HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 1/4 HMPSA94 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMPSA94 is designed for application that requires high voltage. Features TO-92 • High Breakdown Voltage: 400V(Min.) at IC=1mA • High Current: IC=300mA at 25°C • Complementary to HMPSA44 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................................ +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)............................................................................................. 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage.................................................................................................. -400 V VCEO Collector to Emitter Voltage .............................................................................................. -400 V VEBO Emitter to Base Voltage......................................................................................................... -6 V IC Collector Current ................................................................................................................. -500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 Min. -400 -400 -6 40 50 45 40 Typ. - Max. -100 -100 -500 -350 -500 -750 -750 300 - Unit V V V nA nA nA mV mV mV mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-400V, IE=0 VEB=-4V, IC=0 VCE=-400V, VBE=0 IC=-1mA, IB=-0.1mA IC=-20mA, IB=-2mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 Rank hFE@VCE=-3V, IC=-100mA hFE2@VCE=-10V, IC=-10mA VCE(sat)@IC=-20mA, IB=-2mA HMPSA94 NSS >50 70-200 <200mV NS >50 70-300 <500mV SD 70-200 <200mV N 50-300 <500mV HSMC Product Specification HI-SINCERITY Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Current Gain & Collector Current 1000 1000 o 75 C o o 125 C o 125 C 100 75 C 100 o o 25 C hFE hFE 25 C 10 10 hFE @ VCE=3V hFE @ VCE=10V 1 1 0.1 1 10 100 Collector Current IC (mA) 1000 0.1 1 10 100 1000 Collector Current IC (mA) Saturation Voltage & Collector Current Saturation Voltage & Collector Current 100000 10000 o 10000 Saturation Voltage (mV) Saturation Voltage (mV) 75 C o 25 C 1000 o 125 C 100 o 75 C 1000 o 25 C o 125 C VBE(sat) @ IC=10IB VCE(sat) @ IC=10IB 10 100 1 10 100 1000 1 Collector Current IC (mA) 10 100 1000 Collector Current IC (mA) Safe Operating Area Capacitance & Reverase-Biased Voltage 10000 100 PT=1m s Collector Current-IC (mA) Capacitance (pF) PT=100ms Cob 10 1 1000 PT=1s 100 10 1 0.1 1 10 Reverse-Biased Voltage (V) HMPSA94 100 1 10 100 1000 Forward Biased Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 3/4 PD-Ta 700 Power Dissipation-PD(mW) 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HMPSA94 HSMC Product Specification HI-SINCERITY Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking: H MP S A 9 4 B 1 2 3 Date Code Control Code α3 Style: Pin 1.Emitter 2.Base 3.Collector C D H I G α1 E F 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA94 HSMC Product Specification