ESDASCY Automotive quad Transil™ array for ESD protection Datasheet production data Features ■ 4 unidirectional Transil functions ■ Low leakage current: IR max. < 20 µA at VRM ■ 400 W peak pulse power (8/20 µs) Benefits ■ High EOS and ESD protection levels ■ High integration ■ Suitable for high density boards ■ AEC-Q101 qualified SOT23-5L (SC-59) Figure 1. Complies with the following standards: ■ ■ ISO 10605: C = 330 pF, R = 330 – 30 kV (air discharge) – 30 kV (contact discharge) ■ ISO 7637-2 – Pulse 1: VS = -100 V – Pulse 2a: VS = +50 V – Pulse 3a: VS = -150 V – Pulse 3b: VS = +100 V 3 Figure 2. Where ESD and EOS transient overvoltage protection in susceptible equipment is required, such as: Information - entertainment ■ Signal communications ■ Connectivity ■ Comfort and convenience 5 2 Applications ■ ESDA14V2SC5Y configuration 1 ISO 10605: C = 150 pF, R = 330 – 30 kV (air discharge) – 30 kV (contact discharge) SOT23-6L (SC-59) 4 ESDA6V1SC6Y and ESDA25SC6Y configuration 1 6 2 5 3 4 Description The ESDASCY devices are monolithic voltage suppressors designed to protect components which are connected to data and transmission lines against ESD. They clamp the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transient. TM: Transil is a trademark of STMicroelectronics. September 2012 This is information on a product in full production. Doc ID 022084 Rev 1 1/12 www.st.com 12 Characteristics 1 ESDASCY Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol VPP PPP Parameter ISO10605 (C = 150 pF, R = 330 ) Contact discharge Air discharge ISO10605 (C = 330 pF, R = 330 ) Contact discharge Air discharge Peak pulse voltage Value 30 30 ESDA5V3SC6Y, ESDA6V1SC6Y 400 ESDA14V2SC5Y, ESDA25SC6Y 300 ESDA5V3SC6Y ESDA6V1SC6Y ESDA14V2SC5Y ESDA25SC6Y 22 18 14 7 A -40 to150 °C -65 to +150 °C 260 °C W IPP Peak pulse current (8/20µs) Tj Operating junction temperature range Tstg Storage temperature range TL Maximum lead temperature for soldering during 10 s For a surge greater than the maximum values, the diode will fail in short-circuit. Symbol VBR VCL IRM VRM IF IPP IR VF Rd aT 2/12 Electrical characteristics (definitions) = = = = = = = = = = kV 30 30 Peak pulse power (8/20µs) Figure 3. Unit Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic impedance Voltage temperature Doc ID 022084 Rev 1 ESDASCY Table 2. Characteristics Electrical characteristics - values (Tamb = 25 °C) VBR @ IR Order code IRM @ VRM VF@ IF typ. max. Rd(2) T Cline(3) typ. max. typ. min. max. V V mA µA V V A V mA m 10-4/C pF ESDA5V3SC6Y 5.3 5.9 1 2 3 18 22 1.25 200 230 5 280 ESDA6V1SC6Y 6.1 7.2 1 20 5.2 22 18 1.25 200 350 6 190 ESDA14V2SC5Y 14.2 15.8 1 5 12 21 14 1.25 200 650 10 100 25 30 1 1 24 30 10 1.2 10 1000 10 60 ESDA25SC6Y max. VCL @ Ipp(1) 1. 8/20 µs waveform 2. Square pulse, Ipp = 15 A, tp= 2.5 µs. 3. VBR = T* (Tamb - 25 °C) * VBR (25 °C) Figure 4. 600 Pulse power versus initial junction Figure 5. temperature PPP (W) 10000 Peak pulse power versus exponential pulse duration (typical values) Ppp(W) 8/20µs 500 1000 400 100 300 200 10 100 tp(µs) Tj (°C) 0 1 0 25 Figure 6. 100 50 75 100 125 150 175 Clamping voltage versus peak pulse current (typical values, 8/20 µs waveform) 10 Figure 7. Ipp(A) 10000 8/20µs TJ=25-C ESDA5V3SC6Y 100 Leakage current versus junction temperature (typical values) IR (nA) ESDA6V1SC6Y (VR=5.2V) 1000 ESDA6V1SC6Y 1000 100 10 ESD14V2SC5Y ESDA5V3SC6Y (VR=3V) 10 ESDA25SCY 1 ESD14V2SC5Y (VR=12V) 1 0.1 Vcl(V) ESDA25SCY (VR=24V) 0,1 Tj(°C) 0.01 4 8 12 16 20 24 28 32 36 25 Doc ID 022084 Rev 1 50 75 100 125 150 3/12 Characteristics ESDASCY Note: ISO7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 V) like ESDA6V1SC6Y. Figure 8. ISO7637-2 pulse 1 response (VS = -100 V) Voltage (V) 15 Voltage ESDA25SC6Y 10 ESDA14V2SC5Y 5 0 -5 Time (ms) -10 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 Current (A) 5 Current 0 ESDA25SC6Y -5 ESDA14V2SC5Y -10 -15 -0.5 Figure 9. 