[ /Title (CD74 HCU04 ) /Subject (High Speed CMOS Logic Hex Inverter CD74HCU04 Data sheet acquired from Harris Semiconductor SCHS127D High-Speed CMOS Logic Hex Inverter February 1998 - Revised May 2004 Features Description • Typical Propagation Delay: 6ns at VCC = 5V, CL = 15pF, TA = 25oC, Fastest Part in QMOS Line The CD74HCU04 unbuffered hex inverter utilizes silicon-gate CMOS technology to achieve operation speeds similar to LSTTL gates, with the low power consumption of standard CMOS integrated circuits. These devices especially are useful in crystal oscillator and analog applications. • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs Ordering Information • HCU Types - 2-V to 6-V Operation - High Noise Immunity: NIL = 20%, NIH = 30% of VCC at VCC = 5V PART NUMBER • CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD74HCU04E -55 to 125 14 Ld PDIP CD74HCU04M -55 to 125 14 Ld SOIC CD74HCU04MT -55 to 125 14 Ld SOIC CD74HCU04M96 -55 to 125 14 Ld SOIC CD74HCU04PWR -55 to 125 14 Ld TSSOP NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a smallquantity reel of 250. Pinout CD74HCU04 (PDIP, SOIC, TSSOP) TOP VIEW 1A 1 14 VCC 1Y 2 13 6A 2A 3 12 6Y 2Y 4 11 5A 3A 5 10 5Y 3Y 6 9 4A GND 7 8 4Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated 1 CD74HCU04 Functional Diagram 1A 1Y 2A 2Y 3A 3Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y Logic Symbol nA nY Schematic Diagram VCC (3, 5, 9, 11, 13) 1 2 (4, 6, 8, 10, 12) 2 CD74HCU04 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC Voltages Referenced to Ground . . . . . . . . . . . . . . . . -0.5V to +7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range TA . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating, and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads SYMBOL VI (V) VIH - VIL Quiescent Device Current MAX MIN MAX MIN MAX UNITS 2 1.7 - 1.7 - 1.7 - V 4.5 3.6 - 3.6 - 3.6 - V 6 4.8 - 4.8 - 4.8 - V - 0.3 - 0.3 - 0.3 V 0.8 - 0.8 - 0.8 V 6 - 1.1 - 1.1 - 1.1 V -0.02 2 1.8 - 1.8 - 1.8 - V -0.02 4.5 4 - 4 - 4 - V -0.02 6 5.5 - 5.5 - 5.5 - V -4 4.5 3.98 - 3.84 - 3.7 - V -5.2 6 5.48 - 5.34 - 5.2 - V 0.02 2 - 0.2 - 0.2 - 0.2 V 0.02 4.5 - 0.5 - 0.5 - 0.5 V 0.02 6 - 0.5 - 0.5 - 0.5 V 4 4.5 - 0.26 - 0.33 - 0.4 V VCC or GND 5.2 6 - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - 2 - 20 - 40 µA VIH or VIL VCC or GND VOL VIH or VIL - MIN - Low Level Output Voltage TTL Loads Input Leakage Current - -55oC TO 125oC 2 High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads IO (mA) VCC (V) -40oC TO +85oC 4.5 VOH - 25oC 3 CD74HCU04 Switching Specifications Input tr, tf = 6ns PARAMETER Propagation Delay, Input to Output Y (Figure 1) Transition Times (Figure 1) Input Capacitance Power Dissipation Capacitance (Notes 2, 3) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 2 - - 70 - 90 - 105 ns CL = 50pF 4.5 - - 14 - 18 - 21 ns CL = 15pF 5 - 5 - - - - - ns CL = 50pF 6 - - 12 - 15 - 18 ns CL = 50pF 2 - - 75 - 95 18 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns tTLH, tTHL CI - CPD - VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS See Figure 3 5 - 14 - - pF - - - NOTES: 2. CPD is used to determine the dynamic power consumption, per inverter. 3. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns VCC 90% 50% 10% INPUT GND tTHL tTLH 90% 50% 10% INVERTING OUTPUT tPLH tPHL FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC ICC, VCC TO GND CURRENT (mA) Typical Performance Curves AMBIENT TEMPERATURE TA = 25o C 25.0 22.5 VCC = 6V 20.0 17.5 15.0 VCC = 4.5V 12.5 10.0 7.5 5.0 VCC = 2V 2.5 0 1 2 3 4 5 VI, INPUT VOLTAGE (V) 6 FIGURE 2. TYPICAL INVERTER SUPPLY CURRENT AS FUNCTION OF INPUT VOLTAGE 4 pF CD74HCU04 CI, INPUT CAPACITANCE (pF) Typical Performance Curves 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 (Continued) AMBIENT TEMPERATURE, TA = 25oC VDD = 2V, VI 0-2V INPUT PIN 5 CONDITIONS VDD = 3V, VI 0-3V VDD = 4V, VI 0-4V VDD = 5V, VI 0-5V VDD = 6V, VI 0-6V 1 2 3 VIN, INPUT VOLTAGE (V) 4 FIGURE 3. INPUT CAPACITANCE AS A FUNCTION OF INPUT VOLTAGE 5 5 6 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74HCU04E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCU04E CD74HCU04EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCU04E CD74HCU04M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCU04M CD74HCU04M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCU04M CD74HCU04M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCU04M CD74HCU04M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCU04M CD74HCU04MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCU04M CD74HCU04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJU04 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 10-Jun-2014 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD74HCU04 : • Automotive: CD74HCU04-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HCU04M96 Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD74HCU04MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD74HCU04PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HCU04M96 SOIC D 14 2500 367.0 367.0 38.0 CD74HCU04MT SOIC D 14 250 367.0 367.0 38.0 CD74HCU04PWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated