Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design AMC1300, AMC1300B SBAS895 – MAY 2018 AMC1300x Precision, ±250-mV Input, Reinforced Isolated Amplifier 1 Features 3 Description • The AMC1300 is a precision, isolated amplifier with an output separated from the input circuitry by an isolation barrier that is highly resistant to magnetic interference. This barrier is certified to provide reinforced galvanic isolation of up to 5 kVRMS according to VDE V 0884-11 and UL1577. Used in conjunction with isolated power supplies, this isolated amplifier separates parts of the system that operate on different common-mode voltage levels and protects lower-voltage parts from damage. 1 • • • • • • • • ±250-mV Input Voltage Range Optimized for Current Measurement Using Shunt Resistors Low Offset Error and Drift: – AMC1300B: ±0.2 mV (max), ±3 µV/°C (max) – AMC1300: ±2 mV (max), ±4 µV/°C (max) Fixed Gain: 8.2 Very Low Gain Error and Drift: – AMC1300B: ±0.3% (max), ±50 ppm/°C (max) – AMC1300: ±1% (max), ±50 ppm/°C (typ) Low Nonlinearity and Drift: 0.03%, 1 ppm/°C (typ) 3.3-V Operation on High-Side (AMC1300B) System-Level Diagnostic Features Safety-Related Certifications: – 7071-VPK Reinforced Isolation per DIN V VDE V 0884-11: 2017-01 – 5000-VRMS Isolation for 1 Minute per UL1577 High CMTI on AMC1300B: 140 kV/µs (typ) 2 Applications • Shunt-Resistor-Based Current Sensing In: – Motor Drives – Frequency Inverters – Uninterruptible Power Supplies The input of the AMC1300 is optimized for direct connection to shunt resistors or other low voltagelevel signal sources. The excellent performance of the device supports accurate current control resulting in system-level power savings and, especially in motor control applications, lower torque ripple. The integrated common-mode overvoltage and missing high-side supply voltage detection features of the AMC1300 simplify system-level design and diagnostics. The AMC1300 is offered with two performance grade options: the AMC1300B is specified over the extended industrial temperature range of –55°C to +125°C, and the AMC1300 for operation at –40°C to +125°C. Device Information(1) PART NUMBER AMC1300 PACKAGE SOIC (8) BODY SIZE (NOM) 5.85 mm × 7.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Floating Power Supply HV+ AMC1300B VDD1 GND1 RSHUNT RFLT INN to Load RFLT CFLT INP VDD2 Reinforced Isolation 3.3 V or 5.0 V 3.3 V, or 5.0 V GND2 OUTP OUTN ADS7263 14-Bit ADC Diagnostics HV- 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 8 8.2 Functional Block Diagram ....................................... 18 8.3 Feature Description................................................. 18 8.4 Device Functional Modes........................................ 20 1 1 1 2 3 3 4 9 Application and Implementation ........................ 21 9.1 Application Information............................................ 21 9.2 Typical Application .................................................. 21 9.3 Do's and Don'ts ...................................................... 23 10 Power Supply Recommendations ..................... 24 11 Layout................................................................... 25 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 5 Power Ratings........................................................... 5 Insulation Specifications............................................ 6 Safety-Related Certifications..................................... 7 Safety Limiting Values .............................................. 7 Electrical Characteristics........................................... 7 Switching Characteristics ........................................ 9 Insulation Characteristics Curves ......................... 10 Typical Characteristics .......................................... 11 11.1 Layout Guidelines ................................................. 25 11.2 Layout Example .................................................... 25 12 Device and Documentation Support ................. 26 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Documentation Support ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 26 26 26 26 27 27 27 13 Mechanical, Packaging, and Orderable Information ........................................................... 27 Detailed Description ............................................ 18 8.1 Overview ................................................................. 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 2 DATE REVISION NOTES May 2018 * Initial release. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 5 Device Comparison Table PARAMETER High-side supply voltage, VDD1 Specified ambient temperature, TA 4.5 V ≤ VDD1 ≤ 5.5 V Input offset voltage, VOS AMC1300B AMC1300 3.0 V to 5.5 V 4.5 V to 5.5 V –55°C to +125°C –40°C to +125°C ±2 mV ±0.2 mV 3.0 V ≤ VDD1 ≤ 4.5 V Input offset drift, TCVOS Gain error, EG Gain error drift, TCEG Not applicable ±3 µV/°C (max) ±4 µV/°C (max) ±0.3% ±1% ±15 ppm/°C (typ), ±50 ppm/°C (max) ±50 ppm/°C (typ) 75 kV/µs (min), 140 kV/µs (typ) 15 kV/µs (min), 30 kV/µs (typ) 250 kHz (min), 310 kHz (typ) 170 kHz (min), 230 kHz (typ) 3 µs (max) 3.4 µs (max) Common-mode transient immunity, CMTI Output bandwidth, BW INP, INN to OUTP, OUTN signal delay (50% – 90%) 6 Pin Configuration and Functions DWV Package 8-Pin SOIC Top View VDD1 1 8 VDD2 INP 2 7 OUTP INN 3 6 OUTN GND1 4 5 GND2 Not to scale Pin Functions PIN NO. 1 NAME TYPE DESCRIPTION High-side power supply, 3.0 V to 5.5 V for the AMC1300B (4.5 V to 5.5 V for the AMC1300), relative to GND1. See the Power Supply Recommendations section for power-supply decoupling recommendations. VDD1 — 2 INP I Noninverting analog input 3 INN I Inverting analog input 4 GND1 — High-side analog ground 5 GND2 — Low-side analog ground 6 OUTN O Inverting analog output 7 OUTP O Noninverting analog output 8 VDD2 — Low-side power supply, 3.0 V to 5.5 V. See the Power Supply Recommendations section for power-supply decoupling recommendations. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 3 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) Power-supply voltage MIN MAX VDD1 to GND1 –0.3 6.5 VDD2 to GND2 –0.3 6.5 GND1 – 6 VDD1 + 0.5 GND2 – 0.5 VDD2 + 0.5 V –10 10 mA Input voltage INP, INN Output voltage OUTP, OUTN Input current Continuous, any pin except power-supply pins Temperature (1) Junction, TJ UNIT V 150 Storage, Tstg –65 V °C 150 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX VDD1 to GND1, AMC1300 4.5 5 5.5 VDD1 to GND1, AMC1300B 3.0 5 5.5 VDD2 to GND2 3.0 3.3 5.5 UNIT POWER SUPPLY High-side power supply Low-side power supply V V ANALOG INPUTS VClipping Differential input voltage before clipping output VIN = VINP – VINN VFSR Specified linear differential input full-scale VIN = VINP – VINN Absolute common-mode input voltage VCM (1) Operating common-mode input voltage (VINP + VINN) / 2 to GND1 ±320 –250 mV 250 mV –2 VDD1 V –0.16 VDD1 – 2.1 V AMC1300 –40 125 AMC1300B –55 125 (VINP + VINN) / 2 to GND1 TEMPERATURE RANGE TA (1) 4 Specified ambient temperature °C Steady-state voltage supported by the device in case of a system failure. See the specified common-mode input voltage VCM for normal operation. Observe analog input voltage range as specified in the Absolute Maximum Ratings table. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 7.4 Thermal Information AMC1300x THERMAL METRIC (1) DWV (SOIC) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 85.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 26.8 °C/W RθJB Junction-to-board thermal resistance 43.5 °C/W ψJT Junction-to-top characterization parameter 4.8 °C/W ψJB Junction-to-board characterization parameter 41.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Power Ratings PARAMETER TEST CONDITIONS PD Maximum power dissipation (both sides) PD1 Maximum power dissipation (high-side supply) PD2 Maximum power dissipation (low-side supply) VALUE VDD1 = VDD2 = 5.5 V 98.45 VDD1 = VDD2 = 3.6 V, AMC1300B only 56.52 VDD1 = 5.5 V 53.90 VDD1 = 3.6 V, AMC1300B only 30.60 VDD2 = 5.5 V 44.55 VDD2 = 3.6 V 25.92 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 UNIT mW mW mW 5 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 7.6 Insulation Specifications over operating ambient temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VALUE UNIT GENERAL CLR External clearance (1) Shortest pin-to-pin distance through air ≥9 mm CPG External creepage (1) Shortest pin-to-pin distance across the package surface ≥9 mm DTI Distance through insulation Minimum internal gap (internal clearance) of the double insulation (2 × 0.0105 mm) ≥ 0.021 mm CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 ≥ 600 V Material group According to IEC 60664-1 Overvoltage category per IEC 60664-1 I-IV Rated mains voltage ≤ 600 VRMS I-IV Rated mains voltage ≤ 1000 VRMS I-III DIN V VDE V 0884-11 (VDE V 0884-11): 2017-01 VIORM Maximum repetitive peak isolation voltage VIOWM I Rated mains voltage ≤ 300 VRMS (2) At AC voltage 2121 VPK Maximum-rated isolation working voltage At AC voltage (sine wave); see Figure 4 1500 VRMS At DC voltage 2121 VDC VIOTM Maximum transient isolation voltage VTEST = VIOTM, t = 60 s (qualification test) 7071 VTEST = 1.2 × VIOTM, t = 1 s (100% production test) 8485 VIOSM Maximum surge isolation voltage (3) Test method per IEC 60065, 1.2/50-µs waveform, VTEST = 1.6 × VIOSM = 12800 VPK (qualification) 8000 Apparent charge (4) qpd Barrier capacitance, input to output (5) CIO Insulation resistance, input to output (5) RIO Method a, after input/output safety test subgroup 2 / 3, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.2 × VIORM = 2545 VPK, tm = 10 s ≤5 Method a, after environmental tests subgroup 1, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.6 × VIORM = 3394 VPK, tm = 10 s ≤5 Method b1, at routine test (100% production) and preconditioning (type test), Vini = VIOTM, tini = 1 s, Vpd(m) = 1.875 × VIORM = 3977 VPK, tm = 1 s ≤5 VIO = 0.5 VPP at 1 MHz ~1 VPK VPK pC pF 12 VIO = 500 V at TA = 25°C > 10 VIO = 500 V at 100°C ≤ TA ≤ 125°C > 1011 VIO = 500 V at TS = 150°C > 109 Pollution degree 2 Climatic category 55/125/21 Ω UL1577 VISO (1) (2) (3) (4) (5) 6 Withstand isolation voltage VTEST = VISO = 5000 VRMS or 7000 VDC, t = 60 s (qualification), VTEST = 1.2 × VISO = 6000 VRMS, t = 1 s (100% production test) 5000 VRMS Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal in certain cases. Techniques such as inserting grooves, ribs, or both on a PCB are used to help increase these specifications. This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits. Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier. Apparent charge is electrical discharge caused by a partial discharge (pd). All pins on each side of the barrier are tied together, creating a two-pin device. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 7.7 Safety-Related Certifications VDE UL Certified according to DIN V VDE V 0884-11 (VDE V 0884-11): 2017-01, DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08, and DIN EN 60065 (VDE 0860): 2005-11 Recognized under 1577 component recognition and CSA component acceptance NO 5 programs Reinforced insulation Single protection Certificate number: 40040142 File number: E181974 7.8 Safety Limiting Values Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. PARAMETER TEST CONDITIONS Safety input, output, or supply current IS PS Safety input, output, or total power (1) TS Maximum safety temperature (1) MIN TYP MAX UNIT RθJA = 85.4°C/W, TJ = 150°C, TA = 25°C, VDD1 = VDD2 = 5.5 V, see Figure 2 266 RθJA = 85.4°C/W, TJ = 150°C, TA = 25°C, VDD1 = VDD2 = 3.6 V, AMC1300B only, see Figure 2 406 RθJA = 85.4°C/W, TJ = 150°C, TA = 25°C, see Figure 3 1463 mW 150 °C mA The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power, respectively. Do not exceed the maximum limits of IS and PS. These limits vary with the ambient temperature, TA. The junction-to-air thermal resistance, RθJA, in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter: TJ = TA + RθJA × P, where P is the power dissipated in the device. TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum junction temperature. PS = IS × LDOINmax, where LDOINVmax is the maximum supply voltage. 7.9 Electrical Characteristics minimum and maximum specifications of the AMC1300 apply from TA = –40°C to +125°C, VDD1 = 4.5 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, INP = –250 mV to +250 mV, and INN = GND1 = 0 V; minimum and maximum specifications of the AMC1300B apply from TA = –55°C to +125°C, VDD1 = 3.0 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, INP = –250 mV to +250 mV, and INN = GND1 = 0 V; typical specifications are at TA = 25°C, VDD1 = 5 V, and VDD2 = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUT VCMov Common-mode overvoltage detection level VDD1 – 2 Hysteresis of common-mode overvoltage detection level VOS Input offset voltage (1) V 95 AMC1300, initial, at TA = 25°C, VINP = VINN = GND1 mV –2 ±0.01 2 –0.2 ±0.01 0.2 AMC1300 –4 ±1.3 4 AMC1300B –3 ±1 3 AMC1300B, initial, at TA = 25°C, VINP = VINN = GND1 mV TCVOS Input offset drift (1) CMRR Common-mode rejection ratio CIN Single-ended input capacitance INN = GND1, fIN = 275 kHz 2 CIND Differential input capacitance fIN = 275 kHz 1 pF RIN Single-ended input resistance INN = GND1 19 kΩ RIND Differential input resistance 22 kΩ IIB Input bias current TCIIB Input bias current drift ±1 nA/°C IIO Input offset current ±5 nA (1) fIN = 0 Hz, VCM min ≤ VCM ≤ VCM max –100 fIN = 10 kHz, VCM min ≤ VCM ≤ VCM max INP = INN = GND1, IIB = (IIBP + IIBN) / 2 µV/°C dB –98 –41 –30 pF –24 µA The typical value includes one sigma statistical variation. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 7 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Electrical Characteristics (continued) minimum and maximum specifications of the AMC1300 apply from TA = –40°C to +125°C, VDD1 = 4.5 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, INP = –250 mV to +250 mV, and INN = GND1 = 0 V; minimum and maximum specifications of the AMC1300B apply from TA = –55°C to +125°C, VDD1 = 3.0 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, INP = –250 mV to +250 mV, and INN = GND1 = 0 V; typical specifications are at TA = 25°C, VDD1 = 5 V, and VDD2 = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX –1% 0.4% 1% –0.3% ±0.05% 0.3% UNIT ANALOG OUTPUT Nominal gain Gain error (1) EG Gain error drift (1) TCEG 8.2 AMC1300, initial, at TA = 25°C AMC1300B, initial, at TA = 25°C AMC1300 AMC1300B Nonlinearity (1) ±50 –50 ±15 50 –0.03% ±0.01% 0.03% Nonlinearity drift THD SNR Total harmonic distortion VIN = 0.5 V, fIN = 10 kHz, BW = 100 kHz Output noise VINP = VINN = GND1, BW = 100 kHz Signal-to-noise ratio VIN = 0.5 V, fIN = 1 kHz, BW = 10 kHz 80 VIN = 0.5 V, fIN = 10 kHz, BW = 100 kHz Power-supply rejection ratio (2) Common-mode output voltage VFAILSAFE Failsafe differential output voltage BW Output bandwidth ROUT Output resistance PSRR vs VDD1, 100-mV and 10-kHz ripple Common-mode transient immunity dB 230 µVRMS 85 dB –96 PSRR vs VDD2, at DC dB –106 –86 1.39 VCM ≥ VCMov or VDD1 missing 1.44 1.49 V –2.6 –2.5 V AMC1300 170 230 AMC1300B 250 310 On OUTP or OUTN kHz < 0.2 Output short-circuit current CMTI ppm/°C –85 –103 PSRR vs VDD2, 100-mV and 10-kHz ripple VCMout ppm/°C ±1 72 PSRR vs VDD1, at DC PSRR V/V Ω ±13 mA |GND1 – GND2| = 1 kV, AMC1300 15 30 |GND1 – GND2| = 1 kV, AMC1300B 75 140 1.75 2.53 2.7 AMC1300B only, 3.0 V ≤ VDD1 ≤ 3.6 V 6.3 8.5 4.5 V ≤ VDD1 ≤ 5.5 V 7.2 9.8 3.0 V ≤ VDD2 ≤ 3.6 V 5.3 7.2 4.5 V ≤ VDD2 ≤ 5.5 V 5.9 8.1 kV/µs POWER SUPPLY VDD1UV VDD1 undervoltage detection threshold voltage IDD1 High-side supply current IDD2 Low-side supply current (2) 8 VDD1 falling V mA mA This parameter is output referred. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 7.10 Switching Characteristics over operating ambient temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX tr Rise time of OUTP, OUTN See Figure 1 1.3 tf Fall time of OUTP, OUTN See Figure 1 1.3 INP, INN to OUTP, OUTN signal delay (50% – 10%) AMC1300, unfiltered output, see Figure 1 1.5 2.2 1 1.5 INP, INN to OUTP, OUTN signal delay (50% – 50%) AMC1300, unfiltered output, see Figure 1 2 2.7 AMC1300B, unfiltered output, see Figure 1 1.6 2.1 INP, INN to OUTP, OUTN signal delay (50% – 90%) AMC1300, unfiltered output, see Figure 1 2.7 3.4 AMC1300B, unfiltered output, see Figure 1 2.5 3 VDD1 step to 3.0 V with VDD2 ≥ 3.0 V, to OUTP, OUTN valid, 0.1% settling 500 tAS AMC1300B, unfiltered output, see Figure 1 Analog settling time UNIT µs µs µs µs µs µs 0.25 V INP - INN 50% 0V 50% - 50% 50% - 90% 50% - 10% OUTP 50% 10% 90% VCMout OUTN tr tf Figure 1. Rise, Fall, and Delay Time Waveforms Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 9 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 7.11 Insulation Characteristics Curves 1600 500 VDD1 = VDD2 = 3.6 V VDD1 = VDD2 = 5.5 V 1400 400 300 PS (mW) IS (mA) 1200 200 1000 800 600 400 100 200 0 0 0 25 50 75 TA (°C) 100 125 0 150 Figure 2. Thermal Derating Curve for Safety-Limiting Current per VDE 50 100 125 150 D002 Safety Margin Zone: 1800 VRMS , 254 Years Operating Zone: 1500 VRMS , 135 Years TDDB Line (<1 PPM Fail Rate) 1E+10 1E+9 75 TA (°C) Figure 3. Thermal Derating Curve for Safety-Limiting Power per VDE 1E+11 Time to Fail (sec) 25 D001 87.5% 1E+8 1E+7 1E+6 1E+5 1E+4 1E+3 20% 1E+2 9000 9500 8500 8000 7500 7000 6500 6000 5500 5000 4500 4000 3500 3000 2500 2000 1500 500 1000 1E+1 Stress Voltage (V RMS) TA up to 150°C, stress-voltage frequency = 60 Hz, isolation working voltage = 1500 VRMS, operating lifetime = 135 year Figure 4. Reinforced Isolation Capacitor Lifetime Projection 10 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 7.12 Typical Characteristics at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 3.8 3.3 3.4 3.25 3.2 VCMov (V) VCMov (V) 3 2.6 2.2 1.8 3.15 3.1 3.05 3 1.4 2.95 1 3 3.25 3.5 3.75 4 4.25 4.5 VDD1 (V) 4.75 5 5.25 2.9 -55 -40 -25 -10 5.5 5 D003 20 35 50 65 Temperature (qC) 80 95 110 125 D004 –55°C ≤ TA < –40°C for AMC1300B only Figure 5. Common-Mode Overvoltage Detection Level vs High-Side Supply Voltage Figure 6. Common-Mode Overvoltage Detection Level vs Temperature 50 200 vs VDD1 vs VDD2 150 40 30 VOS (PV) Devices (%) 100 20 50 0 -50 -100 10 -150 -200 200 175 150 125 75 100 50 0 25 -25 -50 -75 -100 -125 -150 -175 -200 0 3 VOS (PV) 3.75 4 4.25 4.5 VDDx (V) 4.75 5 5.25 5.5 D006 Figure 8. Input Offset Voltage vs Supply Voltage Figure 7. Input Offset Voltage Histogram 200 200 Device 1 Device 2 Device 3 150 100 100 50 50 0 0 -50 -50 -100 -100 -150 -150 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 Device 1 Device 2 Device 3 150 VOS (PV) VOS (PV) 3.5 3 V ≤ VDD1 < 4.5 V for AMC1300B only AMC1300B -200 -40 3.25 D005 110 125 -200 -55 -40 -25 -10 D007 AMC1300 5 20 35 50 65 Temperature (°C) 80 95 110 125 D008 AMC1300B Figure 9. Input Offset Voltage vs Temperature Figure 10. Input Offset Voltage vs Temperature Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 11 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Typical Characteristics (continued) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 90 0 80 -20 60 -40 CMRR (dB) Devices (%) 70 50 40 30 -60 -80 20 -100 10 -120 0.001 3 2.5 2 1.5 1 0 0.5 -1 -0.5 -1.5 -2 -2.5 -3 0 0.01 0.1 D009 TCVOS (PV/qC) 1 fIN (kHz) 10 100 1000 D010 AMC1300B Figure 12. Common-Mode Rejection Ratio vs Input Frequency Figure 11. Input Offset Drift Histogram -70 25 -75 15 5 -85 IIB (PA) CMRR (dB) -80 -90 -5 -15 -95 -25 -100 -35 -105 -110 -55 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 -45 -0.5 95 110 125 0 0.5 1 1.5 VCM (V) D011 2 2.5 3 D012 –55°C ≤ TA < –40°C for AMC1300B only Figure 14. Input Bias Current vs Common-Mode Input Voltage -23 -23 -25 -25 -27 -27 -29 -29 IIB (PA) IIB (PA) Figure 13. Common-Mode Rejection Ratio vs Temperature -31 -33 -31 -33 -35 -35 -37 -37 -39 -39 -41 3 3.25 3.5 3.75 4 4.25 4.5 VDD1 (V) 4.75 5 5.25 5.5 -41 -55 -40 -25 -10 D013 5 20 35 50 65 Temperature (°C) 80 95 110 125 D014 –55°C ≤ TA < –40°C for AMC1300B only Figure 15. Input Bias Current vs High-Side Supply Voltage 12 Figure 16. Input Bias Current vs Temperature Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 Typical Characteristics (continued) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 50 0.5 0.4 40 0.3 EG (%) Devices (%) 0.2 30 20 0.1 0 -0.1 -0.2 10 -0.3 0 -0.5 AMC1300 vs VDD1 AMC1300 vs VDD2 AMC1300B vs VDD1 AMC1300B vs VDD1 EG (%) 0.3 0.25 0.2 0.15 0.1 0 0.05 -0.1 -0.05 -0.15 -0.2 -0.25 -0.3 -0.4 3 3.25 3.5 3.75 D019 4 4.25 4.5 VDDx (V) 4.75 5 5.25 5.5 D015 AMC1300B Figure 18. Gain Error vs Supply Voltage Figure 17. Gain Error Histogram 0.3 1 Device 1 Device 2 Device 3 0.8 0.2 0.6 0.1 0.2 EG (%) EG (%) 0.4 0 -0.2 0 -0.1 -0.4 -0.6 Device 1 Device 2 Device 3 -0.8 -1 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 -0.2 -0.3 -55 -40 -25 -10 110 125 5 D016 AMC1300 80 95 110 125 D017 AMC1300B Figure 19. Gain Error vs Temperature Figure 20. Gain Error vs Temperature 35 5 0 Normalized Gain (dB) 30 25 Devices (%) 20 35 50 65 Temperature (°C) 20 15 10 -5 -10 -15 -20 -25 -30 5 AMC1300B AMC1300 -35 0 45 40 35 30 25 20 15 10 5 -5 -10 -15 -20 -25 -30 -35 -40 -45 -40 1 10 TCEG (ppm/qC) 100 1000 fIN (kHz) D018 D020 AMC1300B Figure 21. Gain Error Drift Histogram Figure 22. Normalized Gain vs Input Frequency Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 13 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Typical Characteristics (continued) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 0° 5 -45° 4.5 VOUTN VOUTP 4 -90° VOUT (V) Output Phase 3.5 -135° -180° -225° 3 2.5 2 1.5 -270° 1 -315° AMC1300B