Rohm BD1HD500EFJ-C 1ch high-side switch Datasheet

Datasheet
Automotive IPS series
1ch High-side switch
BD1Hx500 Series
Features
■ Built-in overcurrent protection circuit
■ Built-in Thermal Shut Down(TSD)
■ Built-in Open Load Detection circuit(When Output is
OFF)
■ Possibility to control directly from CMOS logic IC
■ Low standby current
■ Built-in Under Voltage Lock Out circuit
■ Built-in diagnostic(ST) output function
■ Low On resistance of RDS(ON)=500mΩ(Typ) (VDD=12V,
Ta=25°C, Io=0.25A)
■ Monolithic power IC that has a built in control part
(CMOS) and a power MOS FET on 1chip
■ 1ch High-side switch for the mechanical relay coil
drive
■ AEC-Q100 qualified (1)
Product Summary
Operating voltage
On-state resistance
(25°C, Typ)
Overcurrent limit (Typ)
Active clamp energy (25°C)
Package
HTSOP-J8
HSON8
MSOP8
4V to 18V
500mΩ
1.45A
33mJ
4.90mm x 6.00mm x 1.00mm
2.90mm x 3.00mm x 0.60mm
2.90mm x 4.00mm x 0.90mm
(1) Grade 1
General Description
BD1HC/D500 Series is an Automotive 1ch High-Side
switch.
It has a built-in overcurrent protection circuit, Thermal
Shut Down (TSD) circuit, Open Load Detection circuit,
Under Voltage Lock Out circuit, and has diagnostic (ST)
output function at the time during abnormal detection.
HTSOP-J8
HSON 8
MSOP 8
Application
■ For automotive (Air conditioner, body equipment, and
meter, etc.)
Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BD1Hx500 Series
Pin Descriptions
Pin
Symbol
1
IN
2
GND
Earth terminal.
3, 4
OUT
Output terminal. When the load becomes in a short-circuit state and if the current
exceeds overcurrent detection value of 0.8A (Min) the current flowing in the
output pin will be limited due IC protection.
5, 6
VDD
Power-supply terminal.
7
N.C
N.C
8
ST
Cooling Tab (1)
TAB
Function
Input terminal. The pull-down resistor is internally connected.
Self-diagnostic output terminal. "L" is becomes the output state during overcurrent,
overheating and open load detection conditions.
Please refer to Diagnostic Output Truth Table on page 5. The circuit is composed of
an open drain N channel MOS.
Since it has connected with sub of IC, please connect the heat dissipation metal to
external GND potential. (HTSOP-J8,HSON8)
(1)MSOP8 does not have Cooling Tab.
Pin Configurations
HTSOP-J8
(TOP VIEW)
HSON8
(TOP VIEW)
1.IN
8. ST
2.GND
7. N.C
3.OUT
6. VDD
4.OUT
5. VDD
MSOP8
(TOP VIEW)
1.IN
8. ST
1.IN
8. ST
2.GND
7. N.C
2.GND
7. N.C
3.OUT
6. VDD
3.OUT
6. VDD
4.OUT
5. VDD
4.OUT
5. VDD
Product Line-up
Product Name
BD1HC500EFJ-C
PKG
On-state
Resistance
(25°C, Typ)
HTSOP-J8
BD1HC500HFN-C
HSON 8
BD1HC500FVM-C
MSOP 8
BD1HD500EFJ-C
BD1HD500HFN-C
HTSOP-J8
HSON 8
BD1HD500FVM-C
MSOP 8
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TSD Function
Off-latch
500mΩ
Self-restart
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Datasheet
BD1Hx500 Series
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Voltage between drain and source
V DS
44.5 (Internal limitation)
V
Power supply voltage
V DD
Input voltage
V IN
-0.3 to +12
(1)
Diagnostic output voltage
V ST
-0.3 to +15
(1)
Output current (DC)
Output current (Pulse)
I OD
0.8
I OP
Internal limitation
Diagnostic output current
I ST
40
V
V
V
(2)
A
(3)
mA
2.100 (HTSOP-J8)
Power Consumption
A
1
Pd
1.750(HSON 8)
(5)
0.587 (MSOP 8)
(6)
(4)
W
Operating temperature range
T opr
-40 ≤ Topr < +150
°C
Storage temperature range
T stg
-55 to +150
°C
Maximum junction temperature
T jmax
150
°C
E AV
33
mJ
Symbol
Rating
Unit
V DD
4 to 18
V
Active clamp energy (single pulse)
Operating Voltage Ratings
Parameter
Operating voltage
(1) However, V D D ≥ VIN
(2) However, exceed neither Pd nor ASO.
