TI CC8530RHAR 2.4 ghz rf soc for wireless digital audio streaming Datasheet

CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
www.ti.com
2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING
CC8520, CC8521, CC8530 & CC8531 - PurePath™ Wireless
Development tools
- PC-based PurePath™ Wireless
Configurator for CC85xx configuration
- CC85xx Family User Guide
- CC85XXDK audio development kit
- CC85XXDK-HEADSET development kit
AVDD 31
GIOI2 34
SDA/
33
GIO11
SCL/
32
GIO10
36
GIOI3 35
IOVDD 37
xPAEN
DCPL 39
xLNAEN 38
QFN-40 PIN CONFIGURATION (TOP VIEW)
3
xANTN
/USBP
xANTP
/USBN
CSN
4
SCLK
AVDD
27
5
MOSI
AVDD
26
6
MISO
RF_N
25
7
GIO1
RF_P
24
8
GIO2
AVDD
23
9
GIO3
X0
10
IOVDD
X1
22
21
AD2/
GIO9
AVDD
28
20
29
AVDD
19
30
VBAT
IOVDD
17
16
15
14
11
RBIAS
18
CC85xx
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
2
13
1
RSTN
RF section
- 5 Mbps over-the-air data rate
- Bandwidth-efficient modulation format
- Excellent link budget with programmable
output power up to +3.5 dBm and -83 dBm
sensitivity
- Seamless support for CC2590 range
extender (+11dBm output power, -87dBm
sensitivity)
Digital audio support
- Digital I2S audio interface supports 1 or 2
audio channels for the CC8520 and 1 to 4
audio channels for the CC8530 at sample
rates of 32, 40.275, 44.1 and 48 kHz, and
supports 16 bit word-widths
- USB audio support for 32, 44.1 and 48 kHz,
and supports 16 bit word-widths.
- Audio latency down to 16 ms
- Data side-channel allows data to be sent
alongside the audio between external host
controllers
USB
- Full-speed USB Audio device
- USB Basic Audio Device Class: HT1, HS1
and MT topologies (headphone, headset
and microphone)
- USB Audio Device Class. Maximum 2 input
channels. Maximum 2 output channels
- Basic USB HID device class support for
remote control functionality
- Autonomous operation only.
DVDD 40
External system
- Can be used autonomously, or can be
controlled by an external host MCU for
greatest flexibility
- Seamless connection and control of
selected TI audio codecs, DACs/ADCs and
digital audio amplifiers using I2S and I2C
- HID functions like power control, binding,
volume control, audio channel selection
can be mapped to I/Os
- RoHS compliant 6mm x 6mm QFN-40
package
Suited for systems targeting compliance
with
worldwide
radio
frequency
regulations: ETSI EN 300 328 and EN
300 440 class 2 (Europe), FCC CFR47 Part
15 (US) and ARIB STD-T66 (Japan)
IOVDD
FEATURES
Built-in audio protocol
- CD-quality uncompressed audio
- Excellent robustness and co-existence
through multiple techniques
- Adaptive Frequency Hopping
- Forward Error Correction
- Buffering and Retransmission
- Error Concealment
- Optional
high
quality
audio
compression
- No software development needed when
used in autonomous mode
-
12
APPLICATIONS
- Wireless high-quality digital audio
- Wireless point-to-point audio link
- Wireless (USB) headphones / headsets
- Wireless (USB) loudspeakers
- Wireless 2.1 speaker systems
- CC852x supports up to 2 channels
- CC853x supports up to 4 channels
- CC85x1 supports USB
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath™ is a trademark for Texas Instruments
All other trademarks are the property of their respective owners.
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
DESCRIPTION
The PurePath™ Wireless platform is a cost-effective and low-power solution optimized for wireless
transmission of high-quality digital audio.
The CC85xx includes a robust built-in wireless audio transmission protocol and can control
selected external audio devices. Utilizing numerous coexistence mechanisms allows the CC85xx to
avoid interfering with, or being interfered by other 2.4 GHz radio systems.
