TI LMV722IDGKRG4 10-mhz low-noise low-voltage low-power operational amplifier Datasheet

LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
FEATURES
•
•
•
•
•
•
LMV7210DBV or DCK PACKAGE
(TOP VIEW)
Power-Supply Voltage Range: 2.2 V to 5 V
Low Supply Current: 930 µA/Amplifier at 2.2 V
High Unity-Gain Bandwidth: 10 MHz
Rail-to-Rail Output Swing
– 600-Ω Load: 120 mV From Either Rail at
2.2 V
– 2-kΩ Load: 50 mV From Either Rail at 2.2 V
Input Common-Mode Voltage Range Includes
Ground
Input Voltage Noise: 9 nV/√Hz at f = 1 kHz
OUT
VCC−
IN+
5
VCC+
4
IN−
2
3
LMV7220D, DGK, OR DRG PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
VCC−
APPLICATIONS
•
•
•
•
1
Cellular and Cordless Phones
Active Filter and Buffers
Laptops and PDAs
Battery Powered Electronics
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN−
2IN+
DESCRIPTION/ORDERING INFORMATION
The LMV721 (single) and LMV722 (dual) are low-noise low-voltage low-power operational amplifiers that can be
designed into a wide range of applications. The LMV721 and LMV722 have a unity-gain bandwidth of 10 MHz, a
slew rate of 5 V/µs, and a quiescent current of 930 µA/amplifier at 2.2 V.
The LMV721 and LMV722 are designed to provide optimal performance in low-voltage and low-noise systems.
They provide rail-to-rail output swing into heavy loads. The input common-mode voltage range includes ground,
and the maximum input offset voltage are 3.5 mV (over recommended temperature range) for the devices. Their
capacitive load capability is also good at low supply voltages. The operating range is from 2.2 V to 5.5 V.
ORDERING INFORMATION
PACKAGE (1)
TA
Single
LMV721IDCKR
Reel of 250
LMV721IDCKT
Reel of 3000
LMV721IDBVR
Reel of 2500
LMV722IDR
Tube of 75
LMV722ID
VSSOP – DGK
Reel of 2500
LMV722IDGKR
R6_
QFN – DRG
Reel of 2500
LMV722IDRGR
ZYY
SOIC – D
Dual
(1)
(2)
TOP-SIDE MARKING (2)
Reel of 3000
SC-70 – DCK
SOT-23 – DBV
–40°C to 85°C
ORDERABLE PART NUMBER
RK_
RBF_
MV722I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DGK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
Typical Application
R5
VCC
C1
R3
Electret
Microphone
R4
Input
VCC
R1
−
+
Output
C2
R2
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VCC+ – VCC–
Supply voltage (2)
VID
Differential input voltage (3)
Package thermal impedance (4)
TJ
Operating virtual-junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
V
±Supply voltage
V
97
DBV package (5)
206
DCK package (5)
252
package (5)
172
DRG package (6)
50.7
DGK
UNIT
5.5
package (5)
D
θJA
MAX
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
Differential voltages are at IN+ with respect to IN–.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions
MIN
MAX
UNIT
VCC+ – VCC–
Supply voltage
2.2
5
V
TJ
Operating virtual-junction temperature
–40
85
°C
ESD Protection
Human-Body Model
Machine Model
2
Submit Documentation Feedback
TYP
UNIT
2000
V
100
V
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
Electrical Characteristics
VCC+ = 2.2 V, VCC– = GND, VICR = VCC+/2, VO = VCC+/2, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TJ
MIN
25°C
TYP
MAX
0.02
3
UNIT
VIO
Input offset voltage
TCVIO
Input offset voltage average drift
25°C
0.6
µV/°C
IIB
Input bias current
25°C
260
nA
IIO
Input offset current
25°C
25
nA
CMMR
Common-mode rejection ratio
VICR = 0 V to 1.3 V
PSRR
Power-supply rejection ratio
VCC+ = 2.2 V to 5 V,
VO = 0, VICR = 0
VICR
Input common-mode voltage
AVD
Large-signal voltage gain
–40°C to 85°C
25°C
70
–40°C to 85°C
64
25°C
80
–40°C to 85°C
70
CMRR ≥ 50 dB
RL = 600 Ω,
VO = 0.75 V to 2 V
RL = 2 kΩ,
VO = 0.5 V to 2.1 V
RL = 600 Ω to VCC+/2
3.5
90
RL = 2 kΩ to VCC+/2
25°C
75
–40°C to 85°C
70
25°C
75
–40°C to 85°C
70
25°C
2.090
–40°C to 85°C
2.065
Output current
Sinking, VO = 2.2 V,
VIN(diff) = ±0.5 V
2.125
LMV721
ICC
Supply current
2.150
–40°C to 85°C
2.125
2.177
0.056
LMV722
V
0.080
0.105
25°C
10
–40°C to 85°C
5
25°C
10
–40°C to 85°C
5
14.9
mA
17.6
0.93
–40°C to 85°C
25°C
0.120
0.145
25°C
25°C
dB
84
–40°C to 85°C
IO
V
81
0.071
25°C
Sourcing, VO = 0 V,
VIN(diff) = ±0.5 V
dB
0.3
–40°C to 85°C
Output swing
dB
–0.3
25°C
25°C
VO
88
mV
1.3
1.5
1.81
–40°C to 85°C
2.4
mA
2.6
SR
Slew rate (1)
25°C
GBW
Gain bandwidth product
Φm
Phase margin
Gm
Gain margin
Vn
Input-referred voltage noise
f = 1 kHz
25°C
9
nV/√Hz
In
Input-referred current noise
f = 1 kHz
25°C
0.3
pA/√Hz
Total harmonic distortion
f = 1 kHz, AV = 1,
RL = 600 Ω, VO = 500 mVpp
25°C
0.004
THD
(1)
4.9
V/µs
25°C
10
MHz
25°C
67.4
°
25°C
–9.8
dB
%
Connected as voltage follower with 1-V step input. Number specified is the slower of the positive and negative slew rate.
