh
0C000h
010FFh
08000h
010FFh
01080h
0107Fh
01080h
0107Fh
01080h
0107Fh
08400h
Segment n−1
Segment n
Segment A
Information Memory
Segment B
01000h
01000h
01000h
Figure 6-7. Flash Memory Map
6.9
Peripherals
Peripherals are connected to the CPU through data, address, and control buses. Peripherals can be
managed using all instructions. For complete module descriptions, see the MSP430x4xx Family User's
Guide.
6.9.1
Oscillator and System Clock
The clock system is supported by the FLL+ module that includes support for a 32768-Hz watch crystal
oscillator, an internal digitally controlled oscillator (DCO), and a high-frequency crystal oscillator. The FLL+
clock module is designed to meet the requirements of both low system cost and low power consumption.
The FLL+ features digital frequency locked loop (FLL) hardware that, in conjunction with a digital
modulator, stabilizes the DCO frequency to a programmable multiple of the watch crystal frequency. The
internal DCO provides a fast turnon clock source and stabilizes in less than 6 µs. The FLL+ module
provides the following clock signals:
•
•
•
•
Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high-frequency crystal
Main clock (MCLK), the system clock used by the CPU
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules
ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, or ACLK/8
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6.9.2
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Brownout, Supply Voltage Supervisor (SVS)
The brownout circuit provides the proper internal reset signal to the device during power on and power off.
The SVS circuitry detects if the supply voltage drops below a user-selectable level and supports both
supply voltage supervision (the device is automatically reset) and supply voltage monitoring (the device is
not automatically reset).
The CPU begins code execution after the brownout circuit releases the device reset. However, VCC may
not have ramped to VCC(min) at that time. The user must ensure that the default FLL+ settings are not
changed until VCC reaches VCC(min). If desired, the SVS circuit can be used to determine when VCC
reaches VCC(min).
6.9.3
Digital I/O
Two I/O ports are implemented: ports P1 and P2 (only six P2 I/O signals are available on external pins).
•
•
•
•
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the 8 bits of ports P1 and P2.
Read/write access to port-control registers is supported by all instructions.
NOTE
Six bits of port P2 (P2.0 to P2.5) are available on external pins, but all control and data bits
for port P2 are implemented.
6.9.4
Basic Timer1
The Basic Timer1 has two independent 8-bit timers that can be cascaded to form a 16-bit timer/counter.
Both timers can be read and written by software. The Basic Timer1 can be used to generate periodic
interrupts and clock for the LCD module.
6.9.5
LCD Driver
The LCD driver generates the segment and common signals required to drive an LCD display. The LCD
controller has dedicated data memory to hold segment drive information. Common and segment signals
are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported by this
peripheral.
6.9.6
Watchdog Timer (WDT+)
The primary function of the WDT+ module is to perform a controlled system restart after a software
problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function
is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
34
Detailed Description
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6.9.7
SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016
Timer_A3
Timer_A3 is a 16-bit timer and counter with three capture/compare registers. Timer_A3 can support
multiple capture/compares, PWM outputs, and interval timing (see Table 6-10). Timer_A3 also has
extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and
from each of the capture/compare registers.
Table 6-10. Timer_A3 Signal Connections
INPUT PIN NUMBER
DEVICE INPUT
SIGNAL
MODULE INPUT
NAME
48 - P1.5
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
48 - P1.5
TACLK
INCLK
53 - P1.0
TA0
CCI0A
52 - P1.1
TA0
CCI0B
DVSS
GND
DVCC
VCC
51 - P1.2
TA1
CCI1A
51 - P1.2
TA1
CCI1B
DVSS
GND
45 - P2.0
6.9.8
DVCC
VCC
TA2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN
NUMBER
53 - P1.0
CCR0
TA0
51 - P1.2
CCR1
TA1
45 - P2.0
CCR2
TA2
USART0
The MSP430F42x devices have one hardware universal synchronous/asynchronous receive transmit
(USART0) peripheral module that is used for serial data communication. USART0 supports synchronous
SPI (3- or 4-pin) and asynchronous UART communication protocols, using double-buffered transmit and
receive channels.
