SPANSION MBM29LV320BE10PBT Flash memory Datasheet

MBM29LV320TE80/90/10/
MBM29LV320BE80/90/10
80/90/10
90/10
Data Sheet (Retired Product)
MBM29LV320TE
80/
/MBM29LV320BE
Cover Sheet
This product has been retired and is not recommended for new designs. Availability of this document is retained for reference
and historical purposes only.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been
made are the result of normal data sheet improvement and are noted in the document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number MBM29LV320TE/BE
Revision DS05-20894-5E
Issue Date July 31, 2007
Data
Sheet
(R etired
Produ ct)
This page left intentionally blank.
2
MBM29LV320TE/BE_DS05-20894-5E July 31, 2007
SPANSION
TM
Flash Memory
Data Sheet
September 2003
TM
This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,
these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a SPANSION TM product. Future routine
revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about SPANSION
solutions.
TM
memory
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-20894-5E
FLASH MEMORY
CMOS
32 M (4 M × 8/2 M × 16) BIT
MBM29LV320TE 80/90/10
MBM29LV320BE80/90/10
■ DESCRIPTION
The MBM29LV320TE/BE is 32 M-bit, 3.0 V-only Flash memory organized as 4 M bytes of 8 bits each or 2 M words
of 16 bits each. The device is offered in a 48-pin TSOP (1) and 63-ball FBGA packages. This device is designed
to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required
for write or erase operations. The device can also be reprogrammed in standard EPROM programmers.
The standard device offers access times 80 ns, 90 ns and 100 ns, allowing operation of high-speed microprocessors without wait state. To eliminate bus contention the device has separate chip enable(CE), write enable(WE)
and output enable (OE) controls.
(Continued)
■ PRODUCT LINE UP
MBM29LV320TE/BE
Part No.
80
90
V
VCC = 3.3 V +0.3
−0.3 V
Power Supply Voltage (V)
100
V
VCC = 3.0 V +0.6
−0.3 V
Max Address Access Time (ns)
80
90
100
Max CE Access Time (ns)
80
90
100
Max OE Access Time (ns)
30
35
35
■ PACKAGES
48-pin plastic TSOP (1)
48-pin plastic TSOP (1)
63-ball plastic FBGA
Marking Side
Marking Side
(FPT-48P-M19)
(FPT-48P-M20)
(Continued)
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(BGA-63P-M01)
MBM29LV320TE/BE80/90/10
The device is pin and command set compatible with JEDEC standard E2PROMs. Commands are written to the
command register using standard microprocessor write timings. Register contents serve as input to an internal
state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses
and data needed for the programming and erase operations. Reading data out of the device is similar to reading
from 5.0 V and 12.0 V Flash or EPROM devices.
The device is programmed by executing the program command sequence. This invokes the Embedded Program
Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper
cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished
by executing the erase command sequence. This invokes the Embedded Erase Algorithm which is an internal
algorithm that automatically preprograms the array if it is not already programmed before executing the erase
operation. During erase, the device automatically time the erase pulse widths and verify proper cell margin.
A sector is Typically erased and verified in 1.0 second. (If already completely preprogrammed.)
The device also features a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The device is erased when shipped from the factory.
The device features single 3.0 V power supply operation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low VCC detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7,
by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle is completed,
the device internally resets to the read mode.
The device also has a hardware RESET pin. When this pin is driven low, execution of any Embedded Program
Algorithm or Embedded Erase Algorithm is terminated. The internal state machine is then reset to the read
mode. The RESET pin may be tied to the system reset circuitry. Therefore, if a system reset occurs during the
Embedded Program Algorithm or Embedded Erase Algorithm, the device is automatically reset to the read mode
and will have erroneous data stored in the address locations being programmed or erased. These locations
need re-writing after the reset. Resetting the device enables the system’s microprocessor to read the boot-up
firmware from the Flash memory.
Fujitsu Flash technology combines years of EPROM and E2PROM experience to produce the highest levels of
quality, reliability, and cost effectiveness. The device memory electrically erase the entire chip or all bits within
a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a
time using the EPROM programming mechanism of hot electron injection.
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MBM29LV320TE/BE80/90/10
■ FEATURES
• 0.23 μm Process Technology
• Single 3.0 V Read, Program, and Erase
Minimized system level power requirements
• Compatible with JEDEC-standard Commands
Use the same software commands as E2PROMs
• Compatible with JEDEC-standard Worldwide Pinouts
48-pin TSOP (1) (Package suffix : TN − Normal Bend Type, TR − Reversed Bend Type)
63-ball FBGA (Package suffix : PBT)
• Minimum 100,000 Program/Erase Cycles
• High Performance
80 ns maximum access time
• Sector Erase Architecture
Eight 4 K word and sixty-three 32 K word sectors in word mode
Eight 8 K byte and sixty-three 64 K byte sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase.
• Boot Code Sector Architecture
T = Top sector
B = Bottom sector
• HiddenROM Region
256 byte of HiddenROM, accessible through a new “HiddenROM Enable” command sequence
Factory serialized and protected to provide a secure electronic serial number (ESN)
• WP/ACC Input Pin
At VIL, allows protection of boot sectors, regardless of sector protection/unprotection status
At VACC, increases program performance
• Embedded EraseTM* Algorithms
Automatically pre-programs and erases the chip or any sector
• Embedded ProgramTM* Algorithms
Automatically writes and verifies data at specified address
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion
• Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
• Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode.
• Low VCC write inhibit ≤ 2.5 V
• Erase Suspend/Resume
Suspends the erase operation to allow a read data and/or program in another sector within the same device
• Sector group protection
Hardware method disables any combination of sector groups from program or erase operations
• Sector Group Protection Set function by Extended sector group protection command
• Fast Programming Function by Extended Command
• Temporary sector group unprotection
Temporary sector group unprotection via the RESET pin.
• In accordance with CFI (Common Flash Memory Interface)
*: Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
6
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■ PIN ASSIGNMENTS
TSOP (1)
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE
RESET
N.C.
WP/ACC
RY/BY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(Marking Side)
MBM29LV320TE/BE
Normal Bend
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE
VSS
CE
A0
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
A0
CE
VSS
OE
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
VCC
DQ4
DQ12
DQ5
DQ13
DQ6
DQ14
DQ7
DQ15/A-1
VSS
BYTE
A16
(FPT-48P-M19)
A1
A2
A3
A4
A5
A6
A7
A17
A18
RY/BY
WP/ACC
N.C.
RESET
WE
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
(Marking Side)
MBM29LV320TE/BE
Reverse Bend
(FPT-48P-M20)
(Continued)
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MBM29LV320TE/BE80/90/10
(Continued)
FBGA
(TOP VIEW)
Marking Side
A8
B8
L8
M8
N.C.
N.C.
N.C.
N.C.
A7
B7
C7
D7
E7
F7
G7
L7
M7
N.C.
N.C.
A13
A12
A14
A15
A16
N.C.
N.C.
C6
D6
E6
F6
G6
A9
A8
A10
A11
DQ7 DQ14 DQ13 DQ6
C5
D5
E5
F5
G5
A19
DQ5 DQ12
WE RESET N.C.
C4
D4
RY/BY WP/
ACC
H7
J7
K7
BYTE DQ15/ VSS
A-1
H6
H5
H4
J6
K6
J5
K5
VCC
DQ4
J4
K4
E4
F4
G4
A18
A20
DQ2 DQ10 DQ11 DQ3
C3
D3
E3
F3
G3
H3
J3
K3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A2
C2
D2
E2
F2
G2
H2
J2
K2
L2
M2
N.C.
A3
A4
A2
A1
A0
CE
OE
VSS
N.C.
N.C.
A1
B1
L1
M1
N.C.
N.C.
N.C.
N.C.
(BGA-63P-M01)
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MBM29LV320TE/BE80/90/10
■ PIN DESCRIPTION
MBM29LV320 TE/BE Pin Configuration Table
Pin
Function
A20 to A0, A-1
Address Inputs
DQ15 to DQ0
Data Inputs/Outputs
CE
Chip Enable
OE
Output Enable
WE
Write Enable
RESET
Hardware Reset Pin/Temporary Sector Group Unprotection
RY/BY
Ready/Busy Output
BYTE
Selects 8-bit or 16-bit mode
WP/ACC
Hardware Write Protection/Program Acceleration
N.C.
No Internal Connection
VSS
Device Ground
VCC
Device Power Supply
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MBM29LV320TE/BE80/90/10
■ BLOCK DIAGRAM
RY/BY
Buffer
DQ15 to DQ0
RY/BY
VCC
VSS
WE
BYTE
Erase Voltage
Generator
Input/Output
Buffers
State
Control
RESET
WP/ACC
Command
Register
Program Voltage
Generator
Chip Enable
Output Enable
Logic
CE
STB
Data Latch
OE
Y-Decoder
STB
Timer for
Program/Erase
Low VCC Detector
Address
X-Decoder
Latch
A20 to A09
A-1
■ LOGIC SYMBOL
A-1
21
A20 to A0
16 or 8
DQ15 to DQ0
CE
OE
WE
RY/BY
RESET
BYTE
WP/ACC
10
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Y-Gating
Cell Matrix
MBM29LV320TE/BE80/90/10
■ DEVICE BUS OPERATION
MBM29LV320TE/BE User Bus Operations Table (BYTE = VIH)
Operation
CE OE WE
Auto-Select Manufacturer Code *1
A0
A1
A6
A9
DQ15 to
DQ0
RESET
WP/
ACC
L
L
H
L
L
L
VID
Code
H
X
Auto-Select Device Code *
L
L
H
H
L
L
VID
Code
H
X
Extended Auto-Select Device Code *1
L
L
H
H
H
L
VID
Code
H
X
Read *3
L
L
H
A0
A1
A6
A9
DOUT
H
X
Standby
H
X
X
X
X
X
X
High-Z
H
X
Output Disable
L
H
H
X
X
X
X
High-Z
H
X
Write (Program/Erase)
L
H
L
A0
A1
A6
A9
DIN
H
X
Enable Sector Group Protection *2, *4
L
VID
L
H
L
VID
X
H
X *6
Verify Sector Group Protection *2, *4
L
L
H
L
H
L
VID
Code
H
X *6
Temporary Sector Group Unprotection *5
X
X
X
X
X
X
X
X
VID
X *6
Reset (Hardware) /Standby
X
X
X
X
X
X
X
High-Z
L
X
Boot Block Sector Write Protection
X
X
X
X
X
X
X
X
X
L
1
Legend : L = VIL, H = VIH, X = VIL or VIH,
= Pulse input. See “■DC CHARACTERISTICS” for voltage levels.
*1: Manufacturer and device codes are accessed via a command register write sequence. See “MBM29LV320TE/
BE Command Definitions Table”.
*2: See the section on “7. Sector Group Protection” in ■FUNCTIONAL DESCRIPTION.
*3: WE can be VIL if OE is VIL, OE at VIH initiates the write operations.
*4: VCC = 3.3 V ± 10%
*5: Also used for the extended sector group protection.
*6: Conditional exceptions are to be noticed as follows: For MBM29LV320TE (SA22, 23) , WP/ACC = VIH.
For MBM29LV320BE (SA0, 1) , WP/ACC = VIH.
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MBM29LV320TE/BE80/90/10
MBM29LV320TE/BE User Bus Operations Table (BYTE = VIL)
Operation
CE
Auto-Select Manufacturer Code *1
OE WE
DQ15
/A-1
A0
A1
A6
A9
DQ7 to
DQ0
RESET
WP/
ACC
L
L
H
L
L
L
L
VID
Code
H
X
Auto-Select Device Code *
L
L
H
L
H
L
L
VID
Code
H
X
Extended Auto-Select Device Code *1
L
L
H
L
H
H
L
VID
Code
H
X
Read *3
L
L
H
A-1
A0
A1
A6
A9
DOUT
H
X
Standby
H
X
X
X
X
X
X
X
High-Z
H
X
Output Disable
L
H
H
X
X
X
X
X
High-Z
H
X
Write (Program/Erase)
L
H
L
A-1
A0
A1
A6
A9
DIN
H
X
Enable Sector Group Protection *2, *4
L
VID
L
L
H
L
VID
X
H
X *6
Verify Sector Group Protection *2, *4
L
L
H
L
L
H
L
VID
Code
H
X *6
Temporary Sector Group Unprotection *5 X
X
X
X
X
X
X
X
X
VID
X *6
Reset (Hardware) /Standby
X
X
X
X
X
X
X
X
High-Z
L
X
Boot Block Sector Write Protection
X
X
X
X
X
X
X
X
X
X
L
1
Legend : L = VIL, H = VIH, X = VIL or VIH,
= Pulse input. See “■DC CHARACTERISTICS” for voltage levels.
*1: Manufacturer and device codes may also be accessed via a command register write sequence. See
“MBM29LV320TE/BE Command Definitions Table”.
*2: See the section on “7. Sector Group Protection” in ■FUNCTIONAL DESCRIPTION.
*3: WE can be VIL if OE is VIL, OE at VIH initiates the write operations.
*4: VCC = 3.3 V ± 10%
*5: It is also used for the extended sector group protection.
*6: Conditional exceptions are to be noticed as follows: For MBM29LV320TE (SA22, 23) , WP/ACC = VIH.
For MBM29LV320BE (SA0, 1) , WP/ACC = VIH.
