MC74HC574A Octal 3-State Noninverting D Flip-Flop High−Performance Silicon−Gate CMOS The MC74HC574A is identical in pinout to the LS574. The device inputs are compatible with standard CMOS outputs; with pull−up resistors, they are compatible with LSTTL outputs. Data meeting the set−up time is clocked to the outputs with the rising edge of the Clock. The Output Enable input does not affect the states of the flip−flops but when Output Enable is high, all device outputs are forced to the high−impedance state. Thus, data may be stored even when the outputs are not enabled. The HC574A is identical in function to the HC374A but has the flip−flop inputs on the opposite side of the package from the outputs to facilitate PC board layout. Features • • • • • • • http://onsemi.com MARKING DIAGRAMS 20 1 MC74HC574AN AWLYYWWG 1 20 SOIC−20 DW SUFFIX CASE 751D 20 Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA In Compliance with the Requirements Defined by JEDEC Standard No. 7 A Chip Complexity: 266 FETs or 66.5 Equivalent Gates These Devices are Pb−Free and are RoHS Compliant 20 PDIP−20 N SUFFIX CASE 738 1 HC574A AWLYYWWG 1 20 HC 574A ALYWG G TSSOP−20 DT SUFFIX CASE 948E 20 1 1 20 SOEIAJ−20 F SUFFIX CASE 967 1 20 1 A WL, L YY, Y WW, W G or G 74HC574A AWLYWWG = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 13 1 Publication Order Number: MC74HC574A/D MC74HC574A OUTPUT ENABLE D0 1 20 VCC 2 19 Q0 D1 3 18 Q1 D2 4 17 Q2 D3 5 16 Q3 OE L L L H FUNCTION TABLE Inputs D4 6 15 Q4 D5 7 14 Q5 D6 8 13 Q6 D7 9 12 Q7 10 11 CLOCK GND D Q L,H, X H L X X H L No Change Z X = Don’t Care Z = High Impedance Figure 1. Pin Assignment D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 CLOCK OUTPUT ENABLE 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 Q0 Q1 Q2 Q3 Q4 NONINVERTING OUTPUTS Q5 Q6 Q7 11 PIN 20 = VCC PIN 10 = GND 1 Figure 2. Logic Diagram ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Design Criteria Value Units Internal Gate Count* 66.5 ea. Internal Gate Propagation Delay 1.5 ns Internal Gate Power Dissipation 5.0 mW 0.0075 pJ Speed Power Product *Equivalent to a two−input NAND gate. http://onsemi.com 2 Output Clock MC74HC574A MAXIMUM RATINGS Symbol VCC Parameter Value Unit *0.5 to )7.0 V *0.5 to VCC )0.5 V *0.5 to VCC )0.5 V DC Supply Voltage VI DC Input Voltage VO DC Output Voltage (Note 1) IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $35 mA IO DC Output Sink Current $35 mA ICC DC Supply Current per Supply Pin $75 mA IGND DC Ground Current per Ground Pin $75 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85_C MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup _C _C PDIP SOIC TSSOP 67 96 128 _C/W PDIP SOIC TSSOP 750 500 450 mW Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance 260 )150 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) >4000 >300 >1000 V Above VCC and Below GND at 85_C (Note 5) $300 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI, VO Parameter Min Max Unit DC Supply Voltage (Referenced to GND) 2.0 6.0 V DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V *55 )125 _C 0 0 0 1000 500 400 ns TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 3) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 3 MC74HC574A ORDERING INFORMATION Package Shipping† PDIP−20 (Pb−Free) 18 Units / Box MC74HC574ADWG SOIC−20 WIDE (Pb−Free) 38 Units / Rail MC74HC574ADWR2G SOIC−20 WIDE (Pb−Free) 1000 Tape & Reel MC74HC574ADTR2G TSSOP−20* 2500 Tape & Reel MC74HC574AFG SOEIAJ−20 (Pb−Free) 40 Units / Rail MC74HC574AFELG SOEIAJ−20 (Pb−Free) 2000 Tape & Reel Device MC74HC574ANG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC V Guaranteed Limit ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter Test Conditions *55 to 25_C v85_C v125_C Unit VIH Minimum High−Level Input Voltage Vout = VCC – 0.1 V |Iout| v 20 mA 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 V VIL Maximum Low−Level Input Voltage Vout = 0.1 V |Iout| v 20 mA 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 V VOH Minimum High−Level Output Voltage Vin = VIH |Iout| v 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V VOH Minimum High−Level Output Voltage Vin = VIH 