6.9.9
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs 16- ×
16-bit, 16- × 8-bit, 8- × 16-bit, and 8- × 8-bit operations. The module supports signed and unsigned
multiplication as well as signed and unsigned multiply-and-accumulate operations. The result of an
operation can be accessed immediately after the operands have been loaded into the peripheral registers.
No additional clock cycles are required.
6.9.10 SD16
The SD16 module integrates three independent 16-bit sigma-delta ADCs, an internal temperature sensor,
and a built-in voltage reference. Each channel is designed with a fully differential analog input pair and
programmable gain amplifier input stage.
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6.9.11 Peripheral File Map
Table 6-11 and Table 6-12 list the peripheral registers with their addresses.
Table 6-11. Peripherals With Word Access
MODULE
Watchdog
REGISTER NAME
Watchdog timer control
Timer0_A interrupt vector
Timer0_A control
Timer_A3
ACRONYM
0120h
TA0IV
012Eh
TACTL0
0160h
Capture/compare control 0
TACCTL0
0162h
Capture/compare control 1
TACCTL1
0164h
Capture/compare control 2
TACCTL2
0166h
Reserved
0168h
Reserved
016Ah
Reserved
016Ch
Reserved
Timer_A counter
016Eh
TA0R
0170h
Capture/compare 0
TACCR0
0172h
Capture/compare 1
TACCR1
0174h
Capture/compare 2
TACCR2
0176h
Reserved
0178h
Reserved
017Ah
Reserved
017Ch
Reserved
Sum extend
Hardware Multiplier
013Eh
Result high word
RESHI
013Ch
Result low word
RESLO
013Ah
Second operand
OP2
0138h
MACS
0136h
MAC
0134h
MPYS
0132h
Multiply signed + accumulate/operand 1
Multiply signed/operand 1
Multiply unsigned/operand 1
36
Detailed Description
017Eh
SUMEXT
Multiply + accumulate/operand 1
Flash
ADDRESS
WDTCTL
MPY
0130h
Flash control 3
FCTL3
012Ch
Flash control 2
FCTL2
012Ah
Flash control 1
FCTL1
0128h
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Table 6-11. Peripherals With Word Access (continued)
MODULE
REGISTER NAME
ACRONYM
ADDRESS
SD16CTL
0100h
Channel 0 control
SD16CCTL0
0102h
Channel 1 control
SD16CCTL1
0104h
Channel 2 control
SD16CCTL2
0106h
General control
SD16
(also see Table 6-12)
Reserved
0108h
Reserved
010Ah
Reserved
010Ch
Reserved
010Eh
Interrupt vector word
SD16IV
0110h
Channel 0 conversion memory
SD16MEM0
0112h
Channel 1 conversion memory
SD16MEM1
0114h
Channel 2 conversion memory
SD16MEM2
0116h
Reserved
0118h
Reserved
011Ah
Reserved
011Ch
Reserved
011Eh
Table 6-12. Peripherals With Byte Access
MODULE
SD16
(also see Table 6-11)
ACRONYM
ADDRESS
Channel 0 input control
REGISTER NAME
SD16INCTL0
0B0h
Channel 1 input control
SD16INCTL1
0B1h
Channel 2 input control
SD16INCTL2
0B2h
Reserved
0B3h
Reserved
0B4h
Reserved
0B5h
Reserved
0B6h
Reserved
0B7h
Channel 0 preload
SD16PRE0
Channel 1 preload
SD16PRE1
0B9h
Channel 2 preload
SD16PRE2
0BAh
Reserved
0BBh
Reserved
0BCh
Reserved
0BDh
Reserved
0BEh
Reserved
LCD memory 20
⋮
LCD
0B8h
0BFh
LCDM20
⋮
0A4h
⋮
LCD memory 16
LCDM16
0A0h
LCD memory 15
LCDM15
09Fh
⋮
⋮
⋮