(3) Because of overcurrent protection circuit. (Refer to P11 Figure 20)
(4) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 16.8mW above 25°C
(5) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 14.0mW above 25°C
(6) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 1 layer board).
Derate by 4.7mW above 25°C.
Heat Dissipation Characteristic
4.00
3.750 W
(1)
(2)
(3)
(4)
3.50
3.00
(1) HTSOP-J8
2.50
Pd [W]
HTSOP-J8(glass epoxy 4 layer board)
HTSOP-J8(glass epoxy 2 layer board)
HSON8 (glass epoxy 2 layer board)
MSOP8 (glass epoxy 1 layer board)
2.100 W
2.00
1.750 W
(2) HTSOP-J8
1.50
(3) HSON8
1.00
0.587 W
0.50
(4) MSOP8
0.00
0
25
50
75
100
125
150
Ta [°C]
(HTSOP-J8) (1)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 4 layer board). Derate by 30mW/°C above 25°C.
(2)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 16.8mW/°C above 25°C.
(HSON 8)
(3)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 14.0mW/°C above 25°C.
(MSOP 8)
(4)IC mounted on ROHM standard board (70×70×1.6[mm],copper area 70×70[mm],
glass epoxy 1 layer board). Derate by 4.7mW/°C above 25°C.
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Datasheet
BD1Hx500 Series
Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40°C ≤ Tj ≤ +150°C)
Target value
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
[Power Supply Block]
VDD=12V,VIN=0V,
VOUT=0V,Tj=25°C
VDD=12V,VIN=0V,
VOUT=0V,Tj=150°C
IDDS1
-
0.1
10
μA
IDDS2
-
-
220
μA
IDD
-
1.5
3.0
mA
VUVLO
-
3.0
3.6
V
H level input voltage
VIN(H)
3.0
-
-
V
L level input voltage
VIN(L)
-
-
1.0
V
VIN(HYS)
-
0.3
-
V
H level input current
IIN(H)
-
50
100
μA
VIN=5V
L level input current
IIN(L)
-10
-
10
μA
VIN=0V
RDS(ON)
RDS(ON)
-
500
900
650
1200
mΩ
mΩ
VDD=12V,IOUT=0.25A,Tj=25°C
VDD=12V,IOUT=0.25A,Tj=150°C
Standby current
Operating current
Under Voltage Lock Out (UVLO)
Threshold
VDD=12V,VIN=5V，VOUT=open
[Input Block]
Input hysteresis
[Power MOS Output]
Output ON resistance
IL(OFF)
-
-
5
μA
VIN=0V, Tj=25°C
IL(OFF)
-
-
200
μA
VIN=0V, Tj=150°C
tON
-
13
25
μs
tOFF
-
9
25
μs
Slew rate on
dV/dtON
-
3
6
V/μs
Slew rate off
-dV/dtOFF
-
3
6
V/μs
VCL
-8
-6.0
-4.5
V
“L” level
VSTL
-
-
0.4
V
VIN=5V,IST=0.1mA
“H” level
ISTH
-
-
10
μA
VIN=0V,VST=12V
Output leak current
Switching time
Output clamp voltage
VDD=12V ,RL=47Ω,Tj=25°C
Figure16
VDD=12V ,RL=47Ω,Tj=25°C
Figure16
VDD=12V ,RL=47Ω,Tj=25°C
Figure16
VDD=12V ,RL=47Ω,Tj=25°C
Figure16
VIN =0V,IOUT=100mA
Figure17
[Diagnostic Output]
Diagnostic
output voltage
Diagnostic
output current
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TSZ02201-0G3G0BD00070-1-2
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Datasheet
BD1Hx500 Series
Electrical Characteristics (unless otherwise specified, VDD=4V to 18V, -40°C ≤ Tj ≤ 150°C)
Target value
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
[Protect Circuit]
Overcurrent protection
ILIM
0.8
1.45
2.0
A
ON
tDHL
-
20
100
μs
OFF
tDLH
-
100
200
μs
(1)
VOPEN
1.3
2.8
4.0
V
VIN =0V
Open Load Detection delay time
TOPEN
100
300
1000
μs
VIN =5V to 0V
Diagnostic output
delay time(OCP)
Open Load Detection threshold
Diagnostic output
delay time(OCP) Figure20
VDD=12V, RL=∞ to 4Ω
Figure 20
Figure21
(1) In order to detect the voltage, an external resistance (Rext) of 130kΩ (Typ) is required between VDD and OUT pins.
At worst condition, the following resistance is recommended.
