a FEATURES ⴞ1.2% Accuracy Over Line and Load Regulations @ 25ⴗC Ultralow Dropout Voltage: 80 mV Typical @ 50 mA Requires Only C O = 0.47 F for Stability anyCAP = Stable with All Types of Capacitors (Including MLCC) Current and Thermal Limiting Low Noise Low Shutdown Current: 1 A 2.8 V to 12 V Supply Range –20ⴗC to +85ⴗC Ambient Temperature Range Several Fixed Voltage Options Ultrasmall SOT-23-5 Package Excellent Line and Load Regulations anyCAP® 50 mA Low Dropout Linear Regulator ADP3308 FUNCTIONAL BLOCK DIAGRAM Q1 IN OUT ADP3308 THERMAL PROTECTION ERR/NC Q2 R1 CC gm DRIVER R2 SD BANDGAP REF GND APPLICATIONS Cellular Telephones Notebook, Palmtop Computers Battery Powered Systems PCMCIA Regulator Bar Code Scanners Camcorders, Cameras GENERAL DESCRIPTION The ADP3308 is a member of the ADP330x family of precision low dropout anyCAP voltage regulators. It is pin-for-pin and functionally compatible with National’s LP2980, but offers performance advantages. The ADP3308 stands out from the conventional LDOs with a novel architecture and an enhanced process. Its patented design requires only a 0.47 µF output capacitor for stability. This device is stable with any type of capacitor regardless of its ESR (Equivalent Serial Resistance) value, including ceramic types for space restricted applications. The ADP3308 achieves ± 1.2% accuracy at room temperature and ± 2.2% overall accuracy over temperature, line and load regulations. The dropout voltage of the ADP3308 is only 80 mV (typical) at 50 mA. This device also includes a current limit and a shutdown feature. In shutdown mode, the ground current is reduced to ~1 µA. ERR/NC 4 ADP3308-3.3 1 IN VIN OUT 5 VOUT = +3.3V C2 0.47F C1 0.47F 3 2 ON OFF SD GND Figure 1. Typical Application Circuit The ADP3308 operates with a wide input voltage range from 2.8 V to 12 V and delivers a load current in excess of 100 mA. The ADP3308 anyCAP LDO offers a wide range of output voltages. For 100 mA version, refer to the ADP3309 data sheet. anyCAP is a registered trademark of Analog Devices, Inc. REV. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000 (@ TA = –20ⴗC to +85ⴗC, VIN = 7 V, CIN = 0.47 F, COUT = 0.47 F, unless ADP3308-xx–SPECIFICATIONS otherwise noted.) The following specifications apply to all voltage options. 1 Parameter Symbol Conditions Min OUTPUT VOLTAGE ACCURACY VOUT VIN = VOUTNOM + 0.3 V to 12 V IL = 0.1 mA to 50 mA TA = 25°C VIN = VOUTNOM + 0.3 V to 12 V IL = 0.1 mA to 50 mA Typ Max Unit –1.2 +1.2 % –2.2 +2.2 % ∆V O ∆V IN VIN = VOUTNOM + 0.3 V to 12 V TA = 25°C 0.02 mV/V ∆V O ∆ IL IL = 0.1 mA to 50 mA TA = 25°C 0.06 mV/mA GROUND CURRENT IGND IL = 50 mA IL = 0.1 mA 0.54 0.19 1.4 0.3 mA mA GROUND CURRENT IN DROPOUT IGND VIN = 2.4 V IL = 0.1 mA 0.9 1.7 mA VOUT = 98% of VOUTNOM IL = 50 mA IL = 10 mA IL = 1 mA 0.08 0.025 0.004 0.17 0.07 0.030 V V V 0.75 0.75 0.3 V V 1 9 µA µA 0.005 1 µA 0.01 3 µA 2 4 µA µA 13 µA 0.3 V LINE REGULATION LOAD REGULATION DROPOUT VOLTAGE SHUTDOWN THRESHOLD SHUTDOWN PIN INPUT CURRENT VDROP VTHSD ISDIN GROUND CURRENT IN SHUTDOWN IQ MODE ON OFF 2.0 0 < VSD ≤ 5 V 5 < VSD ≤ 12 V @ VIN = 12 V VSD = 0 V, VIN = 12 V TA = 25°C VSD = 0 V, VIN = 12 V TA = 85°C TA = 25°C @ VIN = 12 V TA = 85°C @ VIN = 12 V OUTPUT CURRENT IN SHUTDOWN MODE IOSD ERROR PIN OUTPUT LEAKAGE IEL ERROR PIN OUTPUT “LOW” VOLTAGE VEOL ISINK = 400 µA 0.12 PEAK LOAD CURRENT ILDPK VIN = VOUTNOM + 1 V, TA = 25°C 