MCP1701A 2 µA Low-Dropout Positive Voltage Regulator Features General Description • 2.0 µA Typical Quiescent Current • Input Operating Voltage Range up to 10.0V • Low-Dropout Voltage (LDO): - 120 mV (typical) @ 100 mA - 380 mV (typical) @ 200 mA • High Output Current: 250 mA (VOUT = 5.0V) • High-Accuracy Output Voltage: ±2% (max) • Low Temperature Drift: ±100 ppm/°C (typical) • Excellent Line Regulation: 0.2%/V (typical) • Package Options: 3-Pin SOT-23A, 3-Pin SOT-89, and 3-Pin TO-92 • Short Circuit Protection • Standard Output Voltage Options: - 1.8V, 2.5V, 3.0V, 3.3V, 5.0V The MCP1701A is a family of CMOS low-dropout, positive voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 µA of quiescent current (typ.). The input operating range is specified up to 10V, making it ideal for lithium-ion (one or two cells), 9V alkaline and other two and three primary cell battery-powered applications. Applications • • • • • • • • • • • • Battery-Powered Devices Battery-Powered Alarm Circuits Smoke Detectors CO2 Detectors Smart Battery Packs PDAs Low-Quiescent Current Voltage Reference Cameras and Portable Video Equipment Pagers and Cellular Phones Solar-Powered Instruments Consumer Products Microcontroller Power The MCP1701A is capable of delivering 250 mA with an input-to-output voltage differential (dropout voltage) of 650 mV. The low-dropout voltage extends the battery operating lifetime. It also permits high currents in small packages when operated with minimum VIN – VOUT differentials. The MCP1701A offers improved startup and transient response. The MCP1701A has a tight tolerance output voltage regulation of ±0.5% (typ.) and very good line regulation at ±0.2%. The LDO output is stable when using only 1 µF of output capacitance of either tantalum or aluminum-electrolytic style capacitors. The MCP1701A LDO also incorporates short circuit protection to ensure maximum reliability. Package options include the 3-pin SOT-23A, 3-pin SOT-89 and 3-Pin TO-92. Package Types 3-Pin SOT-23A VIN 3-Pin SOT-89 VIN 3 MCP1701A MCP1701A 1 GND 2 1 2 3 GND VIN VOUT VOUT 3-Pin TO-92 123 Bottom View GND VIN VOUT Note: 3-Pin SOT-23A is equivalent to the EIAJ SC-59. © 2007 Microchip Technology Inc. DS21991C-page 1 MCP1701A Functional Block Diagram MCP1701A VOUT VIN Short-Circuit Protection + – Voltage Reference GND Typical Application Circuits MCP1701A GND VOUT 3.3V IOUT 50 mA DS21991C-page 2 VIN VOUT VIN 9V Alkaline Battery CIN 1 µF Tantalum COUT 1 µF Tantalum © 2007 Microchip Technology Inc. MCP1701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ........................................................+12V Output Current (Continuous)..........PD/(VIN – VOUT)mA Output Current (peak) ..................................... 500 mA Output Voltage ............... (GND – 0.3V) to (VIN + 0.3V) Continuous Power Dissipation: 3-Pin SOT-23A ............................................ 150 mW 3-Pin SOT-89............................................... 500 mW 3-Pin TO-92 ................................................. 