AMC1300 0.5 -360° 1 10 100 0 -350 1000 fIN (kHz) -250 -150 -50 50 150 Differential Input Voltage (mV) D021 Figure 23. Output Phase vs Input Frequency 250 350 D022 Figure 24. Output Voltage vs Input Voltage 0.03 0.03 vs VDD1 vs VDD2 0.025 0.02 0.02 0.01 Nonlinearity (%) Nonlinearity (%) 0.015 0.005 0 -0.005 -0.01 0.01 0 -0.01 -0.015 -0.02 -0.02 -0.025 -0.03 -250 -200 -150 -100 -50 0 50 100 150 Differential Input Voltage (mV) -0.03 200 250 3 3.25 Figure 25. Nonlinearity vs Input Voltage 4 4.25 4.5 VDDx (V) 4.75 5 5.25 5.5 D024 Figure 26. Nonlinearity vs Supply Voltage Device 1 Device 2 Device 3 0.02 vs VDD1 vs VDD2 -75 -80 0.01 THD (dB) Nonlinearity (%) 3.75 -70 0.03 0 -85 -0.01 -90 -0.02 -95 -0.03 -55 -40 -25 -10 -100 5 20 35 50 65 Temperature (°C) 80 95 110 125 3 3.25 D025 –55°C ≤ TA < –40°C for AMC1300B only Figure 27. Nonlinearity vs Temperature 14 3.5 D023 3.5 3.75 4 4.25 4.5 VDDx (V) 4.75 5 5.25 5.5 D026 3 V ≤ VDD1 < 4.5 V for AMC1300B only Figure 28. Total Harmonic Distortion vs Supply Voltage Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 Typical Characteristics (continued) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) -70 10000 Noise Density (PV/—Hz) -75 THD (dB) -80 -85 -90 1000 100 Device 1 Device 2 Device 3 -95 -100 -55 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 10 0.1 95 110 125 1 10 Frequency (kHz) D027 100 1000 D028 –55°C ≤ TA < –40°C for AMC1300B only Figure 30. Input-Referred Noise Density vs Frequency 80 75 77.5 70 75 65 72.5 SNR (dB) SNR (dB) Figure 29. Total Harmonic Distortion vs Temperature 80 60 55 70 67.5 50 65 45 62.5 40 vs VDD1 vs VDD2 60 0 50 100 150 200 |VINP - VINN| (mV) 250 300 3 3.25 3.5 D029 3.75 4 4.25 4.5 VDDx (V) 4.75 5 5.25 5.5 D030 3 V ≤ VDD1 < 4.5 V for AMC1300B only Figure 31. Signal-to-Noise Ratio vs Input Voltage Figure 32. Signal-to-Noise Ratio vs Supply Voltage 0 80 77.5 -20 -40 72.5 PSRR (dB) SNR (dB) 75 70 67.5 -60 -80 65 Device 1 Device 2 Device 3 62.5 60 -55 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 -100 vs VDD2 vs VDD1 95 110 125 -120 0.001 D031 0.01 0.1 1 10 Ripple Frequency (kHz) 100 1000 D032 –55°C ≤ TA < –40°C for AMC1300B only Figure 33. Signal-to-Noise Ratio vs Temperature Figure 34. Power-Supply Rejection Ratio vs Ripple Frequency Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 15 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Typical Characteristics (continued) 1.49 1.49 1.48 1.48 1.47 1.47 1.46 1.46 1.45 1.45 VCMout (V) VCMout (V) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 1.44 1.43 1.44 1.43 1.42 1.42 1.41 1.41 1.4 1.4 1.39 3 3.25 3.5 3.75 4 4.25 4.5 VDD2 (V) 4.75 5 5.25 1.39 -55 -40 -25 -10 5.5 5 D033 20 35 50 65 Temperature (°C) 80 95 110 125 D034 –55°C ≤ TA < –40°C for AMC1300B only Figure 35. Output Common-Mode Voltage vs Low-Side Supply Voltage Figure 36. Output Common-Mode Voltage vs Temperature 340 340 AMC1300B AMC1300 320 300 BW (kHz) BW (kHz) 300 280 260 280 260 240 240 220 220 200 3 3.25 3.5 3.75 4 4.25 4.5 VDD2 (V) 4.75 5 5.25 200 -55 -40 -25 -10 5.5 20 35 50 65 Temperature (°C) 80 95 110 125 D036 Figure 38. Output Bandwidth vs Temperature 8.5 8.5 8 8 7.5 7.5 7 IDDx (mA) 7 IDDx (mA) 5 D035 Figure 37. Output Bandwidth vs Low-Side Supply Voltage 6.5 6 5.5 6.5 6 5.5 5 5 4.5 4.5 IDD1 vs VDD1 IDD2 vs VDD2 4 3 3.25 3.5 3.75 4 4.25 4.5 VDDx (V) 4.75 5 5.25 IDD1 IDD2 4 3.5 5.5 3.5 -55 -40 -25 -10 D037 3 V ≤ VDD1 < 4.5 V for AMC1300B only Figure 39. Supply Current vs Supply Voltage 16 AMC1300B AMC1300 320 5 20 35 50 65 Temperature (°C) 80 95 110 125 D038 –55°C ≤ TA < –40°C for AMC1300B only Figure 40. Supply Current vs Temperature Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 Typical Characteristics (continued) 4 4 3.5 3.5 3 3 2.5 2.5 tr/tf (Ps) tr / tf (Ps) at VDD1 = 5 V, VDD2 = 3.3 V, VINP = –250 mV to 250 mV, VINN = 0 V, and fIN = 10 kHz (unless otherwise noted) 2 2 1.5 1.5 1 1 0.5 0.5 0 3 3.25 3.5 3.75 4 4.25 4.5 VDD2 (V) 4.75 5 5.25 0 -55 -40 -25 -10 5.5 5 D039 20 35 50 65 Temperature (°C) 80 95 110 125 D040 –55°C ≤ TA < –40°C for AMC1300B only Figure 42. Output Rise and Fall Time vs Temperature 3.8 3.8 3.4 3.4 3 3 Signal Delay (Ps) Signal Delay (Ps) Figure 41. Output Rise and Fall Time vs Low-Side Supply 2.6 2.2 1.8 1.4 1 2.6 2.2 1.8 1.4 1 50% - 90% 50% - 50% 50% - 10% 0.6 50% - 90% 50% - 50% 50% - 10% 0.6 0.2 0.2 3 3.25 3.5 3.75 4 4.25 4.5 VDD2 (V) 4.75 5 5.25 3 5.5 3.25 3.5 3.75 4 D041 AMC1300 3.4 3.4 3 3 Signal Delay (Ps) Signal Delay (Ps) 3.8 2.6 2.2 1.8 1.4 1 5 20 35 50 65 Temperature (°C) 5.25 5.5 D042 80 95 50% - 90% 50% - 50% 50% - 10% 2.6 2.2 1.8 1.4 1 50% - 90% 50% - 50% 50% - 10% 0.6 -10 5 Figure 44. VIN to VOUT Signal Delay vs Low-Side Supply Voltage 3.8 -25 4.75 AMC1300B Figure 43. VIN to VOUT Signal Delay vs Low-Side Supply Voltage 0.2 -40 4.25 4.5 VDD2 (V) 0.6 110 125 0.2 -55 -40 -25 -10 D043 AMC1300 5 20 35 50 65 Temperature (°C) 80 95 110 125 D044 AMC1300B Figure 45. VIN to VOUT Signal Delay vs Temperature Figure 46. VIN to VOUT Signal Delay vs Temperature Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 17 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 8 Detailed Description 8.1 Overview The AMC1300 is a fully-differential, precision, isolated amplifier. The input stage of the device consists of a fullydifferential amplifier that drives a second-order, delta-sigma (ΔΣ) modulator. The modulator uses the internal voltage reference and clock generator to convert the analog input signal to a digital bitstream. The drivers (called TX in the Functional Block Diagram) transfer the output of the modulator across the isolation barrier that separates the high-side and low-side voltage domains. The received bitstream and clock are synchronized and processed, as shown in the Functional Block Diagram, by a fourth-order analog filter on the low-side and presented as a differential output of the device. The SiO2-based, double-capacitive isolation barrier supports a high level of magnetic field immunity, as described in ISO72x Digital Isolator Magnetic-Field Immunity. The digital modulation used in the AMC1300 and the isolation barrier characteristics result in high reliability and common-mode transient immunity. 