12
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MBM29LV320TE/BE80/90/10
MBM29LV320TE/BE Command Definitions Table
Second
Command
Sequence
First Bus
Third Bus
Bus
Bus
Write Write Cycle
Write Cycle
Write Cycle
Cycles
Req’d
Fourth Bus
Fifth Bus
Sixth Bus
Read/Write
Write Cycle Write Cycle
Cycle
Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data
Read/
Reset*6
Word
Read/
Reset*6
Word
Autoselect
Program
Chip Erase
Sector
Erase
Byte
Byte
Word
Byte
Word
Byte
Word
Byte
Word
Byte
1
3
3
4
6
6
XXXh F0h
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
AAh
AAh
AAh
AAh
AAh
⎯
2AAh
555h
2AAh
555h
2AAh
555h
2AAh
555h
2AAh
555h
⎯
⎯
55h
55h
55h
55h
55h
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
⎯
⎯
⎯
⎯
⎯
⎯
⎯
F0h
RA*7 RD*7
⎯
⎯
⎯
⎯
90h
IA*7
ID*7
⎯
⎯
⎯
⎯
A0h
PA
PD
⎯
⎯
⎯
⎯
80h
80h
555h
AAAh
555h
AAAh
AAh
AAh
2AAh
555h
2AAh
555h
55h
555h
AAAh
10h
55h
SA
30h
Erase Suspend
1
XXXh B0h
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Erase Resume
1
XXXh
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
20h
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Set to
Fast Mode
Word
Fast
Program*1
Word
Byte
Byte
3
2
Reset from Word
Fast Mode*1 Byte
2
Extended
Sector
Group
Protection*2
3
Query*3
555h
AAAh
XXXh
XXXh
XXXh
XXXh
30h
AAh
A0h
90h
2AAh
555h
PA
55h
PD
XXXh
*5
XXXh F0h
555h
AAAh
Word
XXXh
60h
SPA
60h
SPA
98h
⎯
⎯
⎯
40h SPA*7 SD*7
Byte
Word
Byte
1
HiddenROM Word
Entry
Byte
3
HiddenROM Word
Program*4
Byte
4
HiddenROM Word
Erase*4
Byte
6
HiddenROM Word
Exit*4
Byte
4
55h
AAh
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
AAh
AAh
AAh
AAh
2AAh
555h
2AAh
555h
2AAh
555h
2AAh
555h
55h
55h
55h
55h
555h
AAAh
555h
AAAh
555h
AAAh
555h
AAAh
⎯
⎯
⎯
⎯
⎯
⎯
⎯
88h
⎯
⎯
⎯
⎯
⎯
⎯
PD
⎯
⎯
⎯
⎯
55h
HRA
30h
⎯
⎯
⎯
A0h
80h
90h
(HRA)
PA
555h
AAAh
XXXh
AAh
00h
2AAh
555h
⎯
(Continued)
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MBM29LV320TE/BE80/90/10
(Continued)
*1 : This command is valid during Fast Mode.
*2 : This command is valid while RESET = VID.
*3 : The valid addresses are A6 to A0.
*4 : This command is valid during HiddenROM mode (except during HiddenROM mode).
*5 : The data "00h" is also acceptable.
*6 : Both of these reset commands are equivalent.
*7 : The fourth bus cycle is only for read.
Notes: • Address bits A20 to A11 = X = “H” or “L” for all address commands except or Program Address (PA) and
Sector Address (SA) .
• Bus operations are defined in “MBM29LV320TE/BE User Bus Operations Tables (BYTE = VIH and BYTE
= VIL)” .
• RA = Address of the memory location to be read
IA = Autoselect read address that sets both the bank address specified at (A19, A18, A17, A16, A15) and
all the other A6, A1, A0, (A-1) .
PA = Address of the memory location to be programmed
Addresses are latched on the falling edge of the write pulse.
SA = Address of the sector to be erased. The combination of A20, A19, A18, A17, A16, A15, A14, A13, and A12
will uniquely select any sector.
• RD = Data read from location RA during read operation.
ID = Device code/manufacture code for the address located by IA.
PD = Data to be programmed at location PA. Data is latched on the rising edge of write pulse.
• SPA = Sector group address to be protected. Set sector group address (SGA) and (A6, A1, A0) = (0, 1, 0).
SD = Sector group protection verify data. Output 01h at protected sector group addresses and
output 00h at unprotected sector group addresses.
• HRA = Address of the HiddenROM area
29LV320TE (Top Boot Type)
Word Mode : 1FFFE0h to 1FFFFFh
Byte Mode : 3FFFC0h to 3FFFFFh
29LV320BE (Bottom Boot Type) Word Mode : 000000h to 000040h
Byte Mode : 000000h to 000080h
• The system should generate the following address patterns :
Word Mode : 555h or 2AAh to addresses A10 to A0
Byte Mode : AAAh or 555h to addresses A10 to A0, and A-1
• Both Read/Reset commands are functionally equivalent, resetting the device to the read mode.
• The command combinations not described in “MBM29LV320TE/BE Command Definition Table” are
illegal.
14
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MBM29LV320TE/BE80/90/10
MBM29LV320TE/BE Sector Group Protection Verify Autoselect Codes Table
Type
A6
A1
A0
SA
VIL
VIL
VIL
SA
VIL
VIL
VIH
SA
VIL
VIL
VIH
SA
VIL
VIH
VIH
Sector Group
Addresses
VIL
VIH
VIL
Byte
Manufacture’s Code
Word
MBM29LV320TE
Device
Code
MBM29LV320BE
Extend
Device
Code
A20 to A12
Byte
Word
Byte
Word
Byte
MBM29LV320TE/BE
Word
Byte
Sector Group Protection
Word
A-1 *1
Code (HEX)
VIL
04h
X
0004h
VIL
F6h
X
22F6h
VIL
F9h
X
22F9h
VIL
19h
X
0019h
VIL
01h*2
X
0001h*2
*1 : A-1 is for byte mode. At byte mode, DQ14 to DQ8 are High-Z and DQ15 is A-1, the lowest address.
*2 : Outputs 01h at protected sector group addresses and outputs 00h at unprotected sector group addresses.
Extended Autoselect Code Table
Type
Code DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
(B)*
HZ
HZ
HZ
HZ
0
0
0
0
0
F6h
MBM29LV (B)*
320TE
(W) 22F6h
Device
Code
F9h
MBM29LV (B)*
320BE
(W) 22F9h
A-1
HZ
HZ
HZ
HZ
0
0
1
0
0
A-1
HZ
HZ
HZ
HZ
0
0
1
0
0
Extend
(B)*
19h
MBM29LV
Device
320TE/BE (W) 0019h
Code
A-1
HZ
HZ
HZ
HZ
0
0
0
0
0
HZ
HZ
HZ
HZ
0
0
0
0
Manufacturer’s
Code
Sector Group
Protection
04h A-1
(W) 0004h
(B)*
01h A-1
(W) 0001h
0
HZ HZ HZ
0
0
0
HZ HZ HZ
0
1
0
HZ HZ HZ
0
1
0
HZ HZ HZ
0
0
0
HZ HZ HZ
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
0
0
1
1
1
1
0
1
1
0
1
1
1
1
0
1
1
0
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
1
0
0
0
1
1
0
0
1
0
0
0
1
1
0
0
1
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
(B) : Byte mode
(W) : Word mode
HZ: High-Z
* : At byte mode, DQ14 to DQ8 are High-Z and DQ15 is A-1, the lowest address.
Retired Product
DS05-20894-5E_July 31, 2007
15
MBM29LV320TE/BE80/90/10
■ FLEXIBLE SECTOR-ERASE ARCHITECTURE
Sector Address Table (MBM29LV320TE)
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA0
0
0
0
0
0
0
X
X
X
X
64/32
000000h to 00FFFFh
000000h to 007FFFh
SA1
0
0
0
0
0
1
X
X
X
X
64/32
010000h to 01FFFFh
008000h to 00FFFFh
SA2
0
0
0
0
1
0
X
X
X
X
64/32
020000h to 02FFFFh
010000h to 017FFFh
SA3
0
0
0
0
1
1
X
X
X
X
64/32
030000h to 03FFFFh
018000h to 01FFFFh
SA4
0
0
0
1
0
0
X
X
X
X
64/32
040000h to 04FFFFh
020000h to 027FFFh
SA5
0
0
0
1
0
1
X
X
X
X
64/32
050000h to 05FFFFh
028000h to 02FFFFh
SA6
0
0
0
1
1
0
X
X
X
X
64/32
060000h to 06FFFFh
030000h to 037FFFh
SA7
0
0
0
1
1
1
X
X
X
X
64/32
070000h to 07FFFFh
038000h to 03FFFFh
SA8
0
0
1
0
0
0
X
X
X
X
64/32
080000h to 08FFFFh
040000h to 047FFFh
SA9
0
0
1
0
0
1
X
X
X
X
64/32
090000h to 09FFFFh
048000h to 04FFFFh
SA10
0
0
1
0
1
0
X
X
X
X
64/32
0A0000h to 0AFFFFh
050000h to 057FFFh
SA11
0
0
1
0
1
1
X
X
X
X
64/32
0B0000h to 0BFFFFh
058000h to 05FFFFh
SA12
0
0
1
1
0
0
X
X
X
X
64/32
0C0000h to 0CFFFFh
060000h to 067FFFh
SA13
0
0
1
1
0
1
X
X
X
X
64/32
0D0000h to 0DFFFFh
068000h to 06FFFFh
SA14
0
0
1
1
1
0
X
X
X
X
64/32
0E0000h to 0EFFFFh
070000h to 077FFFh
SA15
0
0
1
1
1
1
X
X
X
X
64/32
0F0000h to 0FFFFFh
078000h to 07FFFFh
SA16
0
1
0
0
0
0
X
X
X
X
64/32
100000h to 10FFFFh
080000h to 087FFFh
SA17
0
1
0
0
0
1
X
X
X
X
64/32
110000h to 11FFFFh
088000h to 08FFFFh
SA18
0
1
0
0
1
0
X
X
X
X
64/32
120000h to 12FFFFh
090000h to 097FFFh
SA19
0
1
0
0
1
1
X
X
X
X
64/32
130000h to 13FFFFh
098000h to 09FFFFh
SA20
0
1
0
1
0
0
X
X
X
X
64/32
140000h to 14FFFFh
0A0000h to 0A7FFFh
SA21
0
1
0
1
0
1
X
X
X
X
64/32
150000h to 15FFFFh
0A8000h to 0AFFFFh
SA22
0
1
0
1
1
0
X
X
X
X
64/32
160000h to 16FFFFh
0B0000h to 0B7FFFh
SA23
0
1
0
1
1
1
X
X
X
X
64/32
170000h to 17FFFFh
0B8000h to 0BFFFFh
SA24
0
1
1
0
0
0
X
X
X
X
64/32
180000h to 18FFFFh
0C0000h to 0C7FFFh
SA25
0
1
1
0
0
1
X
X
X
X
64/32
190000h to 19FFFFh
0C8000h to 0CFFFFh
SA26
0
1
1
0
1
0
X
X
X
X
64/32
1A0000h to 1AFFFFh
0D0000h to 0D7FFFh
SA27
0
1
1
0
1
1
X
X
X
X
64/32
1B0000h to 1BFFFFh
0D8000h to 0DFFFFh
SA28
0
1
1
1
0
0
X
X
X
X
64/32
1C0000h to 1CFFFFh
0E0000h to 0E7FFFh
SA29
0
1
1
1
0
1
X
X
X
X
64/32
1D0000h to 1DFFFFh
0E8000h to 0EFFFFh
SA30
0
1
1
1
1
0
X
X
X
X
64/32
1E0000h to 1EFFFFh
0F0000h to 0F7FFFh
SA31
0
1
1
1
1
1
X
X
X
X
64/32
1F0000h to 1FFFFFh
0F8000h to 0FFFFFh
(Continued)
16
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA32
1
0
0
0
0
0
X
X
X
X
64/32
200000h to 20FFFFh
100000h to 107FFFh
SA33
1
0
0
0
0
1
X
X
X
X
64/32
210000h to 21FFFFh
108000h to 10FFFFh
SA34
1
0
0
0
1
0
X
X
X
X
64/32
220000h to 22FFFFh
110000h to 117FFFh
SA35
1
0
0
0
1
1
X
X
X
X
64/32
230000h to 23FFFFh
118000h to 11FFFFh
SA36
1
0
0
1
0
0
X
X
X
X
64/32
240000h to 24FFFFh
120000h to 127FFFh
SA37
1
0
0
1
0
1
X
X
X
X
64/32
250000h to 25FFFFh
128000h to 12FFFFh
SA38
1
0
0
1
1
0
X
X
X
X
64/32
260000h to 26FFFFh
130000h to 137FFFh
SA39
1
0
0
1
1
1
X
X
X
X
64/32
270000h to 27FFFFh
138000h to 13FFFFh
SA40
1
0
1
0
0
0
X
X
X
X
64/32
280000h to 28FFFFh
140000h to 147FFFh
SA41
1
0
1
0
0
1
X
X
X
X
64/32
290000h to 29FFFFh
148000h to 14FFFFh
SA42
1
0
1
0
1
0
X
X
X
X
64/32
2A0000h to 2AFFFFh
150000h to 157FFFh
SA43
1
0
1
0
1
1
X
X
X
X
64/32
2B0000h to 2BFFFFh
158000h to 15FFFFh
SA44
1
0
1
1
0
0
X
X
X
X
64/32
2C0000h to 2CFFFFh
160000h to 167FFFh
SA45
1
0
1
1
0
1
X
X
X
X
64/32
2D0000h to 2DFFFFh
168000h to 16FFFFh
SA46
1
0
1
1
1
0
X
X
X
X
64/32
2E0000h to 2EFFFFh
170000h to 177FFFh
SA47
1
0
1
1
1
1
X
X
X
X
64/32
2F0000h to 2FFFFFh
178000h to 17FFFFh
SA48
1
1
0
0
0
0
X
X
X
X
64/32
300000h to 30FFFFh
180000h to 187FFFh
SA49
1
1
0
0
0
1
X
X
X
X
64/32
310000h to 31FFFFh
188000h to 18FFFFh
SA50
1
1
0
0
1
0
X
X
X
X
64/32
320000h to 32FFFFh
190000h to 197FFFh
SA51
1
1
0
0
1
1
X
X
X
X
64/32
330000h to 33FFFFh
198000h to 19FFFFh
SA52
1
1
0
1
0
0
X
X
X
X
64/32
340000h to 34FFFFh
1A0000h to 1A7FFFh
SA53
1
1
0
1
0
1
X
X
X
X
64/32
350000h to 35FFFFh
1A8000h to 1AFFFFh
SA54
1
1
0
1
1
0
X
X
X
X
64/32
360000h to 36FFFFh
1B0000h to 1B7FFFh
SA55
1
1
0
1
1
1
X
X
X
X
64/32
370000h to 37FFFFh
1B8000h to 1BFFFFh
SA56
1
1
1
0
0
0
X
X
X
X
64/32
380000h to 38FFFFh
1C0000h to 1C7FFFh
SA57
1
1
1
0
0
1
X
X
X
X
64/32
390000h to 39FFFFh
1C8000h to 1CFFFFh
SA58
1
1
1
0
1
0
X
X
X
X
64/32
3A0000h to 3AFFFFh
1D0000h to 1D7FFFh
SA59
1
1
1
0
1
1
X
X
X
X
64/32
3B0000h to 3BFFFFh
1D8000h to 1DFFFFh
SA60
1
1
1
1
0
0
X
X
X
X
64/32
3C0000h to 3CFFFFh
1E0000h to 1E7FFFh
SA61
1
1
1
1
0
1
X
X
X
X
64/32
3D0000h to 3DFFFFh
1E8000h to 1EFFFFh
SA62
1
1
1
1
1
0
X
X
X
X
64/32
3E0000h to 3EFFFFh
1F0000h to 1F7FFFh
SA63
1
1
1
1
1
1
0
0
0
X
8/4
3F0000h to 3F1FFFh
1F8000h to 1F8FFFh
SA64
1
1
1
1
1
1
0
0
1
X
8/4
3F2000h to 3F3FFFh
1F9000h to 1F9FFFh
(Continued)
Retired Product
DS05-20894-5E_July 31, 2007
17
MBM29LV320TE/BE80/90/10
(Continued)
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA65
1
1
1
1
1
1
0
1
0
X
8/4
3F4000h to 3F5FFFh
1FA000h to 1FAFFFh
SA66
1
1
1
1
1
1
0
1
1
X
8/4
3F6000h to 3F7FFFh
1FB000h to 1FBFFFh
SA67
1
1
1
1
1
1
1
0
0
X
8/4
3F8000h to 3F9FFFh
1FC000h to 1FCFFFh
SA68
1
1
1
1
1
1
1
0
1
X
8/4
3FA000h to 3FBFFFh
1FD000h to 1FDFFFh
SA69
1
1
1
1
1
1
1
1
0
X
8/4
3FC000h to 3FDFFFh
1FE000h to 1FEFFFh
SA70
1
1
1
1
1
1
1
1
1
X
8/4
3FE000h to 3FFFFFh
1FF000h to 1FFFFFh
Note : The address range is A20 : A-1 if in byte mode (BYTE = VIL).