Submit Documentation Feedback
3
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
Electrical Characteristics
VCC+ = 5 V, VCC– = GND, VICR = VCC+/2, VO = VCC+/2, and RL > 1 MΩ (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TJ
MIN
25°C
TYP
MAX
–0.08
3
VIO
Input offset voltage
TCVIO
Input offset voltage average drift
25°C
0.6
µV/°C
IIB
Input bias current
25°C
260
nA
IIO
Input offset current
25°C
25
nA
CMMR
Common-mode rejection ratio
VICR = 0 V to 1.3 V
PSRR
Power-supply rejection ratio
VCC+ = 2.2 V to 5 V,
VO = 0, VICR = 0
VICR
Input common-mode voltage
AVD
Large-signal voltage gain
–40°C to 85°C
RL = 600 Ω,
VO = 0.75 V to 4.8 V
RL = 2 kΩ,
VO = 0.7 V to 4.9V
3.5
25°C
80
–40°C to 85°C
75
25°C
70
–40°C to 85°C
64
CMRR ≥ 50 dB
RL = 600 Ω to VCC+/2
VO
89
90
80
RL = 2 kΩ to VCC+/2
–40°C to 85°C
70
25°C
80
–40°C to 85°C
70
25°C
4.84
–40°C to 85°C
4.815
4.882
Output current
Sinking, VO = 2.2 V,
VIN(diff) = ±0.5 V
4.93
–40°C to 85°C
4.905
4.952
0.076
LMV721
ICC
Supply current
LMV722
20
–40°C to 85°C
12
25°C
15
–40°C to 85°C
8.5
0.11
52.6
mA
23.7
1.03
–40°C to 85°C
25°C
V
0.135
25°C
25°C
0.19
0.215
25°C
–40°C to 85°C
IO
dB
94
0.134
25°C
Sourcing, VO = 0 V,
VIN(diff) = ±0.5 V
V
87
–40°C to 85°C
Output swing
dB
4.1
25°C
mV
dB
–0.3
25°C
25°C
1.4
1.7
2.01
–40°C to 85°C
2.4
mA
2.8
SR
Slew rate (1)
25°C
5.25
V/µs
GBW
Gain bandwidth product
25°C
10
MHz
Φm
Phase margin
25°C
72
°
Gm
Gain margin
25°C
–11
dB
Vn
Input-referred voltage noise
f = 1 kHz
25°C
8.5
nV/√Hz
In
Input-referred current noise
f = 1 kHz
25°C
0.2
pA/√Hz
Total harmonic distortion
f = 1 kHz, AV = 1,
RL = 600 Ω, VO = 500 mVpp
25°C
0.001
THD
(1)
4
UNIT
Connected as voltage follower with 1-V step input. Number specified is the slower of the positive and negative slew rate.