VDD
12 V
6V
Rext
Under 200kΩ
Under 50kΩ
5V
Under 25kΩ
5V
VDD=12V
100kΩ
ST
VDD
Rext
130kΩ
IN
OUT
GND
Terms
Figure 1. Terms
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Datasheet
BD1Hx500 Series
Measuring circuit
VDD=12V
VDD=12V
RDS(ON)=(VDD-VOUT)/IOUT
VDD
VDD
IN
IN
OUT
GND
VIN=5V
IOUT=0.25A
OUT
VIN=0V/5V
RL=47Ω
GND
VOUT
Figure 3. Switching time measuring circuit
Figure 2. RON measuring circuit
5V
VDD=12V
VDD=12V
100kΩ
VDD
ST
VDD
VST
IN
Rext
OUT
IN
GND
IOUT=100mA
VCL
5V to 0V
Vopen
Figure 5. Open Load Detection threshold
measuring circuit
Figure 4. Output clamp voltage measuring circuit
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OUT
GND
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Datasheet
BD1Hx500 Series
Diagnostic Output Truth Table
VIN
OUTPUT
Tj
Mode
VST
Output state
IOUT < 1.45A(Typ)
Normal
H
ON
IOUT ≥ 1.45A(Typ)
Overcurrent
protect
L
OFF (1)
-
-
Overheating
protect
L
OFF(1)
H
(Over 2.8V(Typ))
-
Open protect
L
OFF(1)
L
-
Stand by
H
OFF(1)
VOUT
Tj ≤ 175°C (Typ)
-
H
Tj > 175°C (Typ)
L
-
IOUT
(1)OFF : 130kΩ(Typ) is built in between OUT and GND.
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Datasheet
BD1Hx500 Series
1200
1200
1000
1000
800
800
Ron [mΩ]
RDS(on) [mΩ]
Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
600
600
(1)
400
400
200
200
0
0
-50
-25
0
25
50
75
100 125 150
4
6
8
Tj [°C]
10
12
14
16
18
VDD [V]
Figure 6. Output ON Resistance Characteristic
[temperature characteristic]
Figure 7. Output ON Resistance Characteristic
[Power supply voltage characteristic]
(1)Since the reference voltage of a charge
pump circuit changes at the time of reduced
voltage, ON resistance changes about 3% in
the 6.5V neighborhood.
10.0
300
250
8.0
6.0
IIN [µA]
IDDS [µA]
200
4.0
Tj=150°C
150
Tj=25°C
100
2.0
50
Tj=-40°C
0
0.0
4
6
8
10
12
14
16
0
18
4
6
8
10
12
VIN [V]
VDD [V]
Figure 8. Standby Current Characteristic
(VIN=0V)
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Figure 9. Input Current Characteristic
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Datasheet
BD1Hx500 Series
25.0
25.0
20.0
20.0
15.0
15.0
tOFF [μs]
tON [μs]
Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
10.0
10.0
5.0
5.0
0.0
0.0
-50
-25
0
25
50
75
100 125 150
-50
-25
0
25
Tj [°C]
75
100 125 150
Tj [°C]
Figure 10. Switching Time (tON)[temperature characteristic]
Figure 11. Switching Time (tOFF)[temperature characteristic]
6.0
6.0
5.0
5.0
4.0
4.0
-dV/dtOFF [V/μs]
dV/dtON [V/μs]
50
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
-50
-25
0
25
50
75
100
125 150
Tj [°C]
Figure 12. Slew Rate ON [temperature characteristic]
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-50
-25
0
25
50
75
100 125 150
Tj [°C]
Figure 13. Slew Rate OFF [temperature characteristic]
TSZ02201-0G3G0BD00070-1-2
2015.04.15 Rev.002
Datasheet
BD1Hx500 Series
Typical Performance Curves (unless otherwise specified, VDD=12V, VIN=5V, Tj=25°C)
30
2.3
2.2
ON threshold
25
2.1
20
IOUT [μA]
VIN [V]
2.0
1.9
1.8
15
10
1.7
5
OFF threshold
1.6
0
1.5
-50
-25
0
25
50
75
-50
100 125 150
-25
0
25
50
75
100 125 150
Tj [°C]
Tj [℃]
Figure 14. Input Voltage Threshold Characteristic
Figure 15. Output Leak Current [temperature characteristic]
（VIN=0V）
Switching time measuring
Active clamp energy timing chart
Input
Voltage
VIN
Error
flag
VST
t
t
Output
voltage VOUT
t
VCL
Output
current IOUT
tON
Figure 16. Switching time
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tOFF
t
Figure 17. Active Clamp Energy Timing Chart
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Datasheet
BD1Hx500 Series
Protect function timing chart
Input
voltage
Input
voltage
VIN
VIN
t
Chip
temperature
t
Chip
temperature
Tj
Tj
t
Output
current
t
Output
current
IOUT
IOUT
t
Error
flag
t
Error
flag
VST
t
VST
t
12.5μs(Typ)
12.5μs(Typ)
Figure 19. BD1HD500 Self-restart Overheat Protection
Timing Chart
Figure 18. BD1HC500 Off-latch Overheat Protection
Timing Chart
Input V
IN
voltage
t
Input
voltage
VIN
t
Output
Vout
voltage
t
Output I
OUT
current
Output
voltage
Vout ≥ 2.8V(Typ)
(VOPEN )
Vout
IOCP
t
t
1ms(Typ)
Error
flag
VST
t
Error
flag
VST
t
20μs(Typ)
(tDHL)
100μs(Typ)
(tDLH)
Figure 20. Overcurrent Protect Timing Chart
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300μs(Typ)
(TOPEN)
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Figure 21. Open Load Detection Timing Chart
TSZ02201-0G3G0BD00070-1-2
2015.04.15 Rev.002