The CC85xx operates autonomously, and can be used with or without an external MCU. An external
host processor can be connected through SPI and control some aspects of its operation. The
CC85xx interfaces easily with other TI audio ICs and DSPs (using I2S and DSP/TDM interfaces).
More details can be found in the CC85xx Family User Guide [2].
ABBREVIATIONS
2
ADC
Analog to Digital Converter
LED
Light Emitting Diode
ARIB
Association of Radio Industries and Businesses
LNA
Low Noise Amplifier
BER
Bit Error Rate
MISO
Master In Slave Out
CODEC
Coder/Decoder
MOSI
Master Out Slave In
DAC
Digital to Analog Converter
MCU
Microcontroller
DSP
Digital Signal Processor
PA
Power Amplifier
EHIF
External Host Interface
PCM
Pulse Code Modulation
ESD
Electro Static Discharge
PER
Packet Error Rate
ETSI
European Telecommunications Standard Institute
PLL
Phase Lock Loop
FCC
Federal Communications Commission
PM
Protocol Master
FEC
Forward Error Correction
PPW
PurePath™ Wireless
FSK
Frequency Shift Keying
PS
Protocol Slave
FW
Firmware
RoHS
Restriction of Hazardous Substances
HID
Human Interface Device
RF
Radio Frequency
I2C
Inter-Integrated Circuit (serial communications bus)
SLAC
Slightly Lossy Compression Algorithm
I2S
Inter-IC Sound (serial bus for digital audio signals)
SPI
Serial Peripheral Interface
IEEE
Institute of Electrical and Electronics Engineers
SoC
System-on-Chip
ISM
Industrial, Scientific, Medical
STD
Standard
JEDEC
Joint Electron Device Engineering Council
TDM
Time-Division Multiplexing
LDO
Low-Dropout Regulator
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
(2)
(1)
TEST CONDITIONS
Min
Max
Unit
All supply pins must have the same voltage
–0.3
3.9
V
–0.3
min(VDD +
0.3, 3.9)
V
10
dBm
125
°C
According to IPC/JEDEC J-STD-020
260
°C
All pads, according to human-body model
(HBM), JEDEC STD 22, method A114
2000
V
According to charged-device model (CDM),
JEDEC STD 22, method C101E
400
V
Voltage on any digital pin
Input RF level
Storage temperature range
Reflow soldering temperature
ESD
(3)
-40
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings.
(3)
CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS, CC8520/CC8530
PARAMETER
TEST CONDITIONS
Min
Max
Unit
Operating ambient temperature range, TA
-40
+85
°C
Operating supply voltage
2.0
3.6
V
Min
Max
Unit
-40
+85
°C
3.0
3.6
V
RECOMMENDED OPERATING CONDITIONS, CC8521/CC8531
PARAMETER
TEST CONDITIONS
Operating ambient temperature range, TA
Operating supply voltage
(1)
3
(1)
For CC8521 and CC8531 running on USB power, a LDO is needed to comply with these ratings.
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
RF frequency range
Data rate
Shaped 8FSK
Audio latency
Latency between I2S interface on audio source
and I2S interface on audio sink. Uncompressed
16 bit. Audio latency is programmable using the
PurePath Wireless Configurator [1].
Audio sample rate
Audio sample rate is programmable using the
(1)
PurePath Wireless Configurator [1]
(1)
(2)
MIN
TYP
2400
MAX
UNIT
2483.5
MHz
5
Mbps
768
2048
48
44.1
(2)
40.275
32
Samples
kHz
±2000ppm tolerance
Not supported in USB mode. For USB Headset, dynamic sample rate change is not allowed.
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xxEM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
Current consumption,
power down state
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
1
A
Current consumption, headphone
master(1)
Average current for a PurePath Wireless master
with I2S interface active, sourcing two PCM16
channels with maximum output power.
