ON MC10SX1190 Fibre channel coaxial cable driver and loop resiliency circuit Datasheet

MC10SX1190
Fibre Channel Coaxial
Cable Driver and Loop
Resiliency Circuit
Description
The MC10SX1190 is a differential receiver, differential transmitter
specifically designed to drive coaxial cables. It incorporates the output
cable drive capability of the MC10EP89 Coaxial Cable Driver with
additional circuitry to multiplex the output cable drive source between
the cable receiver or the local transmitter inputs. The multiplexer
control circuitry is TTL compatible for ease of operation.
The MC10SX1190 is useful as a bypass element for Fibre
Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture
(SSA) applications, to create loop style interconnects with fault
tolerant, active switches at each device node. This device is
particularly useful for back panel applications where small size is
desirable.
The EP89 style drive circuitry produces swings approximately 70%
larger than a standard PECL output. When driving a coaxial cable,
proper termination is required at both ends of the line to minimize
reflections. The 1.4 V output swings allow for proper termination at
both ends of the cable, while maintaining the required swing at the
receiving end of the cable. Because of the larger output swings, the
QT, QT outputs are terminated into the thevenin equivalent of 50 W to
VCC − 3.0 V instead of 50 W to VCC − 2.0 V.
•
•
•
MARKING
DIAGRAM
10SX
1190
ALYWG
G
TSSOP−20
DT SUFFIX
CASE 948E
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
PIN DESCRIPTION
Features
•
•
•
•
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PIN
2.5 Gb/s Operation
425 ps Propagation Delay
1.4 V Output Swing on the Cable Driving Output
Single Positive SUpply Operation Ranges:
VCC = 3.0 V to 3.6 V, VEE = 0 V
VCC = 4.5 V to 5.5 V, VEE = 0 V
75 kW Internal Input Pull Down Resistors
ESD Protection: 2000 V Human Body Model,
>100 V Machine Model
These are Pb−Free Devices*
VCC
VCC
QR
QR
VEE
DT
DT
VCC
VBB
VEE
20
19
18
17
16
15
14
13
12
11
FUNCTION
DR/DR
ECL Diff. Inputs from Receive Cable
QR/QR
ECL Buffered Differential Outputs from
Receive Cable
DT/DT
ECL Differential Input to Transmit Cable
QT/QT
ECL Buffered Differential Output to
Transmit Cable
SEL
TTL Multiplexer Control Signal
VBB
Reference Voltage Output
VCC
ECL Positive Supply
VEE
ECL Negative, 0 Supply
TRUTH TABLE
1
2
3
4
5
6
7
VEE
DR
DR
VCC
VCC
QT
QT
8
VEE
9
SEL
10
VCC
Figure 1. 20-Lead TSSOP Pinout: (Top View)
SEL
Function
L
H
DR → QT
DT → QT
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 3
1
Publication Order Number:
MC10SX1190/D
MC10SX1190
LOCAL
RECEIVE DATA
(ECL LEVELS)
QR
QR
DR
DR
FROM
INPUT CABLE
(ECL LEVELS)
VBB
LOCAL
TRANSMIT DATA
(ECL LEVELS)
1
DT
DT
QT
QT
0
TO OUTPUT
CABLE
(ENHANCED SWING)
SEL (TTL)
Figure 2. Logic Diagram
Table 1. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
Power Supply Voltage (VEE = 0 V)
0 to +6.0
Vdc
VEE
Power Supply Voltage (VCC = 0 V)
−6.0 to 0
Vdc
VIN
Input Voltage (VEE = 0 V, VIN not more positive than VCC)
0 to +6.0
Vdc
VIN
Input Voltage (VCC = 0 V, VIN not more negative than VEE)
−6.0 to 0
Vdc
IOUT
Output Current
Continuous
Surge
50
100
mA
qJA
Thermal Resistance (Junction−to−Ambient)
Still Air
500 lfpm
90
60
°C/W
qJC
Thermal Resistance (Junction−to−Case)
30 to 35
°C/W
TA
Operating Temperature Range
−40 to +85
°C
TSTG
Storage Temperature Range
−50 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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MC10SX1190
Table 2. DC CHARACTERISTICS (VCC = 3.3 V, VEE = 0 V) (Note 1)
-40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VOH
Output Voltage High (QR,QR) (Note 2)
2.22
2.35
2.52
2.27
2.39
2.57
2.30
2.40
2.60
V
VOL
Output Voltage Low (QR,QR) (Note 2)
1.35
1.54
1.65
1.37
1.57
1.67
1.40
1.57
1.71
V
VOH
Output Voltage High (QT,QT) (Note 3)
2.13
2.29
2.40
2.18
2.33
2.46
2.20
2.34
2.48
V
VOL
Output Voltage Low (QT,QT) (Note 3)
0.50
0.67
1.10
0.48
0.64
1.06
0.44
0.63
1.06
V
ICC
Quiescent Supply Current (Note 4)
30
60
90
30
60
90
30
60
90
mA
VIH
Input Voltage High
2070
2410
2170
2490
2240
2580
mV
VIL
Input Voltage Low
1350
1800
1350
1820
1350
1860
mV
VIH
Input Voltage High SEL (Note 5)
VIL
Input Voltage Low SEL (Note 5)
VBB
Output Reference Voltage (Note 1)
2.0
2.0
2.0
0.8
1.80
1.90
2.05
V
0.8
1.80
1.90
2.05
1.85
1.95
0.8
V
2.05
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters will track 1:1 VCC. VEE can vary +0.3 V to −0.3 V.
