Common mode Noise Filters Common mode Noise Filters Type: EXC24CE EXC24CF ■ Features ■ Recommended Applications ● Reduce the common mode noise and reform the signal wave by high-coupled inductors ● The strong multi-layer structure provides high resistance to reflow soldering heat and a high mounting reliability ● Magnetic shield type ● High-Q impedance : EXC24CF type is also available ● Small size (L 1.25 mm҂W 1.00 mm҂H 0.50 mm) and low-profile ● USB data lines such as PCs, DSC, Mobile phone. ● LVDS data lines such as PCs, TV. ● IEEE1394 data lines such as PCs, TV. ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E X C 2 4 C E 9 0 0 U Size Number of Terminals Product Code Noise Filter Code Dimensions(mm) 2 Type Characteristics Coupled type 4 Terminals C 1.25 ҂ 1.00 ҂ 0.50 (L) ҂ (W) ҂ (H) ■ Construction Nominal Impedance High speed E Differential transmission (for Mbps) High speed F Differential transmission (for Mbps) High-Q type Form 12 Suffix The first two digits are Code Packing significant figure of U Embossed Carrier Taping impedance value, and the third one denotes the number of zeros following ■ Dimensions in mm (not to scale) F Ferrite C D E A B Inner Conductor Electrode Type (inches) Dimensions (mm) A B C D E F EXC24CE/CF 1.25±0.15 1.00±0.15 0.50±0.10 0.20±0.15 0.55±0.10 0.30±0.10 (0504) Mass (Weight) [mg/pc.] 3 ■ Circuit Configuration 4 3 4 3 1 2 1 2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2008 Common mode Noise Filters ■ Ratings Impedance (액) at 100 MHz Common Mode Differential Mode Rated Voltage (V DC) Rated Current (mA DC) DC Resistance (액)max. EXC24CE360UP 36 액±25 % 20 액 max. 5 200 1.00 EXC24CE900U 90 액±25 % 15 액 max. 5 160 1.75 EXC24CE121U 120 액±25 % 18 액 max. 5 140 2.20 EXC24CE201U 200 액±25 % 20 액 max. 5 130 2.70 EXC24CF900U 90 액±25 % 20 액 max. 5 130 2.50 Part Number ■ Impedance Characteristics (Typical) ● EXC24CE360UP ● EXC24CE900U 1000 Impedance (액) Impedance (액) 10000 1000 Common Mode 100 Common Mode 100 10 10 Differential Mode 11 10 100 Frequency (MHz) 1000 Differential Mode 1 10000 ● EXC24CE121U 1 100 Frequency (MHz) 1000 10000 ● EXC24CE201U 1000 1000 Common Mode Impedance (액) Common Mode Impedance (액) 10 100 10 100 10 Differential Mode Differential Mode 1 1 10 100 Frequency (MHz) 1000 10000 11 10 100 Frequency (MHz) 1000 10000 ● EXC24CF900U Impedance (액) 10000 1000 Common Mode 100 10 Differential Mode 1 1 10 100 Frequency (MHz) 1000 10000 ● Measurement Circuit (A) Common Mode (B) Differential Mode Z Z ■ Packaging Methods(Taping) and Recommended Land Pattern Design ■ Recommended Soldering Conditions and Safety Precations Refer 120 page. Refer 121 page. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2010 Common mode Noise Filters ■ Packaging Methods (Taping) ● Standard Quantity Part Number Kind of Taping EXC14C첸첸첸첸U Embossed Carrier Taping EXC18C첸첸첸첸U EXC24C첸첸첸첸U ● Embossed Carrier Taping t1 Pitch (P1) Quantity 2 mm 10000 pcs./reel 4 mm 5000 pcs./reel ● Embossed Carrier Taping P0 t1 Sprocket hole Compartment φD0 Chip component B P2 Tape running direction Compartment A B W F E P2 φD0 P0 EXC14C첸 2.0±0.1 4.0±0.1 t1 P2 P0 Chip component P1 EXC14C첸 0.75±0.10 0.95±0.10 8.0±0.2 3.50±0.05 1.75±0.10 2.0±0.1 Type P1 t2 (mm) Embossed Carrier Dimensions Type F W F P1 t2 Tape running direction –0 1.5+0.1 0.25±0.05 0.85±0.15 (mm) Embossed Carrier Dimensions Type A B W EXC18C첸 1.00±0.10 1.80±0.10 EXC24C첸 1.20±0.15 1.45±0.15 t2 W A A B φ D0 E E Sprocket hole Type EXC18C첸 EXC24C첸 P2 2.0±0.1 4.0±0.1 E P1 8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1 φD0 P0 F t1 t2 1.5+0.1 0.25±0.05 –0 0.50±0.05 0.90±0.15 ● Taping Reel T φC φB φD E φA (mm) Standard Reel Dimensions W t Type φA φB EXC14C첸 EXC18C첸 180.0±3.0 60.0±1.0 EXC24C첸 φC φD 13.0±0.5 21.0±0.8 Type E W T t EXC14C첸 EXC18C첸 EXC24C첸 2.0±0.5 9.0±0.3 11.4±1.5 1.2±0.2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2009 Common mode Noise Filters ■ Recommended Land Pattern Design ● EXC14C첸, EXC24C첸 ● EXC18C첸 B B F F E Type A D E D C C D A D E Dimensions (mm) A B C D E F EXC14C첸 0.80 to 1.00 0.80 0.30 0.25 to 0.35 0.30 0.20 EXC24C첸 1.60 to 2.00 0.95 0.70 0.45 to 0.65 0.35 0.25 Dimensions (mm) Type EXC18C첸 A B C D E F 1.4 1.4 0.4 0.5 0.2 0.4 ■ Recommended Soldering Conditions Recommendations and precautions are described below ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 10 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 °C to 170 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Flow soldering · We do not recommend flow soldering , because flow soldering may cause bridges betwwn the electrodes. <Repair with hand soldering> ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Safety Precations The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog. 1. Use rosin-based flux or halogen-free flux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 3. Do not apply shock to Common mode Noise Filters (hereafter called the filters) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care. 4. Store the filters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. Use the filters within half a year after the date of the outgoing inspection indicated on the packages. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2009 Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment (except ESD Suppressors) These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). • Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Jan. 2008 – EL113 –