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels with maximum output power
29
mA
25
mA
Current consumption, headphone
slave(1)
(1)
MIN
TYP
MAX
UNIT
Measured on Texas Instruments CC85xx EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled.
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531
Measured on Texas Instruments CC85xx EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
Output power
MIN
TYP
MAX
UNIT
Maximum output power setting
3.5
dBm
5 Mbps, 0.1 % BER
-83
dBm
5 Mbps, 0.1 % BER
-2
dBm
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity
8
dB
Alternate channel, ±8MHz, wanted 3dB above
sensitivity
35
dB
Occupied bandwidth
99% energy bandwidth
3.8
MHz
Optimum load impedance
Differential impedance seen from the RF port
(RF_P and RF_N) towards the antenna
70 + j30
Ω
Spurious emission
Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15
and ARIB STD-T-66
Receiver sensitivity
(1)
Saturation (maximum input level)
(1)
Selectivity
(1)
Measured using data packets with 40 byte payload.
Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by
using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be
connected to a good RF ground.
(2)
4
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
ELECTRICAL CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
Current consumption,
power down state(1)
Voltage regulator / crystal oscillator off – status
lost (POWERED_DOWN state)
Average current for a PurePath Wireless master
with I2S interface active, sourcing two PCM16
channels.
Average current for a PurePath Wireless slave
with I2S interface active, sinking two PCM16
channels
Current consumption, headphone
master(2)
Current consumption, headphone
slave(2)
(1)
(2)
MIN
TYP
MAX
UNIT
1
A
38
mA
28
mA
CC2590 power down current is 100 nA[4]
Measured on Texas Instruments CC85xx+CC2590 EM reference designs and CC85XXDK. Sample rate 48 kHz, MCLK disabled.
RF CHARACTERISTICS, CC8520/CC8521/CC8530/CC8531 +CC2590
Measured on Texas Instruments CC85xx+CC2590 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
Output power
Maximum output power setting
11
dBm
Receiver sensitivity(1)
5 Mbps, 0.1 % BER
-87
dBm
Saturation (maximum input level)
5 Mbps, 0.1 % BER
-12
dBm
Adjacent channel, ±4MHz, wanted 3dB above
sensitivity
9
Alternate channel, ±8MHz, wanted 3dB above
sensitivity
34
MAX
Selectivity
dB
Suitable for systems targeting compliance with EN 300 328, EN 300 440(2), FCC CFR47 Part 15
and ARIB STD-T-66
Spurious emission
(1)
UNIT
Measured using data packets with 40 byte payload.
48-MHz CRYSTAL REQUIREMENTS
General parameters with TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
Crystal frequency
Crystal frequency accuracy requirement
TYP
MAX
48
(1)
UNIT
MHz
-50
50
ppm
ESR Equivalent series resistance
-
60
ohm
C0 Crystal shunt capacitance
-
3
pF
CL Crystal load capacitance
15
16
17
pF
MIN
TYP
MAX
UNIT
(1)
Including aging and temperature dependency
AUDIO CLOCK CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
MCLK Frequency range
BCLK Frequency range
TEST CONDITION
Programmable using the PurePath Wireless
Configurator [1]
Programmable using the PurePath Wireless
Configurator [1]
WCLK Frequency range
RMS jitter (Output clocks)
5
RMS period jitter for 1000 periods
32·FWCLK
512·FWCLK
32·FWCLK
256·FWCLK
31.936
48.096
kHz
200
ps
80
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
SPI INTERFACE CHARACTERISTICS
TA = 25°C and VDD = 3.3 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
SCLK frequency
0
SCLK low
25
ns
SCLK high
25
ns
20
MHz
CSN high
Minimum time CSN must be high, if brought high,
between commands (it is not necessary to bring
CSN high between commands).
50
ns
CSN falling edge to
SCLK rising edge
Distance from CSN asserted until first rising edge
on SCLK.
25
ns
SCLK falling edge to
CSN rising edge
Distance from last negative edge of SCLK in last
word until CSN can be de-asserted.