LCD memory 1
LCDM1
091h
LCD control and mode
LCDCTL
090h
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Table 6-12. Peripherals With Byte Access (continued)
MODULE
USART0
ACRONYM
ADDRESS
Transmit buffer
REGISTER NAME
U0TXBUF
077h
Receive buffer
U0RXBUF
076h
Baud rate 1
U0BR1
075h
Baud rate 0
U0BR0
074h
Modulation control
U0MCTL
073h
Receive control
U0RCTL
072h
Transmit control
U0TCTL
071h
USART control
Brownout, SVS
FLL+ Clock
Basic Timer1
U0CTL
070h
SVSCTL
056h
FLL+ control 1
FLL_CTL1
054h
FLL+ control 0
FLL_CTL0
053h
System clock frequency control
SVS control register
SCFQCTL
052h
System clock frequency integrator
SCFI1
051h
System clock frequency integrator
SCFI0
050h
BT counter 2
BTCNT2
047h
BT counter 1
BTCNT1
046h
BT control
BTCTL
040h
Port P2 selection
P2SEL
02Eh
P2IE
02Dh
Port P2 interrupt-edge select
P2IES
02Ch
Port P2 interrupt flag
P2IFG
02Bh
Port P2 direction
P2DIR
02Ah
Port P2 output
P2OUT
029h
P2IN
028h
P1SEL
026h
P1IE
025h
P1IES
024h
Port P1 interrupt flag
P1IFG
023h
Port P1 direction
P1DIR
022h
Port P1 output
P1OUT
021h
Port P1 input
P1IN
020h
SFR module enable 2
ME2
005h
SFR module enable 1
ME1
004h
SFR interrupt flag 2
IFG2
003h
SFR interrupt flag 1
Port P2 interrupt enable
Port P2
Port P2 input
Port P1 selection
Port P1 interrupt enable
Port P1 interrupt-edge select
Port P1
Special Functions
38
Detailed Description
IFG1
002h
SFR interrupt enable 2
IE2
001h
SFR interrupt enable 1
IE1
000h
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6.10 Input/Output Diagrams
6.10.1 Port P1 (P1.0 and P1.1) Input/Output With Schmitt Trigger
Figure 6-8 shows the port diagram. Table 6-13 summarizes the selection of the port function.
Pad Logic
CAPD.x
P1SEL.x
0: Input
1: Output
0
P1DIR.x
Direction Control
From Module
P1OUT.x
1
0
1
Module X OUT
Bus
keeper
P1.0/TA0
P1.1/TA0/MCLK
P1IN.x
EN
D
Module X IN
P1IE.x
P1IRQ.x
P1IFG.x
Q
EN
Interrupt
Edge
Select
Set
P1IES.x
P1SEL.x
NOTE: 0 ≤ x ≤ 1. Port function is active if CAPD.x = 0.
Figure 6-8. Port P1 (P1.0 and P1.1) Diagram
Table 6-13. Port P1 (P1.0 and P1.1) Pin Function
P1SEL.x
P1DIR.x
DIRECTION
CONTROL
FROM
MODULE
P1OUT.x
MODULE X
OUT
P1IN.x
MODULE X
IN
P1IE.x
P1IFG.x
P1IES.x
CAPD.x
P1SEL.0
P1DIR.0
P1DIR.0
P1OUT.0
Out0 Sig. (1)
P1IN.0
CCI0A (1)
P1IE.0
P1IFG.0
P1IES.0
DVSS
P1SEL.1
P1DIR.1
P1DIR.1
P1OUT.1
MCLK
P1IN.1
CCI0B (1)
P1IE.1
P1IFG.1
P1IES.1
DVSS
(1)
Timer_A3
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6.10.2 Port P1 (P1.2 to P1.7) Input/Output With Schmitt Trigger
Figure 6-9 shows the port diagram. Table 6-14 summarizes the selection of the port function.
Pad Logic
Port/LCD
Segment xx
DVSS
P1SEL.x
0: Input
1: Output
0
P1DIR.x
Direction Control
From Module
P1OUT.x
1
0
1
Module X OUT
Bus
keeper
P1.2/TA1/S31
P1.3/SVSOUT/S30
P1.4/S29
P1.5/TACLK/ACLK/S28
P1.6/SIMO0/S27
P1.7/SOMI0/S26
P1IN.x
EN
D
Module X IN
P1IE.x
P1IRQ.x
P1IFG.x
Q
EN
Interrupt
Edge
Select
Set
P1IES.x
P1SEL.x
NOTE: 2 ≤ x ≤ 7. Port function is active if Port/LCD = 0.
