GAL16V8Z GAL16V8ZD Zero Power E2CMOS PLD Functional Block Diagram Features I/CLK • ZERO POWER E2CMOS TECHNOLOGY — 100µA Standby Current — Input Transition Detection on GAL16V8Z — Dedicated Power-down Pin on GAL16V8ZD — Input and Output Latching During Power Down CLK 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q 8 OLMC I/O/Q I • HIGH PERFORMANCE E2CMOS TECHNOLOGY — 12 ns Maximum Propagation Delay — Fmax = 83.3 MHz — 8 ns Maximum from Clock Input to Data Output — TTL Compatible 16 mA Output Drive — UltraMOS® Advanced CMOS Technology PROGRAMMABLE AND-ARRAY (64 X 32) I I/DPP • E2 CELL TECHNOLOGY — Reconfigurable Logic — Reprogrammable Cells — 100% Tested/100% Yields — High Speed Electrical Erasure (<100ms) — 20 Year Data Retention I I • EIGHT OUTPUT LOGIC MACROCELLS — Maximum Flexibility for Complex Logic Designs — Programmable Output Polarity — Architecturally Similar to Standard GAL16V8 I • PRELOAD AND POWER-ON RESET OF ALL REGISTERS — 100% Functional Testability I • APPLICATIONS INCLUDE: — Battery Powered Systems — DMA Control — State Machine Control — High Speed Graphics Processing I OE I/OE • ELECTRONIC SIGNATURE FOR IDENTIFICATION Description Pin Configuration The GAL16V8Z and GAL16V8ZD, at 100 µA standby current and 12ns propagation delay provides the highest speed and lowest DESCRIPTION power combination PLD available in the market. The GAL16V8Z/ ZD is manufactured using Lattice Semiconductor's advanced zero power E2CMOS process, which combines CMOS with Electrically Erasable (E2) floating gate technology. DIP/SOIC 3 The GAL16V8Z uses Input Transition Detection (ITD) to put the device in standby mode and is capable of emulating the full functionality of the standard GAL16V8. The GAL16V8ZD utilizes a dedicated power-down pin (DPP) to put the device in standby mode. It has 15 inputs available to the AND array. I/DPP 1 19 4 18 GAL16V8Z I I I/O/Q I/CLK Vcc I I PLCC 6 GAL16V8ZD Top View 16 I Unique test circuitry and reprogrammable cells allow complete AC, DC, and functional testing during manufacture. As a result, Lattice Semiconductor delivers 100% field programmability and functionality of all GAL products. In addition, 100 erase/write cycles and data retention in excess of 20 years are specified. 8 14 13 11 9 1 20 Vcc I 2 19 I/ O/ Q I I/O/Q 3 GAL 18 I/ O/ Q I/ O/ Q I/D P P 4 I/O/Q I 5 16V8Z 17 16V8ZD 16 I/O/Q I 6 15 I/ O/ Q I/O/Q I 7 14 I/O/Q I 8 13 I/O/Q I 9 12 I/ O/ Q 10 11 I /O E I/O/Q I/ O/ Q I/O/Q I/O/Q I/OE GND I I I/C LK GND Copyright © 1997 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 16v8zzd_03 1 December 1997 Specifications GAL16V8Z GAL16V8ZD GAL16V8Z/ZD Ordering Information GAL16V8Z: Commercial Grade Specifications Tpd (ns) Tsu (ns) Tco (ns) 12 10 8 15 15 10 Icc (mA) Isb (µA) Ordering # Package 55 100 GAL16V8Z-12QP 20-Pin Plastic DIP 55 100 GAL16V8Z-12QJ 20-Lead PLCC 55 100 GAL16V8Z-12QS 20-Lead SOIC 55 100 GAL16V8Z-15QP 20-Pin Plastic DIP 55 100 GAL16V8Z-15QJ 20-Lead PLCC 55 100 GAL16V8Z-15QS 20-Lead SOIC GAL16V8ZD: Commercial Grade Specifications Tpd (ns) Tsu (ns) Tco (ns) 12 10 8 15 15 10 Icc (mA) Isb (µA) Ordering # Package 55 100 GAL16V8ZD-12QP 20-Pin Plastic DIP 55 100 GAL16V8ZD-12QJ 20-Lead PLCC 55 100 GAL16V8ZD-15QP 20-Pin Plastic DIP 55 100 GAL16V8ZD-15QJ 20-Lead PLCC Part Number Description XXXXXXXX _ XX Device Name GAL16V8Z (Zero Power ITD) GAL16V8ZD (Zero Power DPP) X X X Grade Blank = Commercial Package P = Plastic DIP J = PLCC S = SOIC Speed (ns) Active Power Q = Quarter Power 2 Specifications GAL16V8Z GAL16V8ZD