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.2 3.7 5.2 V VOL Maximum Low−Level Output Voltage Vin = VIL |Iout| v 20 mA 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.4 0.4 0.4 |Iout| v 2.4 mA |Iout| v 6.0 mA |Iout| v 7.8 mA Vin = VIL |Iout| v 2.4 mA |Iout| v 6.0 mA |Iout| v 7.8 mA Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 $0.1 $1.0 $1.0 mA IOZ Maximum Three−State Leakage Current Output in High−Impedance State Vin = VIL or VIH Vout = VCC or GND 6.0 $0.5 $5.0 $10 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 mA 6.0 4.0 40 160 mA http://onsemi.com 4 MC74HC574A AC ELECTRICAL CHARACTERISTICS (CL = 50 pF; Input tr = tf = 6.0 ns) VCC V Guaranteed Limit ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter *55 to 25_C v85_C v125_C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 3 and 6) 2.0 3.0 4.5 6.0 6.0 15 30 35 4.8 10 24 28 4.0 8.0 20 24 MHz tPLH, tPHL Maximum Propagation Delay, Clock to Q (Figures 3 and 6) 2.0 3.0 4.5 6.0 160 105 32 27 200 145 40 34 240 190 48 41 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Q (Figures 4 and 7) 2.0 3.0 4.5 6.0 150 100 30 26 190 125 38 33 225 150 45 38 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to Q (Figures 4 and 7) 2.0 3.0 4.5 60 140 90 28 24 175 120 35 30 210 140 42 36 ns tTLH, tTHL Maximum Output Transition Time, any Output (Figures 3 and 6) 2.0 3.0 4.5 6.0 60 27 12 10 75 32 15 13 90 36 18 15 ns Cin Maximum Input Capacitance 10 10 10 pF Cout Maximum Three−State Output Capacitance, Output in High−Impedance State 15 15 15 pF CPD Power Dissipation Capacitance (Per Enabled Output)* Typical @ 25°C, VCC = 5.0 V 24 pF *Used to determine the no−load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . TIMING REQUIREMENTS (CL = 50 pF; Input tr = tf = 6.0 ns) Guaranteed Limit VCC – 55 to 25_C v 85_C v 125_C ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter Figure Volts Min Max Min Max Min Max Unit tsu Minimum Setup Time, Data to Clock 5 2.0 3.0 4.6 6.0 50 40 10 9.0 65 50 13 11 75 60 15 13 ns th Minimum Hold Time, Clock to Data 5 2.0 3.0 4.5 6.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ns tw Minimum Pulse Width, Clock 3 2.0 3.0 4.5 6.0 75 60 15 13 95 80 19 16 110 90 22 19 ns Maximum Input Rise and Fall Times 3 2.0 3.0 4.5 6.0 tr, tf http://onsemi.com 5 1000 800 500 400 1000 800 500 400 1000 800 500 400 ns MC74HC574A tr CLOCK SWITCHING WAVEFORMS tf VCC 90% 50% 10% tw OUTPUT ENABLE GND 1/fmax tPLH Q VCC VM 90% 50% 10% tPLZ tPZH tPHZ GND HIGH IMPEDANCE VM Q tPHL tPZL Q tTLH 10% VOL 90% VOH MC74HC574A: VM = VOH x 0.5 MC74HCT574A: VM = 1.3 V @ VCC = 3 V tTHL Figure 3. Figure 4. TEST POINT OUTPUT VALID DATA VCC 50% tsu DEVICE UNDER TEST GND th CL * VCC CLOCK 50% GND *Includes all probe and jig capacitance. Figure 5. Figure 6. D0 D1 D2 TEST POINT OUTPUT DEVICE UNDER TEST 1 kW CL * D3 CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. D4 D5 *Includes all probe and jig capacitance. D6 2 C Q D 19 3 C Q D 18 4 C Q D 17 5 C Q D 16 6 C Q D 15 7 C Q D 14 8 C Q D 13 9 C Q D 12 Figure 7. Test Circuit D7 CLOCK OUTPUT ENABLE 11 1 Figure 8. Expanded Logic Diagram http://onsemi.com 6 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 MC74HC574A PACKAGE DIMENSIONS PDIP−20 N SUFFIX CASE 738−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. −A− 20 11 1 10 B L C −T− K SEATING PLANE M N E G F J D 20 PL 20 PL 0.25 (0.010) 0.25 (0.010) M T A M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 M SOIC−20 DW SUFFIX CASE 751D−05 ISSUE G A 20 11 X 45 _ E h 1 10 20X B B 0.25 M T A S B S A L H M 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q B M D 18X e A1 SEATING PLANE C T http://onsemi.com 7 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC74HC574A PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B −U− PIN 1 IDENT 1 SECTION N−N 0.25 (0.010) N 10 M 0.15 (0.006) T U S N A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 8 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC574A PACKAGE DIMENSIONS SOEIAJ−20 F SUFFIX CASE 967−01 ISSUE A 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.032 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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