ON CM1425-03CS 4-channel emi filter array with esd protection Datasheet

4-Channel EMI Filter Array
with ESD Protection
CM1425
Features
Product Description
•
The CM1425 is an EMI filter array with ESD
protection, which integrates 4 pi filters (C-R-C). The
CM1425 has component values of 20pF-100Ω-20pF.
The parts include ESD protection diodes on every
pin, which provide a very high level of protection for
sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The ESD
diodes connected to the filter ports safely dissipate
ESD strikes of ±15kV, well beyond the maximum
requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater
than ±30kV.
•
•
•
•
•
•
•
Four channels of EMI filtering with ESD
protection
Pin compatible with CMD’s CSPRC032A
Greater than 30dB attenuation over the 800MHz
to 3GHz frequency range
±15kV ESD protection (IEC 61000-4-2, contact
discharge)
±30kV ESD protection (HBM)
9-bump, 2.470mm x 0.970mm footprint Chip
Scale Package (CSP)
Available with OptiGuard™ coating for improved
reliability
Lead-free versions available
Applications
•
•
•
•
Filtering for antenna and keypad data lines
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
EMI filtering for LCD and chip-to-chip data lines
in mobile electronic devices that use flexible PCB
interconnections
This device is particularly well-suited for portable
electronics (e.g. mobile handsets, PDAs, notebook
computers) because of its small package and easyto-use pin assignments. In particular, the CM1425 is
ideal for EMI filtering and protecting data lines from
ESD in wireless handsets.
All CM1425 devices are optionally available with
OptiGuard™ coating which results in improved
reliability at assembly. These devices are also
available with standard and lead-free finishing. The
CM1425 is housed in a space-saving, low-profile,
chip-scale package and is fabricated with the
Centurion™ processes.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1425/D
CM1425
Block Diagram
Rev. 2 | Page 2 of 9 | www.onsemi.com
CM1425
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
FILTER+ESD1
Filter Channel 1
B1
FILTER+ESD1
Filter Channel 1
A2
FILTER+ESD2
Filter Channel 2
B2
FILTER+ESD2
Filter Channel 2
A4
FILTER+ESD3
Filter Channel 3
B4
FILTER+ESD3
Filter Channel 3
A5
FILTER+ESD4
Filter Channel 4
B5
FILTER+ESD4
Filter Channel 4
B3
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
2
Standard Finish
Lead-free Finish
OptiGuard™ Coated
No Coating
OptiGuard™ Coated
-No Coating
Bumps
PKG
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
Ordering Part
1
Number
Part
Marking
9
CSP
CM1425-01CS
N251
CM1425-03CS
N253
CM1425-01CP
N251
CM1425-03CP
N253
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
Power Rating per Resistor
100
mW
Package Power Rating
300
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 2 | Page 3 of 9 | www.onsemi.com
CM1425
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
80
100
120
Ω
16
20
24
pF
R
Resistance
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
Diode Standoff Voltage
IDIODE = 10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = + 3.3V
100
300
nA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
VDIODE
VESD
RDYN
f
C
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-42 Level 4
Note 2
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
5.6
-1.5
V
±30
kV
±15
kV
1.5
0.9
Ω
Ω
86
MHz
R = 100Ω, C = 20pF
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 2 | Page 4 of 9 | www.onsemi.com
CM1425
Performance Information
.
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Rev. 2 | Page 5 of 9 | www.onsemi.com
CM1425
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 6 of 9 | www.onsemi.com
260°C
CM1425
Mechanical Details
CM1425 devices are packaged in a custom a 9-bump custom Chip Scale Packages (CSP) and available with
optional OptiGuardTM coating. Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Millimeters
Inches
Dim
Min
Nom
Max
A1
0.925
0.970
1.015
0.0364 0.0382 0.0400
A2
2.425
2.470
2.515
0.0955 0.0972 0.0990
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.185
0.235
0.285
0.0073 0.0093 0.0112
C2
0.185
0.235
0.285
0.0073 0.0093 0.0112
D11
0.562
0.606
0.650
0.0221 0.0239 0.0256
D21
0.356
0.381
0.406
0.0140 0.0150 0.0160
D32
0.575
0.644
0.714
0.0226 0.0254 0.0281
D42
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape
and reel
Min
Nom
Max
3500 pieces
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard™ (coated) devices only.
Package Dimensions
CM1425 9-bump Chip Scale Package
Rev. 2 | Page 7 of 9 | www.onsemi.com
CM1425
Mechanical Details (cont’d)
CSP Tape and Reel Specifications
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P0
P1
PART NUMBER
PKG. SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1425-01
2.470 X 0.970 X 0.606
2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm
4mm
CM1425-03
2.470 X 0.970 X 0.644
2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm
4mm
Figure 6. Tape and Reel Mechanical Data
Rev. 2 | Page 8 of 9 | www.onsemi.com
CM1425
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 2 | Page 9 of 9 | www.onsemi.com
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