Output Logic Macrocell (OLMC) The following discussion pertains to configuring the output logic macrocell. It should be noted that actual implementation is accomplished by development software/hardware and is completely transparent to the user. each macrocell controls the polarity of the output in any of the three modes, while the AC1 bit of each of the macrocells controls the input/output configuration. These two global and 16 individual architecture bits define all possible configurations in a GAL16V8Z/ZD. The information given on these architecture bits is only to give a better understanding of the device. Compiler software will transparently set these architecture bits from the pin definitions, so the user should not need to directly manipulate these architecture bits. There are three global OLMC configuration modes possible: simple, complex, and registered. Details of each of these modes is illustrated in the following pages. Two global bits, SYN and AC0, control the mode configuration for all macrocells. The XOR bit of Compiler Support for OLMC In complex mode pin 1 and pin 11 become dedicated inputs and use the feedback paths of pin 19 and pin 12 respectively. Because of this feedback path usage, pin 19 and pin 12 do not have the feedback option in this mode. Software compilers support the three different global OLMC modes as different device types. Most compilers also have the ability to automatically select the device type, generally based on the register usage and output enable (OE) usage. Register usage on the device forces the software to choose the registered mode. All combinatorial outputs with OE controlled by the product term will force the software to choose the complex mode. The software will choose the simple mode only when all outputs are dedicated combinatorial without OE control. For further details, refer to the compiler software manuals. In simple mode all feedback paths of the output pins are routed via the adjacent pins. In doing so, the two inner most pins ( pins 15 and 16) will not have the feedback option as these pins are always configured as dedicated combinatorial output. When using the standard GAL16V8 JEDEC fuse pattern generated by the logic compilers for the GAL16V8ZD, special attention must be given to pin 4 (DPP) to make sure that it is not used as one of the functional inputs. When using compiler software to configure the device, the user must pay special attention to the following restrictions in each mode. In registered mode pin 1 and pin 11 are permanently configured as clock and output enable, respectively. These pins cannot be configured as dedicated inputs in the registered mode. 3 Specifications GAL16V8Z GAL16V8ZD Registered Mode In the Registered mode, macrocells are configured as dedicated registered outputs or as I/O functions. Registered outputs have eight product terms per output. I/Os have seven product terms per output. Architecture configurations available in this mode are similar to the common 16R8 and 16RP4 devices with various permutations of polarity, I/O and register placement. Pin 4 is used as dedicated power-down pin on GAL16V8ZD. It cannot be used as functional input. The JEDEC fuse numbers, including the User Electronic Signature (UES) fuses and the Product Term Disable (PTD) fuses, are shown on the logic diagram on the following page. All registered macrocells share common clock and output enable control pins. Any macrocell can be configured as registered or I/O. Up to eight registers or up to eight I/Os are possible in this mode. Dedicated input or output functions can be implemented as subsets of the I/O function. CLK Registered Configuration for Registered Mode D XOR - SYN=0. - AC0=1. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1=0 defines this output configuration. - Pin 1 controls common CLK for the registered outputs. - Pin 11 controls common OE for the registered outputs. - Pin 1 & Pin 11 are permanently configured as CLK & OE for registered output configuration. Q Q OE Combinatorial Configuration for Registered Mode - SYN=0. - AC0=1. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1=1 defines this output configuration. - Pin 1 & Pin 11 are permanently configured as CLK & OE for registered output configuration. XOR Note: The development software configures all of the architecture control bits and checks for proper pin usage automatically. 4 Specifications GAL16V8Z GAL16V8ZD Registered Mode Logic Diagram DIP, SOIC & PLCC Package Pinouts 1 0 4 8 12 16 20 28 24 2128 PTD 0000 OLMC 0224 19 XOR-2048 AC1-2120 2 0256 OLMC 0480 18 XOR-2049 AC1-2121 3 0512 OLMC 0736 17 XOR-2050 AC1-2122 * 4 0768 OLMC 0992 16 XOR-2051 AC1-2123 5 1024 OLMC 1248 15 XOR-2052 AC1-2124 6 1280 OLMC 1504 14 XOR-2053 AC1-2125 7 1536 OLMC 1760 13 XOR-2054 AC1-2126 8 1792 OLMC 2016 12 XOR-2055 AC1-2127 9 2191 64-USER ELECTRONIC SIGNATURE FUSES 2056, 2057, .... .... 2118, 2119 Byte7 Byte6 .... .... Byte1 Byte0 MSB OE 11 SYN-2192 AC0-2193 * Note: Input not available on GAL16V8ZD LSB 5 Specifications GAL16V8Z GAL16V8ZD Complex Mode In the Complex mode, macrocells are configured as output only or I/O functions. All macrocells have seven product terms per output. One product term is used for programmable output enable control. Pins 1 and 11 are always available as data inputs into the AND array. Architecture configurations available in this mode are similar to the common 16L8 and 16P8 devices with programmable polarity in each macrocell. Pin 4 is used as dedicated power-down pin on GAL16V8ZD. It cannot be used as functional input. Up to six I/Os are possible in this mode. Dedicated inputs or outputs can be implemented as subsets of the I/O function. The two outer most macrocells (pins 12 & 19) do not have input capability. Designs requiring eight I/Os can be implemented in the Registered mode. The JEDEC fuse numbers including the UES fuses and PTD fuses are shown on the logic diagram on the following page. Combinatorial I/O Configuration for Complex Mode - SYN=1. - AC0=1. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1 has no effect on this mode. - Pin 13 through Pin 18 are configured to this function. XOR Combinatorial Output Configuration for Complex Mode - SYN=1. - AC0=1. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1 has no effect on this mode. - Pin 12 and Pin 19 are configured to this function. XOR Note: The development software configures all of the architecture control bits and checks for proper pin usage automatically. 6 Specifications GAL16V8Z GAL16V8ZD Complex Mode Logic Diagram DIP, SOIC & PLCC Package Pinouts 1 2128 0 4 8 12 16 20 24 28 PTD 0000 OLMC 19 XOR-2048 AC1-2120 0224 2 0256 OLMC 18 XOR-2049 AC1-2121 0480 3 0512 OLMC 17 XOR-2050 AC1-2122 0736 * 4 0768 OLMC 16 XOR-2051 AC1-2123 0992 5 1024 OLMC 15 XOR-2052 AC1-2124 1248 6 1280 OLMC 14 XOR-2053 AC1-2125 1504 7 1536 OLMC 13 XOR-2054 AC1-2126 1760 8 1792 OLMC 12 XOR-2055 AC1-2127 2016 9 11 2191 64-USER ELECTRONIC SIGNATURE FUSES 2056, 2057, .... .... 