8.2 Functional Block Diagram VDD2 VDD1 VDD1 Detection Reinforced Isolation Barrier Band-Gap Reference Band-Gap Reference INP û -Modulator Data TX RX Retiming and 4th-Order Active Low-Pass Filter INN VCM Diagnostic CLK RX TX OUTP OUTN Oscillator AMC1300x GND1 GND2 8.3 Feature Description 8.3.1 Analog Input The differential amplifier input stage of the AMC1300 feeds a second-order, switched-capacitor, feed-forward ΔΣ modulator. The gain of the differential amplifier is set by internal precision resistors to a factor of 4 with a differential input impedance of 22 kΩ. The modulator converts the analog signal into a bitstream that is transferred over the isolation barrier, as described in the Isolation Channel Signal Transmission section. There are two restrictions on the analog input signals (VINP and VINN). First, if the input voltage exceeds the range GND1 – 6 V to VDD1 + 0.5 V, the input current must be limited to 10 mA because the device input electrostatic discharge (ESD) diodes turn on. In addition, the linearity and noise performance of the device are ensured only when the analog input voltage remains within the specified linear full-scale range (FSR) and within the specified common-mode input voltage range. 18 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 Feature Description (continued) 8.3.2 Isolation Channel Signal Transmission The AMC1300 uses an on-off keying (OOK) modulation scheme to transmit the modulator output bitstream across the SiO2-based isolation barrier. As shown in Figure 47, the transmitter modulates the bitstream at TX IN with an internally-generated, high-frequency carrier across the isolation barrier to represent a digital one and does not send a signal to represent the digital zero. The nominal frequency of the carrier used inside the AMC1300 is 480 MHz. The receiver demodulates the signal after advanced signal conditioning and produces the output. The AMC1300 also incorporates advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions caused by the high-frequency carrier and IO buffer switching. Transmitter Receiver OOK Modulation TX IN TX Signal Conditioning SiO2-Based Capacitive Reinforced Isolation Barrier RX Signal Conditioning Envelope Detection RX OUT Oscillator Figure 47. Block Diagram of an Isolation Channel Figure 48 shows the concept of the OOK scheme. TX IN Carrier Signal Across the Isolation Barrier RX OUT Figure 48. OOK-Based Modulation Scheme Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 19 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Feature Description (continued) 8.3.3 Fail-Safe Output The AMC1300 offers a fail-safe output that simplifies diagnostics on a system level. The fail-safe output is active in two cases: • When the high-side supply VDD1 of the AMC1300 is missing, or • When the common-mode input voltage, that is VCM = (VINP + VINN) / 2, exceeds the minimum common-mode overvoltage detection level VCMov of VDD1 – 2 V. Figure 49 and Figure 50 show the fail-safe output of the AMC1300 as a negative differential output voltage value that does not occur under normal device operation. Use the VFAILSAFE voltage specified in the Electrical Characteristics table as a reference value for the fail-safe detection on a system level. Figure 49. Typical Negative Clipping Output of the AMC1300 Figure 50. Typical Fail-Safe Output of the AMC1300 8.4 Device Functional Modes The AMC1300 is operational when the power supplies VDD1 and VDD2 are applied, as specified in the Recommended Operating Conditions table. 20 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The low input voltage range, very low nonlinearity, and temperature drift make the AMC1300 a high-performance solution for industrial applications where shunt-based current sensing with high common-mode voltage levels is required. 9.2 Typical Application Isolated amplifiers are widely used in frequency inverters, which are critical parts of industrial motor drives, photovoltaic inverters, uninterruptible power supplies, and other industrial applications. The input structure of the AMC1300 is optimized for use with low-value shunt resistors in current sensing applications. Figure 51 depicts a typical operation of the AMC1300 for current sensing in a frequency inverter application. Phase current measurement is accomplished through the shunt resistors, RSHUNT (in this case, a two-pin shunt). The differential input and the high common-mode transient immunity of the AMC1300 ensure reliable and accurate operation even in high-noise environments (such as the power stage of the motor drive). The highimpedance input and wide input voltage