LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 LM4125 Precision Micropower Low Dropout Voltage Reference Check for Samples: LM4125 FEATURES DESCRIPTION • • • • • • • • • The LM4125 is a precision low power low dropout bandgap voltage reference with up to 5 mA output current source and sink capability. 1 2 Small SOT23-5 Package Low Dropout Voltage: 120 mV Typ @ 1 mA High Output Voltage Accuracy: 0.2% Source and Sink Current Output: ±5 mA Supply Current: 160 μA Typ. Low Temperature Coefficient: 50 ppm/°C Fixed Output Voltages: 2.048, 2.5,and 4.096 Industrial Temperature Range: −40°C to +85°C (For Extended Temperature Range, −40°C to 125°C, Contact TI) APPLICATIONS • • • • • • • • • • Portable, Battery Powered Equipment Instrumentation and Process Control Automotive & Industrial Test Equipment Data Acquisition Systems Precision Regulators Battery Chargers Base Stations Communications Medical Equipment This series reference operates with input voltages as low as 2V and up to 6V consuming 160 µA (Typ.) supply current. In power down mode, device current drops to less than 2 μA. The LM4125 comes in two grades (A and Standard) and three voltage options for greater flexibility. The best grade devices (A) have an initial accuracy of 0.2%, while the standard have an initial accuracy of 0.5%, both with a tempco of 50ppm/°C ensured from −40°C to +125°C. The very low dropout voltage, low supply current and power-down capability of the LM4125 makes this product an ideal choice for battery powered and portable applications. The device performance is ensured over the industrial temperature range (−40°C to +85°C), while certain specs are ensured over the extended temperature range (−40°C to +125°C). Please contact TI for full specifications over the extended temperature range. The LM4125 is available in a standard 5-pin SOT-23 package. Connection Diagram Figure 1. 5-Pin SOT-23 Surface Mount Package See Package Number DBV These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2013, Texas Instruments Incorporated LM4125 SNVS238A – MAY 2004 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) −0.3V to 8V Maximum Voltage on input or enable pins Output Short-Circuit Duration Power Dissipation (TA = 25°C) (3) ESD Susceptibility (4) Indefinite DBV package − θJA 280°C/W Power Dissipation 350 mW Human Body Model Machine Model Lead Temperature: (1) (2) (3) (4) 2 kV 200V Soldering, (10 sec.) +260°C Vapor Phase (60 sec.) +215°C Infrared (15 sec.) +220°C “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX (maximum junction temperature), θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is: PDissMAX = (TJMAX − TA)/θJ-A up to the value listed in the Absolute Maximum Ratings. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Range (1) −65°C to +150°C Storage Temperature Range Ambient Temperature Range −40°C to +85°C Junction Temperature Range −40°C to +125°C (1) 2 “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 Electrical Characteristics — LM4125-2.048V and 2.5V Unless otherwise specified VIN = 3.3V, ILOAD = 0, COUT = 0.01µF, TA = Tj = 25°C. Limits with standard typeface are for Tj = 25°C, and limits in boldface type apply over the −40°C ≤ TA ≤ +85°C temperature range. Symbol VOUT Parameter Conditions Output Voltage Initial Accuracy LM4125A-2.048 LM4125A-2.500 ±0.2 % LM4125-2.048 LM4125-2.500 ±0.5 % Temperature Coefficient −40°C ≤ TA ≤ +125°C Line Regulation 3.3V ≤ VIN ≤ 6V Load Regulation Dropout Voltage (3) Output Noise Voltage (4) VN IS (1) (2) 14 50 ppm/°c 0.0007 0.008 0.01 %/V 0 mA ≤ ILOAD ≤ 1 mA 0.03 0.08 0.17 1 mA ≤ ILOAD ≤ 5 mA 0.01 0.04 0.1 −1 mA ≤ ILOAD ≤ 0 mA 0.04 0.12 −5 mA ≤ ILOAD ≤ −1 mA 0.01 45 65 100 ILOAD = +1 mA 120 150 200 ILOAD = +5 mA 180 210 300 0.1 Hz to 10 Hz 20 µVPP 10 Hz to 10 kHz 36 µVPP 160 VIN = 3.3V, VOUT = 0 ISC Short Circuit Current Hyst Thermal Hysteresis (5) (1) (2) (3) (4) (5) (6) Long Term Stability mV 257 290 µA 15 6 VIN = 6V, VOUT = 0 30 mA 17 6 (6) %/mA ILOAD = 0 mA Supply Current ΔVOUT Max Units ΔVOUT/ΔVIN VIN−VOUT Typ (1) TCVOUT/°C ΔVOUT/ΔILOAD Min 30 −40°C ≤ TA ≤ 125°C 0.5 mV/V 1000 hrs. @ 25°C 100 ppm Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate Outgoing Quality Level (AOQL). Typical numbers are at 25°C and represent the most likely parametric norm. Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes ≤ 1% from VOUT at VIN = 3.3V for 2.0V, 2.5V and 5V for 4.1V. A parasitic diode exists between input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN. Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8V)/1.8) * VOUT. VN (2.5V) = (36µVPP/1.8) * 2.5 = 46µVPP. Thermal hysteresis is defined as the change in +25°C output voltage before and after exposing the device to temperature extremes. Long term stability is change in VREF at 25°C measured continuously during 1000 hrs. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 3 LM4125 SNVS238A – MAY 2004 – REVISED APRIL 2013 www.ti.com Electrical Characteristics — LM4125-4.096V Unless otherwise specified VIN = 5V, ILOAD = 0, COUT = 0.01µF, TA = Tj = 25°C. Limits with standard typeface are for Tj = 25°C, and limits in boldface type apply over the −40°C ≤ TA ≤ +85°C temperature range. Symbol VOUT Parameter Conditions Output Voltage Initial Accuracy LM4125A-4.096 ±0.2 % LM4125-4.096 ±0.5 % Temperature Coefficient −40°C ≤ TA ≤ +125°C Line Regulation 5V ≤ VIN ≤ 6V Load Regulation Dropout Voltage (3) Output Noise Voltage (4) VN IS Max Units ΔVOUT/ΔVIN VIN−VOUT Typ (1) TCVOUT/°C ΔVOUT/ΔILOAD Min (1) (2) 14 50 ppm/°c 0.0007 0.008 0.01 %/V 0 mA ≤ ILOAD ≤ 1 mA 0.03 0.08 0.17 1 mA ≤ ILOAD ≤ 5 mA 0.01 0.04 0.1 −1 mA ≤ ILOAD ≤ 0 mA 0.04 0.12 −5 mA ≤ ILOAD ≤ −1 mA 0.01 ILOAD = 0 mA 45 65 100 ILOAD = +1 mA 120 150 200 ILOAD = +5 mA 180 210 300 0.1 Hz to 10 Hz 20 10 Hz to 10 kHz 36 Supply Current 160 VOUT = 0 %/mA mV µVPP µVPP 257 290 µA 15 6 30 ISC Short Circuit Current Hyst Thermal Hysteresis (5) −40°C ≤ TA ≤ 125°C 0.5 mV/V ΔVOUT Long Term Stability (6) 1000 hrs. @ 25°C 100 ppm VIN = 6V, VOUT = 0 17 6 (1) (2) (3) (4) (5) (6) 4 mA 30 Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate Outgoing Quality Level (AOQL). Typical numbers are at 25°C and represent the most likely parametric norm. Dropout voltage is the differential voltage between VOUT and VIN at which VOUT changes ≤ 1% from VOUT at VIN = 3.3V for 2.0V, 2.5V and 5V for 4.1V. A parasitic diode exists between input and output pins; it will conduct if VOUT is pulled to a higher voltage than VIN. Output noise voltage is proportional to VOUT. VN for other voltage option is calculated using (VN(1.8V)/1.8) * VOUT. VN (2.5V) = (36µVPP/1.8) * 2.5 = 46µVPP. Thermal hysteresis is defined as the change in +25°C output voltage before and after exposing the device to temperature extremes. Long term stability is change in VREF at 25°C measured continuously during 1000 hrs. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 LM4125 Typical Operating Characteristics Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C. Long Term Drift Typical Temperature Drift Figure 2. Figure 3. Short Circuit Current vs Temperature Dropout Voltage vs Output Error Figure 4. Figure 5. Dropout Voltage vs Load Current Load Regulation Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 5 LM4125 SNVS238A – MAY 2004 – REVISED APRIL 2013 www.ti.com LM4125 Typical Operating Characteristics (continued) Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C. 6 GND Pin Current GND Pin Current at No Load vs Temperature Figure 8. Figure 9. GND Pin Current vs Load 0.1Hz to 10Hz output Noise Figure 10. Figure 11. Output Impedance vs Frequency PSRR vs Frequency Figure 12. Figure 13. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 LM4125 Typical Operating Characteristics (continued) Unless otherwise specified, VIN = 3.3V, VOUT = 2.5V, ILOAD = 0, COUT = 0.022µF and TA = 25°C. Start-Up Response Load Step Response Figure 14. Figure 15. Load Step Response Line Step Response Figure 16. Figure 17. Thermal Hysteresis Figure 18. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 7 LM4125 SNVS238A – MAY 2004 – REVISED APRIL 2013 www.ti.com PIN FUNCTIONS Output (Pin 5): Reference Output. Input (Pin 4): Positive Supply. Ground (Pin 2): Negative Supply or Ground Connection. APPLICATION HINTS The standard application circuit for the LM4125 is shown in Figure 19. It is designed to be stable with ceramic output capacitors in the range of 0.022µF to 0.1µF. Note that 0.022µF is the minimum required output capacitor. These capacitors typically have an ESR of about 0.1 to 0.5Ω. Smaller ESR can be tolerated, however larger ESR can not. The output capacitor can be increased to improve load transient response, up to about 1µF. However, values above 0.047µF must be tantalum. With tantalum capacitors, in the 1µF range, a small capacitor between the output and the reference pin is required. This capacitor will typically be in the 50pF range. Care must be taken when using output capacitors of 1µF or larger. These application must be thoroughly tested over temperature, line and load. An input capacitor is typically not required. However, a 0.1µF ceramic can be used to help prevent line transients from entering the LM4125. Larger input capacitors should be tantalum or aluminum. The typical thermal hysteresis specification is defined as the change in +25°C voltage measured after thermal cycling. The device is thermal cycled to temperature -40°C and then measured at 25°C. Next the device is thermal cycled to temperature +125°C and again measured at 25°C. The resulting VOUT delta shift between the 25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature and board mounting temperature are all factors that can contribute to thermal hysteresis. Figure 19. Standard Application Circuit INPUT CAPACITOR Noise on the power-supply input can effect the output noise, but can be reduced by using an optional bypass capacitor between the input pin and the ground. PRINTED CIRCUIT BOARD LAYOUT CONSIDERATION The mechanical stress due to PC board mounting can cause the output voltage to shift from its initial value. References in SOT packages are generally less prone to assembly stress than devices in Small Outline (SOIC) package. To reduce the stress-related output voltage shifts, mount the reference on the low flex areas of the PC board such as near to the edge or the corner of the PC board. 8 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 Typical Application Circuits Figure 20. Voltage Reference with Negative Output Figure 21. Precision High Current Low Dropout Regulator Figure 22. Precision High Current Negative Voltage Regulator Figure 23. Voltage Reference with Complimentary Output Figure 24. Precision High Current Low Droput Regulator Figure 25. Precision Voltage Reference with Force and Sense Output Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 9 LM4125 SNVS238A – MAY 2004 – REVISED APRIL 2013 www.ti.com Figure 26. Programmable Current Source Figure 27. Precision Regulator with Current Limiting Circuit Figure 28. Power Supply Splitter 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 LM4125 www.ti.com SNVS238A – MAY 2004 – REVISED APRIL 2013 REVISION HISTORY Changes from Original (April 2013) to Revision A • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM4125 11 PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM4125AIM5-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R81A LM4125IM5-2.0/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R80B LM4125IM5-2.5 LIFEBUY SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 R81B LM4125IM5-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R81B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM4125AIM5-2.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 LM4125IM5-2.0/NOPB SOT-23 DBV 5 1000 178.0 LM4125IM5-2.5 SOT-23 DBV 5 1000 178.0 LM4125IM5-2.5/NOPB SOT-23 DBV 5 1000 178.0 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4125AIM5-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4125IM5-2.0/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4125IM5-2.5 SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4125IM5-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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