Submit Documentation Feedback
%
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SOURCING CURRENT
vs
OUTPUT VOLTAGE
100
1.4
VCC = 2.2 V
TA = 125°C
TA = 85°C
Isource – Sourcing Current – mA
1.3
ICC – Supply Current – mA
1.2
1.1
1
0.9
TA = 25°C
0.8
TA = –40°C
0.7
0.6
10
1
0.5
0.1
0.001
0.4
2
2.5
3
3.5
4
4.5
5
5.5
6
0.01
1
10
Output Voltage Referenced to VCC – V
VCC – Supply Voltage – V
SOURCING CURRENT
vs
OUTPUT VOLTAGE
SINKING CURRENT
vs
OUTPUT VOLTAGE
100
100
VCC = 5 V
VCC = 2.2 V
Isink – Sinking Current – mA
Isource – Sourcing Current – mA
0.1
10
1
0.1
0.001
0.01
0.1
1
10
10
1
0.1
0.001
Output Voltage Referenced to VCC – V
Submit Documentation Feedback
0.01
0.1
1
10
Output Voltage Referenced to VCC – V
5
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
SINKING CURRENT
vs
OUTPUT VOLTAGE
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
100
0.3
VIO – Input Offset Voltage – mV
Isink – Sinking Current – mA
VCC = 5 V
10
1
0.1
0.001
0.2
0.1
0
-0.1
-0.2
-0.3
0.01
0.1
1
10
2
2.5
3
Output Voltage Referenced to VCC – V
4.5
5
INPUT OFFSET VOLTAGE
vs
INPUT COMMON-MODE VOLTAGE
0.3
0.3
VCC = 2.2 V
VCC = 5 V
0.2
VIO – Input Offset Voltage – mV
VIO – Input Offset Voltage – mV
4
VCC – Supply Voltage – V
INPUT OFFSET VOLTAGE
vs
INPUT COMMON-MODE VOLTAGE
0.1
0
-0.1
-0.2
-0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0
0.3
0.6
0.9
1.2
1.5
0
VICR – Input Common-Mode Voltage – V
6
3.5
Submit Documentation Feedback
0.5
1
1.5
2
2.5
3
3.5
VICR – Input Common-Mode Voltage – V
4
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
INPUT VOLTAGE
vs
OUTPUT VOLTAGE
INPUT VOLTAGE
vs
OUTPUT VOLTAGE
0.3
0.3
VCC = 5 V
VCC = 2.2 V
Input Differential Voltage – mV
Input Differential Voltage – mV
0.2
0.1
0
-0.1
-0.2
0.2
0.1
0
-0.1
-0.2
-0.3
-0.3
0
0.5
1
1.5
2
0
2.5
INPUT VOLTAGE NOISE
vs
FREQUENCY
1.5
2
2.5
3
3.5
4
4.5
5
INPUT CURRENT NOISE
vs
FREQUENCY
100
Input Current Noise – pA/ √Hz
Hz
100
Input Voltage Noise – µV/ √Hz
Hz
1
Output Voltage – V
Output Voltage – V
10
1
10
1.E+01
0.5
100
1.E+02
1.E+03
1k
1.E+04
10k
1.E+05
100k
10
1
0.1
10
1.E+01
f – Frequency – Hz
100
1.E+02
1k
1.E+03
10k
1.E+04
f – Frequency – Hz
Submit Documentation Feedback
7
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
PSRR
vs
FREQUENCY
PSRR
vs
FREQUENCY
120
120
VCC = 5 V
100
100
80
80
PSRR – dB
60
60
40
40
20
20
0
1.E+02
100
1.E+03
1k
1.E+04
10k
1.E+05
100k
1.E+06
1M
0
1.E+02
100
1.E+07
10M
1.E+03
1k
1.E+04
10k
1.E+05
100k
f – Frequency – Hz
f – Frequency – Hz
GAIN AND PHASE
vs
FREQUENCY
GAIN AND PHASE
vs
FREQUENCY
80
80
130
VCC = 5 V
115
70
100
60
50
85
50
40
70
30
55
20
40
10
115
Phase
100
85
Gain
40
70
30
55
20
40
25
10
25
0
10
0
10
-10
-5
-10
-5
Gain – dB
Gain – dB
8
Gain
Phase – deg
Phase
60
1.E+07
10M
130
VCC = 2.2 V
70
1.E+06
1M
-20
-20
10k
100k 1.E+06
10M
100M
1k
1M
1.E+03
1.E+04
1.E+05
1.E+07
1.E+08
-20
-20
10k
100k
10M
100M
1k
1M
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
1.E+08
f – Frequency – Hz
f – Frequency – Hz
Submit Documentation Feedback
Phase – deg
PSRR – dB
VCC = 2.2 V
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
SLEW RATE
vs
SUPPLY VOLTAGE
THD
vs
FREQUENCY
6
1
VCC = 2.2 V
5.8
5.6
5.2
THD – %
SR – Slew Rate – V/µs
0.1
5.4
5
Rising
0.01
4.8
4.6
0.001
4.4
Falling
4.2
4
2
2.5
3
3.5
4
4.5
5
0.0001
100
10000
10k
100000
100k
f – Frequency – Hz
VCC – Supply Voltage – V
PULSE RESPONSE
PULSE RESPONSE
VCCR=L 5= V,
RL = C
2 Lk=Ω21.2
, CL =nF,
21.2
RO ©