range make the AMC1311 suitable for DC bus voltage sensing. +VBUS Motor RSHUNT L1 RSHUNT L2 RSHUNT L3 3.3 V RFLT AMC1300B VDD1 INP OUTP INN OUTN GND1 GND2 CFLT RFLT 3.3 V VDD2 Analog Filter to ADC -VBUS 3.3 V RFLT AMC1300B VDD1 INP OUTP INN OUTN GND1 GND2 CFLT RFLT 3.3 V RFLT AMC1300B VDD1 VDD2 INP OUTP INN OUTN GND1 GND2 CFLT RFLT 3.3 V RFLT CFLT AMC1311B VDD1 Analog Filter to ADC 3.3 V Analog Filter to ADC 3.3 V VDD2 VIN VOUTP SHTDN VOUTN GND1 3.3 V VDD2 Analog Filter to ADC GND2 Figure 51. Using the AMC1300B for Current Sensing in Frequency Inverters Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 21 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com Typical Application (continued) 9.2.1 Design Requirements Table 1 lists the parameters for this typical application. Table 1. Design Requirements PARAMETER VALUE High-side supply voltage 3.3 V or 5 V Low-side supply voltage 3.3 V or 5 V Voltage drop across the shunt for a linear response ± 250 mV (maximum) Signal delay (50% VIN to 90% OUTP, OUTN) 3 µs (maximum) 9.2.2 Detailed Design Procedure The high-side power supply (VDD1) for the AMC1300 is derived from the power supply of the upper gate driver. Further details are provided in the Power Supply Recommendations section. The floating ground reference (GND1) is derived from one of the ends of the shunt resistor that is connected to the negative input of the AMC1300 (INN). If a four-pin shunt is used, the inputs of the AMC1300 device are connected to the inner leads and GND1 is connected to one of the outer shunt leads. Use Ohm's Law to calculate the voltage drop across the shunt resistor (VSHUNT) for the desired measured current: VSHUNT = I × RSHUNT. Consider the following two restrictions to choose the proper value of the shunt resistor RSHUNT: • The voltage drop caused by the nominal current range must not exceed the recommended differential input voltage range: VSHUNT ≤ ± 250 mV • The voltage drop caused by the maximum allowed overcurrent must not exceed the input voltage that causes a clipping output: VSHUNT ≤ VClipping For systems using single-ended input ADCs, Figure 52 shows an example of a TLV6001-based signal conversion and filter circuit as used on the AMC1311EVM. Tailor the bandwidth of this filter stage to the bandwidth requirement of the system and use NP0-type capacitors for best performance. AMC1300 VCMADC VDD1 VDD2 INP OUTP + INN OUTN ± GND1 GND2 TLV6001 To ADC GND2 Figure 52. Connecting the AMC1300 Output to a Single-Ended Input ADC For more information on the general procedure to design the filtering and driving stages of SAR ADCs, see 18Bit, 1MSPS Data Acquisition Block (DAQ) Optimized for Lowest Distortion and Noise and 18-Bit Data Acquisition Block (DAQ) Optimized for Lowest Power, available for download at www.ti.com. 22 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 9.2.3 Application Curves In frequency inverter applications, the power switches must be protected in case of an overcurrent condition. To allow for fast powering off of the system, a low delay caused by the isolated amplifier is required. Figure 53 shows the typical full-scale step response of the AMC1300. Consider the delay of the required window comparator and the MCU to calculate the overall response time of the system. VIN VOUTP VOUTN Figure 53. Step Response of the AMC1300 The high linearity and low temperature drift of offset and gain errors of the AMC1300, as shown in Figure 54, allow design of motor drives with low torque ripple. 0.03 0.025 0.02 Nonlinearity (%) 0.015 0.01 0.005 0 -0.005 -0.01 -0.015 -0.02 -0.025 -0.03 -250 -200 -150 -100 -50 0 50 100 150 Differential Input Voltage (mV) 200 250 D023 Figure 54. Typical Nonlinearity of the AMC1300 9.3 Do's and Don'ts Do not leave the inputs of the AMC1300 unconnected (floating) when the device is powered up. If both device inputs are left floating, the input bias current drives these inputs to the output common-mode of the analog frontend of approximately 2 V. If the high-side supply voltage VDD1 is below 4 V, the internal common-mode overvoltage detector turns on and the output functions as described in the Fail-Safe Output section, which may lead to an undesired reaction on the system level. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 23 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 10 Power Supply Recommendations In a typical frequency inverter application, the high-side power supply (VDD1) for the device is directly derived from the floating power supply of the upper gate driver. For lowest system-level cost, a Zener diode can be used to limit the voltage to 5 V or 3.3 V (for AMC1300B only) ± 10%. Alternatively, a low-cost low-dropout (LDO) regulator (for example, the LM317-N) may be used to minimize noise on the power supply. TI recommends a low-ESR decoupling capacitor of 0.1 µF to filter this power-supply path. Place this capacitor (C2 in Figure 55) as close as possible to the VDD1 pin of the AMC1300 for best performance. If better filtering is required, an additional 2.2-µF capacitor may be used. The floating ground reference (GND1) is derived from the end of the shunt resistor, which is connected to the negative input (INN) of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads, and GND1 is connected to one of the outer leads of the shunt. To decouple the low-side power supply on the controller side, use a 0.1-µF