0.0 0.5 1.0 1.5 2.0 2.5 ISO7637-2 pulse 2a response (VS = 50 V) Voltage (V) 50 Voltage 40 ESDA25SC6Y 30 ESDA14V2SC5Y 20 10 0 -20 16 Time (µs) 0 20 40 60 80 100 Current (A) Current 12 ESDA25SC6Y 8 ESDA14V2SC5Y 4 0 Time (µs) -4 -20 4/12 0 20 40 60 Doc ID 022084 Rev 1 80 100 ESDASCY Characteristics Figure 10. ISO7637-2 pulse 3a response (VS = -150 V) Voltage (V) 20 Voltage 15 10 ESDA25SC6Y 5 ESDA14V2SC5Y 0 -5 Time (µs) -10 -0.5 0.5 0.0 0.5 1.0 1.5 2.0 Current (A) Current 0 -0.5 ESDA25SC6Y -1 ESDA14V2SC5Y -1.5 Time (µs) -2 -0.5 0.5 1.5 2.5 3.5 4.5 Figure 11. ISO7637-2 pulse 3b response (VS = 100 V) 50 Voltage (V) Voltage 40 ESDA25SC6Y 30 ESDA14V2SC5Y 20 10 0 -0.2 Time (µs) 0.8 1.8 1.6 Current (A) Current 1.2 ESDA25SC6Y 0.8 ESDA14V2SC5Y 0.4 0 -0.4 -0.2 Time (µs) 0.8 Doc ID 022084 Rev 1 1.8 5/12 Application and design guidelines 2 ESDASCY Application and design guidelines More information is available in the STMicroelectronics Application note AN2689: “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 3 Ordering information Figure 12. Ordering information scheme ESDA ESD array Breakdown voltage 6V1 = 6.1 V 14V2 = 14.2 V 25 = 25 V Package SC5 = SOT23-5L SC6 = SOT23-6L Automotive grade 6/12 Doc ID 022084 Rev 1 XX SCX Y ESDASCY 4 Package information Package information ● Epoxy meets UL94, V0 standard ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT23-5L dimensions Dimensions Ref. A Millimeters Min. Typ. Max. Inches Min. Typ. Max. E e B D e A2 c 0.90 A1 0 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 e A1 θ A L H 1.45 0.035 0.057 0.15 0.006 0 0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.30 0.60 0.012 0.024 M 0° 10° 0° 10° Figure 13. SOT23-5L footprint (dimensions in mm) 0.60 1.20 0.95 3.50 2.30 Doc ID 022084 Rev 1 1.10 7/12 Package information ESDASCY Table 4. SOT23-6L dimensions Dimensions Ref. Millimeters Min. Typ. Max. θ L H A E Min. Typ. Max. A 0.90 A1 0 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 A1 c Inches 1.45 0.035 0.057 0.15 0.006 0 e D b e e A2 0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.30 0.60 0.012 0.024 0° 10° Figure 14. SOT23-6L footprint (dimensions in mm) 0.60 1.20 0.95 3.50 8/12 2.30 Doc ID 022084 Rev 1 1.10 0° 10° ESDASCY Recommendation on PCB assembly Figure 15. Tape and reel specifications 2.0 Ø 1.55 4.0 8.0 3.5 2.1 2.9 1.75 0.21 3.1 4.0 1.24 All dimensions are typical values in mm User direction of unreeling 5 Recommendation on PCB assembly 5.1 Solder paste 5.2 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ±0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. Doc ID 022084 Rev 1 9/12 Recommendation on PCB assembly 5.3 5.4 ESDASCY PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 10/12 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 022084 Rev 1 ESDASCY 6 Ordering information Ordering information Table 5. Ordering information Marking(1) Package ESDA5V3SC6Y ES5Y SOT23-6L ESDA6V1SC6Y ES6Y SOT23-6L ESDA14V2SC5Y EC1Y SOT23-5L ESDA25SC6Y ES2Y SOT23-6L Order codes Weight Base qty Delivery mode 16.7 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location 7 Revision history Table 6. Document revision history Date Revision 04-Sep-2012 1 Changes First issue. Doc ID 022084 Rev 1 11/12 ESDASCY Please Read Carefully: Information in this document is provided solely in connection with ST products. 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