300 mW † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25°C. Parameters Sym Min Typ Max Units Output Voltage Regulation VOUT VR - 2% VR±0.5% VR + 2% V Maximum Output Current IOUTMAX 250 — — mA 200 — — VOUT = 4.0V 150 — — VOUT = 3.3V 150 — — VOUT = 3.0V 125 — — VOUT = 2.5V 110 — — VOUT = 1.8V -1.60 ±0.8 +1.60 -2.25 ±1.1 +2.25 VOUT = 4.0V, 1 mA ≤ IOUT ≤ 100 mA -2.72 ±1.3 +2.72 VOUT = 3.3V, 1 mA ≤ IOUT ≤ 80 mA -3.00 ±1.5 +3.00 VOUT = 3.0V, 1 mA ≤ IOUT ≤ 80 mA -3.60 ±1.8 +3.60 VOUT = 2.5V, 1 mA ≤ IOUT ≤ 60 mA -1.60 ±0.8 +1.60 — 380 600 — 400 630 IOUT = 200 mA, VR = 4.0V — 400 700 IOUT = 150 mA, VR = 3.3V — 400 700 IOUT = 150 mA, VR = 3.0V — 400 700 IOUT = 120 mA, VR = 2.5V — 180 300 IQ — 2.0 4.5 µA VIN = VR + 1.0V ΔVOUT•100 — 0.2 0.3 %/V IOUT = 40 mA, (VR +1) ≤ VIN ≤ 10.0V Load Regulation (Note 3) Dropout Voltage ΔVOUT/ VOUT VIN - VOUT Input Quiescent Current Line Regulation % Conditions IOUT = 40 mA (Note 1) VOUT = 5.0V (VIN = VR + 1.0V) VOUT = 5.0V, 1 mA ≤ IOUT ≤ 100 mA VOUT = 1.8V, 1 mA ≤ IOUT ≤ 30 mA mV IOUT = 200 mA, VR = 5.0V IOUT = 20 mA, VR = 1.8V ΔVIN•VOUT VIN — — 10 V TCVOUT — ±100 — ppm/ °C TR — 200 — µs Input Voltage Temperature Coefficient of Output Voltage Output Rise Time 1: 2: 3: IOUT = 40 mA, -40°C ≤ TA ≤ +85°C (Note 2) 10% VR to 90% VR, VIN = 0V to VR +1V, RL = 25Ω resistive VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V. The input voltage VIN = VR + 1.0V, IOUT = 40 mA. TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = Highest voltage measured over the temperature range. VOUT-LOW = Lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. © 2007 Microchip Technology Inc. DS21991C-page 3 MCP1701A TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise specified, TA = +25°C. Parameters Sym Min Typ Max Units Conditions Specified Temperature Range (I) TA -40 — +85 °C Storage Temperature Range TA -40 — +125 °C θJA — 335 — °C/W Minimum trace width single layer application — 230 — °C/W Typical FR4, 4-layer application Temperature Ranges Package Thermal Resistances Thermal Resistance, 3L-SOT-23A Thermal Resistance, 3L-SOT-89 θJA — 52 — °C/W Typical, when mounted on 1 square inch of copper Thermal Resistance, 3L-TO-92 θJA — 131.9 — °C/W EIA/JEDEC JESD51-751-7 4-layer board DS21991C-page 4 © 2007 Microchip Technology Inc. MCP1701A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 3 2.8 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 1.7 VR = 1.8V Supply Current (μA) Supply Current (μA) Notes: Unless otherwise specified, VOUT = 1.8V, 3.3V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. +90°C +25°C -45°C VIN = 4.3V VR = 3.3V 1.6 1.5 +90°C 1.4 +25°C 1.3 1.2 -45°C 1.1 1 3 5 7 9 0 11 50 FIGURE 2-1: Supply Current vs. Input Voltage (VR = 1.8V). 2.2 VR = 3.3V 1.7 +90°C 1.5 +25°C 1.4 1.3 -45°C 1.2 1.1 1 200 VIN = 6.0V VR = 5.0V 2 +90°C 1.8 +25°C 1.6 1.4 -45°C 1.2 1 4 6 8 10 12 0 50 Input Voltage (V) 2.2 VR = 5.0V Supply Current (μA) +90°C 2 +25°C 1.8 1.6 1.4 150 200 FIGURE 2-5: Supply Current vs. Load Current (VR = 5.0V). 2.4 2.2 100 Load Current (mA) FIGURE 2-2: Supply Current vs. Input Voltage (VR = 3.3V). Supply Current (μA) 150 FIGURE 2-4: Supply Current vs. Load Current (VR = 3.3V). Supply Current (μA) Supply Current (μA) 1.8 1.6 100 Load Current (mA) Input Voltage (V) -45°C 1.2 VIN = VR + 1.0V IOUT = 0 μA 2 VR = 5.0V 1.8 VR = 3.3V 1.6 VR = 1.8V 1.4 1.2 1 6 7 8 9 10 11 12 -45 -25 FIGURE 2-3: Supply Current vs. Input Voltage (VR = 5.0V). © 2007 Microchip Technology Inc. -5 15 35 55 75 95 Temperature (°C) Input Voltage (V) FIGURE 2-6: Temperature. Supply Current vs. DS21991C-page 5 MCP1701A Note: Unless otherwise indicated, VOUT = 1.8V, 3.3V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 1.88 Output Voltage (V) Output Voltage (V) VR = 1.8V IOUT = 0.1 mA 1.86 1.84 +25°C 1.82 1.8 1.78 +90°C 1.76 1.74 -45°C 1.72 3 4 5 6 7 8 9 10 11 1.82 1.81 1.8 1.79 1.78 1.77 1.76 1.75 1.74 1.73 1.72 1.71 12 +90°C -45°C 0 20 Input Voltage (V) 3.4 +90°C +25°C 3.3 -45°C 3.28 3.26 100 3.31 +25°C 3.3 3.29 3.28 -45°C 3.27 3.26 3.24 4 5 6 7 8 9 10 11 3.25 12 0 30 Input Voltage (V) FIGURE 2-8: Output Voltage vs. Input Voltage (VR = 3.3V). 5.12 5.04 Output Voltage (V) +90°C 5.04 +25°C 5.02 -45°C 5 4.98 120 150 VR = 5.0V VIN = 6.0V +90°C 5.03 5.08 5.06 60 90 Load Current (mA) FIGURE 2-11: Output Voltage vs. Load Current (VR = 3.3V). VR = 5.0V IOUT = 0.1 mA 5.1 Output Voltage (V) 80 VR = 3.3V VIN = 4.3V +90°C 3.32 Output Voltage (V) Output Voltage (V) 3.33 3.36 3.32 60 FIGURE 2-10: Output Voltage vs. Load Current (VR = 1.8V). VR = 3.3V IOUT = 0.1 mA 3.34 40 Load Current (mA) FIGURE 2-7: Output Voltage vs. Input Voltage (VR = 1.8V). 3.38 VR = 1.8V VIN = 3.0V +25°C +25°C 5.02 5.01 5 -45°C 4.99 4.98 4.97 6 7 8 9 10 11 12 Input Voltage (V) FIGURE 2-9: Output Voltage vs. Input Voltage (VR = 5.0V). DS21991C-page 6 0 50 100 150 200 250 Load Current (mA) FIGURE 2-12: Output Voltage vs. Load Current (VR = 5.0V). © 2007 Microchip Technology Inc. MCP1701A Note: Unless otherwise indicated, VOUT = 1.8V, 3.3V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 0.7 VR = 1.8V Dropout Voltage (V) 0.6 +25°C 0.5 +90°C 0.4 -45°C 0.3 0.2 0.1 0.0 0 20 40 60 80 Load Current (mA) 100 FIGURE 2-13: Dropout Voltage vs. Load Current (VR = 1.8V). FIGURE 2-16: (VR = 1.8V). Start-up From VIN FIGURE 2-17: (VR = 3.3V). Start-up From VIN FIGURE 2-18: (VR = 5.0V). Start-up From VIN 0 Dropout Voltage (V) 0.50 VR = 3.3V 0.40 0.30 +25°C +90°C 0.20 0.10 -45°C 0.00 0 25 50 75 100 125 150 Load Current (mA) FIGURE 2-14: Dropout Voltage vs. Load Current (VR = 3.3V). 0.6 Dropout Voltage (V) VR = 5.0V 0.5 0.4 +25°C 0.3 +90°C 0.2 -45°C 0.1 0 0 50 100 150 200 250 Load Current (mA) FIGURE 2-15: Dropout Voltage vs. Load Current (VR = 5.0V). © 2007 Microchip Technology Inc. DS21991C-page 7 MCP1701A Note: Unless otherwise indicated, VOUT = 1.8V, 3.3V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum. 0.18 VR = 1.8V IOUT = 1 to 30 mA VIN = 6.0V -0.10 Line Regulation (%/V) Load Regulation (%) 0.00 -0.05 VIN = 3.0V -0.15 VIN = 8.0V -0.20 -0.25 VIN = 10.0V -0.30 -0.35 VIN = 12.0V -0.40 0.14 0.12 IOUT = 1.0 mA 0.10 0.08 IOUT = 10 mA 0.06 IOUT = 100 mA 0.04 0.02 0.00 -45 -30 -15 0 15 30 45 60 75 90 -45 -30 -15 Temperature (°C) VR = 3.3V IOUT = 1 to 80 mA VIN = 4.3V -0.45 VIN = 8.0V -0.50 -0.55 VIN = 10.0V -0.60 VIN = 12.0V -0.70 Line Regulation (%/V) Load Regulation (%) -0.40 -0.75 30 45 60 75 90 IOUT = 0 mA VR = 3.3V VIN = 4.3V to 10V 0.16 IOUT = 10 mA 0.14 IOUT = 100 mA 0.12 0.10 IOUT = 200 mA 0.08 0.06 IOUT = 300 mA 0.04 -45 -25 -5 15 35 55 75 -45 -30 -15 Temperature (°C) VR = 5.0V VIN = 6.0V to 12V VIN = 6.0V -0.25 -0.30 -0.35 -0.40 VIN = 8.0V -0.45 -0.50 -0.55 VIN = 10.0V VIN = 12.0V -0.60 -0.65 -25 -5 15 35 55 75 Temperature (°C) FIGURE 2-21: Load Regulation vs. Temperature (VR = 5.0V). DS21991C-page 8 30 45 0.18 60 75 90 VR = 5.0V VIN = 6.0V to 10V IOUT = 0 mA 0.16 IOUT = 1 mA 0.14 IOUT = 10 mA 0.12 0.10 IOUT = 100 mA IOUT = 200 mA 0.08 IOUT = 300 mA 0.06 -45 15 FIGURE 2-23: Line Regulation vs. Temperature (VR = 3.3V). Line Regulation (%/V) -0.20 0 Temperature (°C) FIGURE 2-20: Load Regulation vs. Temperature (VR = 3.3V). Load Regulation (%) 15 FIGURE 2-22: Line Regulation vs. Temperature (VR = 1.8V). 