2118, 2119 Byte7 Byte6 .... .... Byte1 Byte0 MSB SYN-2192 AC0-2193 * Note: Input not available on GAL16V8ZD LSB 7 Specifications GAL16V8Z GAL16V8ZD Simple Mode In the Simple mode, macrocells are configured as dedicated inputs or as dedicated, always active, combinatorial outputs. Pins 1 and 11 are always available as data inputs into the AND array. The center two macrocells (pins 15 & 16) cannot be used in the input configuration. Architecture configurations available in this mode are similar to the common 10L8 and 12P6 devices with many permutations of generic output polarity or input choices. Pin 4 is used as dedicated power-down pin on GAL16V8ZD. It cannot be used as functional input. All outputs in the simple mode have a maximum of eight porduct terms that can control the logic. In addition, each output has programmable polarity. The JEDEC fuse numbers including the UES fuses and PTD fuses are shown on the logic diagram. Combinatorial Output with Feedback Configuration for Simple Mode Vcc - SYN=1. - AC0=0. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1=0 defines this configuration. - All OLMC except pins 15 & 16 can be configured to this function. XOR Combinatorial Output Configuration for Simple Mode - SYN=1. - AC0=0. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1=0 defines this configuration. - Pins 15 & 16 are permanently configured to this function. Vcc XOR Dedicated Input Configuration for Simple Mode - SYN=1. - AC0=0. - XOR=0 defines Active Low Output. - XOR=1 defines Active High Output. - AC1=1 defines this configuration. - All OLMC except pins 15 & 16 can be configured to this function. Note: The development software configures all of the architecture control bits and checks for proper pin usage automatically. 8 Specifications GAL16V8Z GAL16V8ZD Simple Mode Logic Diagram DIP, SOIC & PLCC Package Pinouts 1 2128 0 4 8 12 16 24 20 28 PTD 0000 OLMC XOR-2048 AC1-2120 0224 19 2 0256 OLMC XOR-2049 AC1-2121 0480 18 3 0512 OLMC XOR-2050 AC1-2122 0736 17 * 4 0768 OLMC XOR-2051 AC1-2123 0992 16 5 1024 OLMC XOR-2052 AC1-2124 1248 15 6 1280 OLMC XOR-2053 AC1-2125 1504 14 7 1536 OLMC XOR-2054 AC1-2126 1760 13 8 1792 OLMC XOR-2055 AC1-2127 2016 9 12 11 2191 64-USER ELECTRONIC SIGNATURE FUSES 2056, 2057, .... .... 2118, 2119 Byte7 Byte6 .... .... Byte1 Byte0 MSB LSB SYN-2192 AC0-2193 * Note: Input not available on GAL16V8ZD 9 Specifications GAL16V8Z GAL16V8ZD Absolute Maximum Ratings(1) Recommended Operating Conditions Supply voltage VCC ........................................ –.5 to +7V Input voltage applied .......................... –2.5 to VCC +1.0V Off-state output voltage applied ......... –2.5 to VCC +1.0V Storage Temperature ................................ –65 to 150°C Ambient Temperature with Power Applied ........................................... –55 to 125°C Commercial Devices: Ambient Temperature (TA) ............................... 0 to 75°C Supply voltage (VCC) with Respect to Ground ..................... +4.75 to +5.25V 1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress only ratings and functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). DC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Specified) SYMBOL VIL VIH IIL IIH VOL VOH MIN. TYP.2 MAX. UNITS Input Low Voltage Vss – 0.5 — 0.8 V Input High Voltage 2.0 — Vcc+1 V PARAMETER CONDITION Input or I/O Low Leakage Current 0V ≤ VIN ≤ VIL (MAX.) — — –10 µA Input or I/O High Leakage Current 3.5V ≤ VIN ≤ VCC — — 10 µA Output Low Voltage IOL = MAX. Vin = VIL or VIH — — 0.5 V Output High Voltage IOH = MAX. Vin = VIL or VIH 2.4 — — V Vcc-1 — — V Low Level Output Current — — 16 mA High Level Output Current — — –3.2 mA –30 — –150 mA IOH = -100 µA Vin = VIL or VIH IOL IOH IOS1 Output Short Circuit Current COMMERCIAL ISB Stand-by Power VCC = 5V VOUT = 0.5V VIL = GND VIH = Vcc Outputs Open Z-12/-15 ZD-12/-15 — 50 100 µA VIL = 0.5V VIH = 3.0V ftoggle = 15 MHz Outputs Open Z-12/-15 ZD-12/-15 — — 55 mA Supply Current ICC Operating Power Supply Current TA = 25°C 1) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2) Typical values are at Vcc = 5V and TA = 25 °C Capacitance (TA = 25°C, f = 1.0 MHz) SYMBOL PARAMETER MAXIMUM* UNITS TEST CONDITIONS CI Input Capacitance 10 pF VCC = 5.0V, VI = 2.0V CI/O I/O Capacitance 10 pF VCC = 5.0V, VI/O = 2.0V *Characterized but not 100% tested. 10 Specifications GAL16V8Z Specifications GAL16V8Z GAL16V8ZD AC Switching Characteristics Over Recommended Operating Conditions PARAMETER tpd tco tcf2 tsu th fmax3 twh twl ten tdis tas tsa4 TEST COND1. COM COM -12 -15 MIN. MAX. MIN. MAX. DESCRIPTION UNITS A Input or I/O to Combinational Output 3 12 3 15 ns A Clock to Output Delay 2 8 2 10 ns — Clock to Feedback Delay — 6 — 7 ns — Setup Time, Input or Feedback before Clock↑ 10 — 15 — ns — Hold Time, Input or Feedback after Clock↑ 0 — 0 — ns A Maximum Clock Frequency with External Feedback, 1/(tsu + tco) 55 — 40 — MHz A Maximum Clock Frequency with Internal Feedback, 1/(tsu + tcf) 62.5 — 45.5 — MHz A Maximum Clock Frequency with No Feedback 83.3 — 62.5 — MHz — Clock Pulse Duration, High 6 — 8 — ns — Clock Pulse Duration, Low 6 — 8 — ns B Input or I/O to Output Enabled — 12 — 15 ns B OE to Output Enabled — 12 — 15 ns C Input or I/O to Output Disabled — 15 — 15 ns C OE to Output DIsabled — 12 — 15 ns — Last Active Input to Standby 60 140 50 150 ns — Standby to Active Output 6 13 5 15 ns 1) Refer to Switching Test Conditions section. 2) Calculated from fmax with internal feedback. Refer to fmax Specification section. 3) Refer to fmax Specification section. 4) Add tsa to tpd, tsu, ten and tdis when the device is coming out of standby state. Standby Power Timing Waveforms Icc POWER Isb t as tsa tpd INPUT or I/O FEEDBACK ten, tdis OE * tsu * Note: Rising clock edges are allowed during tsa but outputs are not guaranteed. CLK tco OUTPUT 11 Specifications GAL16V8ZD AC Switching Characteristics Over Recommended Operating Conditions PARAMETER tpd tco tcf2 tsu th fmax3 twh twl ten tdis TEST COND1. COM COM -12 -15 MIN. MAX. MIN. MAX. DESCRIPTION UNITS A Input or I/O to Combinational Output 3 12 3 15 ns A Clock to Output Delay 2 8 2 10 ns — Clock to Feedback Delay — 6 — 7 ns — Setup Time, Input or Feedback before Clock↑ 10 — 15 — ns — Hold Time, Input or Feedback after Clock↑ 0 — 0 — ns A Maximum Clock Frequency with External Feedback, 1/(tsu + tco) 55 — 40 — MHz A Maximum Clock Frequency with Internal Feedback, 1/(tsu + tcf) 62.5 — 45.5 — MHz A Maximum Clock Frequency with No Feedback 83.3 — 62.5 — MHz — Clock Pulse Duration, High 6 — 8 — ns — Clock Pulse Duration, Low 6 — 8 — ns B Input or I/O to Output Enabled — 12 — 15 ns B OE to Output Enabled — 12 — 15 ns C Input or I/O to Output Disabled — 15 — 15 ns C OE to Output Disabled — 12 — 15 ns 1) Refer to Switching Test Conditions section. 2) Calculated from fmax with internal feedback. Refer to fmax Specification section. 3) Refer to fmax Specification section. 