150 mA OUTPUT NOISE @ 5 V OUTPUT VNOISE f = 10 Hz–100 kHz 100 µV rms NOTES 1 Ambient temperature of 85°C corresponds to a junction temperature of 125°C under typical full load test conditions. Specifications subject to change without notice. –2– REV. B ADP3308 ABSOLUTE MAXIMUM RATINGS* PIN FUNCTION DESCRIPTIONS Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited Operating Ambient Temperature Range . . . –55°C to +125°C Operating Junction Temperature Range . . . –55°C to +125°C θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165°C/W θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300°C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C *This is a stress rating only; operation beyond these limits can cause the device to be permanently damaged. ORDERING GUIDE Model Voltage Output Package Option* Marking Code ADP3308ART-2.5 ADP3308ART-2.7 ADP3308ART-2.85 ADP3308ART-2.9 ADP3308ART-3 ADP3308ART-3.3 ADP3308ART-3.6 2.5 V 2.7 V 2.85 V 2.9 V 3.0 V 3.3 V 3.6 V SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 LAC DAC DJC DKC DCC DEC DFC Pin Name Function 1 2 3 IN GND SD 4 ERR/NC 5 OUT Regulator Input. Ground Pin. Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this pin should be connected to the input pin. Open Collector. Output that goes low to indicate the output is about to go out of regulation or no connect. Output of the Regulator, fixed 2.5, 2.7, 2.85, 2.9, 3.0, 3.3, or 3.6 volts output voltage. Bypass to ground with a 0.47 µF or larger capacitor. PIN CONFIGURATION IN 1 GND 2 SD 5 OUT ADP3308 TOP VIEW 3 (Not to Scale) 4 ERR/NC NC = NO CONNECT *SOT = Surface Mount. Contact the factory for the availability of other output voltage options. Other Member of anyCAP Family 1 Model Output Current Package Option2 ADP3309 100 mA SOT-23-5 Lead NOTES 1 See individual data sheet for detailed ordering information. 2 SOT = Surface Mount. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADP3308 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. B –3– WARNING! ESD SENSITIVE DEVICE ADP3308–Typical Performance Characteristics 3.302 3.302 1150 I L = 0mA OUTPUT VOLTAGE – Volts OUTPUT VOLTAGE – Volts I L = 10mA 3.300 3.299 VOUT = 3.3V 3.298 I L = 50mA 3.297 GROUND CURRENT – A 3.301 3.301 VOUT = 3.3V I L = 0mA VOUT = 3.3V VIN = 7V 3.300 3.299 3.298 3.297 3.296 3.296 3.295 3.3 4 3.295 5 0 6 7 8 9 10 11 12 13 14 INPUT VOLTAGE – Volts 8 400 160 0 1.2 2.4 3.6 4.8 6.0 7.2 8.4 9.6 10.8 12.0 INPUT VOLTAGE – Volts TPC 3. Quiescent Current vs. Supply Voltage 0.2 800 650 0 16 24 32 40 48 56 64 72 80 OUTPUT LOAD – mA TPC 2. Output Voltage vs. Load Current TPC 1. Line Regulation: Output Voltage vs. Supply Voltage 900 700 550 425 IL = 0 TO 80mA 300 –0.2 I L = 50mA 0 20 40 60 OUTPUT LOAD – mA 80 TPC 5. Output Voltage Variation % vs. Temperature INPUT/OUTPUT VOLTAGE – Volts 72 48 24 0 20 40 60 OUTPUT LOAD – mA 80 TPC 7. Dropout Voltage vs. Output Current 300 IL = 0mA 200 4 3 2 1 0 1 3 2 4 3 2 INPUT VOLTAGE – Volts 1 TPC 8. Power-Up/Power-Down –4– 15 35 55 75 95 115 135 TEMPERATURE – ⴗC TPC 6. Quiescent Current vs. Temperature 8.0 VOUT = 3.3V RL = 66⍀ 0 400 0 –45 –25 –5 15 35 55 75 95 115 135 TEMPERATURE – ⴗC 5 96 IL = 50mA 500 100 –0.4 –45 –25 –5 120 INPUT/OUTPUT VOLTAGE – mV I L = 30mA –0.1 –0.3 TPC 4. Quiescent Current vs. Load Current 0 I L = 0mA 0.0 INPUT/OUTPUT VOLTAGE – Volts 175 GROUND CURRENT – A 675 OUTPUT VOLTAGE – % GROUND