0.18 -0.35 0 Temperature (°C) FIGURE 2-19: Load Regulation vs. Temperature (VR = 1.8V). -0.65 VR = 1.8V VIN = 2.8V to 10V IOUT = 0 mA IOUT = 0.1 mA 0.16 -45 -30 -15 0 15 30 45 60 75 90 Temperature (°C) FIGURE 2-24: Line Regulation vs. Temperature (VR = 5.0V). © 2007 Microchip Technology Inc. MCP1701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. SOT-23A Pin No. SOT-89 Pin No. TO-92 Name 1 1 1 GND Ground Terminal 3.1 2 3 3 VOUT Regulated Voltage Output 3 2 2 VIN Unregulated Supply Input Ground Terminal (GND) Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2 µA, typ.) flows out of this pin, there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load. 3.2 Function Regulated Voltage Output (VOUT) Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close as possible to the LDO VOUT pin. The current flowing out of this pin is equal to the DC load current. © 2007 Microchip Technology Inc. 3.3 Unregulated Supply Input (VIN) Connect the input supply voltage and the positive side of the input capacitor to VIN. Like all low-dropout linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. The input capacitor should be physically located as close as possible to the VIN pin. For most applications, 1 µF of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low equivalent series resistance characteristics of the ceramic will yield better noise and PSRR performance at high frequency. The current flow into this pin is equal to the DC load current, plus the LDO bias current (2 µA, typical). DS21991C-page 9 MCP1701A 4.0 DETAILED DESCRIPTION 4.2 The MCP1701A is a low-quiescent current, precision, fixed-output voltage LDO. Unlike bipolar regulators, the MCP1701A supply current does not increase proportionally with load current. 4.1 Output Capacitor A minimum of 1 µF output capacitor is required. The output capacitor should have an ESR greater than 0.1Ω and less than 5Ω, plus a resonant frequency above 1 MHz. Larger output capacitors can be used to improve supply noise rejection and transient response. Care should be taken when increasing COUT to ensure that the input impedance is not high enough to cause high input impedance oscillation. Input Capacitor A 1 µF input capacitor is recommended for most applications when the input impedance is on the order of 10Ω. Larger input capacitance may be required for stability when operating from a battery input, or if there is a large distance from the input source to the LDO. When large values of output capacitance are used, the input capacitance should be increased to prevent high source impedance oscillations. 4.3 Overcurrent The MCP1701 internal circuitry monitors the amount of current flowing through the P-channel pass transistor. In the event of a short circuit or excessive output current, the MCP1701 will act to limit the output current. VIN VOUT Short Circuit Protection + – Voltage Reference GND FIGURE 4-1: DS21991C-page 10 MCP1701A Block Diagram. © 2007 Microchip Technology Inc. MCP1701A 5.0 THERMAL CONSIDERATIONS 5.1 Power Dissipation The amount of power dissipated internal to the LDO linear regulator is the sum of the power dissipation within the linear pass device (P-channel MOSFET) and the quiescent current required to bias the