12 Specifications GAL16V8ZD Dedicated Power-Down Pin Specifications Over Recommended Operating Conditions PARAMETER twhd twld TEST COND1. COM COM -12 -15 MIN. MAX. MIN. MAX. DESCRIPTION UNITS — DPP Pulse Duration High 12 — 15 — ns — DPP Pulse Duration Low 25 — 30 — ns — Valid Input before DPP High 5 — 8 — ns — Valid OE before DPP High 0 — 0 — ns — Valid Clock Before DPP High 0 — 0 — ns — Input Don't Care after DPP High — 2 — 5 ns — OE Don't Care after DPP High — 6 — 9 ns — Clock Don't Care after DPP High — 8 — 11 ns — DPP Low to Valid Input 12 — 15 — ns — DPP Low to Valid OE 16 — 20 — ns — DPP Low to Valid Clock 18 — 20 — ns A DPP Low to Valid Output 5 24 5 30 ns ACTIVE TO STANDBY tivdh tgvdh tcvdh tdhix tdhgx tdhcx STANDBY TO ACTIVE tdliv tdlgv tdlcv tdlov 1) Refer to Switching Test Conditions section. Dedicated Power-Down Pin Timing Waveforms DPP tivdh tdhix tdliv tgvdh tdhgx tdlgv INPUT or I/O FEEDBACK OE tcvdh tdhcx tdlcv CLK tco t pd, t en, t dis OUTPUT 13 tdlov Specifications GAL16V8Z GAL16V8ZD Switching Waveforms INPUT or I/O FEEDBACK INPUT or I/O FEEDBACK VALID INPUT VALID INPUT tsu tpd th CLK COMBINATIONAL OUTPUT tco REGISTERED OUTPUT 1/fmax (external fdbk) Combinatorial Output INPUT or I/O FEEDBACK Registered Output tdis ten COMBINATIONAL OUTPUT OE tdis Input or I/O to Output Enable/Disable ten REGISTERED OUTPUT OE to Output Enable/Disable twh twl CLK CLK 1/ fmax (w/o fb) 1/ fmax (internal fdbk) t cf REGISTERED FEEDBACK Clock Width fmax with Feedback 14 tsu Specifications GAL16V8Z GAL16V8ZD fmax Descriptions CLK LOGIC ARRAY REGISTER CLK LOGIC ARRAY tsu tco REGISTER fmax with External Feedback 1/(tsu+tco) Note: fmax with external feedback is calculated from measured tsu and tco. t cf t pd CLK fmax with Internal Feedback 1/(tsu+tcf) LOGIC ARRAY Note: tcf is a calculated value, derived by subtracting tsu from the period of fmax w/internal feedback (tcf = 1/fmax - tsu). The value of tcf is used primarily when calculating the delay from clocking a register to a combinatorial output (through registered feedback), as shown above. For example, the timing from clock to a combinatorial output is equal to tcf + tpd. REGISTER tsu + th fmax with No Feedback Note: fmax with no feedback may be less than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%. Switching Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Reference Levels Output Timing Reference Levels Output Load GND to 3.0V 3ns 10% – 90% 1.5V 1.5V +5V R1 See Figure 3-state levels are measured 0.5V from steady-state active level. FROM OUTPUT (O/Q) UNDER TEST TEST POINT Output Load Conditions (see figure) Test Condition A B Active High Active Low C Active High Active Low R1 300Ω ∞ 300Ω ∞ 300Ω R2 390Ω 390Ω 390Ω 390Ω 390Ω CL 50pF 50pF 50pF 5pF 5pF R2 C L* *C L INCLUDES TEST FIXTURE AND PROBE CAPACITANCE 15 Specifications GAL16V8Z GAL16V8ZD Electronic Signature Output Register Preload An electronic signature word is provided in every GAL16V8Z/ZD device. It contains 64 bits of reprogrammable memory that can contain user defined data. Some uses include user ID codes, revision numbers, or inventory control. The signature data is always available to the user independent of the state of the security cell. When testing state machine designs, all possible states and state transitions must be verified in the design, not just those required in the normal machine operations. This is because, in system operation, certain events occur that may throw the logic into an illegal state (power-up, line voltage glitches, brown-outs, etc.). To test a design for proper treatment of these conditions, a way must be provided to break the feedback paths, and