HSMC HMPSA94 Pnp epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 1/4
HMPSA94
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMPSA94 is designed for application that requires high voltage.
Features
TO-92
• High Breakdown Voltage: 400V(Min.) at IC=1mA
• High Current: IC=300mA at 25°C
• Complementary to HMPSA44
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ........................................................................................................ -55 ~ +150 °C
Junction Temperature ................................................................................................ +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................................. 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage.................................................................................................. -400 V
VCEO Collector to Emitter Voltage .............................................................................................. -400 V
VEBO Emitter to Base Voltage......................................................................................................... -6 V
IC Collector Current ................................................................................................................. -500 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
ICES
*VCE(sat)1
*VCE(sat)2
*VCE(sat)3
*VBE(sat)
*hFE1
*hFE2
*hFE3
*hFE4
Min.
-400
-400
-6
40
50
45
40
Typ.
-
Max.
-100
-100
-500
-350
-500
-750
-750
300
-
Unit
V
V
V
nA
nA
nA
mV
mV
mV
mV
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-400V, IE=0
VEB=-4V, IC=0
VCE=-400V, VBE=0
IC=-1mA, IB=-0.1mA
IC=-20mA, IB=-2mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
VCE=-10V, IC=-1mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-50mA
VCE=-10V, IC=-100mA
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2
Rank
hFE@VCE=-3V, IC=-100mA
hFE2@VCE=-10V, IC=-10mA
VCE(sat)@IC=-20mA, IB=-2mA
HMPSA94
NSS
>50
70-200
<200mV
NS
>50
70-300
<500mV
SD
70-200
<200mV
N
50-300
<500mV
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 2/4
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Current Gain & Collector Current
1000
1000
o
75 C
o
o
125 C
o
125 C
100
75 C
100
o
o
25 C
hFE
hFE
25 C
10
10
hFE @ VCE=3V
hFE @ VCE=10V
1
1
0.1
1
10
100
Collector Current IC (mA)
1000
0.1
1
10
100
1000
Collector Current IC (mA)
Saturation Voltage & Collector Current
Saturation Voltage & Collector Current
100000
10000
o
10000
Saturation Voltage (mV)
Saturation Voltage (mV)
75 C
o
25 C
1000
o
125 C
100
o
75 C
1000
o
25 C
o
125 C
VBE(sat) @ IC=10IB
VCE(sat) @ IC=10IB
10
100
1
10
100
1000
1
Collector Current IC (mA)
10
100
1000
Collector Current IC (mA)
Safe Operating Area
Capacitance & Reverase-Biased Voltage
10000
100
PT=1m s
Collector Current-IC (mA)
Capacitance (pF)
PT=100ms
Cob
10
1
1000
PT=1s
100
10
1
0.1
1
10
Reverse-Biased Voltage (V)
HMPSA94
100
1
10
100
1000
Forward Biased Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 3/4
PD-Ta
700
Power Dissipation-PD(mW)
600
500
400
300
200
100
0
0
20
40
60
80
100
120
140
160
o
Ambient Temperature-Ta( C)
HMPSA94
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 4/4
MICROELECTRONICS CORP.
TO-92 Dimension
α2
A
Marking:
H MP S
A 9 4
B
1
2
3
Date Code
Control Code
α3
Style: Pin 1.Emitter 2.Base 3.Collector
C
D
H
I
G
α1
E
F
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
Inches
Min.
Max.
0.1704
0.1902
0.1704
0.1902
0.5000
0.0142
0.0220
*0.0500
0.1323
0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142
0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPSA94
HSMC Product Specification
Similar pages