BT138 series D and E 12 A four-quadrant triacs, sensitive gate Rev. 02 — 12 March 2008 Product data sheet 1. Product profile 1.1 General description Passivated sensitive gate triac in a SOT78 plastic package. 1.2 Features n Very sensitive gate n Direct interfacing to logic level ICs n Gate triggering in four quadrants n Direct interfacing to low power gate drive circuits 1.3 Applications n General purpose switching and phase control n 230 V lamp dimmers 1.4 Quick reference data n n n n n n VDRM ≤ 600 V (BT138-600D) VDRM ≤ 600 V (BT138-600E) VDRM ≤ 800 V (BT138-800E) IGT ≤ 5 mA (BT138-600D) IGT ≤ 10 mA (BT138-600E) IGT ≤ 10 mA (BT138-800E) n n n n n IT(RMS) ≤ 12 A ITSM ≤ 95 A (t = 20 ms) IGT ≤ 10 mA (T2− G+) (BT138-600D) IGT ≤ 25 mA (T2− G+) (BT138-600E) IGT ≤ 25 mA (T2− G+) (BT138-800E) BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 2. Pinning information Table 1. Pinning Pin Description Simplified outline 1 main terminal 1 (T1) 2 main terminal 2 (T2) 3 gate (G) mb mounting base; main terminal 2 (T2) Graphic symbol mb T2 T1 G sym051 1 2 3 SOT78 (TO-220AB) 3. Ordering information Table 2. Ordering information Type number Package BT138-600D Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 BT138-600E BT138-800E 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage Conditions - 600 V BT138-600E [1] - 600 V BT138-800E - 800 V - 12 A t = 20 ms - 95 A t = 16.7 ms - 105 A - 45 A2s full sine wave; Tmb ≤ 99 °C; see Figure 4 and 5 ITSM non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 for fusing tp = 10 ms BT138_SER _D_E_2 Product data sheet Unit [1] RMS on-state current I2t Max BT138-600D IT(RMS) I2t Min © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 2 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate Table 3. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit dIT/dt rate of rise of on-state current ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ - 50 A/µs T2+ G− - 50 A/µs T2− G− - 50 A/µs T2− G+ - 10 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature −40 +150 °C Tj junction temperature - 125 °C [1] over any 20 ms period Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. 003aac220 20 Ptot (W) 15 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° α 90° 60° 10 30° 5 0 0 2 4 6 8 10 12 IT(RMS) (A) 14 α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 3 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 003aac217 100 ITSM (A) 80 60 40 ITSM IT t 20 1/f Tj(init) = 25 °C max 0 1 10 102 103 104 number of cycles f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aac221 103 ITSM IT ITSM (A) t tp Tj(init) = 25 °C max 102 (1) (2) 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit (2) T2− G+ quadrant limit Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 4 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 003aac218 50 003aac215 15 IT(RMS) (A) IT(RMS) (A) 40 10 30 20 5 10 0 10-2 10-1 0 -50 1 10 surge duration (s) 0 50 100 150 Tmb (°C) f = 50 Hz Tmb = 99 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature; maximum values 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Rth(j-mb) Rth(j-a) Conditions Min Typ Max Unit thermal resistance from junction to full cycle; see Figure 6 mounting base - - 1.5 K/W thermal resistance from junction to full cycle; in free air ambient - 60 - K/W 003aab762 10 Zth(j-mb) (K/W) 1 10−1 P 10−2 tp 10−3 10−5 10−4 10−3 10−2 10−1 1 t 10 tp (s) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 5 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 6. Static characteristics Table 5. Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter IGT IL gate trigger current latching current Conditions BT138-600D BT138-600E BT138-800E Unit Min Typ Max Min Typ Max T2+ G+ - 1.3 5 - 2.5 10 mA T2+ G− - 2.8 5 - 4.0 10 mA T2− G− - 3.2 5 - 5.0 10 mA T2− G+ - 5.5 10 - 11 25 mA T2+ G+ - - 15 - - 30 mA T2+ G− - - 20 - - 40 mA T2− G− - - 15 - - 30 mA VD = 12 V; IT = 0.1 A; see Figure 8 VD = 12 V; IG = 0.1 A; see Figure 10 - - 20 - - 40 mA IH holding current VD = 12 V; IG = 0.1 A; see Figure 11 T2− G+ - - 10 - - 30 mA VT on-state voltage IT = 15 A; see Figure 9 - 1.4 1.65 - 1.4 1.65 V VGT gate trigger voltage IT = 0.1 A; see Figure 7 VD = 12 V; - 0.7 1.5 - 0.7 1.5 V VD = VDRM; Tj = 125 °C 0.25 0.4 - 0.25 0.4 - V - 0.1 0.5 - 0.1 0.5 mA ID off-state current VD = VDRM(max); Tj = 125 °C BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 6 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 7. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter Conditions BT138-600D BT138-600E BT138-800E Unit Min Typ Max Min Typ Max dVD/dt rate of rise of off-state voltage VDM = 0.67 × VDRM(max); exponential waveform; gate open circuit; Tj = 110 °C - 50 - - 150 - V/µs tgt gate-controlled turn-on time - 2 - - 2 - µs ITM = 16 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs 003aac223 1.6 003aac224 3 VGT IGT VGT(25°C) IGT(25°C) (1) (2) 1.2 2 (3) (4) 0.8 (1) (2) (3) 1 (4) 0.4 0 −60 −10 40 90 0 −60 140 Tj (°C) −10 40 90 140 Tj (°C) (1) T2− G+ (2) T2− G− (3) T2+ G− (4) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 7 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 003aac214 40 003aac225 3 IT (A) IL IL(25°C) 30 2 20 (1) (2) 1 (3) 10 0 0 0.5 1 1.5 2 0 −60 2.5 VT (V) −10 40 90 140 Tj (°C) Vo = 1.175 V Rs = 0.032 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage Fig 10. Normalized latching current as a function of junction temperature 003aac226 2.0 IH IH(25°C) 1.5 1.0 0.5 0 −60 −10 40 90 140 Tj (°C) Fig 11. Normalized holding current as a function of junction temperature BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 8 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 8. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB E SOT78 A A1 p q mounting base D1 D L2 L1 Q b1 L 1 2 3 c b e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 c D D1 E e L L1 L2 max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.45 1.00 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 05-03-22 05-10-25 Fig 12. Package outline SOT78 (TO-220AB) BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 9 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BT138_SER_D_E_2 20080312 Product data sheet - BT138_SERIES_E_1 Modifications: BT138_SERIES_E_1 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. BT138-600D product added 19970901 Product data sheet BT138_SER _D_E_2 Product data sheet - - © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 10 of 12 BT138 series D and E NXP Semiconductors 12 A four-quadrant triacs, sensitive gate 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BT138_SER _D_E_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 12 March 2008 11 of 12 NXP Semiconductors BT138 series D and E 12 A four-quadrant triacs, sensitive gate 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 March 2008 Document identifier: BT138_SER _D_E_2