TI1 LM9070SX/NOPB Low-dropout system voltage regulator Datasheet

LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
LM9070 Low-Dropout System Voltage Regulator with Keep-Alive ON/OFF Control
Check for Samples: LM9070
FEATURES
DESCRIPTION
•
•
•
•
The LM9070 is a 5V, 3% accurate, 250 mA lowdropout voltage regulator. The regulator features an
active low delayed reset output flag which can be
used to reset a microprocessor system on turn-ON
and in the event that the regulator output falls out of
regulation for any reason. An external capacitor
programs a delay time interval before the reset output
can return high.
1
2
•
•
•
•
•
•
•
•
•
•
Automotive Application Reliability
3% Output Voltage Tolerance
Insensitive to Radiated RFI
Dropout Voltage Less than 800 mV with 250
mA Output Current
Externally Programmed Reset Delay Interval
Keep-Alive Feature with 2 Logic Control Inputs
60V Load Dump Transient Protection
Thermal Shutdown
Short Circuit Protection and Disable Safety
Features
Reverse Battery Protection
Low OFF Quiescent Current, 50 μA Maximum
Wide Operating Temperature Range −40°C to
+125°C
TO-263 and 20-Pin Power Surface Mount
Packages
Lead Form Compatible with TLE4267 TO-220
Regulator
Designed for automotive application the
contains a variety of protection features
reverse battery, over-voltage shutdown,
shutdown, input transient protection and
operating temperature range.
LM9070
such as
thermal
a wide
A unique two-input logic control scheme is used to
enable or disable the regulator output. An ON/OFF
input can be provided by an ignition switch derived
signal while a second, Keep-Alive input, is generated
by a system controller. This allows for a system to
remain ON after ignition has been switched OFF. The
system controller can then execute a power-down
routine and after which command the regulator OFF
to a low quiescent current state (60 μA max).
Design techniques have been employed to allow the
regulator to remain operational and not generate false
reset signals when subjected to high levels of RF
energy (300V/m from 2 MHz to 400 MHz).
Connection Diagrams and Ordering Information
Backside metal is internally connected to ground.
Figure 1. 7 Lead TO-263 (Top View)
Package Number KTW0007B
Figure 2. 20-Pin SOIC Package
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Tab is internally connected to ground.
Tab is internally connected to ground.
Figure 3. 7-Lead TO-220 Package
(Odd numbered pins bent forward away from
package body)
Figure 4. 7-Lead TO-220 Package
(Even numbered pins bent forward away from
package body)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Input Voltage, DC
−26V to +40V
ON/OFF, Keep-Alive Inputs
(through 1kΩ)
−26V to +26V
Positive Input Transient (t<100 ms)
60V
−50V
Negative Input Transient (t<1 ms)
Reset Output Sink Current
5 mA
Power Dissipation
Internally Limited
Junction Temperature
ESD Susceptibility
150°C
(2)
12 kV, 2 kV
Lead Temperature
(Soldering, 10 seconds)
260°C
−50°C to +150°C
Storage Temperature
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
All pins will survive an ESD impulse of ±2000V using the human body model of 100 pF discharged through a 1.5 kΩ resistor. In addition,
input pins VIN and the ON/OFF input will withstand ten pulses of ±12 kV from a 150 pF capacitor discharged through a 560Ω resistor
with each pin bypassed with a 22 nF, 100V capacitor.
Operating Ratings
(1)
Input Voltage
6V to 26V
−40°C to +125°C
Ambient Temperature
TO-220 Thermal Resistance, θJ-C
3°C/W
(2)
73°C/W
TO-263 Thermal Resistance, θJ-A (3)
80°C/W
SO20 Thermal Resistance, θJ-PINS
25°C/W
SO20 Thermal Resistance, θJ-A
85°C/W
TO-220 Thermal Resistance, θJ-A
TO-263 Thermal Resistance, θJ-C
(1)
(2)
(3)
2
3°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal
shutdown. The θJ-A value for the TO-220 package (still air, no additional heat sink) is 73°C/W. The effective θJ-A value of the TO-220
package can be reduced by using conventional heat sink methods.
Exceeding the Maximum Allowable power dissipation will cause excessive die temperature, and the device will go into thermal
shutdown. The θJ-A value for the TO-263 package (still air, no additional heat sink) is 80°C/W. The effective θJ-A value of the TO-263
package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4
mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will
reduce θJ-Ato 37°C/W, ad an area of 1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the
copper clad area should be increased by at least 50% to maintain a similar θJ-A rating.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
Electrical Characteristics
(1)
The following specifications apply for VCC= 6V to 26V, −40°C ≤ TA≤ 125°C, unless otherwise specified. COUT=47µF with an
ESR < 3Ω. CIN= 1µF.