= 2.1 Ω
2 k©,
ROnF,
= 2.1
nF, RnF,
0O©= 0 Ω
VCC =R5
V,2Rk©,
kLΩ=, 21.2
CL = 21.2
L=
O =R
L = 2C
0.25 V per Division
0.25 V per Division
1000
1k
2 µs per Division
2 µs per Division
Submit Documentation Feedback
9
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
PULSE RESPONSE
PULSE RESPONSE
10Rk©,
C = 21.2 nF, R = 0 ©
VCCR=L 5= V,
L = 10 LkΩ, CL = 21.2OnF, RO = 0 Ω
0.25 V per Division
0.25 V per Division
= V,
2 k©,
ROnF,
= 9.5
VCCR=L 5
RL = C
2Lk=Ω21.2
, CL =nF,
21.2
RO ©
= 9.5 Ω
2 µs per Division
2 µs per Division
PULSE RESPONSE
PULSE RESPONSE
2R
©,
C2L =
ROnF,
= 0R©
VCC = R
2.2
Ω2.12
, CL =nF,
2.12
L =V,
L =
O = 0 Ω
0.25 V per Division
250 mV per Division
= V,
600
CL =Ω21.2
ROnF,
= 0R©O = 0 Ω
VCCR=L 5
RL©,
= 600
, CL =nF,
21.2
2 µs per Division
10
1 µs per Division
Submit Documentation Feedback
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
www.ti.com
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
PULSE RESPONSE
PULSE RESPONSE
10Rk©,
C k=
ROnF,
= 0R©
VCC = R2.2
Ω,2.12
CL =nF,
2.12
L =V,
L = 10 L
O = 0 Ω
250 mV per Division
250 mV per Division
RL =V,2Rk©,
CLΩ=, 2.12
nF, RnF,
0O©= 0 Ω
VCC = 2.2
CL = 2.12
O =R
L = 2 k
1 µs per Division
1 µs per Division
PULSE RESPONSE
PULSE RESPONSE
VCC = R
2.2
= 10Ck
CL =nF,
2.12ROnF,
RO = ©
11.5 Ω
10RLk©,
= ,2.12
= 11.5
L =V,
LΩ
250 mV per Division
250 mV per Division
RL V,
= 10
k©,
2.12
nF, R
VCC = 2.2
RL =
10 C
kΩ
,C
nF,
2.2 Ω
L=
O =R2.2
L = 2.12
O =©
1 µs per Division
1 µs per Division
Submit Documentation Feedback
11
LMV721,, LMV722
10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
SLOS470A – JUNE 2005 – REVISED AUGUST 2006
TYPICAL CHARACTERISTICS (continued)
PULSE RESPONSE
250 mV per Division
600
CL =
ROnF,
= 0R©
VCC = R
2.2
RL ©,
= 600
Ω1.89
, CL =nF,
1.89
L =V,
O = 0 Ω
1 µs per Division
12
Submit Documentation Feedback
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV721IDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV721IDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV721IDCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV721IDCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV721IDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV721IDCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722IDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722IDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV722IDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2008
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMV721IDBVR
DBV
5
SITE 35
180
9
3.23
3.17
1.37
4
8
Q3
LMV721IDBVR
DBV
5
SITE 45
0
0
3.23
3.17
1.37
4
8
Q3
LMV721IDCKR
DCK
5
SITE 35
180
9
2.24
2.34
1.22
4
8
Q3
LMV721IDCKR
DCK
5
SITE 45
0
0
2.4
2.5
1.2
4
8
Q3
LMV721IDCKT
DCK
5
SITE 35
180
9
2.24
2.34
1.22
4
8
Q3
LMV721IDCKT
DCK
5
SITE 45
0
0
2.4
2.5
1.2
4
8
Q3
LMV722IDGKR
DGK
8
SITE 47
330
12
5.3
3.3
1.3
8
12
Q1
LMV722IDR
D
8
SITE 27
330
12
6.4
5.2
2.1
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2008
Device
Package
Pins
Site
Length (mm)
Width (mm)
LMV721IDBVR
DBV
5
SITE 35
202.0
201.0
28.0
LMV721IDBVR
DBV
5
SITE 45
0.0
185.0
220.0
LMV721IDCKR
DCK
5
SITE 35
202.0
201.0
28.0
LMV721IDCKR
DCK
5
SITE 45
0.0
185.0
220.0
LMV721IDCKT
DCK
5
SITE 35
202.0
201.0
28.0
LMV721IDCKT
DCK
5
SITE 45
0.0
185.0
220.0
LMV722IDGKR
DGK
8
SITE 47
370.0
355.0
55.0
LMV722IDR
D
8
SITE 27
342.9
338.1
20.64
Pack Materials-Page 2
Height (mm)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated
Similar pages