TI1 LMR23630 Simple switcher 36 v, 3 a synchronous step-down converter Datasheet

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LMR23630
SNVSAH2 – DECEMBER 2015
1 Features
3 Description
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The LMR23630 SIMPLE SWITCHER® is an easy to
use 36 V, 3 A synchronous step down regulator. With
a wide input range from 4 V to 36 V, it’s suitable for
various applications from industrial to automotive for
power conditioning from unregulated sources. Peak
current mode control is employed to achieve simple
control loop compensation and cycle-by-cycle current
limiting. The regulator’s quiescent current is 75 μA
makes it suitable for battery powered systems. An
ultra-low 2 μA current in shutdown mode can further
prolong battery life. The switching frequency options
allow either efficiency or solution size to be optimized.
Internal loop compensation means that the user is
free from the tedious task of loop compensation
design. This also minimizes the external components
of the device. The device has option for fixed
frequency FPWM mode to eliminate frequency
variation to minimize EMI. An extended family is
available in 1 A and 2 A load current options in pin to
pin compatible package which allows simple,
optimum PCB layout. A precision enable input allows
simplification of regulator control and system power
sequencing. Protection features include cycle-bycycle current limit, hiccup mode short circuit
protection and thermal shutdown due to excessive
power dissipation.
1
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•
4 V to 36 V Input Range
3 A Continuous Output Current
Integrated Synchronous Rectification
Internal Compensation for Ease of Use
400 kHz Switching Frequency With PFM and
Forced PWM Mode Options
Frequency Synchronization to External Clock
75 µA Quiescent Current at No Load
Minimum Switch-On Time: 60 ns
High Duty Cycle Operation Supported
Precision Enable Input
Output Short-Circuit Protection with Hiccup Mode
Thermal and Overvoltage Protection
8-Pin HSOIC with PowerPAD™ Package
2 Applications
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•
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Automotive Battery Regulation
Industrial Power Supplies
Telecom and Datacom Systems
Battery Powered System
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMR23630A
HSOIC (8)
4.89 mm x 3.90 mm
LMR23630AF
(FPWM Option)
HSOIC (8)
4.89 mm x 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
Efficiency vs Load
VIN up to 36 V
100
CIN
VIN
90
BOOT
CBOOT
AGND
L
VOUT
SW
RFBT
COUT
VCC
FB
C1
RFBB
Efficiency (%)
EN/SYNC
80
70
60
PGND
50
PFM, VIN = 12 V
PFM, VIN = 24 V
40
0.0001
0.001
0.01
IOUT (A)
0.1
1
3
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
LMR23630 SIMPLE SWITCHER® 36 V, 3 A Synchronous Step-Down Converter
LMR23630
SNVSAH2 – DECEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Device and Documentation Support....................
6.1
6.2
6.3
6.4
1
1
1
2
3
4
7
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
4
4
Mechanical, Packaging, and Orderable
Information ............................................................. 5
4 Revision History
DATE
REVISION
NOTES
December 2015
*
Initial release.
PRODUCT PREVIEW
2
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR23630
LMR23630
www.ti.com
SNVSAH2 – DECEMBER 2015
5 Pin Configuration and Functions
DDA Package
8-Pin HSOIC
Top View
SW
1
BOOT
2
VCC
FB
8
PGND
7
VIN
3
6
AGND
4
5
EN/SYNC
Thermal Pad
(9)
Pin Functions
NAME
NO.
I/O
(1)
DESCRIPTION
SW
1
O
Switching output of the regulator. Internally connected to both power MOSFETs. Connect to
power inductor.
BOOT
2
O
Boot-strap capacitor connection for high-side driver. Connect a high quality 470 nF capacitor
from BOOT to SW.
VCC
3
O
Internal bias supply output for bypassing. Connect bypass capacitor from this pin to AGND.
Do not connect external loading to this pin. Never short this pin to ground during operation.
FB
4
I
Feedback input to regulator, connect the feedback resistor divider tap to this pin.
EN/SYNC
5
I
Enable input to regulator. High = On, Low = Off. Can be connected to VIN. Do not float.
Adjust the input under voltage lockout with two resistors. See the Enable and Adjusting
Under voltage Lockout section. The internal oscillator can be synchronized to an external
clock by coupling a positive pulse into this pin through a small coupling capacitor. See the
frequency synchronization section for detail.
AGND
6
G
Analog ground pin. Ground reference for internal references and logic. Connect to system
ground.
VIN
7
I
Input supply voltage with 4 V to 36 V operating range.
PGND
8
G
Power ground pin, connected internally to the low side power FET. Connect to system
ground, PAD, AGND, ground pins of CIN and COUT. Path to CIN must be as short as possible.
PAD
9
G
Low impedance connection to AGND. Connect to PGND on PCB. Major heat dissipation
path of the die. Must be used for heat sinking to ground plane on PCB.
(1)
I = Input, O = Output, G = Ground.
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR23630
3
PRODUCT PREVIEW
PIN
LMR23630
SNVSAH2 – DECEMBER 2015
www.ti.com
6 Device and Documentation Support
6.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.2 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
6.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PRODUCT PREVIEW
6.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
4
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR23630
LMR23630
www.ti.com
SNVSAH2 – DECEMBER 2015
7 Mechanical, Packaging, and Orderable Information
PRODUCT PREVIEW
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR23630
5
PACKAGE OPTION ADDENDUM
www.ti.com
2-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMR23630ADDA
PREVIEW SO PowerPAD
DDA
8
75
TBD
Call TI
Call TI
-40 to 125
LMR23630ADDAR
PREVIEW SO PowerPAD
DDA
8
2500
TBD
Call TI
Call TI
-40 to 125
LMR23630AFDDA
PREVIEW SO PowerPAD
DDA
8
75
TBD
Call TI
Call TI
-40 to 125
LMR23630AFDDAR
PREVIEW SO PowerPAD
DDA
8
2500
TBD
Call TI
Call TI
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Dec-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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