High Current, High Frequency, Power Inductors HALOGEN HF Pb FREE Flat-Pac™ FP1007R6 Series Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Desktop and server VRMs and EVRDs • Notebook regulators • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules Description • DCR Sensing Environmental Data • Halogen free, lead free, RoHS compliant • 125°C Maximum total temperature operation • Storage temperature range: -40°C to +125°C • 10.5 x 8.0 x 7.0mm Maximum surface mount package • Ferrite core material • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Controlled DCR tolerance for sensing circuits • Solder reflow temperature: J-STD-020D compliant • Inductance Range from 150nH to 470nH Packaging • Current range from 23.5 to 75 Amps • Supplied in tape-and-reel packaging, 700 parts per 13 inch diameter reel • Frequency range up to 2MHz Product Specifications Part Number7 FP1007R6-R15-R FP1007R6-R18-R FP1007R6-R22-R FP1007R6-R27-R FP1007R6-R33-R FP1007R6-R39-R FP1007R6-R47-R OCL1 ±10% (nH) 150 180 220 270 330 390 470 FLL2 Min. (nH) 108 129 158 194 237 280 338 Irms3 (Amps) 61 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff at +25°C. 0912 BU-SB12795 Page 1 of 4 Isat14 @25°C (Amps) 75.0 60.0 50.0 41.0 33.0 28.0 23.5 Isat25 @100°C (Amps) 60.0 50.0 40.0 33.0 26.5 22.5 19.0 DCR @20°C (mΩ) K-Factor6 0.29 ± 5% 348.8 5. Isat2: Peak current for approximately 20% rolloff at +100°C. 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007R6-Rxx-R FP1007R6 = Product code and size Rxx= Inductance value in uH, R = decimal point -R suffix = RoHS compliant Data Sheet: 10007 Dimensions - mm The nominal DCR is measured from point "A" to point "B" Part Marking: Coiltronics Logo, 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level Tolerance are ±0.15mm unless otherwise specified. Soldering surfaces to be coplanar within 0.1016mm. PCB tolerance ±0.1mm unless otherwise specified. Packaging Information - mm 1.5 dia 1.75 2.0 1.5 dia 4.0 A 1 11.5 24.0 ±0.30 2 10.60 8.1 12.0 Supplied in Tape-and-Reel packaging, 700 parts per 13 inch diameter reel. A 7.1 SECTION A-A Temperature Rise vs. Total Loss 60 Temperature Rise (°C) 50 40 30 20 10 0 0 .0 0 .4 0 .8 1 .2 Total Loss (W) 0912 BU-SB12795 Page 2 of 4 Data Sheet: 10007 1 .6 2 .0 Core Loss Core Loss vs. Bp-p 10 1MHz 500kHz 300kHz 200kHz 100kHz Core Loss (W) 1 0 .1 0 .0 1 0 .0 0 1 0 .0 0 0 1 0 .0 0 0 0 1 100 1000 10000 Bp-p (Gauss) Inductance Characteristics % of OCL vs. Isat1 100% 80% % of OCL 60% 40% -40°C +100°C +25°C 20% 0% 0% 20% 40% 60% 80% 100% % of Isat1 0912 BU-SB12795 Page 3 of 4 Data Sheet: 10007 120% 140% 160% Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T c) TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25°C ts Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2012 Cooper Bussmann w w w. c o o p e r b u s s m a n n . c o m 0912 BU-SB12795 Page 4 of 4 Data Sheet: 10007