Figure 6-9. Port P1 (P1.2 to P1.7) Diagram
Table 6-14. Port P1 (P1.2 to P1.7) Pin Functions
P1SEL.x
P1DIR.x
DIRECTION
CONTROL
FROM
MODULE
P1OUT.x
MODULE X
OUT
P1IN.x
MODULE
X IN
P1IE.x
P1IFG.x
P1IES.x
P1SEL.2
P1DIR.2
P1DIR.2
P1OUT.2
Out1 Sig. (1)
P1IN.2
CCI1A†
P1IE.2
P1IFG.2
P1IES.2
P1SEL.3
P1DIR.3
P1DIR.3
P1OUT.3
SVSOUT
P1IN.3
unused
P1IE.3
P1IFG.3
P1IES.3
P1SEL.4
P1DIR.4
P1DIR.4
P1OUT.4
DVSS
P1IN.4
unused
P1IE.4
P1IFG.4
P1IES.4
P1SEL.5
P1DIR.5
P1DIR.5
P1OUT.5
ACLK
P1IN.5
TACLK (1)
P1IE.5
P1IFG.5
P1IES.5
P1SEL.6
P1DIR.6
DCM_SIMO
P1OUT.6
SIMO0(o) (2)
P1IN.6
SIMO0(i) (2)
P1IE.6
P1IFG.6
P1IES.6
P1SEL.7
P1DIR.7
DCM_SOMI
P1OUT.7
SOMI0(o) (2)
P1IN.7
SOMI0(i) (2)
P1IE.7
P1IFG.7
P1IES.7
(1)
(2)
Port/LCD
SEGMENT
0: LCDPx
< 05h,
1: LCDPx
≥ 05h
0: LCDPx
< 04h,
1: LCDPx
≥ 04h
S31
S30
S29
S28
S27
S26
Timer_A3
USART0 (also see Figure 6-10)
Direction Control for SIMO0
SYNC
MM
DCM_SIMO
Direction Control for SOMI0
SYNC
MM
STC
STC
STE
STE
DCM_SOMI
Figure 6-10. Direction Control for SIMO0 and SOMI0
40
Detailed Description
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6.10.3 Port P2 (P2.0 and P2.1) Input/Output With Schmitt Trigger
Figure 6-11 shows the port diagram. Table 6-15 summarizes the selection of the port function.
0: Port active
1: Segment xx function active
Pad Logic
Port/LCD
Segment xx
P2SEL.x
0: Input
1: Output
0
P2DIR.x
Direction Control
From Module
1
0
P2OUT.x
1
Module X OUT
Bus
Keeper
P2.0/TA2/S25
P2.1/UCLK0/S24
P2IN.x
EN
Module X IN
D
P2IE.x
P2IRQ.x
P2IFG.x
EN
Q
Set
Interrupt
Edge
Select
P2IES.x
P2SEL.x
NOTE: 0 ≤ x ≤ 1. Port function is active if Port/LCD = 0.
Figure 6-11. Port P2 (P2.0 and P2.1) Diagram
Table 6-15. Port P2 (P2.0 and P2.1) Pin Functions
P2Sel.x
P2DIR.x
DIRECTION
CONTROL
FROM
MODULE
P2OUT.x
MODULE X
OUT
P2IN.x
MODULE X
IN
P2IE.x
P2IFG.x
P2IES.x
Port/LCD
SEGMENT
P2Sel.0
P2DIR.0
P2DIR.0
P2OUT.0
Out2 Sig. (1)
P2IN.0
CCI2A (1)
P2IE.0
P2IFG.0
P2IES.0
S25
P2Sel.1
P2DIR.1
DCM_UCLK
P2OUT.1
UCLK0(o) (2)
P2IN.1
UCLK0(i) (2)
P2IE.1
P2IFG.1
P2IES.1
0: LCDPx
< 04h,
1: LCDPx
≥ 04h
(1)
(2)
S24
Timer_A3
USART0 (also see Figure 6-12)
Direction Control for UCLK0
SYNC
MM
DCM_UCLK
STC
STE
Figure 6-12. Direction Control for UCLK0
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6.10.4 Port P2 (P2.2 to P2.5) Input/Output With Schmitt Trigger
Figure 6-13 shows the port diagram. Table 6-16 summarizes the selection of the port function.
