MC10SX1190 Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit Description The MC10SX1190 is a differential receiver, differential transmitter specifically designed to drive coaxial cables. It incorporates the output cable drive capability of the MC10EP89 Coaxial Cable Driver with additional circuitry to multiplex the output cable drive source between the cable receiver or the local transmitter inputs. The multiplexer control circuitry is TTL compatible for ease of operation. The MC10SX1190 is useful as a bypass element for Fibre Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture (SSA) applications, to create loop style interconnects with fault tolerant, active switches at each device node. This device is particularly useful for back panel applications where small size is desirable. The EP89 style drive circuitry produces swings approximately 70% larger than a standard PECL output. When driving a coaxial cable, proper termination is required at both ends of the line to minimize reflections. The 1.4 V output swings allow for proper termination at both ends of the cable, while maintaining the required swing at the receiving end of the cable. Because of the larger output swings, the QT, QT outputs are terminated into the thevenin equivalent of 50 W to VCC − 3.0 V instead of 50 W to VCC − 2.0 V. • • • MARKING DIAGRAM 10SX 1190 ALYWG G TSSOP−20 DT SUFFIX CASE 948E A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. PIN DESCRIPTION Features • • • • http://onsemi.com PIN 2.5 Gb/s Operation 425 ps Propagation Delay 1.4 V Output Swing on the Cable Driving Output Single Positive SUpply Operation Ranges: VCC = 3.0 V to 3.6 V, VEE = 0 V VCC = 4.5 V to 5.5 V, VEE = 0 V 75 kW Internal Input Pull Down Resistors ESD Protection: 2000 V Human Body Model, >100 V Machine Model These are Pb−Free Devices* VCC VCC QR QR VEE DT DT VCC VBB VEE 20 19 18 17 16 15 14 13 12 11 FUNCTION DR/DR ECL Diff. Inputs from Receive Cable QR/QR ECL Buffered Differential Outputs from Receive Cable DT/DT ECL Differential Input to Transmit Cable QT/QT ECL Buffered Differential Output to Transmit Cable SEL TTL Multiplexer Control Signal VBB Reference Voltage Output VCC ECL Positive Supply VEE ECL Negative, 0 Supply TRUTH TABLE 1 2 3 4 5 6 7 VEE DR DR VCC VCC QT QT 8 VEE 9 SEL 10 VCC Figure 1. 20-Lead TSSOP Pinout: (Top View) SEL Function L H DR → QT DT → QT ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 January, 2006 − Rev. 3 1 Publication Order Number: MC10SX1190/D MC10SX1190 LOCAL RECEIVE DATA (ECL LEVELS) QR QR DR DR FROM INPUT CABLE (ECL LEVELS) VBB LOCAL TRANSMIT DATA (ECL LEVELS) 1 DT DT QT QT 0 TO OUTPUT CABLE (ENHANCED SWING) SEL (TTL) Figure 2. Logic Diagram Table 1. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCC Power Supply Voltage (VEE = 0 V) 0 to +6.0 Vdc VEE Power Supply Voltage (VCC = 0 V) −6.0 to 0 Vdc VIN Input Voltage (VEE = 0 V, VIN not more positive than VCC) 0 to +6.0 Vdc VIN Input Voltage (VCC = 0 V, VIN not more negative than VEE) −6.0 to 0 Vdc IOUT Output Current Continuous Surge 50 100 mA qJA Thermal Resistance (Junction−to−Ambient) Still Air 500 lfpm 90 60 °C/W qJC Thermal Resistance (Junction−to−Case) 30 to 35 °C/W TA Operating Temperature Range −40 to +85 °C TSTG Storage Temperature Range −50 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 2 MC10SX1190 Table 2. DC CHARACTERISTICS (VCC = 3.3 V, VEE = 0 V) (Note 1) -40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit VOH Output Voltage High (QR,QR) (Note 2) 2.22 2.35 2.52 2.27 2.39 2.57 2.30 2.40 2.60 V VOL Output Voltage Low (QR,QR) (Note 2) 1.35 1.54 1.65 1.37 1.57 1.67 1.40 1.57 1.71 V VOH Output Voltage High (QT,QT) (Note 3) 2.13 2.29 2.40 2.18 2.33 2.46 2.20 2.34 2.48 V VOL Output Voltage Low (QT,QT) (Note 3) 0.50 0.67 1.10 0.48 0.64 1.06 0.44 0.63 1.06 V ICC Quiescent Supply Current (Note 4) 30 60 90 30 60 90 30 60 90 mA VIH Input Voltage High 2070 2410 2170 2490 2240 2580 mV VIL Input Voltage Low 1350 1800 1350 1820 1350 1860 mV VIH Input Voltage High SEL (Note 5) VIL Input Voltage Low SEL (Note 5) VBB Output Reference Voltage (Note 1) 2.0 2.0 2.0 0.8 1.80 1.90 2.05 V 0.8 1.80 1.90 2.05 1.85 1.95 0.8 V 2.05 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters will track 1:1 VCC. VEE can vary +0.3 V to −0.3 V. 2. QR outputs loaded with 50 W to VCC − 2.0 V 3. QT outputs loaded with 50 W to VCC − 3.0 V 4. Outputs open circuited. 