The address range is A20 : A0 if in word mode (BYTE = VIH).
18
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
Sector Address Table (MBM29LV320BE)
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA70
1
1
1
1
1
1
X
X
X
X
64/32
3F0000h to 3FFFFFh
1F8000h to 1FFFFFh
SA69
1
1
1
1
1
0
X
X
X
X
64/32
3E0000h to 3EFFFFh
1F0000h to 1F7FFFh
SA68
1
1
1
1
0
1
X
X
X
X
64/32
3D0000h to 3DFFFFh
1E8000h to 1EFFFFh
SA67
1
1
1
1
0
0
X
X
X
X
64/32
3C0000h to 3CFFFFh
1E0000h to 1E7FFFh
SA66
1
1
1
0
1
1
X
X
X
X
64/32
3B0000h to 3BFFFFh
1D8000h to 1DFFFFh
SA65
1
1
1
0
1
0
X
X
X
X
64/32
3A0000h to 3AFFFFh
1D0000h to 1D7FFFh
SA64
1
1
1
0
0
1
X
X
X
X
64/32
390000h to 39FFFFh
1C8000h to 1CFFFFh
SA63
1
1
1
0
0
0
X
X
X
X
64/32
380000h to 38FFFFh
1C0000h to 1C7FFFh
SA62
1
1
0
1
1
1
X
X
X
X
64/32
370000h to 37FFFFh
1B8000h to 1BFFFFh
SA61
1
1
0
1
1
0
X
X
X
X
64/32
360000h to 36FFFFh
1B0000h to 1B7FFFh
SA60
1
1
0
1
0
1
X
X
X
X
64/32
350000h to 35FFFFh
1A8000h to 1AFFFFh
SA59
1
1
0
1
0
0
X
X
X
X
64/32
340000h to 34FFFFh
1A0000h to 1A7FFFh
SA58
1
1
0
0
1
1
X
X
X
X
64/32
330000h to 33FFFFh
198000h to 19FFFFh
SA57
1
1
0
0
1
0
X
X
X
X
64/32
320000h to 32FFFFh
190000h to 197FFFh
SA56
1
1
0
0
0
1
X
X
X
X
64/32
310000h to 31FFFFh
188000h to 18FFFFh
SA55
1
1
0
0
0
0
X
X
X
X
64/32
300000h to 30FFFFh
180000h to 187FFFh
SA54
1
0
1
1
1
1
X
X
X
X
64/32
2F0000h to 2FFFFFh
178000h to 17FFFFh
SA53
1
0
1
1
1
0
X
X
X
X
64/32
2E0000h to 2EFFFFh
170000h to 177FFFh
SA52
1
0
1
1
0
1
X
X
X
X
64/32
2D0000h to 2DFFFFh
168000h to 16FFFFh
SA51
1
0
1
1
0
0
X
X
X
X
64/32
2C0000h to 2CFFFFh
160000h to 167FFFh
SA50
1
0
1
0
1
1
X
X
X
X
64/32
2B0000h to 2BFFFFh
158000h to 15FFFFh
SA49
1
0
1
0
1
0
X
X
X
X
64/32
2A0000h to 2AFFFFh
150000h to 157FFFh
SA48
1
0
1
0
0
1
X
X
X
X
64/32
290000h to 29FFFFh
148000h to 14FFFFh
SA47
1
0
1
0
0
0
X
X
X
X
64/32
280000h to 28FFFFh
140000h to 147FFFh
SA46
1
0
0
1
1
1
X
X
X
X
64/32
270000h to 27FFFFh
138000h to 13FFFFh
SA45
1
0
0
1
1
0
X
X
X
X
64/32
260000h to 26FFFFh
130000h to 137FFFh
SA44
1
0
0
1
0
1
X
X
X
X
64/32
250000h to 25FFFFh
128000h to 12FFFFh
SA43
1
0
0
1
0
0
X
X
X
X
64/32
240000h to 24FFFFh
120000h to 127FFFh
SA42
1
0
0
0
1
1
X
X
X
X
64/32
230000h to 23FFFFh
118000h to 11FFFFh
SA41
1
0
0
0
1
0
X
X
X
X
64/32
220000h to 22FFFFh
110000h to 117FFFh
SA40
1
0
0
0
0
1
X
X
X
X
64/32
210000h to 21FFFFh
108000h to 10FFFFh
SA39
1
0
0
0
0
0
X
X
X
X
64/32
200000h to 20FFFFh
100000h to 107FFFh
SA38
0
1
1
1
1
1
X
X
X
X
64/32
1F0000h to 1FFFFFh
0F8000h to 0FFFFFh
(Continued)
Retired Product
DS05-20894-5E_July 31, 2007
19
MBM29LV320TE/BE80/90/10
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA37
0
1
1
1
1
0
X
X
X
X
64/32
1E0000h to 1EFFFFh
0F0000h to 0F7FFFh
SA36
0
1
1
1
0
1
X
X
X
X
64/32
1D0000h to 1DFFFFh
0E8000h to 0EFFFFh
SA35
0
1
1
1
0
0
X
X
X
X
64/32
1C0000h to 1CFFFFh
0E0000h to 0E7FFFh
SA34
0
1
1
0
1
1
X
X
X
X
64/32
1B0000h to 1BFFFFh
0D8000h to 0DFFFFh
SA33
0
1
1
0
1
0
X
X
X
X
64/32
1A0000h to 1AFFFFh
0D0000h to 0D7FFFh
SA32
0
1
1
0
0
1
X
X
X
X
64/32
190000h to 19FFFFh
0C8000h to 0CFFFFh
SA31
0
1
1
0
0
0
X
X
X
X
64/32
180000h to 18FFFFh
0C0000h to 0C7FFFh
SA30
0
1
0
1
1
1
X
X
X
X
64/32
170000h to 17FFFFh
0B8000h to 0BFFFFh
SA29
0
1
0
1
1
0
X
X
X
X
64/32
160000h to 16FFFFh
0B0000h to 0B7FFFh
SA28
0
1
0
1
0
1
X
X
X
X
64/32
150000h to 15FFFFh
0A8000h to 0AFFFFh
SA27
0
1
0
1
0
0
X
X
X
X
64/32
140000h to 14FFFFh
0A0000h to 0A7FFFh
SA26
0
1
0
0
1
1
X
X
X
X
64/32
130000h to 13FFFFh
098000h to 09FFFFh
SA25
0
1
0
0
1
0
X
X
X
X
64/32
120000h to 12FFFFh
090000h to 097FFFh
SA24
0
1
0
0
0
1
X
X
X
X
64/32
110000h to 11FFFFh
088000h to 08FFFFh
SA23
0
1
0
0
0
0
X
X
X
X
64/32
100000h to 10FFFFh
080000h to 087FFFh
SA22
0
0
1
1
1
1
X
X
X
X
64/32
0F0000h to 0FFFFFh
078000h to 07FFFFh
SA21
0
0
1
1
1
0
X
X
X
X
64/32
0E0000h to 0EFFFFh
070000h to 077FFFh
SA20
0
0
1
1
0
1
X
X
X
X
64/32
0D0000h to 0DFFFFh
068000h to 06FFFFh
SA19
0
0
1
1
0
0
X
X
X
X
64/32
0C0000h to 0CFFFFh
060000h to 067FFFh
SA18
0
0
1
0
1
1
X
X
X
X
64/32
0B0000h to 0BFFFFh
058000h to 05FFFFh
SA17
0
0
1
0
1
0
X
X
X
X
64/32
0A0000h to 0AFFFFh
050000h to 057FFFh
SA16
0
0
1
0
0
1
X
X
X
X
64/32
090000h to 09FFFFh
048000h to 04FFFFh
SA15
0
0
1
0
0
0
X
X
X
X
64/32
080000h to 08FFFFh
040000h to 047FFFh
SA14
0
0
0
1
1
1
X
X
X
X
64/32
070000h to 07FFFFh
038000h to 03FFFFh
SA13
0
0
0
1
1
0
X
X
X
X
64/32
060000h to 06FFFFh
030000h to 037FFFh
SA12
0
0
0
1
0
1
X
X
X
X
64/32
050000h to 05FFFFh
028000h to 02FFFFh
SA11
0
0
0
1
0
0
X
X
X
X
64/32
040000h to 04FFFFh
020000h to 027FFFh
SA10
0
0
0
0
1
1
X
X
X
X
64/32
030000h to 03FFFFh
018000h to 01FFFFh
SA9
0
0
0
0
1
0
X
X
X
X
64/32
020000h to 02FFFFh
010000h to 017FFFh
SA8
0
0
0
0
0
1
X
X
X
X
64/32
010000h to 01FFFFh
008000h to 00FFFFh
SA7
0
0
0
0
0
0
1
1
1
X
8/4
00E000h to 00FFFFh
007000h to 007FFFh
SA6
0
0
0
0
0
0
1
1
0
X
8/4
00C000h to 00DFFFh
006000h to 006FFFh
SA5
0
0
0
0
0
0
1
0
1
X
8/4
00A000h to 00BFFFh
005000h to 005FFFh
(Continued)
20
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
(Continued)
Sector Address
Sector
A20 A19 A18 A17 A16 A15 A14 A13 A12 A11
Sector
Size
(Kbytes/
Kwords)
(×8)
Address Range
(×16)
Address Range
SA4
0
0
0
0
0
0
1
0
0
X
8/4
008000h to 009FFFh
004000h to 004FFFh
SA3
0
0
0
0
0
0
0
1
1
X
8/4
006000h to 007FFFh
003000h to 003FFFh
SA2
0
0
0
0
0
0
0
1
0
X
8/4
004000h to 005FFFh
002000h to 002FFFh
SA1
0
0
0
0
0
0
0
0
1
X
8/4
002000h to 003FFFh
001000h to 001FFFh
SA0
0
0
0
0
0
0
0
0
0
X
8/4
000000h to 001FFFh
000000h to 000FFFh
Note : The address range is A20 : A-1 if in byte mode (BYTE = VIL).
The address range is A20 : A0 if in word mode (BYTE = VIH).