force any desired (i.e., illegal) state into the registers. Then the machine can be sequenced and the outputs tested for correct next state conditions. NOTE: The electronic signature is included in checksum calculations. Changing the electronic signature will alter checksum. Security Cell The GAL16V8Z/ZD devices includes circuitry that allows each registered output to be synchronously set either high or low. Thus, any present state condition can be forced for test sequencing. If necessary, approved GAL programmers capable of executing test vectors perform output register preload automatically. A security cell is provided in the GAL16V8Z/ZD devices to prevent unauthorized copying of the array patterns. Once programmed, this cell prevents further read access to the functional bits in the device. This cell can only be erased by re-programming the device, so the original configuration can never be examined once this cell is programmed. The electronic signature data is always available to the user, regardless of the state of this security cell. Input Buffers GAL16V8Z/ZD devices are designed with TTL level compatible INPUT BUFFERS input buffers. These buffers, with their characteristically high impedance, load driving logic much less than traditional bipolar devices. This allows for a greater fan out from the driving logic. Device Programming GAL devices are programmed using a Lattice Semiconductorapproved Logic Programmer, available from a number of manufacturers (see the Development Tools Section of the Data Book). Complete programming of the device takes only a few seconds. Erasing of the device is transparent to the user, and is done automatically as part of the programming cycle. GAL16V8Z/ZD input buffers have latches within the buffers. As a result, when the device goes into standby mode the inputs will be latched to its values prior to standby. In order to overcome the input latches, they will have to be driven by an external source. Lattice Semiconductor recommends that all unused inputs and tri-stated I/O pins for both devices be connected to another active input, VCC, or GND. Doing this will tend to improve noise immunity and reduce ICC for the device. Input Transition Detection (ITD) The GAL16V8Z relies on its internal input detection circuitry to put the device in to power down mode. If there is no input transition for the specified period of time, the device will go into the power down state. Any valid input transition will put the device back into the active state. The first rising clock transition from power-down state only acts as a wake up signal to the device and will not clock the data input through to the output (refer to standby power timing waveform for more detail). Any input pulse widths greater than 5ns at input voltage level of 1.5V will be detected as input transition. The device will not detect any input pulse widths less than 1ns measured at input voltage level of 1.5V as an input transition. Typical Input Characteristic 40 Input Current (µA) 30 Dedicated Power-Down Pin 20 10 0 -10 -20 -30 -40 The GAL16V8ZD uses pin 4 as the dedicated power-down signal to put the device in to the power-down state. DPP is an active high signal where a logic high driven on this signal puts the device into power-down state. Input pin 4 cannot be used as a functional input on this device. 