To Brownout/SVS for P2.3/SVSIN
Pad Logic
DVSS
DVSS
CAPD.x
P2SEL.x
0: Input
1: Output
0
P2DIR.x
Direction Control
From Module
P2OUT.x
1
0
1
Module X OUT
Bus
keeper
P2.2/STE0
P2.3/SVSIN
P2.4/UTXD0
P2.5/URXD0
P2IN.x
EN
D
Module X IN
P2IE.x
P2IRQ.x
P2IFG.x
Q
EN
Set
Interrupt
Edge
Select
P2IES.x
P2SEL.x
NOTE: 2 ≤ x ≤ 5. Port function is active if CAPD.x = 0
Figure 6-13. Port P2 (P2.2 to P2.5) Diagram
Table 6-16. Port P2 (P2.2 to P2.5) Pin Functions
P2SEL.x
P2DIR.x
DIRECTION
CONTROL
FROM
MODULE
P2OUT.x
MODULE X
OUT
P2IN.x
MODULE X
IN
P2IE.x
P2IFG.x
P2IES.x
P2SEL.2
P2DIR.2
DVSS
P2OUT.2
DVSS
P2IN.2
STE0 (1)
P2IE.2
P2IFG.2
P2IES.2
DVSS
42
Unused
P2IE.3
P2IFG.3
P2IES.3
SVSCTL
VLD =
1111b
P2IN.4
Unused
P2IE.4
P2IFG.4
P2IES.4
DVSS
P2IN.5
URXD0 (1)
P2IE.5
P2IFG.5
P2IES.5
DVSS
P2SEL.3
P2DIR.3
P2DIR.3
P2OUT.3
DVSS
P2IN.3
P2SEL.4
P2DIR.4
DVCC
P2OUT.4
UTXD0 (1)
P2SEL.5
P2DIR.5
DVSS
P2OUT.5
DVSS
(1)
CAPD.x
USART0
Detailed Description
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6.10.5 Port P2 (P2.6 and P2.7) Unbonded GPIOs
Unbonded GPIOs P2.6 and P2.7 can be used as interrupt flags. Only software can affect the interrupt
flags. They work as software interrupts.
Figure 6-14 shows the port diagram. Table 6-17 summarizes the selection of the port function.
P2SEL.x
0: Input
0
P2DIR.x
1: Output
1
Direction Control
From Module
0
P2OUT.x
1
Module X OUT
P2IN.x
Node Is Reset With PUC
EN
Bus Keeper
Module X IN
D
P2IRQ.x
P2IE.x
P2IFG.x
Q
EN
Set
Interrupt
Flag
PUC
Interrupt
Edge
Select
P2IES.x
P2SEL.x
NOTE: x = Bit identifier 6 or 7 for Port P2 without external pins
Figure 6-14. Port P2 (P2.6 and P2.7) Diagram
Table 6-17. Port P2 (P2.6 and P2.7) Pin Functions
P2SEL.x
P2DIR.x
DIRECTION
CONTROL
FROM
MODULE
P2OUT.x
MODULE X
OUT
P2IN.x
MODULE X
IN
P2IE.x
P2IFG.x
P2IES.x
P2SEL.6
P2DIR.6
P2DIR.6
P2OUT.6
DVSS
P2IN.6
Unused
P2IE.6
P2IFG.6
P2IES.6
P2SEL.7
P2DIR.7
P2DIR.7
P2OUT.7
DVSS
P2IN.7
Unused
P2IE.7
P2IFG.7
P2IES.7
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6.10.6 JTAG Pins TMS, TCK, TDI/TCLK, TDO/TDI, Input/Output With Schmitt-Trigger or Output
Figure 6-15 shows the port diagram.
TDO
Controlled by JTAG
Controlled by JTAG
TDO/TDI
JTAG
Controlled
by JTAG
DVCC
TDI
Burn and Test
Fuse
TDI/TCLK
Test
DVCC
and
Emulation
TMS
Module
TMS
DVCC
TCK
TCK
RST /NMI
Tau ~ 50 ns
Brownout
TCK
G
D
U
S
G
D
U
S
Figure 6-15. JTAG Pins Diagram
44
Detailed Description
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6.10.7 JTAG Fuse Check Mode
MSP430 devices that have the fuse on the TDI/TCLK terminal have a fuse check mode that tests the
continuity of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When
activated, a fuse check current (I(TF)) of 1.8 mA at 3 V can flow from the TDI/TCLK pin to ground if the fuse
is not burned. Take care to avoid accidentally activating the fuse check mode and increasing overall
system power consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if
the TMS is being held low during power up. The second positive edge on the TMS pin deactivates the
fuse check mode. After deactivation, the fuse check mode remains inactive until another POR occurs.