Retired Product
DS05-20894-5E_July 31, 2007
21
MBM29LV320TE/BE80/90/10
Sector Group Address Table (MBM29LV320TE)
(Top Boot Block)
Sector Group
A20
A19
A18
A17
A16
A15
A14
A13
A12
Sectors
SGA0
0
0
0
0
X
X
X
X
X
SA0 to SA3
SGA1
0
0
0
1
X
X
X
X
X
SA4 to SA7
SGA2
0
0
1
0
X
X
X
X
X
SA8 to SA11
SGA3
0
0
1
1
X
X
X
X
X
SA12 to SA15
SGA4
0
1
0
0
X
X
X
X
X
SA16 to SA19
SGA5
0
1
0
1
X
X
X
X
X
SA20 to SA23
SGA6
0
1
1
0
X
X
X
X
X
SA24 to SA27
SGA7
0
1
1
1
X
X
X
X
X
SA28 to SA31
SGA8
1
0
0
0
X
X
X
X
X
SA32 to SA35
SGA9
1
0
0
1
X
X
X
X
X
SA36 to SA39
SGA10
1
0
1
0
X
X
X
X
X
SA40 to SA43
SGA11
1
0
1
1
X
X
X
X
X
SA44 to SA47
SGA12
1
1
0
0
X
X
X
X
X
SA48 to SA51
SGA13
1
1
0
1
X
X
X
X
X
SA52 to SA55
SGA14
1
1
1
0
X
X
X
X
X
SA56 to SA59
0
0
0
1
X
X
X
SA60 to SA62
1
0
SGA15
22
1
1
1
1
SGA16
1
1
1
1
1
1
0
0
0
SA63
SGA17
1
1
1
1
1
1
0
0
1
SA64
SGA18
1
1
1
1
1
1
0
1
0
SA65
SGA19
1
1
1
1
1
1
0
1
1
SA66
SGA20
1
1
1
1
1
1
1
0
0
SA67
SGA21
1
1
1
1
1
1
1
0
1
SA68
SGA22
1
1
1
1
1
1
1
1
0
SA69
SGA23
1
1
1
1
1
1
1
1
1
SA70
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
Sector Group Address Table (MBM29LV320BE)
(Bottom Boot Block)
Sector Group
A20
A19
A18
A17
A16
A15
A14
A13
A12
Sectors
SGA0
0
0
0
0
0
0
0
0
0
SA0
SGA1
0
0
0
0
0
0
0
0
1
SA1
SGA2
0
0
0
0
0
0
0
1
0
SA2
SGA3
0
0
0
0
0
0
0
1
1
SA3
SGA4
0
0
0
0
0
0
1
0
0
SA4
SGA5
0
0
0
0
0
0
1
0
1
SA5
SGA6
0
0
0
0
0
0
1
1
0
SA6
SGA7
0
0
0
0
0
0
1
1
1
SA7
0
1
1
0
X
X
X
SA8 to SA10
1
1
SGA8
0
0
0
0
SGA9
0
0
0
1
X
X
X
X
X
SA11 to SA14
SGA10
0
0
1
0
X
X
X
X
X
SA15 to SA18
SGA11
0
0
1
1
X
X
X
X
X
SA19 to SA22
SGA12
0
1
0
0
X
X
X
X
X
SA23 to SA26
SGA13
0
1
0
1
X
X
X
X
X
SA27 to SA30
SGA14
0
1
1
0
X
X
X
X
X
SA31 to SA34
SGA15
0
1
1
1
X
X
X
X
X
SA35 to SA38
SGA16
1
0
0
0
X
X
X
X
X
SA39 to SA42
SGA17
1
0
0
1
X
X
X
X
X
SA43 to SA46
SGA18
1
0
1
0
X
X
X
X
X
SA47 to SA50
SGA19
1
0
1
1
X
X
X
X
X
SA51 to SA54
SGA20
1
1
0
0
X
X
X
X
X
SA55 to SA58
SGA21
1
1
0
1
X
X
X
X
X
SA59 to SA62
SGA22
1
1
1
0
X
X
X
X
X
SA63 to SA66
SGA23
1
1
1
1
X
X
X
X
X
SA67 to SA70
Retired Product
DS05-20894-5E_July 31, 2007
23
MBM29LV320TE/BE80/90/10
Common Flash Memory Interface Code Table
A6 to A0
DQ15 to DQ0
Query-unique ASCII string “QRY”
10h
11h
12h
0051h
0052h
0059h
Primary OEM Command Set
02h : AMD/FJ standard type
13h
14h
0002h
0000h
Address for Primary Extended Table
15h
16h
0040h
0000h
Alternate OEM Command Set (00h = not applicable)
17h
18h
0000h
0000h
Address for Alternate OEM Extended Table
19h
1Ah
0000h
0000h
VCC Min Voltage (write/erase)
DQ7 to DQ4 : 1 V, DQ3 to DQ0 : 100 mV
1Bh
0027h
VCC Max (write/erase)
DQ7 to DQ4 : 1 V, DQ3 to DQ0 : 100 mV
1Ch
0036h
VPP Min voltage
1Dh
0000h
1Eh
0000h
Typical timeout per single byte/word write 2 μs
1Fh
0004h
Typical timeout for Min size buffer write 2N μs
20h
0000h
Typical timeout per individual sector erase 2N ms
21h
000Ah
Typical timeout for full chip erase 2 ms
22h
0000h
Max timeout for byte/word write 2N times typical
23h
0005h
Max timeout for buffer write 2N times typical
24h
0000h
Max timeout per individual sector erase 2 times typical
25h
0004h
Max timeout for full chip erase 2N times typical
26h
0000h
Device Size = 2N byte
27h
0016h
Flash Device Interface description
02h : ×8/×16
28h
29h
0002h
0000h
Max number of byte in
multi-byte write = 2N
2Ah
2Bh
0000h
0000h
Number of Erase Block Regions within device
2Ch
0002h
Erase Block Region 1 Information
2Dh
2Eh
2Fh
30h
0007h
0000h
0020h
0000h
Erase Block Region 2 Information
31h
32h
33h
34h
003Eh
0000h
0000h
0001h
Description
VPP Max voltage
N
N
N
(Continued)
24
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
(Continued)
Description
A6 to A0
DQ15 to DQ0
Query-unique ASCII string “PRI”
40h
41h
42h
0050h
0052h
0049h
Major version number, ASCII
43h
0031h
Minor version number, ASCII
44h
0031h
Address Sensitive Unlock
00h = Required
45h
0000h
Erase Suspend
02h = To Read & Write
46h
0002h
Sector Protection
X = Number of sectors in per group
47h
0004h
Sector Temporary Unprotection
01h = Supported
48h
0001h
Sector Protection Algorithm
49h
0004h
Number of Sector for Bank 2
00h = Not Supported
4Ah
0000h
Burst Mode Type
00h = Not Supported
4Bh
0000h
Page Mode Type
00h = Not Supported
4Ch
0000h
VACC (Acceleration) Supply Minimum
DQ7 to DQ4 : 1 V, DQ3 to DQ0 : 100 mV
4Dh
00B5h
VACC (Acceleration) Supply Maximum
DQ7 to DQ4 : 1 V, DQ3 to DQ0 : 100 mV
4Eh
00C5h
Boot Type
02h = MBM29LV320BE
03h = MBM29LV320TE
4Fh
00XXh
Retired Product
DS05-20894-5E_July 31, 2007
25
MBM29LV320TE/BE80/90/10
■ FUNCTIONAL DESCRIPTION
1.
Read Mode
The device has two control functions which must be satisfied in order to obtain data at the outputs. CE is the
power control and should be used for a device selection. OE is the output control and used to gate data to the
output pins if a device is selected.
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output
enable access time is the delay from the falling edge of OE to valid data at the output pins. Assuming the
addresses have been stable for at least tACC-tOE time. When reading out data without changing addresses after
power-up, input hardware reset or to change CE pin from “H” or “L”.
2.
Standby Mode
There are two ways to implement the standby mode on the device, one using both the CE and RESET pins; the
other via the RESET pin only.
When using both pins, CMOS standby mode is achieved with CE and RESET inputs both held at VCC ± 0.3 V.
Under this condition the current consumed is less than 5 μA Max During Embedded Algorithm operation, VCC
active current (ICC2) is required even when CE = “H”. The device can be read with standard access time (tCE)
from either of these standby modes.
When using the RESET pin only, CMOS standby mode is achieved with RESET input held at VSS ± 0.3 V
(CE = “H” or “L”). Under this condition the current consumed is less than 5 μA Max Once the RESET pin is
taken high, the device requires tRH as wake up time for outputs to be valid for read access.
In the standby mode the outputs are in the high impedance state independently of the OE input.
3.
Automatic Sleep Mode
There is a function called automatic sleep mode to restrain power consumption during read-out of the device
data. This mode can be useful in the application such as a handy terminal which requires low power consumption.
To activate this mode, the device automatically switches themselves to low power mode when the device addresses remain stable during access time of 150 ns. It is not necessary to control CE, WE, and OE on the mode.
Under the mode, the current consumed is typically 1 μA (CMOS Level).
During simultaneous operation, VCC active current (ICC2) is required.
Since the data are latched during this mode, the data are read-out continuously. If the addresses are changed,
the mode is canceled automatically, and the device read the data for changed addresses.
4.
Output Disable
With the OE input at logic high level (VIH), output from the device is disabled. This will causes the output pins to
be in a high impedance state.
5.
Autoselect
Autoselect mode allows reading out of a binary code from the device and will identify its manufacturer and type.
This mode is intended for use by programming equipment for the purpose of automatically matching the device
to be programmed with its corresponding programming algorithm. This mode is functional over the entire temperature range of the device.
To activate this mode, the programming equipment must force VID (11.5 V to 12.5 V) on address pin A9. Two
identifier bytes may then be sequenced from the device outputs by toggling address A0 from VIL to VIH. All
addresses are DON’T CARES except A6, A1, and A0 (A-1). (See “MBM29LV320TE/BE User Bus Operations
Tables (BYTE = VIH and BYTE = VIL)” in ■DEVICE BUS OPERATIONS.)
The manufacturer and device codes may also be read via the command register, for instances when the device
is erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is
illustrated in “MBM29LV320TE/BE Command Definitions Table” (■DEVICE BUS OPERATIONS) (See “2. Autoselect Command” in ■COMAND DIFINITIONS).
26
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
Word 0 (A0 = VIL) represents the manufacturer’s code (Fujitsu = 04h) and word 1 (A0 = VIH) represents the device
identifier code. Word 3 (A1 = A0 = VIH) represents the extended device code. These three bytes/words are given
in “MBM29LV320TE/BE Sector Group Protection Verify Autoselect Codes Table” and “Extended Autoselect Code
Table” (■DEVICE BUS OPERATIONS). In order to read the proper device codes when executing the autoselect,
A1 must be VIL. (See “MBM29LV320TE/BE Sector Group Protection Verify Autoselect Codes Table” and “Extended Autoselect Code Table” in ■DEVICE BUS OPERATIONS.)
6.
Write
The device erasure and programming are accomplished via the command register. The contents of the register
serve as inputs to the internal state machine. The state machine outputs dictate the device function.
The command register itself does not occupy any addressable memory location. The register is a latch used to
store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the
falling edge of WE or CE, whichever starts later; while data is latched on the rising edge of WE or CE, whichever
starts first. Standard microprocessor write timings are used.
See “Read Only Operation Characteristics” in ■AC CHARACTERISTICS for specific timing parameters.
7.
Sector Group Protection
The device features hardware sector group protection. This feature disables both program and erase operations
in any combination of twenty five sector groups of memory. See “Sector Group Address Tables (MBM29LV320TE/
BE)” in ■FLEXIBLE SECTOR-ERASE ARCHITECTURE. The sector group protection feature is enabled using
programming equipment at the user’s site. The device is shipped with all sector groups unprotected.
To activate it, the programming equipment must force VID on address pin A9 and control pin OE, (suggest VID =
11.5 V), CE = VIL and A6 = A0 = VIL, A1 = VIH. The sector group addresses (A20, A19, A18, A17, A16, A15, A14, A13, and
A12) should be set to the sector to be protected. “Sector Address Tables (MBM29LV320TE/BE)” in ■FLEXIBLE
SECTOR-ERASE ARCHITECTURE define the sector address for each of the seventy one (71) individual sectors,
and “Sector Group Address Tables (MBM29LV320TE/BE)” in ■FLEXIBLE SECTOR-ERASE ARCHITECTURE
define the sector group address for each of the twenty five (25) individual group sectors. Programming of the
protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same.
Sector group addresses must be held constant during the WE pulse. See “14. Sector Group Protection Timing
Diagram” in ■TIMING DIAGRAM and “5. Sector Group Protection Algorithm” in ■FLOW CHART for sector group
protection waveforms and algorithm.
To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9
with CE and OE at VIL and WE at VIH. Scanning the sector group addresses (A20, A19, A18, A17, A16, A15, A14, A13,
and A12) while (A6, A1, A0) = (0, 1, 0) produces a logic “1” code at device output DQ0 for a protected sector.
Otherwise the device produces “0” for unprotected sector. In this mode, the lower order addresses, except for
A0, A1, and A6 are DON’T CARES. Address locations with A1 = VIL are reserved for Autoselect manufacturer and
device codes. A-1 requires to apply VIL on byte mode.
It is also possible to determine if a sector group is protected in the system by writing an Autoselect command.
Performing a read operation at the address location XX02h, where the higher order addresses (A20, A19, A18, A17,
A16, A15, A14, A13, and A12) are the desired sector group address will produce a logical “1” at DQ0 for a protected
sector group. See “MBM29LV320TE/BE Sector Group Protection Verify Autoselect Codes Table” and “Extended
Autoselect Code Table” in ■DEVICE BUS OPERATIONS for Autoselect codes.
8.
Temporary Sector Group Unprotection
This feature allows temporary unprotection of previously protected sector groups of the device in order to change
data. The Sector Group Unprotection mode is activated by setting the RESET pin to high voltage (VID). During
this mode, formerly protected sector groups can be programmed or erased by selecting the sector group addresses. Once the VID is taken away from the RESET pin, all the previously protected sector groups will be
protected again. See “15. Temporary Sector Group Unprotection Timing Diagram” in ■TIMING DIAGRAM and
“6. Temporary Sector Group Unprotection Algorithm” in ■FLOW CHART.
9.
Extended Sector Group Protection
Retired Product
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27
MBM29LV320TE/BE80/90/10
In addition to normal sector group protection, the device has Extended Sector Group Protection as extended
function. This function enables to protect sector group by forcing VID on RESET pin and write a command
sequence. Unlike conventional procedure, it is not necessary to force VID and control timing for control pins. The
extended sector group protection requires VID on RESET pin only. With this condition, the operation is initiated
by writing the set-up command (60h) into the command register. Then, the sector group addresses pins (A20,
A19, A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set to the sector group to be protected
(recommend to set VIL for the other addresses pins), and write extended sector group protection command (60h).
A sector group is typically protected in 250 μs. To verify programming of the protection circuitry, the sector group
addresses pins (A20, A19, A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set and write
a command (40h). Following the command write, a logic “1” at device output DQ0 will produce for protected
sector in the read operation. If the output is logic “0”, please repeat to write extended sector group protection
command (60h) again. To terminate the operation, it is necessary to set RESET pin to VIH. (See “16. Extended
Sector Group Protection Timing Diagram” in ■TIMING DIAGRAM and “7. Extended Sector Group Protection
Algorithm” in ■FLOW CHART.)
10. RESET
Hardware Reset
The device resets by driving RESET pin to VIL. The RESET pin has pulse requirement and has to be kept low
(VIL) for at least “tRP” in order to properly reset internal state machine. Any operation in the process of being
executed is terminated and the internal state machine is reset to the read mode “tREADY” after the RESET pin is
driven low. Furthermore once the RESET pin goes high, the device requires an additional “tRH” before it allows
read access. When the RESET pin is low, the device is in the standby mode for the duration of the pulse and
all the data output pins are tri-stated. If a hardware reset occurs during program or erase operation, the data at
that particular location will be corrupted. Please note that the RY/BY output signal should be ignored during the
RESET pulse. See “10. RESET, RY/BY Timing Diagram” in ■TIMING DIAGRAM for the timing diagram. See “8.
Temporary Sector Group Unprotection” for additional functionality.
11. Boot Block Sector Protection
The Write Protection function provides hardware method of protecting certain boot sectors without using VID.
This function is provided by the WP/ACC pin.
If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions in the two
“outermost” 8 K byte boot sectors (MBM29LV320TE : SA69 and SA70, MBM29LV320BE : SA0 and SA1)
independently of whether those sectors are protected or unprotected using the method described in “Sector
Group Protection”. The two outermost 8 K byte boot sectors are the two sectors containing the lowest addresses
in a bottom-boot-configured device, or the two sectors containing the highest addresses in a top-boot-configured
device.
If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost 8 K byte boot
sectors were last set to be protected or unprotected. That is, sector group protection or unprotection for these
two sectors depends on whether they were last protected or unprotected using the method described in “Sector
Group Protection”.
12. Accelerated Program Operation
The device offers accelerated program operation which enables the programming in high speed. If the system
asserts VACC to the WP/ACC pin, the device automatically enters the acceleration mode and the time required
for program operation will reduce to about 60%. This function is primarily intended to allow high speed program,
so caution is needed as the sector group becomes temporarily unprotected.
The system uses fast program command sequence when programming during acceleration mode. Set command
to fast mode and reset command from fast mode are not necessary. When the device enters the acceleration
mode, the device automatically set to fast mode. Therefore the present sequence is used for programming and
detection of completion during acceleration mode.
Removing VACC from the WP/ACC pin returns the device to normal operation. Do not remove VACC from WP/
ACC pin while programming. See “17. Accelerated Program Timing Diagram” in ■TIMING DIAGRAM.
Erase operation during Accelerated Program Operation is strictly prohibited.
