TDK CGA4J3X5R1H335M125AB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : June 29, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA4J3X5R1H335M125AB
TDK item description CGA4J3X5R1H335MT****
Applications
Feature
Automotive Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA4(2012) [EIA 0805]
Status
Production
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
3.3μF ±20%
Rated Voltage
50VDC
Temperature Characteristic
X5R(±15%)
Dissipation Factor (Max.)
7.5%
Insulation Resistance (Min.)
151MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
Yes
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : June 29, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA4J3X5R1H335M125AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
CGA4J3X5R1H335M125AB
ESR
CGA4J3X5R1H335M125AB
Capacitance
CGA4J3X5R1H335M125AB
CGA4J3X5R1H335M125AB
Temperature Characteristic
CGA4J3X5R1H335M125AB(No
Bias)
DC Bias Characteristic
CGA4J3X5R1H335M125AB(DC Bias
= 25V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
CGA4J3X5R1H335M125AB(100kHz)
CGA4J3X5R1H335M125AB(500kHz)
CGA4J3X5R1H335M125AB(1MHz)
Multilayer Ceramic Chip Capacitors
CGA4J3X5R1H335M125AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : June 29, 2017 (GMT)
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