Freescale MPXC2012DT1 High volume sensor for low pressure application Datasheet

Freescale Semiconductor
Technical Data
MPXC2011DT1
Rev 5, 10/2006
High Volume Sensor for Low
Pressure Applications
MPXC2011DT1
MPXC2012DT1
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer. This new
chip carrier package uses Freescale Semiconductor's unique sensor die with its
piezoresistive technology, along with the added feature of on-chip, thin-film
temperature compensation and calibration.
PRESSURE SENSORS
0 to 75 mm HG
(0 TO 10 kPA
NOTE: Freescale Semiconductor is also offering the Chip Pak package in
application-specific configurations, which will have an “SPX” prefix,
followed by a four-digit number, unique to the specific customer
CHIP PAK PACKAGE
Features
•
•
•
•
•
Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
Provided in Easy-to-Use Tape and Reel
MPXC2011DT1/MPXC2012DT1
CASE 423A-03
Typical Applications
•
•
•
•
PIN NUMBER
Respiratory Diagnostics
Air Movement Control
Controllers
Pressure Switching
1
GND
3
VS
2
S+
4
S-
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak
(pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's
housing. Use caution when handling the devices during all processes.
Freescale Semiconductor's MPXC2011DT1/ MPXC2012DT1 Pressure Sensor has been designed for medical usage by
combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically
approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used
with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The
portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including:
tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP.
The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a
nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of
the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the
corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing,
as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure
transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance
of the sensor.
The MPXC2012DT1 is a no-gel option.
ORDERING INFORMATION
Device Order No.
Case No.
Device Description
Device Marking
MPXC2011DT1
423A
Chip Pak, 1/3 Gel
Date Code, Lot ID
MPXC2012DT1
423A
Chip Pak, No Gel
Date Code, Lot ID
Reel Size
Tape Width
Quantity
330 mm
24 mm
1000 pc/reel
Packaging Information
Tape and Reel
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (Backside)
Pmax
75
kPa
Storage Temperature
Tstg
-25 to +85
°C
Operating Temperature
TA
+15 to +40
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
10
kPa
Supply Voltage(2)
VS
—
3
10
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
24
25
26
mV
Voff
-1.0
—
1.0
mV
Sensitivity
∆V/∆P
—
2.5
—
mV/kPa
Linearity(5)
—
-1.0
—
1.0
%VFSS
Pressure Hysteresis(5) (0 to 10 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5) (+15°C to +40°C)
—
—
±0.1
—
%VFSS
TCVFSS
-1.0
—
1.0
%VFSS
TCVoff
-1.0
—
1.0
mV
Input Impedance
Zin
1300
—
2550
W
Output Impedance
Zout
1400
—
3000
W
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up
—
—
20
v
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Full Scale Span(3)
Offset(4)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXC2011DT1
2
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
A
M
C
L
F
N
B
1 2 3
4
V
K
DETAIL A
-T-
D1
G
J
H
FRONT VIEW
E
END VIEW
AC
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
AA
AB
AD
D2
DETAIL A
BACK VIEW
DIM
A
B
C
D1
D2
E
F
G
H
J
K
L
M
N
V
AA
AB
AC
AD
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.240
0.260
6.10
6.60
0.350
0.370
8.89
9.40
0.140
0.150
3.56
3.81
0.012
0.020
0.30
0.51
0.014
0.022
0.36
0.56
0.088
0.102
2.24
2.59
0.123
0.128
3.12
3.25
0.045
0.055
1.14
1.40
0.037
0.047
0.94
1.19
0.007
0.011
0.18
0.28
0.120
0.140
3.05
3.56
0.095
0.105
2.41
2.67
0.165
0.175
4.19
4.45
0.223
0.239
5.66
6.07
0.105
0.115
2.67
2.92
0.095
0.107
2.41
2.72
0.015
0.035
0.38
0.89
0.120
0.175
3.05
4.45
0.100
0.115
2.54
2.92
CASE 423A-03
ISSUE C
CHIP PAK PACKAGE
MPXC2011DT1
Sensors
Freescale Semiconductor
3
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MPXC2011DT1
Rev. 5
10/2006
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