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■ COMMAND DEFINITIONS
The device operations are selected by writing specific address and data sequences into the command register.
Writing incorrect address and data values or writing them in the improper sequence will reset the device to the
read mode. “MBM29LV320TE/BE Command Definitions Table” in ■DEVICE BUS OPERATIONS defines the
valid register command sequences. Note that the Erase Suspend (B0h) and Erase Resume (30h) commands
are valid only while the Sector Erase operation is in progress. Moreover both Read/Reset commands are
functionally equivalent, resetting the device to the read mode. Please note that commands are always written
at DQ7 to DQ0 and DQ15 to DQ8 bits are ignored.
1.
Read/Reset Command
In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to Read/Reset mode, the Read/
Reset operation is initiated by writing the Read/Reset command sequence into the command register. Microprocessor read cycles retrieve array data from the memory. The device remain enabled for reads until the
command register contents are altered.
The device automatically powers up in the Read/Reset state. In this case, a command sequence is not required
to read data. Standard microprocessor read cycles retrieves array data. This default value ensures that no
spurious alteration of the memory content occurs during the power transition. See “■AC CHARACTERISTICS”
for the specific timing parameters.
2.
Autoselect Command
Flash memories are intended for use in applications where the local CPU alters memory contents. As such,
manufacture and device codes must be accessible while the device resides in the target system. PROM programmers typically access the signature codes by raising A9 to a high voltage. However multiplexing high voltage
onto the address lines is not generally desired system design practice.
The device contains Autoselect command operation to supplement traditional PROM programming methodology.
The operation is initiated by writing the Autoselect command sequence into the command register.
Following the command write, a read cycle from address (XX) 00h retrieves the manufacture code of 04h. A
read cycle from address (XX) 01h for ×16 ((XX) 02h for ×8) returns the device code. A read cycle from address
(XX) 03h for ×16 ((XX) 06h for ×8) returns the extended device code. (See “MBM29LV320TE/BE Sector Group
Protection Verify Autoselect Codes Table” and “Extended Autoselect Code Table” in ■DEVICE BUS OPERATIONS.)
The sector state (protection or unprotection) is informed by address (XX) 02h for ×16 ((XX) 04h for ×8). Scanning
the sector group addresses (A20, A19, A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce
a logic “1” at device output DQ0 for a protected sector group. The programming verification should be performed
by verify sector group protection on the protected sector. (See “MBM29LV320TE/BE User Bus Operations Tables
(BYTE = VIH and BYTE = VIL)” in ■DEVICE BUS OPERATIONS.)
To terminate the operation, it is necessary to write the Read/Reset command sequence into the register. To
execute the Autoselect command during the operation, writing Read/Reset command sequence must precede
the Autoselect command.
3.
Byte/Word Programming
The device is programmed on a byte-by-byte (or word-by-word) basis. Programming is a four bus cycle operation.
There are two “unlock” write cycles. These are followed by the program set-up command and data write cycles.
Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is latched on the
rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever happens first) begins
programming. Upon executing the Embedded Program Algorithm command sequence, the system is not required
to provide further controls or timings. The device automatically provides adequate internally generated program
pulses and verify programmed cell margin.
The system can determine the status of the program operation by using DQ7 (Data Polling), DQ6 (Toggle Bit),
or RY/BY. The Data Polling and Toggle Bit must be performed at the memory location being programmed.
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The automatic programming operation is completed when the data on DQ7 is equivalent to data written to this
bit at which the device return to the read mode and addresses are no longer latched. See “Hardware Sequence
Flags Table”. Therefore the device requires that a valid address to the device be supplied by the system at this
particular instance of time. Hence Data Polling must be performed at the memory location being programmed.
Any commands written to the chip during this period will be ignored. If hardware reset occurs during the programming operation, it is impossible to guarantee the data are being written.
Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be
programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success
according to the data polling algorithm but a read from Read/Reset mode will show that the data is still “0”. Only
erase operations can convert “0”s to “1”s.
“1. Embedded ProgramTM Algorithm” in ■FLOW CHART illustrates the Embedded ProgramTM Algorithm using
typical command strings and bus operations.
4.
Chip Erase
Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are then followed by the chip erase command.
Chip erase does not require the user to program prior to erase. Upon executing the Embedded Erase Algorithm
command sequence the device automatically programs and verifies the entire memory for an all zero data pattern
prior to electrical erase (Preprogram function). The system is not required to provide any controls or timings
during these operations.
The system can determine the erase operation status by using DQ7 (Data Polling), DQ6 (Toggle Bit), or RY/BY.
The chip erase begins on the rising edge of the last CE or WE, whichever happens first in the command sequence
and terminates when the data on DQ7 is “1” (See “12. Write Operation Status”.) at which time the device returns
to read the mode.
Chip Erase Time; Sector Erase Time × All sectors + Chip Program Time (Preprogramming)
“2. Embedded EraseTM Algorithm” in ■FLOW CHART illustrates the Embedded EraseTM Algorithm using typical
command strings and bus operations.
5.
Sector Erase
Sector erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are then followed by the Sector Erase command. The sector
address (any address location within the desired sector) is latched on the falling edge of CE or WE whichever
starts later, while the command (Data = 30h) is latched on the rising edge of CE or WE which happens first.
After time-out of “tTOW” from the rising edge of the last sector erase command, the sector erase operation will begin.
Multiple sectors are erased concurrently by writing the six bus cycle operations on “MBM29LV320TE/BE Command Definitions Table” in ■DEVICE BUS OPERATIONS. This sequence is followed with writes of the Sector
Erase command to addresses in other sectors desired to be concurrently erased. The time between writes must
be less than “tTOW” otherwise that command will not be accepted and erasure will not start. It is recommended
that processor interrupts be disabled during this time to guarantee this condition. The interrupts can be reenabled after the last Sector Erase command is written. A time-out of “tTOW” from the rising edge of last CE or
WE whichever starts first initiates the execution of the Sector Erase command(s). If another falling edge of CE
or WE, whichever starts first occurs within the “tTOW” time-out window the timer is reset. (Monitor DQ3 to determine
if the sector erase timer window is still open, see “16. DQ3”, Sector Erase Timer.) Any command other than
Sector Erase or Erase Suspend during this time-out period will reset the device to the read mode, ignoring the
previous command string. Resetting the device once execution has begun will corrupt the data in the sector. In
that case, restart the erase on those sectors and allow them to complete. (See “12. Write Operation Status” for
Sector Erase Timer operation.) Loading the sector erase buffer may be done in any sequence and with any
number of sectors (0 to 70).
Sector erase does not require the user to program the device prior to erase. The device automatically program
all memory locations in the sector (s) to be erased prior to electrical erase (Preprogram function). When erasing
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a sector or sectors the remaining unselected sectors are not affected. The system is not required to provide any
controls or timings during these operations.
The system can determine the status of the erase operation by using DQ7 (Data Polling), DQ6 (Toggle Bit), or
RY/BY.
The sector erase begins after the “tTOW” time out from the rising edge of CE or WE whichever starts first for the
last sector erase command pulse and terminates when the data on DQ7 is “1” (See “12. Write Operation Status”.)
at which the device return to the read mode. Data polling and Toggle Bit must be performed at an address within
any of the sectors being erased.
Multiple Sector Erase Time; [Sector Erase Time + Sector Program Time (Preprogramming)] × Number of Sector
Erase
“2. Embedded EraseTM Algorithm” in ■FLOW CHART illustrates the Embedded EraseTM Algorithm using typical
command strings and bus operations.
6.
Erase Suspend/Resume
The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads
from or programs to a sector not being erased. This command is applicable ONLY during the Sector Erase
operation which includes the time-out period for sector erase. The Erase Suspend command will be ignored if
written during the Chip Erase operation or Embedded Program Algorithm. Writing the Erase Suspend command
(B0h) during the Sector Erase time-out results in immediate termination of the time-out period and suspension
of the erase operation.
Writing the Erase Resume command (30h) resumes the erase operation. The addresses are “DON’T CARES”
when writing the Erase Suspend or Erase Resume command.
When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum
of “tSPD” to suspend the erase operation. When the device has entered the erase-suspended mode, the
RY/BY output pin is at high impedance state and the DQ7 bit is at logic “1”, and DQ6 stops toggling. The user
must use the address of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation is
suspended. Further writes of the Erase Suspend command are ignored.
When the erase operation is suspended, the device defaults to the erase-suspend-read mode. Reading data in
this mode is the same as reading from the standard read mode except that the data must be read from sectors
that have not been erase-suspended. Successively reading from the erase-suspended sector while the device
is in the erase-suspend-read mode will cause DQ2 to toggle. See “17. DQ2”.
After entering the erase-suspend-read mode, the users can program the device by writing the appropriate
command sequence for Program. This program mode is known as the erase-suspend-program mode. Again,
programming in this mode is the same as programming in the regular Program mode except that the data must
be programmed to sectors that are not erase-suspended. Successively reading from the erase-suspended sector
while the device is in the erase-suspend-program mode causes DQ2 to toggle. The end of the erase-suspended
Program operation is detected by the RY/BY output pin, Data polling of DQ7 or by the Toggle Bit I (DQ6) which
is the same as the regular Program operation. Note that DQ7 must be read from the Program address while DQ6
can be read from any address.
To resume the operation of Sector Erase, the Resume command (30h) should be written. Any further writes of
the Resume command at this point is ignored. Another Erase Suspend command is written after the chip
resumeds erasing.
7.
Extended Command
(1) Fast Mode
Fast Mode function. This mode dispenses with the initial two unclock cycles required in the standard program
command sequence by writing Fast Mode command into the command register. In this mode the required bus
cycle for programming is two cycles instead of four bus cycles in standard program command. The read operation
is also executed after exiting this mode. During the Fast mode, do not write any command other than the Fast
program/Fast mode reset command. To exit this mode, it is necessary to write Fast Mode Reset command into
the command register. (See “8. Embedded ProgramTM Algorithm for Fast Mode” in ■FLOW CHART.) The VCC
active current is required even CE = VIH during Fast Mode.
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(2) Fast Programming
During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program
Algorithm is executed by writing program set-up command (A0h) and data write cycles (PA/PD). (See “8. Embedded ProgramTM Algorithm for Fast Mode” in ■FLOW CHART.)
(3) CFI (Common Flash Memory Interface)
The CFI (Common Flash Memory Interface) specification outlines device and host system software interrogation
handshake which allows specific vendor-specified software algorithms to be used for entire families of device.
This allows device-independent, JEDEC ID-independent, and forward-and backward-compatible software support for the specified flash device families. See “Common Flash Memory Interface Code Table” in ■FLEXIBLE
SECTOR-ERASE ARCHITECTURE for details.
The operation is initiated by writing the query command (98h) into the command register. Following the command
write, a read cycle from specific address retrieves device information. Please note that output data of upper byte
(DQ15 to DQ8) is “0” in word mode (16 bit) read. See “Common Flash Memory Interface Code Table” in ■FLEXIBLE
SECTOR-ERASE ARCHITECTURE. To terminate operation, it is necessary to write the read/reset command
sequence into the register. (See “Common Flash Memory Interface Code Table” in ■FLEXIBLE SECTORERASE ARCHITECTURE.)
8.
HiddenROM Region
The HiddenROM feature provides a Flash memory region that the system may access through a new command
sequence. This is primarily intended for customers who wish to use an Electronic Serial Number (ESN) in the
device with the ESN protected against modification. Once the HiddenROM region is protected, any further
modification of that region is impossible. This ensures the security of the ESN once the product is shipped to
the field.
The HiddenROM region is 256 bytes in length and is stored at the same address of the “outermost” 8 K byte
boot sector. The MBM29LV320TE occupies the address of the byte mode 3FFFC0h to 3FFFFFh (word mode
1FFFE0h to 1FFFFFh) and the MBM29LV320BE type occupies the address of the byte mode 000000h to
000080h (word mode 000000h to 000040h) . After the system writes Enter HiddenROM command sequence,
the system can read the HiddenROM region by using the addresses normally occupied by the boot sector. That
is, the device sends all commands that would normally be sent to the boot sector to the HiddenROM region.
This mode of operation continues until the system issues the Exit HiddenROM command sequence, or until
power is removed from the device. On power-up, or following a hardware reset, the device reverts to sending
commands to the boot sector.
9.
HiddenROM Entry Command
The device has a HiddenROM area with One Time Protect function. This area is to enter the security code and
to unable the change of the code once set. Program/erase is possible in this area until it is protected. However
once it is protected, it is impossible to unprotect so please use this with caution.
HiddenROM area is 256 byte and in the same address area of “outermost” 8 K byte boot block. Therefore, write
the HiddenROM entry command sequence to enter the HiddenROM area. It is called as HiddenROM mode
when the HiddenROM area appears.
Sector other than the boot block area could be read during HiddenROM mode. Read/Program of the HiddenROM
area is possible during HiddenROM mode. Write the HiddenROM reset command sequence to exit the HiddenROM mode.
10. HiddenROM Program Command
To program the data to the HiddenROM area, write the HiddenROM program command sequence during HiddenROM mode. This command is the same as the program command in usual except to write the command
during HiddenROM mode. Therefore the detection of completion method is the same as, using the DQ7 data
poling, DQ6 toggle bit and RY/BY pin. Need to pay attention to the address to be programmed. If the address
other than the HiddenROM area is selected to program, data of the address will be changed.
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Please note that the sector erase command is prohibited during HiddenROM mode. If the sector erase command
is appeared in this mode, data of the address will be erased.
11. HiddenROM Protect Command
There are two methods to protect the HiddenROM area. One of them is to write the sector group protect setup
command (60h) , set the sector address in the HiddenROM area and (A6, A1, A0) = (0,1,0) , and write the sector
group protect command (60h) during the HiddenROM mode. The same command sequence could be used
because it is the same with the extension sector group protect except that it is in the HiddenROM mode and it
does not apply high voltage to RESET pin. Please see “9. Extended Sector Group Protection” in ■FUNCTIONAL
DESCRIPTION for details of extention sector group protect setting.
The other is to apply high voltage (VID) to A9 and OE, set the sector address in the HiddenROM area and (A6,
A1, A0) = (0,1,0) , and apply the write pulse during the HiddenROM mode. To verify the protect circuit, apply
high voltage (VID) to A9, specify (A6, A1, A0) = (0,1,0) and the sector address in the HiddenROM area, and read.
When “1” appears on DQ0, the protect setting is completed. “0” will appear on DQ0 if it is not protected. Please
apply write pulse agian. The same command sequence could be used for the above method because other than
the HiddenROM mode, it is the same as the sector group protect in the past. Please see “7. Sector Group
Protection” in ■FUNCTIONAL DESCRIPTION for details of the sector group protect setting.