internal reference and error amplifier. The internal linear pass device power dissipation is calculated as shown in Equation 5-1. EQUATION 5-1: PD (Pass Device) = (VIN – VOUT) x IOUT The internal power dissipation, as a result of the bias current for the LDO internal reference and error amplifier, is calculated as shown in Equation 5-2. To determine the junction temperature of the device, the thermal resistance from junction-to-ambient must be known. The 3-pin SOT-23A thermal resistance from junction-to-air (RθJA) is estimated to be approximately 335°C/W. The SOT-89 RθJA is estimated to be approximately 52°C/W when mounted on 1 square inch of copper. The RθJA will vary with physical layout, airflow and other application-specific conditions. The device junction temperature is determined by calculating the junction temperature rise above ambient, then adding the rise to the ambient temperature. EQUATION 5-5: JUNCTION TEMPERATURE – SOT-23A EXAMPLE: T J = P DMAX × R θJA + T A T J = 116.0 milliwatts × 335°C/W + 55°C T J = 93.9°C EQUATION 5-2: PD (Bias) = VIN x IGND The total internal power dissipation is the sum of PD (pass device) and PD (bias). EQUATION 5-3: EQUATION 5-6: JUNCTION TEMPERATURE – SOT-89 EXAMPLE: T J = 116.0 milliwatts × 52°C/W + 55°C T J = 61°C PTOTAL = PD (Pass Device) + PD (Bias) For the MCP1701A, the internal quiescent bias current is so low (2 µA, typ.) that the PD (bias) term of the power dissipation equation can be ignored. The maximum power dissipation can be estimated by using the maximum input voltage and the minimum output voltage to obtain a maximum voltage differential between input and output. The next step would be to multiply the maximum voltage differential by the maximum output current. EQUATION 5-4: PD = (VINMAX – VOUTMIN) x IOUTMAX Given: VIN = 3.3V to 4.1V VOUT = 3.0V ± 2% IOUT = 1 mA to 100 mA TAMAX = 55°C PMAX = (4.1V – (3.0V x 0.98)) x 100 mA © 2007 Microchip Technology Inc. DS21991C-page 11 MCP1701A 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 3-Pin SOT-23A 2 1 1 2 3 3-Pin TO-92 3-Pin SOT-89 1 2 3 4 5 6 7 8 Line 1 4 Line 2 3 1 4 1 , 2 , 3 & 4 represents first voltage digit 1V, 2V, 3V, 4V, 5V, 6V Ex: 3.xV = 2 9 10 11 12 5 represents first voltage digit (1-6) 6 represents first voltage decimal (0-9) 7 represents extra feature code: fixed: 0 8 represents regulation accuracy 2 = ±2.0% (standard) 3 represents first decimal place voltage (x.0 - x.9) Ex: 3.4V = = 701A (fixed) 3 E Symbol Voltage Symbol Voltage A B C D E x.0 x.1 x.2 x.3 x.4 F H K L M x.5 x.6 x.7 x.8 x.9 3 represents polarity 0 = Positive (fixed) 4 represents assembly lot number DS21991C-page 12 9 , 10, 11 & 12 represents assembly lot number © 2007 Microchip Technology Inc. MCP1701A 3-Lead Plastic Small Outline Transistor (CB) [SOT-23A] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e1 e 2 1 E E1 N b A c A2 φ L A1 Units Dimension Limits Number of Pins MILLIMETERS MIN NOM MAX N 3 Lead Pitch e 0.95 BSC Outside Lead Pitch e1 Overall Height A 0.89 – Molded Package Thickness A2 0.90 – 1.30 Standoff A1 0.00 – 0.15 Overall Width E 2.10 – 3.00 Molded Package Width E1 1.20 – 1.80 Overall Length D 2.70 – 3.10 Foot Length L 0.15 – 0.60 Foot Angle φ 0° – 30° Lead Thickness c 0.09 – 0.26 1.90 BSC 1.45 Lead Width b 0.30 – 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-130B © 2007 Microchip Technology