5. TTL signal threshold is 1.5 V above VEE. Table 3. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V) (Note 6) -40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit VOH Output Voltage High (QR,QR) (Note 7) 3.92 4.05 4.22 3.97 4.09 4.27 4.0 4.10 4.30 V VOL Output Voltage Low (QR,QR) (Note 7) 3.05 3.24 3.35 3.07 3.27 3.37 3.10 3.27 3.41 V VOH Output Voltage High (QT,QT) (Note 8) 3.83 3.99 4.11 3.88 4.03 4.16 3.90 4.04 4.18 V VOL Output Voltage Low (QT,QT) (Note 8) 1.90 2.14 2.50 1.85 2.09 2.45 1.85 2.08 2.45 V ICC Quiescent Supply Current (Note 9) 30 60 90 30 60 90 30 60 90 mA VIH Input Voltage High 3770 4110 3870 4190 3940 4280 mV VIL Input Voltage Low 3050 3500 3050 3520 3050 3560 mV VIH Input Voltage High SEL (Note 10) VIL Input Voltage Low SEL (Note 10) VBB Output Reference Voltage (Note 6) IIL Input High Current IIH Input LOW Current 2.0 2.0 2.0 0.8 3.50 3.60 3.75 0.8 3.50 150 0.5 V 3.60 3.75 3.55 150 0.5 0.5 3.65 0.8 V 3.75 V 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters will track 1:1 VCC. VEE can vary +0.5 V to −0.5 V. 7. QR outputs loaded with 50 W to VCC − 2.0 V 8. QT outputs loaded with 50 W to VCC − 3.0 V 9. Outputs open circuited. 10. TTL signal threshold is 1.5 V above VEE. http://onsemi.com 3 MC10SX1190 Table 4. AC CHARACTERISTICS (VCC = 3.0 V to 5.5 V, VEE = 0 V) (Note 11) −40°C Symbol tpd Characteristic Propagation Delay−to−Output 25°C to 85°C Min Typ Max Min Typ Max Unit DR → QR (Diff) (Notes 12 and 13) 140 240 340 180 280 380 ps DR → QT (Diff) 300 400 500 350 470 650 DT → QT (Diff) 280 380 480 350 440 650 SEL → QT,QT 400 700 1000 400 700 1000 ps tPLH, tPHL Propagation Delay (1.5 V to 50% Pt) tr, tf Rise Time (20% to 80%) Fall Time (80% to 20%) QR,QR 70 140 200 90 155 250 ps tr, tf Rise Time (20% to 80%) Fall Time 80% to 20% QT,QT 150 200 280 150 230 230 500 ps tskew Within Device Skew (Note 14) VPP Input Swing (Differential Configuration) 200 1000 200 1000 mV VCMR Common Mode Range (Note 15) 3.0 4.35 3.0 4.35 V fmax Maximum Operation Frequency 2.5 15 15 2.5 ps Gb/s NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. VEE can vary +0.3 V to −0.3 V 12. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 13. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 14. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device. 15. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V. http://onsemi.com 4 MC10SX1190 VEE Rpd ZO QT Rt ZO QT Rpd VEE VEE SX1190 Rpd ZO QR Rt ZO QR Rpd Rt = ZO VEE Typical value for Rpd is 160 W to 260 W, depending on the application. The minimum value of Rpd should not be less than 50 W. VTT1 Rt ZO QT ZO QT Rt VTT1 = VCC − 3 V Rt VTT2 = VCC − 2 V VTT1 VTT2 SX1190 ZO QR ZO QR Rt VTT2 Rt = ZO/2 Figure 3. SX1190 Termination Configuration ORDERING INFORMATION Package Shipping † MC10SX1190DT TSSOP−20* 75 Units / Rail MC10SX1190DTG TSSOP−20* 75 Units / Rail MC10SX1190DTR2 TSSOP−20* 2500 / Tape & Reel MC10SX1190DTR2G TSSOP−20* 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 5 MC10SX1190 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX PLASTIC PACKAGE CASE 948E−02 ISSUE B 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V S K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ 11 J J1 B −U− PIN 1 IDENT SECTION N−N 1 10 0.25 (0.010) N 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− N F DETAIL E −W− C D G H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ PLANE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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