Other sector group will be effected if the address other than those for HiddenROM area is selected for the sector
group address, so please be carefull. Once it is protected, protection can not be cancelled, so please pay the
closest attention.
12. Write Operation Status
Details in “Hardware Sequence Flags Table” are all the status flags that can be used to check the status of the
device for current mode operation. During sector erase, the part provides the status flags automatically to the
I/O ports. The information on DQ2 is address sensitive. This means that if an address from an erasing sector is
consecutively read, then the DQ2 bit will toggle. However, DQ2 will not toggle if an address from a non-erasing
sector is consecutively read. This allows users to determine which sectors are in erase.
Once erase suspend is entered, address sensitivity still applies. If the address of a non-erasing sector (that is,
one available for read) is provided, then stored data can be read from the device. If the address of an erasing
sector (that is, one unavailable for read) is applied, the device will output its status bits.
Hardware Sequence Flags Table
Status
DQ7
DQ6
DQ5
DQ3
DQ2
DQ7
Toggle
0
0
1
0
Toggle
0
1
Toggle *1
1
1
0
0
Toggle
Erase Suspend Read
(Non-Erase Suspended Sector)
Data
Data
Data
Data
Data
Erase Suspend Program
(Non-Erase Suspended Sector)
DQ7
Toggle
0
0
1 *2
DQ7
Toggle
1
0
1
0
Toggle
1
1
N/A
DQ7
Toggle
1
0
N/A
Embedded Program Algorithm
Embedded Erase Algorithm
In Progress
Erase Suspend Read
(Erase Suspended Sector)
Erase
Suspended
Mode
Embedded Program Algorithm
Exceeded
Time Limits
Embedded Erase Algorithm
Erase
Suspended
Mode
Erase Suspend Program
(Non-Erase Suspended Sector)
*1: Successive reads from the erasing or erase-suspend sector cause DQ2 to toggle.
*2: Reading from non-erase suspend sector address indicates logic “1” at the DQ2 bit.
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13. DQ7
Data Polling
The device features Data Polling as a method to indicate to the host that the Embedded Algorithms are in
progress or completed. During the Embedded Program Algorithm an attempt to read the device produces a
complement of data last written to DQ7. Upon completion of the Embedded Program Algorithm, an attempt to
read device produces true data last written to DQ7. During the Embedded Erase Algorithm, an attempt to read
device produces a “0” at the DQ7 output. Upon completion of the Embedded Erase Algorithm an attempt to read
device produces a “1” on DQ7. The flowchart for Data Polling (DQ7) is shown in “3. Data Polling Algorithm”
( ■FLOW CHART).
For programming, the Data Polling is valid after the rising edge of the fourth write pulse in the four write pulse
sequence.
For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth write pulse in the six
write pulse sequence. Data Polling must be performed at sector address within any of the sectors being erased,
not a protected sectors. Otherwise, the status may be invalid.
Once the Embedded Algorithm operation is close to being completed, the device data pins (DQ7) may change
asynchronously while the output enable (OE) is asserted low. This means that the device is driving status
information on DQ7 at one instant of time and then that byte’s valid data the next instant of time. Depending on
when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed
the Embedded Algorithm operation and DQ7 has a valid data, the data outputs on DQ0 to DQ6 may be still invalid.
The valid data on DQ0 to DQ7 will be read on the successive read attempts.
The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm, Erase Suspend mode or sector erase time-out. (See “Hardware Sequence Flags” Table.)
See “6. Data Polling during Embedded Algorithm Operation Timing Diagram” in ■TIMING DIAGRAM for the
Data Polling timing specifications and diagrams.
14. DQ6
Toggle Bit I
The device also features the “Toggle Bit I” as a method to indicate to the host system that the Embedded
Algorithms are in progress or completed.
During Embedded Program or Erase Algorithm cycle, successive attempts to read (CE or OE toggling) data
from the device results in DQ6 toggling between one and zero. Once the Embedded Program or Erase Algorithm
cycle is completed, DQ6 stops toggling and valid data is read on the next successive attempts. During programming, the Toggle Bit I is valid after the rising edge of the fourth write pulse in the four write pulse sequence. For
chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth write pulse in the six write
pulse sequence. The Toggle Bit I is active during the sector time out.
In program operation, if the sector being written to be protected, the toggle bit toggles for about 1 μs and then
stops toggling with data unchanged. In erase operation, the device erases all selected sectors except for ones
that are protected. If all selected sectors are protected, chip toggles the toggle bit for about 400 μs and then
drop back into read mode, having data unchanged.
Either CE or OE toggling causes DQ6 to toggle.
See “7. Toggle Bit I during Embedded Algorithm Operation Timing Diagram” in ■TIMING DIAGRAM for the
Toggle Bit I timing specifications and diagrams.
15. DQ5
Exceeded Timing Limits
DQ5 indicates if the program or erase time has exceeded the specified limits (internal pulse count) . Under these
conditions DQ5 produces a “1”. This is a failure condition which indicates that the program or erase cycle was
not successfully completed. Data Polling is the only operating function of device under this condition. The CE
circuit partially powers down device under these conditions (to approximately 2 mA) . The OE and WE pins
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control the output disable functions as described in “MBM29LV320TE/BE User Bus Operations Tables (BYTE
= VIH and BYTE = VIL)” (■DEVICE BUS OPERATIONS).
The DQ5 failure condition may also appear if a user tries to program a non blank location without erasing. In this
case the device locks out and never complete the Embedded Algorithm operation. Hence, the system never
read valid data on DQ7 bit and DQ6 never stop toggling. Once the device has exceeded timing limits, the DQ5
bit indicates a “1.” Please note that this is not a device failure condition since device was incorrectly used. If
this occurs, reset device with command sequence.
16. DQ3
Sector Erase Timer
After completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 remains
low until the time-out is completed. Data Polling and Toggle Bit are valid after the initial sector erase command
sequence.
If Data Polling or Toggle Bit I indicates device has been written with a valid erase command, DQ3 may be used
to determine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled erase cycle
has begun; attempts to write subsequent commands to the device be ignored until the erase operation is
completed as indicated by Data Polling or Toggle Bit I. If DQ3 is low (“0”) , the device will accept additional sector
erase commands. To insure the command has been accepted, the system software should check the status of
DQ3 prior to and following each subsequent Sector Erase command. If DQ3 were high on the second status
check, the command may not have been accepted.
See “Hardware Sequence Flags Table”.
17. DQ2
Toggle Bit II
This toggle bit II, along with DQ6, can be used to determine whether the device is in the Embedded Erase
Algorithm or in Erase Suspend.
Successive reads from the erasing sector cause DQ2 to toggle during the Embedded Erase Algorithm. If the
device is in the erase-suspended-read mode, successive reads from the erase-suspended sector causes DQ2
to toggle. When the device is in the erase-suspended-program mode, successive reads from the byte address
of the non-erase suspended sector indicate a logic “1” at the DQ2 bit.
DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or erase, or erase suspend
program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized
as follows :
For example, DQ2 and DQ6 are used together to determine if the erase-suspend-read mode is in progress. (DQ2
toggles while DQ6 does not.) See also “Toggle Bit Status Table” and “8. DQ2 vs DQ6” in ■TIMING DIAGRAM.
Furthermore, DQ2 is used to determine which sector is being erased. When the device is in the erase mode,
DQ2 toggles if this bit is read from an erasing sector.
18. Reading Toggle Bits DQ6/DQ2
Whenever the system initially begins reading toggle bit status, it must read DQ7 to DQ0 at least twice in a row
to determine whether a toggle bit is toggling. Typically, a system would note and store the value of the toggle bit
after the first read. After the second read, the system would compare the new value of the toggle bit with the
first read. If the toggle bit is not toggling, indicates that the device has completed the program or erase operation.
The system can read array data on DQ7 to DQ0 on the following read cycle.
However if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system
also should note whether the value of DQ5 is high (see “15. DQ5”) . If it is the system should then determine
again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5 went high.
If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If
it is still toggling, the device did not complete the operation successfully, and the system must write the reset
command to return to reading array data.
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The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, the system may choose to perform other
system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine
the status of the operation. See “4. Toggle Bit Algorithm” in ■FLOW CHART.
Toggle Bit Status Table
Mode
DQ7
DQ6
DQ2
DQ7
Toggle
1
Erase
0
Toggle
Toggle*1
Erase-Suspend Read
(Erase-Suspended Sector)
1
1
Toggle
DQ7
Toggle
1*2
Program
Erase-Suspend Program
*1 : Successive reads from the erasing or erase-suspend sector cause DQ2 to toggle.
*2 : Reading from non-erase suspend sector address indicates logic “1” at the DQ2 bit.
19. RY/BY
Ready/Busy
The device provides a RY/BY open-drain output pin as a way to indicate to the host system that the Embedded
Algorithms are either in progress or has been completed. If output is low, the device is busy with either a program
or erase operation. If output is high, the device is ready to accept any read/write or erase operation. When the
RY/BY pin is low, the device will not accept any additional program or erase commands. If the device is placed
in an Erase Suspend mode, RY/BY output is high.
During programming, RY/BY pin is driven low after the rising edge of the fourth write pulse. During an erase
operation, RY/BY pin is driven low after the rising edge of the sixth write pulse. RY/BY pin indicates a busy
condition during RESET pulse. See “9. RY/BY Timing Diagram during Program/Erase operations” and “10.
RESET, RY/BY Timing Diagram” in ■TIMING DIAGRAM for a detailed timing diagram. RY/BY pin is pulled high
in standby mode.
Since this is an open-drain output, the pull-up resistor needs to be connected to VCC ; multiples of devices may
be connected to the host system via more than one RY/BY pin in parallel.
20. Byte/Word Configuration
BYTE pin selects byte (8-bit) mode or word (16-bit) mode for device. When this pin is driven high, the device
operates in word (16-bit) mode. Data is read and programmed at DQ15 to DQ0. When this pin is driven low, the
device operates in byte (8-bit) mode. Under this mode, DQ15/A-1 pin becomes the lowest address bit, and DQ14
to DQ8 bits are tri-stated. However, the command bus cycle is always an 8-bit operation and hence commands
are written at DQ15 to DQ8 and the DQ7 to DQ0 bits are ignored. See “11. Word Mode Configuration Timing
Diagram”, “12. Byte Mode Configuration Timing Diagram” and “13. BYTE Timing Diagram for Write Operations”
in ■TIMING DIAGRAM the detail .
21. Data Protection
The device is designed to offer protection against accidental erasure or programming caused by spurious system
level signals that may exist during power transitions. During power up device automatically resets internal state
machine in Read mode. Also, with its control register architecture, alteration of memory contents only occurs
after successful completion of specific multi-bus cycle command sequences.
The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up
and power-down transitions or system noise.
36
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
22. Low VCC Write Inhibit
To avoid initiation of a write cycle during VCC power-up and power-down, write cycle is locked out for VCC less
than VLKO (Min) . If VCC < VLKO, the command register is disabled and all internal program/erase circuits are
disabled. Under this condition the device resets to the read mode. Subsequent writes are ignored until the VCC
level is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to
prevent unintentional writes when VCC is above VLKO (Min) .
If Embedded Erase Algorithm is interrupted, there is possibility that the erasing sector (s) cannot be used.
23. Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (Typ) on OE, CE, or WE does not initiate write cycle.
24. Logical Inhibit
Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a write cycle CE and WE
must be logical zero while OE is a logical one.
25. Power-Up Write Inhibit
Power-up of the device with WE = CE = VIL and OE = VIH does not accept commands on the rising edge of WE.
The internal state machine is automatically reset to the read mode on power-up.
26. Sector Group Protection
Device user is able to protect each sector group individually to store and protect data. Protection circuit voids
both write and erase commands that are addressed to protected sectors.
Any commands to write or erase addressed to protected sector are ignore. (See “7. Sector Group Protection”
in ■FUNCTIONAL DESCRIPTION.)
Retired Product
DS05-20894-5E_July 31, 2007
37
MBM29LV320TE/BE80/90/10
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Min
Max
Tstg
−55
+125
°C
TA
−40
+85
°C
VIN, VOUT
−0.5
VCC + 0.5
V
Power Supply Voltage *1
VCC
−0.5
+4.0
V
A9, OE, and RESET *1, *3
VIN
−0.5
+13.0
V
1, 4
VACC
−0.5
+13.0
V
Storage Temperature
Ambient Temperature with Power Applied
Voltage with Respect to Ground All pins except A9,
OE, and RESET *1, *2
WP/ACC * *
*1 : Voltage is defined on the basis of VSS = GND = 0 V.
*2 : Minimum DC voltage on input or l/O pins is −0.5 V. During voltage transitions, input or I/O pins may
undershoot VSS to −2.0 V for periods of up to 20 ns. Maximum DC voltage on input or l/O pins is
VCC + 0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC + 2.0 V for periods of up to
20 ns.
* 3: Minimum DC input voltage on A9, OE and RESET pins is −0.5 V. During voltage transitions, A9, OE and RESET
pins may undershoot VSS to −2.0 V for periods of up to 20 ns. Voltage difference between input
and supply voltage (VIN − VCC) does not exceed +9.0 V.Maximum DC input voltage on A9, OE and RESET pins
is +13.0 V which may overshoot to +14.0 V for periods of up to 20 ns.
* 4: Minimum DC input voltage on WP/ACC pin is −0.5 V. During voltage transitions, WP/ACC pin may
undershoot VSS to −2.0 V for periods of up to 20 ns. Maximum DC input voltage on WP/ACC pin is
+13.0 V which may overshoot to +12.0 V for periods of up to 20 ns when VCC is applied.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Ambient Temperature
TA
Power Supply Voltage*
VCC
Part No.
Value
Min
Max
MBM29LV320TE/BE 80/90/10
−40
+85
MBM29LV320TE/BE 80/90
+3.0
+3.6
MBM29LV320TE/BE 10
+2.7
+3.6
Unit
°C
V
* : Voltage is defined on the basis of VSS = GND = 0 V.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
38
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
■ MAXIMUM OVERSHOOT/MAXIMUM UNDERSHOOT
20 ns
20 ns
+0.6 V
−0.5 V
−2.0 V
20 ns
Maximum Undershoot Waveform
20 ns
VCC + 2.0 V
VCC + 0.5 V
+2.0 V
20 ns
20 ns
Maximum Overshoot Waveform 1
20 ns
+14.0 V
+13.0 V
VCC + 0.5 V
20 ns
20 ns
Note : This waveform is applied for A9, OE, and RESET.