Inc. DS21991C-page 13 MCP1701A 3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E H L 1 N 2 b b1 b1 e E1 e1 A C Units Dimension Limits Number of Leads MILLIMETERS MIN N MAX 3 Pitch e 1.50 BSC Outside Lead Pitch e1 3.00 BSC Overall Height A 1.40 1.60 Overall Width H 3.94 4.25 Molded Package Width at Base E 2.29 2.60 Molded Package Width at Top E1 2.13 2.29 Overall Length D 4.39 4.60 Tab Length D1 1.40 1.83 Foot Length L 0.79 1.20 Lead Thickness c 0.35 0.44 Lead 2 Width b 0.41 0.56 Leads 1 & 3 Width b1 0.36 0.48 Notes: 1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-029B DS21991C-page 14 © 2007 Microchip Technology Inc. MCP1701A 3-Lead Plastic Transistor Outline (TO) [TO-92] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E A N 1 L 1 2 3 b e c D R Units Dimension Limits Number of Pins INCHES MIN N MAX 3 Pitch e Bottom to Package Flat D .125 .050 BSC .165 Overall Width E .175 .205 Overall Length A .170 .210 Molded Package Radius R .080 .105 Tip to Seating Plane L .500 – Lead Thickness c .014 .021 Lead Width b .014 .022 Notes: 1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-101B © 2007 Microchip Technology Inc. DS21991C-page 15 MCP1701A NOTES: DS21991C-page 16 © 2007 Microchip Technology Inc. MCP1701A APPENDIX A: REVISION HISTORY Revisions C (February 2007) • Updated Packaging Information Revision B (September 2006) • Numerous changes to Section 1.0. Electrical Characteristics • Added disclaimer to package outline drawings. Revision A (February 2006) • Original Release of this Document. © 2007 Microchip Technology Inc. DS21991C-page 17 MCP1701A NOTES: DS21991C-page 18 © 2007 Microchip Technology Inc. MCP1701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X- XX X X X /XX Tape Output Feature Tolerance Temp. Package and Reel Voltage Code Device: MCP1701A: 2 µA Low-Dropout Positive Voltage Regulator Tape and Reel: T Output Voltage: 18 = 1.8V “Standard” 25 = 2.5V “Standard” 30 = 3.0V “Standard” 33 = 3.3V “Standard” 50 = 5.0V “Standard” *Contact factory for other output voltage options. Examples: a) MCP1701AT-1802I/CB: 1.8V LDO Positive Voltage Regulator, SOT-23A-3 pkg. b) MCP1701AT-1802I/MB: 1.8V LDO Positive Voltage Regulator, SOT89-3 pkg. c) MCP1701A-1802I/TO: 1.8V LDO Positive Voltage Regulator, TO-92 pkg. d) MCP1701AT-2502I/CB: 2.5V LDO Positive Voltage Regulator, SOT-23A-3 pkg. e) MCP1701A-2502I/TO: 2.5V LDO Positive Voltage Regulator, TO-92 pkg. f) MCP1701AT-3002I/CB: 3.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. g) MCP1701AT-3002I/MB: 3.0V LDO Positive Voltage Regulator, SOT89-3 pkg. h) MCP1701A-3002I/TO: 3.0V LDO Positive Voltage Regulator, TO-92 pkg. i) MCP1701AT-3302I/CB: 3.3V LDO Positive Voltage Regulator, SOT-23A-3 pkg. j) MCP1701AT-3302I/MB: 3.3V LDO Positive Voltage Regulator, SOT89-3 pkg. k) MCP1701AT-5002I/CB: 5.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. l) MCP1701AT-5002I/MB: 5.0V LDO Positive Voltage Regulator, SOT89-3 pkg. m) MCP1701A-5002I/TO: 5.0V LDO Positive Voltage Regulator, TO-92 pkg. = Tape and Reel Extra Feature Code: 0 = Fixed Tolerance: 2 = 2.0% (Standard) Temperature: I = -40°C to +85°C Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 TO = 3-Pin TO-92 © 2007 Microchip Technology Inc. DS21991C-page 19 MCP1701A NOTES: DS21991C-page 20 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. 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