After each POR the fuse check mode has the potential to be activated.
The fuse check current flows only when the fuse check mode is active and the TMS pin is in a low state
(see Figure 6-16). Therefore, the additional current flow can be prevented by holding the TMS pin high
(default condition). The JTAG pins are terminated internally and therefore do not require external
termination.
Time TMS Goes Low After POR
TMS
I TF
I TDI/TCLK
Figure 6-16. Fuse Check Mode Current
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7 Device and Documentation Support
7.1
Getting Started and Next Steps
For more information on the MSP430 family of devices and the tools and libraries that are available to
help with your development, visit the Getting Started page.
7.2
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of
three prefixes: MSP, PMS, or XMS. TI recommends two of three possible prefix designators for its support
tools: MSP and MSPX. These prefixes represent evolutionary stages of product development from
engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified production
devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the final electrical specifications of the
device
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed TI's internal qualification testing.
MSP – Fully-qualified development-support product
XMS devices and MSPX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production
devices. TI recommends that these devices not be used in any production system because their expected
end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend
for reading the complete device name for any family member.
46
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MSP 430 F 5 438 A I ZQW T -EP
Processor Family
Optional: Additional Features
MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Processor Family
Optional: Temperature Range
Optional: A = Revision
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
430 = MSP430 low-power microcontroller platform
MCU Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
NOTE: This figure does not represent a complete list of the available features and options, and it does not indicate that all of
these features and options are available for a given device or family.
Figure 7-1. Device Nomenclature – Part Number Decoder
Device and Documentation Support
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7.3
www.ti.com
Tools and Software
Table 7-1 lists the debug features supported by the MSP430F42x microcontrollers. See the Code
Composer Studio for MSP430 User's Guide for details on the available features.
Table 7-1. Hardware Features
MSP430
ARCHITECTURE
4-WIRE
JTAG
2-WIRE
JTAG
BREAKPOINTS
(N)
RANGE
BREAKPOINTS
CLOCK
CONTROL
STATE
SEQUENCER
TRACE
BUFFER
MSP430
Yes
No
3
No
Global
No
No
Design Kits and Evaluation Modules
64-pin Target Development Board and MSP-FET Programmer Bundle - MSP430F1x, MSP430F2x,
MSP430F4x MCUs The MSP-FET430U64 is a powerful flash emulation tool that includes
the hardware and software required to quickly begin application development on the
MSP430 MCU. It includes a ZIF socket target board (MSP-TS430PM64) and a USB
debugging interface (MSP-FET) used to program and debug the MSP430 in-system through
the JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. The flash memory
can be erased and programmed in seconds with only a few keystrokes, and because the
MSP430 flash is ultra-low power, no external power supply is required.
MSP-TS430PM64 - 64-pin Target Development Board for MSP430F1x, MSP430F2x and MSP430F4x
MCUs The MSP-TS430PM64 is a stand-alone ZIF socket target board used to program and
debug the MSP430 MCU in-system through the JTAG interface or the Spy Bi-Wire (2-wire
JTAG) protocol.
Software
MSP430x41x, MSP430F42x Code Examples C Code examples are available for every MSP device that
configures each of the integrated peripherals for various application needs.
Capacitive Touch Software Library Free C libraries for enabling capacitive touch capabilities on
MSP430 MCUs. The MSP430 MCU version of the library features several capacitive touch
implementations including the RO and RC method.
MSPWare Software MSPWare software is a collection of code examples, data sheets, and other design
resources for all MSP devices delivered in a convenient package. In addition to providing a
complete collection of existing MSP design resources, MSPWare software also includes a
high-level API called MSP Driver Library. This library makes it easy to program MSP
hardware. MSPWare software is available as a component of CCS or as a stand-alone
package.