Maximum Overshoot Waveform 2
Retired Product
DS05-20894-5E_July 31, 2007
39
MBM29LV320TE/BE80/90/10
■ DC CHARACTERISTICS
Parameter
Symbol
Conditions
Min
Max
Unit
Input Leakage Current
ILI
VIN = VSS to VCC, VCC = VCC Max
−1.0
+1.0
μA
Output Leakage Current
ILO
VOUT = VSS to VCC, VCC = VCC Max
−1.0
+1.0
μA
A9, OE, RESET Inputs Leakage
Current
ILIT
VCC = VCC Max,
A9, OE, RESET = 12.5 V
⎯
35
μA
CE = VIL, OE = VIH,
f = 5 MHz
VCC Active Current *1
ICC1
CE = VIL, OE = VIH,
f = 1 MHz
Byte
Word
Byte
Word
16
⎯
18
7
⎯
7
mA
VCC Active Current *2
ICC2
CE = VIL, OE = VIH
⎯
40
mA
VCC Current (Standby)
ICC3
VCC = VCC Max, CE = VCC ± 0.3 V,
RESET = VCC ± 0.3 V
⎯
5
μA
VCC Current (Standby, Reset)
ICC4
VCC = VCC Max, WE/ACC = VCC ±
0.3 V, RESET = VSS ± 0.3 V
⎯
5
μA
VCC Current
(Automatic Sleep Mode) *3
ICC5
VCC = VCC Max, CE = VSS ± 0.3 V,
RESET = VCC ± 0.3 V
VIN = VCC ± 0.3 V or VSS ± 0.3 V
⎯
5
μA
WP/ACC Accelerated Program
Current
IACC
VCC = VCC Max,
WP/ACC = VACC Max
⎯
20
mA
Input Low Voltage
VIL
⎯
− 0.5
+ 0.6
V
Input High Voltage
VIH
⎯
2.0
VCC + 0.3
V
VACC
⎯
11.5
12.5
V
Voltage for Autoselect and Sector
Group Protection (A9, OE, RESET) *4
VID
⎯
11.5
12.5
V
Output Low Voltage
VOL
IOL = 4.0 mA, VCC = VCC Min
⎯
0.45
V
VOH1
IOH = −2.0 mA, VCC = VCC Min
2.4
⎯
V
VOH2
IOH = −100 μA
VCC − 0.4
⎯
V
2.3
2.5
V
Voltage for WP/ACC Sector
Protection/Unprotection and
Program Acceleration
Output High Voltage
Low VCC Lock-Out Voltage
VLKO
⎯
* 1: The ICC current listed includes both the DC operating current and the frequency dependent component.
* 2: ICC active while Embedded Algorithm (program or erase) is in progress.
* 3: Automatic sleep mode enables the low power mode when addresses remain stable for 150 ns.
* 4: Applicable for only VCC applying.
40
mA
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
■ AC CHARACTERISTICS
• Read Only Operations Characteristics
Symbol
Parameter
Value
JEDEC Standard
Condition
80*
90*
Min
Max
Min
Read Cycle Time
tAVAV
tRC
⎯
80
⎯
90
Address to Output Delay
tAVQV
tACC
CE = VIL
OE = VIL
⎯
80
⎯
Chip Enable to Output Delay
tELQV
tCE
OE = VIL
⎯
80
Output Enable to Output Delay
tGLQV
tOE
⎯
⎯
Chip Enable to Output High-Z
tEHQZ
tDF
⎯
Output Enable to Output High-Z
tGHQZ
tDF
Output Hold Time From Addresses,
CE or OE, Whichever Occurs First
tAXQX
RESET Pin Low to Read Mode
CE to BYTE Switching Low or High
10*
Max
Unit
Min Max
100
⎯
ns
90
⎯
100
ns
⎯
90
⎯
100
ns
30
⎯
35
⎯
35
ns
⎯
25
⎯
30
⎯
30
ns
⎯
⎯
25
⎯
30
⎯
30
ns
tOH
⎯
0
⎯
0
⎯
0
⎯
ns
⎯
tREADY
⎯
⎯
20
⎯
20
⎯
20
μs
⎯
tELFL
tELFH
⎯
⎯
5
⎯
5
⎯
5
ns
* : Test Conditions :
Output Load : 1 TTL gate and 30 pF (MBM29LV320TE80, MBM29LV320BE80)
100 pF (MBM29LV320TE90/10, MBM29LV320BE90/10)
Input rise and fall times : 5 ns
Input pulse levels : 0.0 V or 3.0 V
Timing measurement reference level
Input : 1.5 V
Output : 1.5 V
3.3 V
Diode = 1N3064
or Equivalent
2.7 kΩ
Device
Under
Test
6.2 kΩ
CL
Diode = 1N3064
or Equivalent
Notes : CL = 30 pF including jig capacitance (MBM29LV320TE80, MBM29LV320BE80)
CL = 100 pF including jig capacitance (MBM29LV320TE90/10, MBM29LV320BE90/10)
Test Conditions
Retired Product
DS05-20894-5E_July 31, 2007
41
MBM29LV320TE/BE80/90/10
• Write/Erase/Program Operations
Symbol
Parameter
JEDEC
Value
80
(Note)
Standard
90
(Note)
10
(Note)
Min
Typ Max
Min
Typ Max
Min
Unit
Typ Max
Write Cycle Time
tAVAV
tWC
80
⎯
⎯
90
⎯
⎯ 100 ⎯
⎯
ns
Address Setup Time
tAVWL
tAS
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
Address Hold Time
tWLAX
tAH
45
⎯
⎯
45
⎯
⎯
45
⎯
⎯
ns
Data Setup Time
tDVWH
tDS
30
⎯
⎯
35
⎯
⎯
35
⎯
⎯
ns
Data Hold Time
tWHDX
tDH
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
⎯
tOEH
10
⎯
⎯
10
⎯
⎯
10
⎯
⎯
ns
Read Recover Time Before Write
tGHWL
tGHWL
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
Read Recover Time Before Write
(OE High to CE Low)
tGHEL
tGHEL
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
CE Setup Time
tELWL
tCS
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
WE Setup Time
tWLEL
tWS
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
CE Hold Time
tWHEH
tCH
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
WE Hold Time
tEHWH
tWH
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
Write Pulse Width
tWLWH
tWP
35
⎯
⎯
35
⎯
⎯
35
⎯
⎯
ns
CE Pulse Width
tELEH
tCP
35
⎯
⎯
35
⎯
⎯
35
⎯
⎯
ns
Write Pulse Width High
tWHWL
tWPH
25
⎯
⎯
30
⎯
⎯
30
⎯
⎯
ns
CE Pulse Width High
tEHEL
tCPH
25
⎯
⎯
30
⎯
⎯
30
⎯
⎯
ns
tWHWH1
tWHWH1
⎯
8
⎯
⎯
8
⎯
⎯
8
⎯
μs
⎯
16
⎯
⎯
16
⎯
⎯
16
⎯
μs
tWHWH2
tWHWH2
⎯
1
⎯
⎯
1
⎯
⎯
1
⎯
s
⎯
tVCS
50
⎯
⎯
50
⎯
⎯
50
⎯
⎯
μs
⎯
tVIDR
500 ⎯
⎯ 500 ⎯
⎯ 500 ⎯
⎯
ns
⎯
tVACCR
500 ⎯
⎯ 500 ⎯
⎯ 500 ⎯
⎯
ns
⎯
tVLHT
⎯
⎯
⎯
⎯
μs
⎯ 100 ⎯
⎯ 100 ⎯
⎯
μs
Output
Enable Hold
Time
Read
Toggle and Data Polling
Byte
Programming Operation
Word
Sector Erase Operation *1
VCC Setup Time
Rise Time to VID *
2
Rise Time to VACC *
3
Voltage Transition Time *2
4
⎯
⎯
4
⎯
tWPP
2
⎯
tOESP
4
⎯
⎯
4
⎯
⎯
4
⎯
⎯
μs
2
⎯
tCSP
4
⎯
⎯
4
⎯
⎯
4
⎯
⎯
μs
Recover Time From RY/BY
⎯
tRB
0
⎯
⎯
0
⎯
⎯
0
⎯
⎯
ns
RESET Pulse Width
⎯
tRP
500 ⎯
⎯ 500 ⎯
⎯ 500 ⎯
⎯
ns
RESET High Level Period Before Read
⎯
tRH
200 ⎯
⎯ 200 ⎯
⎯ 200 ⎯
⎯
ns
Write Pulse Width *2
OE Setup Time to WE Active *
CE Setup Time to WE Active *
100 ⎯
4
(Continued)
42
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
(Continued)
Symbol
Parameter
JEDEC
Value
80
(Note)
Standard
90
(Note)
10
(Note)
Unit
Min
Typ
Max
Min
Typ Max Min Typ
Max
BYTE Switching Low to Output High-Z
⎯
tFLQZ
⎯
⎯
30
⎯
⎯
30
⎯
⎯
30
ns
BYTE Switching High to Output Active
⎯
tFHQV
⎯
⎯
80
⎯
⎯
90
⎯
⎯ 100
ns
Program/Erase Valid to RY/BY Delay
⎯
tBUSY
⎯
⎯
90
⎯
⎯
90
⎯
⎯
90
ns
Delay Time from Embedded Output
Enable
⎯
tEOE
⎯
⎯
80
⎯
⎯
90
⎯
⎯ 100
ns
Erase Time-out Time
⎯
tTOW
50
⎯
⎯
50
⎯
⎯
50
⎯
⎯
μs
Erase Suspend Transition Time
⎯
tSPD
⎯
⎯
20
⎯
⎯
20
⎯
⎯
20
μs
*1 : This does not include the preprogramming time.
*2 : This timing is for Sector Group Protection operation.
*3 : This timing is limited for Accelerated Program operation only.
Retired Product
DS05-20894-5E_July 31, 2007
43
MBM29LV320TE/BE80/90/10
■ ERASE AND PROGRAMMING PERFORMANCE
Limits
Parameter
Unit
Min
Typ
Max
Sector Erase Time
⎯
1
10
s
Word Programming Time
⎯
16
360
μs
Byte Programming Time
⎯
8
300
μs
Chip Programming Time
⎯
⎯
100
s
100,000
⎯
⎯
cycle
Program/Erase Cycle
Comments
Excludes programming time
prior to erasure
Excludes system-level
overhead
Excludes system-level
overhead
⎯
■ TSOP (1) PIN CAPACITANCE
Parameter
Symbol
Condition
Value
Typ
Max
Unit
Input Capacitance
CIN
VIN = 0
6.0
7.5
pF
Output Capacitance
COUT
VOUT = 0
8.5
12.0
pF
Control Pin Capacitance
CIN2
VIN = 0
8.0
10.0
pF
WP/ACC Pin Capacitance
CIN3
VIN = 0
15.0
20.0
pF
Notes : • Test conditions TA = + 25 °C, f = 1.0 MHz
• DQ15/A-1 pin capacitance is stipulated by output capacitance.
■ FBGA PIN CAPACITANCE
Parameter
Symbol
Condition
Typ
Max
Unit
Input Capacitance
CIN
VIN = 0
6.0
7.5
pF
Output Capacitance
COUT
VOUT = 0
8.5
12.0
pF
Control Pin Capacitance
CIN2
VIN = 0
8.0
10.0
pF
WP/ACC Pin Capacitance
CIN3
VIN = 0
15.0
20.0
pF
Notes : • Test conditions TA = + 25 °C, f = 1.0 MHz
• DQ15/A-1 pin capacitance is stipulated by output capacitance.
44
Value
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
■ TIMING DIAGRAM
• Key to Switching Waveforms
WAVEFORM
INPUTS
OUTPUTS
Must Be
Steady
Will Be
Steady
May
Change
from H to L
Will
Change
from H to L
May
Change
from L to H
Will
Change
from L to H
"H" or "L"
Any Change
Permitted
Changing
State
Unknown
Does Not
Apply
Center Line is
HighImpedance
"Off" State
1. Read Operation Timing Diagram
tRC
Address
Address Stable
tACC
CE
tOE
tDF
OE
tOEH
WE
tOH
tCE
High-Z
Outputs
Retired Product
Output Valid
DS05-20894-5E_July 31, 2007
High-Z
45
MBM29LV320TE/BE80/90/10
2. Hardware Reset/Read Operation Timing Diagram
tRC
Address
Address Stable
tACC
CE
tRH
tRP
tRH
tCE
RESET
tOH
High-Z
Outputs
Output Valid
3. Alternate WE Controlled Program Operation Timing Diagram
3rd Bus Cycle
Data Polling
555h
Address
tWC
PA
PA
tAS
tRC
tAH
CE
tCS
tCH
tCE
OE
tGHWL
tWP
tOE
tWPH
tWHWH1
WE
tDS tDH
Data
A0h
PD
DQ7
DOUT
Notes : • PA is address of the memory location to be programmed.
• PD is data to be programmed at byte address.
• DQ7 is the output of the complement of the data written to the device.
• DOUT is the output of the data written to the device.
• Figure indicates last two bus cycles out of four bus cycle sequence.
• These waveforms are for the ×16 mode. The addresses differ from ×8 mode.
46
tOH
tDF
Retired Product
DS05-20894-5E_July 31, 2007
DOUT
MBM29LV320TE/BE80/90/10
4. Alternate CE Controlled Program Operation Timing Diagram
3rd Bus Cycle
Data Polling
555h
Address
tWC
PA
PA
tAS
tAH
WE
tWS
tWH
OE
tGHEL
tCP
tCPH
tWHWH1
CE
tDS
Data
tDH
A0h
PD
DQ7
DOUT
Notes : • PA is address of the memory location to be programmed.
• PD is data to be programmed at byte address.
• DQ7 is the output of the complement of the data written to the device.
• DOUT is the output of the data written to the device.
• Figure indicates last two bus cycles out of four bus cycle sequence.
• These waveforms are for the ×16 mode. The addresses differ from ×8 mode.
Retired Product
DS05-20894-5E_July 31, 2007
47
MBM29LV320TE/BE80/90/10
5. Chip/Sector Erase Operation Timing Diagram
555h
Address
tWC
2AAh
tAS
555h
555h
2AAh
SA*
tAH
CE
tCS
tCH
OE
tGHWL
tWP
tWPH
tDS
tDH
WE
AAh
10h for Chip Erase
55h
80h
AAh
55h
Data
10h/
30h
tVCS
VCC
* : SA is the sector address for Sector Erase. Addresses = 555h (Word), AAAh (Byte) for Chip Erase.
Note : These waveforms are for the ×16 mode. The addresses differ from ×8 mode.