100
ns
Inter-word spacing
Minimum distance in time from rising edge of
SCLK for last bit in word n and the rising edge of
SCLK for the first bit in word n+1.
50
ns
Properly handles abutting words.
Hysteresis on SCLK
Hysteresis around trigger point of input buffer
using a Schmitt trigger
Slew rate on SCLK
Slew rate from 0.1·IOVDD to 0.9·IOVDD
10
mV
V/ s
AVDD 31
SDA/
GIO11 33
SCL/ 32
GIO10
36
GIOI2 34
7
GIOI3 35
6
xPAEN
MOSI
IOVDD 37
SCLK
5
DCPL 39
4
RBIAS
30
VBAT
29
AVDD
28
AVDD
27
AVDD
26
MISO
RF_N
25
GIO1
RF_P
24
8
GIO2
AVDD
23
9
GIO3
X0
10
IOVDD
X1
22
21
IOVDD
AD2/
GIO9
AVDD
18
19
20
17
16
15
14
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
12
13
RSTN
CC85xx
11
2
DVDD
3
xANTN
/USBN
xANTP
/USBP
CSN
1
xLNAEN 38
PIN DESCRIPTION
40
1
100
Figure 1 - CC85xx QFN-40 PIN CONFIGURATION
6
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
PIN
PIN NAME
PIN TYPE
DESCRIPTION
-
GND
Ground
The exposed die attach pad must be connected to a solid ground plane underneath the
chip
1
xANTN
USBN
Digital I/O1
CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch)
CC85x1: USB D- data line
2
xANTP
USBP
Digital I/O1
CC85x0: DO NOT CONNECT (Future FW: Controlling external antenna switch)
CC85x1: USB D+ data line
3
CS_N
Digital Input
(pull-up)
Serial SPI configuration interface, active low chip select
4
SCLK
Digital I/O1
Serial SPI configuration interface, clock input/output
MOSI
Digital I/O
1
Serial SPI configuration interface, master data output, slave data input
1
Serial SPI configuration interface, master data input, slave data output.
5
6
MISO
Digital I/O
7
GIO1
Digital I/O1
GIO2
Digital I/O
1
General-purpose digital I/O pin 2
Digital I/O
2
General-purpose digital I/O pin 3
General-purpose digital I/O pin 1
Configurable with PurePath™ Wireless Configurator
8
9
GIO3
Configurable with PurePath™ Wireless Configurator
10
IOVDD
Power
(I/O pads)
Digital power supply for the digital I/Os in the SPI interface and GIO1-GIO3.
11
RSTN
Digital Input
(pull-up)
Active-low device reset
12
IOVDD
Power
(I/O pins)
Digital power supply for the RSTN and MCLK digital I/O pins.
13
MCLK
Digital I/O1
Master clock output for external audio devices
GIO4
14
BCLK
General-purpose digital I/O pin 4
Digital I/O
1
Digital I/O
1
Digital I/O
1
GIO5
15
WCLK
General-purpose digital I/O pin 5
GIO6
16
AD0
AD1
I2S/DSP audio interface word clock (in/out)
General-purpose digital I/O pin 6
GIO7
17
I2S/DSP audio interface bit clock (in/out)
I2S/DSP audio interface data line 0 (in/out)
General-purpose digital I/O pin 7
Digital I/O1
GIO8
I2S/DSP audio interface data line 1 (in/out)
General-purpose digital I/O pin 8
18
IOVDD
Power
(I/O pins)
Digital power supply for the digital I/Os in audio interface (BCLK-AD2).