MSP Driver Library The abstracted API of MSP Driver Library provides easy-to-use function calls that
free you from directly manipulating the bits and bytes of the MSP430 hardware. Thorough
documentation is delivered through a helpful API Guide, which includes details on each
function call and the recognized parameters. Developers can use Driver Library functions to
write complete projects with minimal overhead.
MSP EnergyTrace Technology EnergyTrace technology for MSP430 microcontrollers is an energybased code analysis tool that measures and displays the energy profile of the application
and helps to optimize it for ultra-low power consumption.
ULP (Ultra-Low Power) Advisor ULP Advisor™ software is a tool for guiding developers to write more
efficient code to fully use the unique ultra-low-power features of MSP and MSP432
microcontrollers. Aimed at both experienced and new microcontroller developers, ULP
Advisor checks your code against a thorough ULP checklist to help minimize the energy
consumption of your application. At build time, ULP Advisor provides notifications and
remarks to highlight areas of your code that can be further optimized for lower power.
Fixed Point Math Library for MSP The MSP IQmath and Qmath Libraries are a collection of highly
optimized and high-precision mathematical functions for C programmers to seamlessly port a
floating-point algorithm into fixed-point code on MSP430 and MSP432 devices. These
routines are typically used in computationally intensive real-time applications where optimal
execution speed, high accuracy, and ultra-low energy are critical. By using the IQmath and
Qmath libraries, it is possible to achieve execution speeds considerably faster and energy
consumption considerably lower than equivalent code written using floating-point math.
48
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Development Tools
Code Composer Studio™ Integrated Development Environment for MSP Microcontrollers
Code
Composer Studio (CCS) integrated development environment (IDE) supports all MSP
microcontroller devices. CCS comprises a suite of embedded software utilities used to
develop and debug embedded applications. CCS includes an optimizing C/C++ compiler,
source code editor, project build environment, debugger, profiler, and many other features.
Command-Line Programmer MSP Flasher is an open-source shell-based interface for programming
MSP microcontrollers through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire
(SBW) communication. MSP Flasher can download binary files (.txt or .hex) directly to the
MSP microcontroller without an IDE.
MSP MCU Programmer and Debugger The MSP-FET is a powerful emulation development tool – often
called a debug probe – which lets users quickly begin application development on MSP lowpower MCUs. Creating MCU software usually requires downloading the resulting binary
program to the MSP device for validation and debugging.
MSP-GANG Production Programmer The MSP Gang Programmer is an MSP430 or MSP432 device
programmer that can program up to eight identical MSP430 or MSP432 flash or FRAM
devices at the same time. The MSP Gang Programmer connects to a host PC using a
standard RS-232 or USB connection and provides flexible programming options that let the
user fully customize the process.
7.4
Documentation Support
The following documents describe the MSP430F42x MCUs. Copies of these documents are available on
the Internet at www.ti.com.
Receiving Notification of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (see Section 7.5 for links to product folders). In the upper right corner, click the
"Alert me" button. This registers you to receive a weekly digest of product information that has changed (if
any). For change details, check the revision history of any revised document.
Errata
MSP430F427 Device Erratasheet Describes the known exceptions to the functional specifications for
each silicon revision of this device.
MSP430F425 Device Erratasheet Describes the known exceptions to the functional specifications for
each silicon revision of this device.
MSP430F423 Device Erratasheet Describes the known exceptions to the functional specifications for
each silicon revision of this device.
User's Guides
MSP430x4xx Family User's Guide Detailed description of all modules and peripherals available in this
device family.
Code Composer Studio v6.1 for MSP430 User's Guide This manual describes the use of TI Code
Composer Studio IDE v6.1 (CCS v6.1) with the MSP430 ultra-low-power microcontrollers.
This document applies only for the Windows® version of the Code Composer Studio IDE.
The Linux® version is similar and, therefore, is not described separately.
IAR Embedded Workbench Version 3+ for MSP430 User's Guide This manual describes the use of
IAR Embedded Workbench (EW430) with the MSP430 ultra-low-power microcontrollers.
Device and Documentation Support
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MSP430 Programming With the Bootloader (BSL) The MSP430 bootloader (BSL, formerly known as
the bootstrap loader) allows users to communicate with embedded memory in the MSP430
microcontroller during the prototyping phase, final production, and in service. Both the
programmable memory (flash memory) and the data memory (RAM) can be modified as
required.