48
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
6. Data Polling during Embedded Algorithm Operation Timing Diagram
CE
tCH
tDF
tOE
OE
tOEH
WE
tCE
*
Data
DQ7
DQ7 =
Valid Data
DQ7
High-Z
tWHWH1 or 2
DQ6 to DQ0
DQ6 to DQ0 =
Output Flag
Data
DQ6 to DQ0
Valid Data
High-Z
tEOE
tBUSY
RY/BY
* : DQ7 = Valid Data (The device has completed the Embedded operation) .
7. Toggle Bit I during Embedded Algorithm Operation Timing Diagram
CE
tOEH
WE
OE
tDH
DQ6
Data (DQ0 to DQ7)
*
DQ6 = Toggle
DQ6 = Toggle
DQ6 =
Stop Toggling
DQ0 to DQ7
Data Valid
tOE
* : DQ6 = Stops toggling. (The device has completed the Embedded operation.)
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MBM29LV320TE/BE80/90/10
8. DQ2 vs. DQ6
Enter
Embedded
Erasing
WE
Erase
Suspend
Erase
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
DQ6
DQ2 *
Toggle
DQ2 and DQ6
with OE or CE
* : DQ2 is read from the erase-suspended sector.
9. RY/BY Timing Diagram during Program/Erase Operations
CE
Rising edge of the last write pulse
WE
Entire programming
or erase operations
RY/BY
tBUSY
10. RESET, RY/BY Timing Diagram
WE
RESET
tRP
tRB
RY/BY
tREADY
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Erase
Complete
MBM29LV320TE/BE80/90/10
11. Word Mode Configuration Timing Diagram
CE
tCE
BYTE
Data Output
DQ14 to DQ0
Data Output
(DQ14 to DQ0)
(DQ7 to DQ0)
tELFH
tFHQV
A-1
DQ15/A-1
DQ15
12. Byte Mode Configuration Timing Diagram
CE
BYTE
DQ14 to DQ0
tELFL
Data Output
Data Output
(DQ14 to DQ0)
(DQ7 to DQ0)
tACC
DQ15/A-1
A-1
DQ15
tFLQZ
13. BYTE Timing Diagram for Write Operations
Falling edge of last write signal
CE or WE
Input
Valid
BYTE
tAS
Retired Product
tAH
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MBM29LV320TE/BE80/90/10
14. Sector Group Protection Timing Diagram
A20, A19, A18
A17, A16, A15
A14, A13, A12
SPAX
SPAY
A6, A0
A1
VID
VIH
A9
tVLHT
VID
VIH
OE
tVLHT
tVLHT
tVLHT
tWPP
WE
tOESP
tCSP
CE
01h
Data
tOE
tVCS
VCC
SPAX : Sector Group Address to be protected.
SPAY : Next Sector Group Address to be protected.
Note : A-1 is VIL on byte mode.
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15. Temporary Sector Group Unprotection Timing Diagram
VCC
tVIDR
tVCS
tVLHT
VID
VIH
RESET
CE
WE
tVLHT
Program or Erase Command Sequence
tVLHT
RY/BY
Unprotection period
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MBM29LV320TE/BE80/90/10
16. Extended Sector Group Protection Timing Diagram
VCC
tVCS
RESET
tVLHT
tVIDR
tWC
Address
tWC
SPAX
SPAX
SPAY
A6, A0
A1
CE
OE
TIME-OUT
tWP
WE
Data
60h
60h
40h
01h
tOE
SPAX : Sector Group Address to be protected
SPAY : Next Sector Group Address to be protected
TIME-OUT : Time-Out window = 250 μs (Min)
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60h
MBM29LV320TE/BE80/90/10
17. Accelerated Program Timing Diagram
VCC
tVACCR
tVCS
tVLHT
VACC
VIH
WP/ACC
CE
WE
tVLHT
Program Command Sequence
tVLHT
RY/BY
Acceleration period
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MBM29LV320TE/BE80/90/10
■ FLOW CHART
1. Embedded ProgramTM Algorithm
EMBEDDED ALGORITHM
Start
Write Program
Command Sequence
(See Below)
Data Polling
No
Increment Address
No
Verify Data
?
Yes
Embedded
Program
Algorithm
in progress
Last Address
?
Yes
Programming Completed
Program Command Sequence (Address/Command):
555h/AAh
2AAh/55h
555h/A0h
Program Address/Program Data
Notes: • The sequence is applied for × 16 mode.
• The addresses differ from × 8 mode.
56
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2. Embedded EraseTM Algorithm
EMBEDDED ALGORITHM
Start
Write Erase
Command Sequence
(See Below)
Data Polling
No
Data = FFh
?
Yes
Embedded
Erase
Algorithm
in progress
Erasure Completed
Chip Erase Command Sequence
(Address/Command):
Individual Sector/Multiple Sector
Erase Command Sequence
(Address/Command):
555h/AAh
555h/AAh
2AAh/55h
2AAh/55h
555h/80h
555h/80h
555h/AAh
555h/AAh
2AAh/55h
2AAh/55h
555h/10h
Sector Address
/30h
Sector Address
/30h
Sector Address
/30h
Additional sector
erase commands
are optional.
Note : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
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MBM29LV320TE/BE80/90/10
3. Data Polling Algorithm
VA = Address for programming
= Any of the sector addresses
within the sector being erased
during sector erase or multiple
erases operation
= Any of the sector addresses
within the sector not being
protected during sector erase or
multiple sector erases
operation
Start
Read Byte
(DQ7 to DQ0)
Addr. = VA
DQ7 = Data?
Yes
No
No
DQ5 = 1?
Yes
Read Byte
(DQ7 to DQ0)
Addr. = VA
DQ7 = Data?
*
No
Fail
Yes
Pass
* : DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
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4. Toggle Bit Algorithm
Start
Read DQ7 to DQ0
Addr. = "H" or "L"
*1
Read DQ7 to DQ0
Addr. = "H" or "L"
DQ6
= Toggle?
No
Yes
No
DQ5 = 1?
Yes
*1, *2
Read DQ7 to DQ0
Addr. = "H" or "L"
Read DQ7 to DQ0
Addr. = "H" or "L"
DQ6
= Toggle?
*1, *2
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation
Complete
*1 : Read toggle bit twice to determine whether it is toggling.
*2 : Recheck toggle bit because it may stop toggling as DQ5 changes to “1”.
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MBM29LV320TE/BE80/90/10
5. Sector Group Protection Algorithm
Start
Setup Sector Group Addr.
A20, A19, A18, A17,A16,
A15, A14, A13, A12
(
)
PLSCNT = 1
OE = VID, A9 = VID,
CE = VIL, RESET = VIH
A6 = A0 = VIL, A1 = VIH
Activate WE Pulse
Increment PLSCNT
Time out 100 μs
WE = VIH, CE = OE = VIL
(A9 should remain VID)
Read from Sector Group
A1 = VIH *
( Addr.A6= =SPA,
)
A0 = VIL
No
PLSCNT = 25?
Yes
Remove VID from A9
Write Reset Command
No
Data = 01h?
Yes
Protect Another Sector
Group ?
No
Device Failed
Remove VID from A9
Write Reset Command
Sector Group Protection
Completed
* : A-1 is V IL on byte mode.
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Yes
MBM29LV320TE/BE80/90/10
6. Temporary Sector Group Unprotection Algorithm
Start
RESET = VID
*1
Perform Erase or
Program Operations
RESET = VIH
Temporary Sector Group
Unprotection Completed
*2
*1 : All protected sectors groups are unprotected.
*2 : All previously protected sectors groups are protected once again.
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MBM29LV320TE/BE80/90/10
7. Extended Sector Group Protection Algorithm
Start
RESET = VID
Wait to 4 μs
Device is Operating in
Temporary Sector Group
Unprotection Mode
No
Extended Sector Group
Protection Entry?
Yes
To Setup Sector Group Protection
Write XXXh/60h
PLSCNT = 1
To Protect Sector Group
Write 60h to Sector Address
(A6 = A0 = VIL, A1 = VIH)
Time out 250 μs
To Verify Sector Group Protection
Write 40h to Sector Address
(A6 = A0 = VIL, A1 = VIH)
Increment PLSCNT
Read from Sector Group
Address
(A0 = VIL, A1 = VIH, A6 = VIL)
No
PLSCNT = 25?
Setup Next Sector Group Address
No
Data = 01h?
Yes
Yes
Remove VID from RESET
Write Reset Command
Protection Other Sector
Group ?
No
Remove VID from RESET
Write Reset Command
Device Failed
Sector Group Protection
Completed
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Yes
MBM29LV320TE/BE80/90/10
8. Embedded ProgramTM Algorithm for Fast Mode
FAST MODE ALGORITHM
Start
555h/AAh
Set Fast Mode
2AAh/55h
555h/20h
XXXh/A0h
Program Address/Program Data
Data Polling
In Fast Program
Verify Data?
No
Yes
Increment Address
No
Last Address
?
Yes
Programming Completed
XXXXh/90h
Reset Fast Mode
XXXXh/F0h
Notes : • The sequence is applied for × 16 mode.
• The addresses differ from × 8 mode.
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MBM29LV320TE/BE80/90/10
■ ORDERING INFORMATION
MBM29LV320
T
E
80
TN
PACKAGE TYPE
TN =
48-Pin Thin Small Outline Package
(TSOP) Normal Bend
TR = 48-Pin Thin Small Outline Package
(TSOP) Reverse Bend
PBT = 63-Ball Fine pitch Ball Grid Array
Package (FBGA)
SPEED OPTION
See Product Selector Guide
DEVICE REVISION
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
MBM29LV320
32Mega-bit (4 M × 8-Bit or 2 M × 16-Bit) Flash Memory
3.0 V-only Read, Program, and Erase
Part No.
Package
Access Time(ns)
MBM29LV320TE80TN
MBM29LV320TE90TN
MBM29LV320TE10TN
48-pin plastic TSOP (1)
(FPT-48P-M19)
Normal Bend
80
90
100
MBM29LV320TE80TR
MBM29LV320TE90TR
MBM29LV320TE10TR
48-pin plastic TSOP (1)
(FPT-48P-M20)
Reverse Bend
80
90
100
MBM29LV320TE80PBT
MBM29LV320TE90PBT
MBM29LV320TE10PBT
63-pin plastic FBGA
(BGA-63P-M01)
80
90
100
MBM29LV320BE80TN
MBM29LV320BE90TN
MBM29LV320BE10TN
48-pin plastic TSOP (1)
(FPT-48P-M19)
Normal Bend
80
90
100
MBM29LV320BE80TR
MBM29LV320BE90TR
MBM29LV320BE10TR
48-pin plastic TSOP (1)
(FPT-48P-M20)
Reverse Bend
80
90
100
63-pin plastic FBGA
(BGA-63P-M01)
80
90
100
MBM29LV320BE80PBT
MBM29LV320BE90PBT
MBM29LV320BE10PBT
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Remarks
Top Sector
Bottom Sector
MBM29LV320TE/BE80/90/10
■ PACKAGE DIMENSIONS
Note 1) *: Values do not include resin protrusion.
Resin protrusion and gate protrusion are +0.15(.006)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
48-pin plastic TSOP(1)
(FPT-48P-M19)
LEAD No.
1
48
INDEX
Details of "A" part
0.25(.010)
0~8˚
0.60±0.15
(.024±.006)
24
25
* 12.00±0.20
20.00±0.20
(.787±.008)
* 18.40±0.20
(.724±.008)
"A"
(.472±.008)
+0.10
1.10 –0.05
+.004
.043 –.002
(Mounting
height)
0.10±0.05
(.004±.002)
(Stand off height)
0.50(.020)
0.10(.004)
+0.03
0.22±0.05
(.009±.002)
0.17 –0.08
+.001
.007 –.003
C
0.10(.004)
M
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
2003 FUJITSU LIMITED F48029S-c-6-7
Note 1) *: Values do not include resin protrusion.
Resin protrusion and gate protrusion are +0.15(.006)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
48-pin plastic TSOP(1)
(FPT-48P-M20)
LEAD No.
1
48
Details of "A" part
INDEX
0.60±0.15
(.024±.006)
0~8˚
0.25(.010)
24
25
+0.03
0.17 –0.08
+.001
.007 –.003
0.50(.020)
0.10(.004)
0.22±0.05
(.009±.002)
M
0.10±0.05
(.004±.002)
(Stand off height)
+0.10
"A"
1.10 –0.05
+.004
* 18.40±0.20
.043 –.002
(Mounting height)
(.724±.008)
20.00±0.20
(.787±.008)
C
0.10(.004)
* 12.00±0.20(.472±.008)
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
2003 FUJITSU LIMITED F48030S-c-6-7
(Continued)
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MBM29LV320TE/BE80/90/10
(Continued)
63-pin plastic FBGA
(BGA-63P-M01)
+0.15
11.00±0.10(.433±.004)
1.05 –0.10
(8.80(.346))
+.006
.041 –.004
(Mounting height)
(7.20(.283))
(5.60(.220))
0.38±0.10
(.015±.004)
(Stand off)
0.80(.031)TYP
8
7
6
7.00±0.10
(.276±.004)
5
(4.00(.157))
(5.60(.220))
4
3
2
1
M
L
K
J
H
G
F
E
D
C
B
A
INDEX AREA
INDEX BALL
63-ø0.45±0.05
(63-ø0.18±.002)
0.08(.003)
M
0.10(.004)
C
66
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
2001 FUJITSU LIMITED B63001S-c-2-2
Retired Product
DS05-20894-5E_July 31, 2007
MBM29LV320TE/BE80/90/10
Revision History
Revision DS05-20894-5E（July 31, 2007）
The following comment is added.
This product has been retired and is not recommended for new designs. Availability of this
document is retained for reference and historical purposes only.
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MBM29LV320TE/BE80/90/10
FUJITSU LIMITED
All Rights Reserved.
For further information please contact:
Japan
FUJITSU LIMITED
Marketing Division
Electronic Devices
Shinjuku Dai-Ichi Seimei Bldg. 7-1,
Nishishinjuku 2-chome, Shinjuku-ku,
Tokyo 163-0721, Japan
Tel: +81-3-5322-3353
Fax: +81-3-5322-3386
http://edevice.fujitsu.com/
North and South America
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94088-3470, U.S.A.
Tel: +1-408-737-5600
Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fme.fujitsu.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD.
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-6281-0770
Fax: +65-6281-0220
http://www.fmal.fujitsu.com/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
1702 KOSMO TOWER, 1002 Daechi-Dong,
Kangnam-Gu,Seoul 135-280
Korea
Tel: +82-2-3484-7100
Fax: +82-2-3484-7111
http://www.fmk.fujitsu.com/
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0305
© FUJITSU LIMITED Printed in Japan
Retired Product
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