2. QR outputs loaded with 50 W to VCC − 2.0 V
3. QT outputs loaded with 50 W to VCC − 3.0 V
4. Outputs open circuited.
5. TTL signal threshold is 1.5 V above VEE.
Table 3. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V) (Note 6)
-40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VOH
Output Voltage High (QR,QR) (Note 7)
3.92
4.05
4.22
3.97
4.09
4.27
4.0
4.10
4.30
V
VOL
Output Voltage Low (QR,QR) (Note 7)
3.05
3.24
3.35
3.07
3.27
3.37
3.10
3.27
3.41
V
VOH
Output Voltage High (QT,QT) (Note 8)
3.83
3.99
4.11
3.88
4.03
4.16
3.90
4.04
4.18
V
VOL
Output Voltage Low (QT,QT) (Note 8)
1.90
2.14
2.50
1.85
2.09
2.45
1.85
2.08
2.45
V
ICC
Quiescent Supply Current (Note 9)
30
60
90
30
60
90
30
60
90
mA
VIH
Input Voltage High
3770
4110
3870
4190
3940
4280
mV
VIL
Input Voltage Low
3050
3500
3050
3520
3050
3560
mV
VIH
Input Voltage High SEL (Note 10)
VIL
Input Voltage Low SEL (Note 10)
VBB
Output Reference Voltage (Note 6)
IIL
Input High Current
IIH
Input LOW Current
2.0
2.0
2.0
0.8
3.50
3.60
3.75
0.8
3.50
150
0.5
V
3.60
3.75
3.55
150
0.5
0.5
3.65
0.8
V
3.75
V
150
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters will track 1:1 VCC. VEE can vary +0.5 V to −0.5 V.
7. QR outputs loaded with 50 W to VCC − 2.0 V
8. QT outputs loaded with 50 W to VCC − 3.0 V
9. Outputs open circuited.
10. TTL signal threshold is 1.5 V above VEE.
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MC10SX1190
Table 4. AC CHARACTERISTICS (VCC = 3.0 V to 5.5 V, VEE = 0 V) (Note 11)
−40°C
Symbol
tpd
Characteristic
Propagation Delay−to−Output
25°C to 85°C
Min
Typ
Max
Min
Typ
Max
Unit
DR → QR (Diff) (Notes 12 and 13)
140
240
340
180
280
380
ps
DR → QT (Diff)
300
400
500
350
470
650
DT → QT (Diff)
280
380
480
350
440
650
SEL → QT,QT
400
700
1000
400
700
1000
ps
tPLH,
tPHL
Propagation Delay
(1.5 V to 50% Pt)
tr,
tf
Rise Time (20% to 80%)
Fall Time (80% to 20%)
QR,QR
70
140
200
90
155
250
ps
tr,
tf
Rise Time (20% to 80%)
Fall Time 80% to 20%
QT,QT
150
200
280
150
230
230
500
ps
tskew
Within Device Skew (Note 14)
VPP
Input Swing (Differential Configuration)
200
1000
200
1000
mV
VCMR
Common Mode Range (Note 15)
3.0
4.35
3.0
4.35
V
fmax
Maximum Operation Frequency
2.5
15
15
2.5
ps
Gb/s
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. VEE can vary +0.3 V to −0.3 V
12. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals.
13. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
14. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device.
15. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls
within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V.
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4
MC10SX1190
VEE
Rpd
ZO
QT
Rt
ZO
QT
Rpd
VEE
VEE
SX1190
Rpd
ZO
QR
Rt
ZO
QR
Rpd
Rt = ZO
VEE
Typical value for Rpd is 160 W to 260 W, depending on the application. The minimum value of Rpd should not be less than 50 W.
VTT1
Rt
ZO
QT
ZO
QT
Rt
VTT1 = VCC − 3 V
Rt
VTT2 = VCC − 2 V
VTT1
VTT2
SX1190
ZO
QR
ZO
QR
Rt
VTT2
Rt = ZO/2
Figure 3. SX1190 Termination Configuration
ORDERING INFORMATION
Package
Shipping †
MC10SX1190DT
TSSOP−20*
75 Units / Rail
MC10SX1190DTG
TSSOP−20*
75 Units / Rail
MC10SX1190DTR2
TSSOP−20*
2500 / Tape & Reel
MC10SX1190DTR2G
TSSOP−20*
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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MC10SX1190
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
PLASTIC PACKAGE
CASE 948E−02
ISSUE B
20X
0.15 (0.006) T U
2X
L
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
S
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
11
J J1
B
−U−
PIN 1
IDENT
SECTION N−N
1
10
0.25 (0.010)
N
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN
FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
M
A
−V−
N
F
DETAIL E
−W−
C
D
G
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
−−− 0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
PLANE
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MC10SX1190/D
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