Datasheet
BD1Hx500 Series
I/O equivalence circuits
Pin
Symbol
1
IN
2
GND
I/O equivalence circuits
VDD
3, 4
OUT
5, 6
VDD
OUT
130kΩ
(Typ)
GND
8
Cooling Tab
ST
TAB
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Datasheet
BD1Hx500 Series
Ordering Information
B
D
1
H
x
5
0
0
Series
C:TSD Off-latch
D:TSD Self-restart
F
V
M
-
PKG
EFJ: HTSOP-J8
HFN:HSON8
FVM: MSOP8
CTR
Packaging and forming specification
E2:Embossed tape and reel
(HTSOP-J8)
TR:Embossed tape and reel
(MSOP 8,HSON 8)
C: High reliability
Marking Diagram
HTSOP-J8 (TOP VIEW)
HSON8 (TOP VIEW)
Part Number Marking
Part Number Marking
H
x
5
0
0
Hx5
LOT Number
0
LOT Number
0
1PIN MARK
1PIN MARK
MSOP8 (TOP VIEW)
Part Number Marking
H
0
x
5
0
LOT Number
1PIN MARK
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Datasheet
BD1Hx500 Series
Physical Dimension Tape and Reel Information
Package Name
HTSOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Datasheet
BD1Hx500 Series
Package Name
HSON8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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Datasheet
BD1Hx500 Series
Package Name
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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Datasheet
BD1Hx500 Series
Operational Notes
1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit
protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the
absolute maximum ratings.
2) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
3) Power supply line
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4) GND voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
5) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions.
6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
7) TSD (Thermal Shut Down)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a 175°C (with 25°C hysteresis). It is not designed to protect the IC from damage or
guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
8) Overcurrent protection circuit (OCP)
The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This
circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current
(without latching) in the event of more than 1.45A (Typ) current flow, such as from a large capacitor or other component
connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and
unexpected current surges. The IC should not be used in applications where the over current protection circuit will be
activated continuously.
ST (8 PIN) will be set to ‘L (abnormal condition)’ if the current limit state continues to 20μs(Typ). Then, ST (8 PIN) will
be set to ‘H (normal condition)’ if the current limit release until 1.1ms(Typ).
If current limit state continues, generation of heat, degradation, etc. of the IC can be considered. When the state of
overcurrent still flows, compensate by setting the IC in standby mode applications using ST (8 PIN).
9) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
11) FIN (HTSOP-J8,HSON 8)
Since it has connected with sub of IC, please connect the heat dissipation metal to external GND potential.
Status of this document
The Japanese version of this document is the formal datasheet. A customer may use this translation version only as
reference to help understand the formal version. If there are any differences, the formal version takes precedence.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/18
TSZ02201-0G3G0BD00070-1-2
2015.04.15 Rev.002
Datasheet
BD1Hx500 Series
Revision History
Date
Revision
20.Sep.2013
001
New Release
002
・P1. “AEC-Q100 qualified” is added in Features
・P1. “Product Summary” modify
・P1. Typical Application Circuit change from ”VDD” to ”VBAT”
・P2. Pin Descriptions change from ”FIN” to ”Cooling Tab” and add Note(1)
・P3. Absolute Maximum Ratings delete “Ta”
・P3. Operating Voltage Ratings change Note(1) content
・P5. Electrical Characteristics modify circuit figure of “Note(1)”
・P7. Diagnostic Output Truth Table modify
・P11 . Change from “µsec” to ”µs” at Protect function timing chart
・P12 . I/O equivalence circuits add “Cooling Tab”
15.Apr.2015
Changes
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/18
TSZ02201-0G3G0BD00070-1-2
2015.04.15 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD1HC500EFJ-C - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD1HC500EFJ-C
HTSOP-J8
2500
2500
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Yes