MSP430 Programming With the JTAG Interface This document describes the functions that are
required to erase, program, and verify the memory module of the MSP430 flash-based and
FRAM-based microcontroller families using the JTAG communication port. In addition, it
describes how to program the JTAG access security fuse that is available on all MSP430
devices. This document describes device access using both the standard 4-wire JTAG
interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
MSP430 Hardware Tools User's Guide This manual describes the hardware of the TI MSP-FET430
Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultralow-power microcontroller. Both available interface types, the parallel port interface and the
USB interface, are described.
Application Reports
MSP430 32-kHz Crystal Oscillators Selection of the right crystal, correct load circuit, and proper board
layout are important for a stable crystal oscillator. This application report summarizes crystal
oscillator function and explains the parameters to select the correct crystal for MSP430 ultralow-power operation. In addition, hints and examples for correct board layout are given. The
document also contains detailed information on the possible oscillator tests to ensure stable
oscillator operation in mass production.
MSP430 System-Level ESD Considerations System-Level ESD has become increasingly demanding
with silicon technology scaling towards lower voltages and the need for designing costeffective and ultra-low-power components. This application report addresses three different
ESD topics to help board designers and OEMs understand and design robust system-level
designs.
Designing With MSP430 and Segment LCDs Segment liquid crystal displays (LCDs) are needed to
provide information to users in a wide variety of applications from smart meters to electronic
shelf labels (ESL) to medical equipment. Several MSP430™ microcontroller families include
built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the
segmented LCD glass. This application note helps explain how segmented LCDs work, the
different features of the various LCD modules across the MSP430 MCU family, LCD
hardware layout tips, guidance on writing efficient and easy-to-use LCD driver software, and
an overview of the portfolio of MSP430 devices that include different LCD features to aid in
device selection.
Understanding MSP430 Flash Data Retention The MSP430 family of microcontrollers, as part of its
broad portfolio, offers both read-only memory (ROM)-based and flash-based devices.
Understanding the MSP430 flash is extremely important for efficient, robust, and reliable
system design. Data retention is one of the key aspects to flash reliability. In this application
report, data retention for the MSP430 flash is discussed in detail and the effect of
temperature is given primary importance.
Interfacing the 3-V MSP430 to 5-V Circuits The interfacing of the 3-V MSP430x1xx and MSP430x4xx
microcontroller families to circuits with a supply of 5 V or higher is shown. Input, output, and
I/O interfaces are given and explained. Worse-case design equations are provided, where
necessary. Some simple power supplies generating both voltages are shown, too.
Efficient Multiplication and Division Using MSP430 Multiplication and division in the absence of a
hardware multiplier require many instruction cycles, especially in C. This report discusses a
method that does not need a hardware multiplier and can perform multiplication and division
with only shift and add instructions. The method described in this application report is based
on Horner's method.
50
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7.5
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Related Links
Table 7-2 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7-2. Related Links
7.6
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MSP430F427
Click here
Click here
Click here
Click here
Click here
MSP430F425
Click here
Click here
Click here
Click here
Click here
MSP430F423
Click here
Click here
Click here
Click here
Click here
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
7.7
Trademarks
MSP430, ULP Advisor, Code Composer Studio, E2E are trademarks of Texas Instruments.
Linux is a registered trademark of Linus Torvalds.
Windows is a registered trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
7.8
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.9
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
7.10 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
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8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
52
Mechanical, Packaging, and Orderable Information
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430A090IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F425
MSP430A092IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F427
MSP430A154IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F427
MSP430F423IPM
NRND
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F423
MSP430F423IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F423
MSP430F425IPM
NRND
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F425
MSP430F425IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F425
MSP430F427IPM
NRND
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F427
MSP430F427IPMR
NRND
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F427
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Aug-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430F423IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
MSP430F425IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
MSP430F427IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Aug-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F423IPMR
LQFP
PM
64
1000
336.6
336.6
41.3
MSP430F425IPMR
LQFP
PM
64
1000
336.6
336.6
41.3
MSP430F427IPMR
LQFP
PM
64
1000
336.6
336.6
41.3
Pack Materials-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
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