CURRENT – A VIN = 7V 600 0.1 0 VIN 7.0 6.0 5.0 4.0 VOUT 3.0 2.0 1.0 0 0 VSD = VIN CL = 0.47F RL = 66⍀ VOUT = 3.3V 20 40 60 80 100 120 140 160 180 200 TIME – s TPC 9. Power-Up Overshoot REV. B ADP3308 3.320 VOUT = 3.3V 3.310 3.300 3.290 Volts 3.280 RL = 3.3k⍀ CL = 0.47F 3.280 VIN 7.5 7.0 7.0 0 TPC 10. Line Transient Response VOUT = 3.3V CL = 4.7F Volts 3.310 10 20 40 60 80 100 120 140 160 180 200 TIME – s 0 VOUT = 3.3V 3.3 200 300 TIME – s 400 VOUT CL = 0.47F 3 3.3V 3.300 2 CL = 4.7F Volts 3.290 150 mA 3.280 IOUT 10 0 100 200 300 TIME – s 400 IOUT 100 0 +3 0 0 0 500 1 2 3 TIME – s 0 4 VOUT = 3.3V RL = 66⍀ CL = 0.47F –10 RIPPLE REJECTION – dB 3 2 1 0 3 VSD 0 5 –20 –30 VOUT = +3.3V a. 0.47F, RL = 3.3k⍀ b. 0.47F, RL = 66⍀ c. 4.7F, RL = 3.3k⍀ d. 4.7F, RL = 66⍀ b –40 –50 d a –60 –70 c b d –80 –90 0 20 40 60 TIME – s TPC 16. Turn Off REV. B 80 VSD +3V 0 TPC 14. Short Circuit Current TPC 13. Load Transient 3.3V 4 VOUT = 3.3V RL = 66⍀ 1 50 100 –100 10 a c 100 1k 10k 100k FREQUENCY – Hz 1M TPC 17. Power Supply Ripple Rejection –5– 10M 20 40 60 TIME – s 80 100 TPC 15. Turn On VOLTAGE NOISE SPECTRAL DENSITY – V/ Hz 100 Volts 500 4 VOUT 0 100 TPC 12. Load Transient 200 mA IOUT 100 TPC 11. Line Transient Response Volts 3.320 VIN 0 40 80 120 160 200 240 280 320 360 400 TIME – s 3.280 mA 7.5 3.300 3.290 3.290 RL = 66⍀ CL = 0.47F VOUT = 3.3V CL = 0.47F 3.310 Volts 3.300 Volts 3.320 3.320 VOUT = 3.3V 3.310 10 VOUT = 3.3V CL = 0.47F IL = 1mA 1 0.1 0.01 100 10k 1k FREQUENCY – Hz 100k TPC 18. Output Noise Density ADP3308 THEORY OF OPERATION Additional features of the circuit include current limit and thermal shutdown. Compared to the standard solutions that give warning after the output has lost regulation, the ADP3308 provides improved system performance by enabling the ERR pin to give warning before the device loses regulation. The new anyCAP LDO ADP3308 uses a single control loop for regulation and reference functions. The output voltage is sensed by a resistive voltage divider consisting of R1 and R2, which is varied to provide the available output voltage option. Feedback is taken from this network by way of a series diode (D1) and a second resistor divider (R3 and R4) to the input of an amplifier. As the chip’s temperature rises above 165°C, the circuit activates a soft thermal shutdown, indicated by a signal low on the ERR pin, to reduce the current to a safe level. OUTPUT INPUT COMPENSATION CAPACITOR ATTENUATION (VBANDGAP /VOUT) Q1 NONINVERTING WIDEBAND DRIVER gm R3 PTAT VOS APPLICATION INFORMATION Capacitor Selection: anyCAP R1 RLOAD D1 Output Capacitors: as with any micropower device, output transient response is a function of the output capacitance. The ADP3308 is stable with a wide range of capacitor values, types and ESR (anyCAP). A capacitor as low as 0.47 µF is all that is needed for stability. However, larger capacitors can be used if high output current surges are anticipated. The ADP3308 is stable with extremely low ESR capacitors (ESR ≈ 0), such as multilayer ceramic capacitors (MLCC) or OSCON. (a) R4 PTAT CURRENT R2 ADP3308 CLOAD GND Figure 2. Functional Block Diagram Input Bypass Capacitor: an input bypass capacitor is not required. However, for applications where the input source is high impedance or far from the input pin, a bypass capacitor is recommended. Connecting a 0.47 µF capacitor from the input pin (Pin 1) to ground reduces