4 Pad Ceramic Package, 2 mm x 2.5 mm Product Features: ILCX18 Series Applications: SMD Package Small package Foot Print Supplied in Tape and Reel Compatible with Leadfree Processing PCMCIA Cards Storage PC’s Wireless Lan USB GSM Cell Phone 2.5 +/-0.1 4 3 1 2 1 2 4 3 2.0 +/-0.1 Frequency 12 MHz to 60 MHz* 0.55 +/-0.1 ESR (Equivalent Series Resistance) 12 MHz – 19.9 MHz 20 MHz – 29.9 MHz 30 MHz – 39.9 MHz 40 MHz – 60.0 MHz 100 Max. 80 Max. 60 Max. 40 Max. Shunt Capacitance (C0) 3.5 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 100 µW Max. Aging 5 ppm Max. / Year Standard Connection diagram 4 3 1 2 Recommended pad layout 0.9 0.8 1.25 Temperature 1.65 0 C to +70 C Standard (see Part Number Guide for more options) Operating Dimension Units: mm Storage -40 C to +85 C Standard Part Number Guide Package ILCX18 - Sample Part Number: ILCX18 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** Mode (overtone) F = Fundamental Load Capacitance (pF) 18 pF Standard Or Specify 9 = -10°C to +50°C D = -10°C to +105°C* E = -40°C to +105°C* * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 7/23/12_D Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 4 Pad Ceramic Package, 2 mm x 2.5 mm ILCX18 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code(yww) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 7/23/12_D Specifications subject to change without notice Page 2