19
AD2
Digital I/O2
I2S/DSP audio interface data line 2 (in/out)
Configurable with PurePath™ Wireless Configurator
GIO9
20
AVDD
Power (Analog)
2.0-3.6V analog power supply connection
21
X1
Analog I/O
Crystal oscillator pin input, or external clock input (48 MHz)
22
X0
Analog I/O
Crystal oscillator pin output (48 MHz)
23
AVDD
Power (Analog)
Analog power supply connection
24
RF_P
RF I/O
Positive differential RF input signal to LNA in receive mode
Positive differential RF output signal from PA in transmit mode
25
RF_N
RF I/O
Negative differential RF input signal to LNA in receive mode
Negative differential RF output signal from PA in transmit mode
7
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
PIN
PIN NAME
PIN TYPE
DESCRIPTION
26
AVDD
Power (Analog)
Analog power supply connection
27
AVDD
Power (Analog)
Analog power supply connection
28
AVDD
Power (Analog)
Analog power supply connection
29
VBAT
Analog input
Battery voltage supervisor (threshold level programmable by external resistor to positive
battery terminal)
30
RBIAS
Analog output
External precision bias resistor for reference current. 56 k , 1%
31
AVDD
Power (Analog)
Analog power supply connection (Guard ring AVDD connection for digital noise isolation)
32
SCL
Digital I/O
1
Digital I/O
1
Digital I/O
1
General-purpose digital I/O pin 12
Digital I/O
1
General-purpose digital I/O pin 13
2
Control external PA
GIO10
33
SDA
General-purpose digital I/O pin 10
GIO11
34
35
GIO12
GIO13
I2C master clock line. Must be connected to external pull-up
I2C master data line. Must be connected to external pull-up
General-purpose digital I/O pin 11
36
xPAEN
Digital I/O
37
IOVDD
Power (I/O pads)
2
38
xLNAEN
Digital I/O
39
DCPL
Power (Digital)
Digital power supply for SCL-GIO15 pins.
Control external LNA
1.7V-1.85 V linear voltage regulator output to which a 1 uF decoupling capacitor should be
attached. For test-purposes an external digital supply voltage (1.62-1.98 V) can be applied
here, bypassing the voltage regulator.
NOTE: The voltage regulator is intended for use with the CC85xx chip only. It cannot be
used to provide supply voltage to other devices.
40
1
2
8
DVDD
Power (Digital)
Digital power supply for the linear voltage regulator.
Digital I/O pad with 4 mA source/sink capability.
Digital I/O pad with 20 mA source/sink capability.
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
2
APPLICATION CIRCUIT
2.0V-3.6V
Power Supply
R101
xANTP
VBAT
29
CSN
AVDD
28
4
SCLK
AVDD
27
5
MOSI
AVDD
26
6
MISO
RF_N
25
7
GIO1
RF_P
24
8
GIO2
AVDD
23
9
GIO3
X0
10
IOVDD
X1
22
21
AVDD
20
Alternative:
CC2590 External LNA/PA
Antenna
(50 Ohm)
C301
C306
L302
L303
C305
L304
C302
L301
C303
C401
AD2/
GIO9
19
18
17
16
15
14
IOVDD
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
12
13
RSTN
11
CC8520/30
Antenna
(50 Ohm)
XTAL
30
C402
AVDD 31
GIOI2 34
36
GIOI3 35
DCPL 39
SDA/
GIO11 33
SCL/ 32
GIO10
3
IOVDD 37
2
xPAEN
xANTM
CC2590 +
Matching/
Filtering
RBIAS
Audio Device
1
xLNAEN 38
DVDD 40
C391
Figure 2 - CC8520/CC8530 Application Circuit
2.0V-3.6V
Power Supply
USB D+
CC2590 +
Matching/
Filtering
R101
AVDD 31
GIOI2 34
GIOI3 35
36
SDA/
33
GIO11
SCL/ 32
GIO10
3
IOVDD 37
2
xPAEN
USBN
30
USBP
VBAT
29
CSN
AVDD
28
4
SCLK
AVDD
27
5
MOSI
AVDD
26
6
MISO
RF_N
25
7
GIO1
RF_P
24
8
GIO2
Antenna
(50 Ohm)
Alternative:
CC2590 External LNA/PA
47 pF
AVDD
L302
L303
C305
23
22
21
L304
C302
L301
C303
C401
GIO9/
AD2
20
18
17
16
15
14
13
19
X1
MCLK/
GIO4
BCLK/
GIO5
WCLK/
GIO6
AD0/
GIO7
AD1/
GIO8
IOVDD
X0
IOVDD
IOVDD
GIO3
RSTN
9
10
C306
C402
AVDD
Antenna
(50 Ohm)
C301
XTAL
CC8521/31
12
1.5k ohm
RBIAS
11
33 ohm
1
xLNAEN 38
47 pF
33 ohm
USB D-
DCPL 39
DVDD 40
C391
Figure 3 - CC8521/CC8531 Application Circuit
9
Copyright © 2011, Texas Instruments Incorporated
CC8520, CC8521, CC8530 & CC8531
SWRS091D – JULY 2011
WWW.TI.COM
3
SYSTEM DESCRIPTION
By employing proprietary technology, referred to as PurePath Wireless, the CC85xx device family provides
robust, high-quality, short-range 2.4 GHz wireless digital audio streaming in low-cost single chip solutions.