0 1 2 3 Input Voltage (Volts) 16 4 5 Specifications GAL16V8Z GAL16V8ZD Power-Up Reset Vcc Vcc (min.) t su t wl CLK t pr INTERNAL REGISTER Q - OUTPUT Internal Register Reset to Logic "0" FEEDBACK/EXTERNAL OUTPUT REGISTER Device Pin Reset to Logic "1" Circuitry within the GAL16V8Z/ZD provides a reset signal to all registers during power-up. All internal registers will have their Q outputs set low after a specified time (tpr, 1µs MAX). As a result, the state on the registered output pins (if they are enabled) will always be high on power-up, regardless of the programmed polarity of the output pins. This feature can greatly simplify state machine design by providing a known state on power-up. The timing diagram for power-up is shown below. Because of the asynchronous nature of system power-up, some conditions must be met to provide a valid power-up reset of the GAL16V8Z/ZD. First, the VCC rise must be monotonic. Second, the clock input must be at static TTL level as shown in the diagram during power up. The registers will reset within a maximum of tpr time. As in normal system operation, avoid clocking the device until all input and feedback path setup times have been met. The clock must also meet the minimum pulse width requirements. Input/Output Equivalent Schematics PIN PIN Feedback Vcc Vcc Tri-State Control Vcc ESD Protection Circuit Vcc Data Output PIN PIN ESD Protection Circuit Feedback (To Input Buffer) Typical Input Typical Output 17 Specifications GAL16V8Z GAL16V8ZD Typical AC and DC Characteristics Normalized Tpd vs Vcc 1.4 1.2 0.9 1 0.9 5.25 5.50 0.8 4.50 4.75 Supply Voltage (V) Normalized Tpd vs Temp 5.00 5.25 4.50 5.50 PT L->H 1 0.9 0.8 1.4 1.2 RISE 1.1 FALL 1 0.9 0.8 PT L->H 1.1 1 0.9 0.8 -55 125 Temperature (deg. C) Delta Tco vs # of Outputs Switching 0 Delta Tco (ns) 0 Delta Tpd (ns) 100 75 50 Delta Tpd vs # of Outputs Switching -0.5 -1 RISE -1.5 FALL -2 -0.5 -1 RISE -1.5 FALL -2 2 3 4 5 6 7 8 1 Number of Outputs Switching 2 3 4 5 6 7 8 Number of Outputs Switching Delta Tpd vs Output Loading Delta Tco vs Output Loading 10 10 8 RISE 6 FALL Delta Tco (ns) Delta Tpd (ns) PT H->L 1.2 0.7 25 0 -25 -55 125 100 75 50 25 0 -25 -55 1.3 Temperature (deg. C) Temperature (deg. C) 1 4 2 0 8 RISE 6 FALL 4 2 0 -2 -2 0 50 100 150 5.50 Normalized Tsu vs Temp 0.7 0.7 5.25 Normalized Tco vs Temp Normalized Tsu 1.1 Normalized Tco 1.2 PT H->L 5.00 Supply Voltage (V) 1.3 1.3 4.75 Supply Voltage (V) 200 250 300 0 Output Loading (pF) 50 100 150 200 250 Output Loading (pF) 18 300 125 5.00 100 4.75 PT L->H 1.1 0.8 4.50 PT H->L 1.2 75 0.8 1 1.3 50 0.9 FALL 0 1 1.1 25 PT L->H -25 1.1 RISE Normalized Tsu PT H->L Normalized Tco Normalized Tpd 1.2 Normalized Tpd Normalized Tsu vs Vcc Normalized Tco vs Vcc Specifications GAL16V8Z GAL16V8ZD Typical AC and DC Characteristics Vol vs Iol 1.25 Voh (V) 1 0.75 0.5 5 5 4 4.5 Voh (V) 1.5 Vol (V) Voh vs Ioh Voh vs Ioh 3 2 0 2.5 0 0.00 20.00 40.00 0.00 60.00 3.5 3 1 0.25 4 10.00 20.00 30.00 40.00 50.00 0.00 60.00 1.00 2.00 3.00 4.00 Iol (mA) Ioh(mA) Ioh(mA) Normalized Icc vs Vcc Normalized Icc vs Temp Normalized Icc vs Freq. (DPP & ITD > 10MHz) 1.30 1.2 1.10 1.00 0.90 0.80 0.70 1.1 Normalized Icc Normalized Icc Normalized Icc 1.30 1.20 1 0.9 0.8 4.50 4.75 5.00 5.25 5.50 1.20 1.10 1.00 0.90 0.80 -55 Supply Voltage (V) -25 0 25 50 75 100 125 0 Temperature (deg. C) Delta Icc vs Vin (1 input) 50 75 100 Frequency (MHz) Normalized Icc vs Freq. (ITD) Input Clamp (Vik) 5 25 1 0 Normalized Icc 4 20 Iik (mA) Delta Icc (mA) 10 3 2 30 40 50 60 70 1 0.8 0.6 0.4 0.2 80 0 90 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 Vin (V) -1.00 0 -0.80 -0.60 -0.40 Vik (V) 19 -0.20 0.00 1 10 100 1000 Frequency (KHz) 10000