the circuit’s sensitivity to PC board layout. If a bigger output capacitor is used, the input capacitor must be 1 µF minimum. A very high gain error amplifier is used to control this loop. The amplifier is constructed in such a way that at equilibrium it produces a large, temperature proportional input “offset voltage” that is repeatable and very well controlled. The temperature proportional offset voltage is combined with the complementary diode voltage to form a “virtual bandgap” voltage, implicit in the network, although it never appears explicitly in the circuit. Ultimately, this patented design makes it possible to control the loop with only one amplifier. This technique also improves the noise characteristics of the amplifier by providing more flexibility on the tradeoff of noise sources that leads to a low noise design. Thermal Overload Protection The ADP3308 is protected against damage due to excessive power dissipation by its thermal overload protection circuit which limits the die temperature to a maximum of 165°C. Under extreme conditions (i.e., high ambient temperature and power dissipation) where die temperature starts to rise above 165°C, the output current is reduced until the die temperature has dropped to a safe level. The output current is restored when the die temperature is reduced. The R1, R2 divider is chosen in the same ratio as the bandgap voltage to the output voltage. Although the R1, R2 resistor divider is loaded by the diode D1 and a second divider consisting of R3 and R4, the values can be chosen to produce a temperature stable output. This unique arrangement specifically corrects for the loading of the divider so that the error resulting from base current loading in conventional circuits is avoided. Current and thermal limit protections are intended to protect the device against accidental overload conditions. For normal operation, device power dissipation should be externally limited so that junction temperatures will not exceed 125°C. The patented amplifier controls a new and unique noninverting driver that drives the pass transistor, Q1. The use of this special noninverting driver enables the frequency compensation to include the load capacitor in a pole splitting arrangement to achieve reduced sensitivity to the value, type and ESR of the load capacitance. Calculating Junction Temperature Device power dissipation is calculated as follows: PD = (VIN – VOUT) ILOAD + (VIN) IGND Where ILOAD and IGND are load current and ground current, VIN and VOUT are input and output voltages respectively. Most LDOs place very strict requirements on the range of ESR values for the output capacitor because they are difficult to stabilize due to the uncertainty of load capacitance and resistance. Moreover, the ESR value required to keep conventional LDOs stable, changes, depending on load and temperature. These ESR limitations make designing with LDOs more difficult because of their unclear specifications and extreme variations over temperature. Assuming ILOAD = 50 mA, IGND = 2 mA, VIN = 5.5 V and VOUT = 2.7 V, device power dissipation is: PD = (5.5 – 2.7) 50 mA + 5.5 × 2 mA = 151 mW ∆T = TJ – TA = PD × θJA = 151 × 165 = 24.9°C With a maximum junction temperature of 125°C, this yields a maximum ambient temperature of ~100°C. This is no longer true with the ADP3308 anyCAP LDO. It can be used with virtually any