Two or more devices form a PurePath Wireless audio network. Great care has been taken to ensure that this
audio network provides gap-less and robust audio streaming in varied environments and that it can coexist
amicably with existing wireless technologies in the crowded 2.4 GHz ISM band.
Most applications can be implemented without any software development and only require the CC85xx to be
connected to an external audio source or sink (such as an audio codec, S/PDIF interface or class-D amplifier)
and a few push buttons, switches or LED for human interaction. Advanced applications can interface a host
processor or DSP directly to the CC85xx and directly stream audio and control most aspects of device and
audio network operation. The complete list of supported audio devices can be found in the PurePath Wireless
Configurator [1].
The PurePath Wireless Configurator [1], a PC-based configuration tool, is used to set up the desired
functionality and parameters of the target system and then produces firmware images that subsequently must
be programmed into the embedded flash memory of each CC85xx.
All devices in the CC85xx family interface seamlessly with the CC2590 RF range extender device to allow for
even wider RF coverage and improved robustness in difficult environments.
4
DOCUMENT HISTORY
Revision
Date
Description/Changes
SWRC09D
July 2011
March 2011
Added info on CC8521 and CC8531
Added info on CC8530. Updated current consumption numbers
and how they are measured. Storage temperature updated. Info on
supported codecs now in PurePath Wireless Configurator.
Add RF Characteristics for CC8520+CC2590EM. Moved the
sections; Network topology, Coexistence, Audio Interface, Human
Interaction drivers and external host interface to the CC85xx
Family User’s Guide [2]. Updated pin-out table and fig 1.
First release
SWRS09C
Sept 2010
SWRS09B
SWRS09A
5
March 2010
REFERENCES
[1] PurePath™ Wireless Configurator
[2] CC85xx Family User Guide
[3] CC-Debugger
[4] CC2590 Product folder
10
Copyright © 2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
CC8520RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8520RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8521RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8521RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8530RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8530RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8531RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC8531RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jul-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CC8520RHAR
VQFN
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8520RHAT
VQFN
RHA
40
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8521RHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8521RHAT
VQFN
RHA
40
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8530RHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8530RHAT
VQFN
RHA
40
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8531RHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC8531RHAT
VQFN
RHA
40
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC8520RHAR
VQFN
RHA
40
2500
333.2
345.9
28.6
CC8520RHAT
VQFN
RHA
40
250
333.2
345.9
28.6
CC8521RHAR
VQFN
RHA
40
2500
333.2
345.9
28.6
CC8521RHAT
VQFN
RHA
40
250
333.2
345.9
28.6
CC8530RHAR
VQFN
RHA
40
2500
333.2
345.9
28.6
CC8530RHAT
VQFN
RHA
40
250
333.2
345.9
28.6
CC8531RHAR
VQFN
RHA
40
2500
333.2
345.9
28.6
CC8531RHAT
VQFN
RHA
40
250
333.2
345.9
28.6
Pack Materials-Page 2
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