Surface Mount RF PIN Switch Diode Technical Data HSMP-3880 Features • Diodes Optimized for: Ultra-Low Distortion Switching • Surface Mount SOT-23 Package Tape and Reel Options Available • Low Failure in Time (FIT) Rate[1] • Lead-free Option Available Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) SINGLE 3 1 #0 2 Description/Applications The HSMP-3880 switching diode is an ultra low distortion device optimized for higher power applications to 1.5 GHz. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. 2 Absolute Maximum Ratings[1] TC = 25°C Symbol If Pt Piv Tj TSTG Parameter Units Absolute Maximum Forward Current (1 ms Pulse) Total Device Dissipation Peak Inverse Voltage Junction Temperature Storage Temperature Amp mW [2] — °C °C 1 250 Same as VBR 150 -65 to 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at TLEAD = 25°C. Derate to zero at maximum rated temperature. Typical Parameters at TC = 25°C Part Number HSMP3880 Test Conditions Series Resistance Carrier Lifetime τ (ns) RS (Ω) 3.8 IF = 1 mA f = 100 MHz Reverse Recovery Time Trr (ns) Total Capacitance CT (pF) 550 VR = 10 V IF = 20 mA 90% Recovery 0.30 @ 50 V 2500 IF = 50 mA IR = 250 mA Electrical Specifications TC = 25°C Part Number HSMP- Package Marking Code[1] Lead Code 3880 S0 0 Configuration Single Test Conditions Note: 1. Package marking code is white. Minimum Breakdown Voltage VBR (V) Maximum Series Resistance RS (Ω) Maximum Total Capacitance CT (pF) Maximum Shunt Mode Harmonic Distortion Hmd (dBc) 100 6.5 0.40 -55 VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz VR = 50 V f = 1 MHz 2 f o, Z o = 50 W f o = 400 MHz Pin = +30 dBm 0 V bias 3 Typical Parameters at TC = 25°C (unless otherwise noted), Single Diode 1000 10 1 0.1 125°C 0.01 0 0.2 0.8 CAPACITANCE (pF) RF RESISTANCE (OHMS) IF – FORWARD CURRENT (mA) 100 100 10 1 0.6 0.8 1.0 0.1 0.01 1.2 1 10 100 Figure 1. Forward Current vs. Forward Voltage. Figure 2. RF Resistance at 25°C vs. Forward Bias Current. 1000 900 800 700 600 500 120 INPUT INTERCEPT POINT (dBm) REVERSE RECOVERY TIME (nS) 0.2 0 0.1 IF – FORWARD BIAS CURRENT (mA) VF – FORWARD CURRENT (mA) VR = 5 V VR = 10 V 400 300 VR = 20 V 100 10 0.4 25°C –55°C 0.4 200 0.6 115 110 Diode Mounted as a Series Attenuator in a 50 Ohm Microstrip and Tested at 123 MHz 105 100 95 90 85 15 20 25 30 1 FORWARD CURRENT (mA) Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage. Figure 5. 2nd Harmonic Input Intercept Point vs. Forward Bias Current. Equivalent Circuit Model HSMP-3880 Cp 0.08 pF Lp Rs 2.0 nH 1Ω 10 30 IF – FORWARD BIAS CURRENT (mA) Rj Cj RT = 1 + R j 0.22 pF* CT = CP + Cj * Measured at -50 V 49 R j = 0.9 Ω I I = Forward Bias Current in mA 0 10 20 30 40 50 VR – REVERSE VOLTAGE (V) Figure 3. Capacitance vs. Reverse Voltage. 4 Package Dimensions Outline 23 (SOT-23) 1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) DATE CODE (X) 3 1.40 (0.055) 1.20 (0.047) XXX 2 1 0.60 (0.024) 0.45 (0.018) 2.65 (0.104) 2.10 (0.083) 2.04 (0.080) 1.78 (0.070) TOP VIEW 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) 1.02 (0.041) 0.85 (0.033) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) PC Board Footprints SOT-23 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 DIMENSIONS IN inches mm Package Characteristics Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260°C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) 5 Profile Option Descriptions -BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation; See Figure 6 -TR2 = 10K pc. Tape and Reel, Device Orientation; See Figure 6 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” For lead-free option, the part number will have the character "G" at the end, e.g., TR2G for a 10K pc lead-free reel. Ordering Information Specify part number followed by option under. For example: HSMP - 3880 - XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Diode Device Orientation For Outline SOT-23 TOP VIEW REEL END VIEW 4 mm 8 mm ABC ABC ABC ABC CARRIER TAPE USER FEED DIRECTION Note: "AB" represents package marking code. "C" represents date code. COVER TAPE Figure 6. Options -TR1, -TR2 for SOT-23 Package. Tape Dimensions and Product Orientation For Outline SOT-23 P P2 D E P0 F W D1 t1 Ko 9° MAX B0 A0 DESCRIPTION 13.5° MAX 8° MAX SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 +0.30 –0.10 0.229 ± 0.013 0.315 +0.012 –0.004 0.009 ± 0.0005 DISTANCE BETWEEN CENTERLINE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 CAVITY PERFORATION www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-7702E March 24, 2004 5988-9924EN