capacitor, with no constraint on the minimum ESR. This innovative design allows the circuit to be stable with just a small 0.47 µF capacitor on the output. Additional advantages of the design scheme include superior line noise rejection and very high regulator gain which leads to excellent line and load regulation. An impressive ± 2.2% accuracy is guaranteed over line, load and temperature. Printed Circuit Board Layout Consideration Surface mount components rely on the conductive traces or pads to transfer heat away from the device. Appropriate PC board layout techniques should be used to remove heat from the immediate vicinity of the package. –6– REV. B ADP3308 The following general guidelines will be helpful when designing a board layout: Higher Output Current The ADP3308 can source up to 50 mA without any heatsink or pass transistor. If higher current is needed, an appropriate pass transistor can be used, as in Figure 4, to increase the output current to 1 A. 1. PC board traces with larger cross section areas will remove more heat. For optimum results, use PC boards with thicker copper and or wider traces. 2. Increase the surface area exposed to open air so heat can be removed by convection or forced air flow. MJE253* VIN = 4V TO 8V C1 47F VOUT = 3.0V @ 1A R1 50⍀ 3. Do not use solder mask or silk screen on the heat dissipating traces because it will increase the junction to ambient thermal resistance of the package. IN OUT C2 10F ADP3308-3.0 Shutdown Mode Applying a TTL high signal to the shutdown pin or tying it to the input pin will turn the output ON. Pulling the shutdown pin down to a TTL low signal or tying it to ground will turn the output OFF. In shutdown mode, quiescent current is reduced to less than 1 µA. SD GND *AAVID531002 HEAT SINK IS USED Figure 4. Higher Output Current Linear Regulator Constant Dropout Post Regulator APPLICATION CIRCUITS Crossover Switch The circuit in Figure 5 provides high precision with low dropout for any regulated output voltage. It significantly reduces the ripple from a switching regulator while providing a constant dropout voltage, which limits the power dissipation of the LDO to 30 mW. The ADP3000 used in this circuit is a switching regulator in the step-up configuration. The circuit in Figure 3 shows that two ADP3308s can be used to form a mixed supply voltage system. The output switches between two different levels selected by an external digital input. Output voltages can be any combination of voltages from the Ordering Guide of the data sheet. VIN = 4V TO 12V VOUT = 3.0V/3.3V OUT IN ADP3308-3.0 SD OUTPUT SELECT 4V 0V GND IN C1 1.0F OUT C2 0.47F ADP3308-3.3 SD GND Figure 3. Crossover Switch L1 6.8H VIN = 2.5V TO 3.5V D1 1N5817 ADP3308-3.0 OUT IN C1 100F 10V R1 120⍀ ILIM C2 100F 10V VIN SW1 ADP3000-ADJ R2 30.1k⍀ 1% SD 3.0V@50mA GND Q1 2N3906 C3 2.2F Q2 2N3906 FB GND R3 124k⍀ 1% SW2 Figure 5. Constant Dropout Post Regulator REV. B –7– R4 274k⍀ ADP3308 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 5-Lead Surface Mount Package (SOT-23) 0.071 (1.80) 0.059 (1.50) 5 1 4 2 3 C00140b–.5–12/00 (rev. B) 0.122 (3.10) 0.106 (2.70) 0.118 (3.00) 0.098 (2.50) PIN 1 0.0374 (0.95) REF 0.075 (1.90) REF 0.051 (1.30) 0.035 (0.90) 0.020 (0.50) 0.010 (0.25) SEATING PLANE 10ⴗ 0ⴗ 0.009 (0.23) 0.003 (0.08) 0.022 (0.55) 0.014 (0.35) PRINTED IN U.S.A. 0.006 (0.15) 0.000 (0.00) 0.057 (1.45) 0.035 (0.90) –8– REV. B