capacitor placed as close to the VDD2 pin of the AMC1300 as possible, followed by an additional capacitor from 1 µF to 10 µF. R1 800 Gate Driver Z1 1N751A C1 2.2 F AMC1300 5.1 V GND1 RSHUNT RFLT INN To Load RFLT CFLT INP 3.3 V or 5.0 V VDD2 VDD1 C2 0.1 F Reinforced Isolation HV+ Floating Power Supply 20 V C4 0.1 F C5 2.2 F GND2 OUTP OUTN ADS7054 14-Bit ADC Gate Driver HV- Figure 55. Zener-Diode-Based, High-Side Power Supply 24 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 11 Layout 11.1 Layout Guidelines Figure 56 shows a layout recommendation with the critical placement of the decoupling capacitors (as close as possible to the AMC1300 supply pins) and placement of the other components required by the device. For best performance, place the shunt resistor close to the INP and INN inputs of the AMC1300 and keep the layout of both connections symmetrical. 11.2 Layout Example Clearance area, to be kept free of any conductive materials. To Floating Power Supply Shunt Resistor RFLT SMD 0603 RFLT SMD 0603 2.2 µF 0.1 µF 0.1 µF 2.2 µF SMD 0603 SMD 0603 SMD 0603 SMD 0603 VDD1 VDD2 INP OUTP CFLT SMD 0603 To Filter or ADC AMC1300 INN OUTN GND1 GND2 LEGEND Copper Pour and Traces High-Side Area Low-Side Area Via to Ground Plane Via to Supply Plane Figure 56. Recommended Layout of the AMC1300 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 25 AMC1300, AMC1300B SBAS895 – MAY 2018 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see the following: • Isolation Glossary • Dual, 1MSPS, 16-/14-/12-Bit, 4×2 or 2×2 Channel, Simultaneous Sampling Analog-to-Digital Converter • Semiconductor and IC Package Thermal Metrics • ISO72x Digital Isolator Magnetic-Field Immunity • AMC1311x High-Impedance, 2-V Input, Reinforced Isolated Amplifier • TLV600x Low-Power, Rail-to-Rail In/Out, 1-MHz Operational Amplifier for Cost-Sensitive Systems • AMC1311EVM Users Guide • 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Distortion and Noise • 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Power • LM117, LM317-N Wide Temperature Three-Pin Adjustable Regulator • SN6501 Transformer Driver for Isolated Power Supplies • High-Bandwidth Phase Current and DC-Link Voltage Sensing Reference Design for Three-Phase Inverters • Three-Phase Inverter Reference Design Using Gate Driver With Built-in Dead Time Insertion • High Accuracy Analog Front End Using 16-Bit SAR ADC with ±10V Measurement Range Reference Design • 2kW, 48V to 400V, >93% Efficiency, Isolated Bidirectional DC-DC Converter Reference Design for UPS • Reference Design for Reinforced Isolation 3-Phase Inverter with Current, Voltage and Temp Protection • Shunt-Based High Current Measurement (200-A) Reference Design with Reinforced Isolation Amplifier • High Accuracy ±0.5% Current and Isolated Voltage Measurement Ref Design Using 24-Bit Delta-Sigma ADC • Shunt-Based 200A Peak Current Measurement Reference Design Using Isolation Amplifier 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 2. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY AMC1300 Click here Click here Click here Click here Click here AMC1300B Click here Click here Click here Click here Click here 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 26 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 AMC1300, AMC1300B www.ti.com SBAS895 – MAY 2018 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Product Folder Links: AMC1300 27 PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AMC1300BDWV ACTIVE SOIC DWV 8 64 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 AMC1300B AMC1300BDWVR ACTIVE SOIC DWV 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -55 to 125 AMC1300B AMC1300DWV ACTIVE SOIC DWV 8 64 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 105 AMC1300 AMC1300DWVR ACTIVE SOIC DWV 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 105 AMC1300 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2018 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 27-May-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant AMC1300BDWVR SOIC DWV 8 1000 330.0 16.4 12.05 6.15 3.3 16.0 16.0 Q1 AMC1300DWVR SOIC DWV 8 1000 330.0 16.4 12.05 6.15 3.3 16.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 27-May-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AMC1300BDWVR SOIC DWV 8 1000 350.0 350.0 43.0 AMC1300DWVR SOIC DWV 8 1000 350.0 350.0 43.0 Pack Materials-Page 2 PACKAGE OUTLINE DWV0008A SOIC - 2.8 mm max height SCALE 2.000 SOIC C SEATING PLANE 11.5 0.25 TYP PIN 1 ID AREA 0.1 C 6X 1.27 8 1 2X 3.81 5.95 5.75 NOTE 3 4 5 0.51 0.31 0.25 C A 8X A 7.6 7.4 NOTE 4 B B 2.8 MAX 0.33 TYP 0.13 SEE DETAIL A (2.286) 0.25 GAGE PLANE 0 -8 0.46 0.36 1.0 0.5 (2) DETAIL A TYPICAL 4218796/A 09/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. www.ti.com EXAMPLE BOARD LAYOUT DWV0008A SOIC - 2.8 mm max height SOIC 8X (1.8) SEE DETAILS SYMM 8X (0.6) SYMM 6X (1.27) (10.9) LAND PATTERN EXAMPLE 9.1 mm NOMINAL CLEARANCE/CREEPAGE SCALE:6X METAL SOLDER MASK OPENING SOLDER MASK OPENING 0.07 MAX ALL AROUND METAL 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4218796/A 09/2013 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DWV0008A SOIC - 2.8 mm max height SOIC 8X (1.8) SYMM 8X (0.6) SYMM 6X (1.27) (10.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4218796/A 09/2013 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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