Symbol
Parameter
Conditions
Min
Max
4.85
Units
REGULATOR OUTPUT
VOUT
Output Voltage
5 mA ≤ IOUT ≤ 250 mA
5.15
V
ΔVOUT Line
Line Regulation
IOUT = 5 mA, 9V ≤ VIN ≤ 16.5V
IOUT = 5 mA, 6V ≤ VIN ≤ 26V
25
50
mV
mV
ΔVOUT Load
Load Regulation
VIN = 14.4V, 5 mA ≤ IOUT ≤ 250 mA
50
mV
Iq
Quiescent Current
VON/OFF ≤ VIN
4
25
10
50
mA
mA
mA
mA
−40°C ≤ TJ ≤ 60°C
60°C ≤ TJ ≤ 135°C
20
60
μA
µA
300
800
mV
mV
1.5
A
IOUT = 5 mA
IOUT = 250 mA, VIN ≥ 8V
IOUT = 5 mA, VIN = 5V
IOUT = 250 mA, VIN = 6V
Ioff
OFF Quiescent Current
VIN ≤ 16.5V, Regulator OFF
Vdo
Dropout Voltage
IOUT = 5 mA
IOUT = 250 mA
Isc
Short Circuit Current
RL = 1Ω
PSRR
Ripple Rejection
VIN = (14VDC) + 1VRMS @ 120HZ)
VothOFF
Safety VOUT Latch-OFF Threshold
OVthr
Overvoltage Shutdown Threshold
Vo Transient
VOUT during Transients
VIN Peak ≤ 60V,
RL = 100Ω, τ = 100 ms
Threshold Voltage
ΔVOUT Required to Generate a Reset
Output
4.85V ≤ VOUT ≤ 5.15V
IOUT = 50 mA
0.4
60
dB
In Keep-Alive mode
VON/OFF = 0V, VKA = 0V
4
4.5
27
V
V
7
V
−500
mV
Isink = 1.6 mA, VOUT > 3.2V
0.4
V
1.4V ≤ VOUT ≤ 3.2V
0.8
V
RESET OUTPUT
Vth
Vlow
Reset Output Low Voltage
Vhigh
Reset Output High Voltage
tDELAY
Delay Time
IDELAY
Rpu
−300
0.9 VOUT
VOUT
V
7
31
ms
Charging Current for CDELAY
10
30
µA
Internal Pull-up Resistance
12
80
kΩ
CDELAY = 0.1µF
CONTROL LOGIC
VKAlow
Low Input Threshold Voltage,
Keep-Alive Input
3.5V ≤ VOUT ≤ 5.25V
0.3 VOUT
0.5 VOUT
V
VKAhigh
High Input Threshold Voltage,
Keep-Alive Input
3.5V ≤ VOUT ≤ 5.25V
0.6 VOUT
0.8 VOUT
V
VON/OFF low
Low Input Voltage, ON/OFF Input
Rseries = 1 kΩ
−2
2
V
VON/OFF high
High Input Voltage, ON/OFF Input
Rseries = 1 kΩ
4
26
V
ION/OFF
Input Current, ON/OFF Input
VON/OFF ≤ 4V
330
μA
4V < VON/OFF < 7V
670
μA
VON/OFF ≥ 7V
10
mA
RpuKA
Internal Pull-up Resistance, Keep-Alive 0V ≤ VIN ≤ 26V
Input
20
100
kΩ
RpdON/OFF
Internal Pull-down Resistance ON/OFF 0V ≤ VON/OFF ≤ 26V
Input
50
210
kΩ
(1)
Datasheet min/max specifications are ensured by design, test, and/or statistical analysis.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
3
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Reset Operation and Protection Features
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
Typical Performance Characteristics
(TA = 25°C unless indicated otherwise)
Turn ON Characteristics
Turn OFF Characteristics
Figure 5.
Figure 6.
Normalized Output Voltage
vs Temperature
Output Voltage at
Input Voltage Extremes
Figure 7.
Figure 8.
Quiescent Current vs
Input Voltage
Input Current vs
Input Voltage
Regulator Switched OFF
Figure 9.
Figure 10.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
5
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
(TA = 25°C unless indicated otherwise)
6
Dropout Voltage vs
Temperature
Reset Delay Time
vs Temperature
Figure 11.
Figure 12.
Short Circuit Current
vs Temperature
Output Capacitor ESR
Figure 13.
Figure 14.
Maximum Power Dissipation
(TO-220 Package)
Maximum Power Dissipation
(TO-263 and SO-20 Packages)
Figure 15.
Figure 16.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
ON/OFF, KEEP-ALIVE AND SAFETY LATCH-OFF CONTROL DIAGRAMS
Note: If Keep-Alive is provided by a microprocessor powered by the output voltage of the LM9070, the logic “1”
voltage level will track VOUT as the regulator turns OFF.
(Keep-Alive input must be high to turn OFF output)
Turn ON with ON/OFF control, Keep output biased with Keep-Alive
input, Turn OFF with Keep-Alive (Keep-Alive low keeps output ON,
Keep-Alive going high turns output OFF)
Figure 17. Simple ON/OFF control
Figure 18. Keep-Alive Mode
Keep output biased with Keep-Alive; Hold ouput ON with ON/OFF;
Turn OFF with ON/OFF input. (Temporary Keep-Alive Mode)
(ON/OFF going high required to turn Output back ON)
Figure 19. Switch ON with ON/OFF input
Figure 20. Safety Latch OFF of VOUT when in KeepAlive Mode
Control Logic Truth Table
ON/OFF
Input
Keep-Alive
Input
Output
Voltage
Reset
Output
L
X
0V
L
↑
X
5V
↑ after delay
H
X
5V
H
Normal ON condition
↓
H
0V
L
Output turns OFF
↓
L
5V
H
Output kept ON by Keep-Alive Input
↑
L
5V
H
Output remains ON (or turns ON)
H
X
ΔVOUT ≥ −300 mV
L
Output pulled out of regulation, reset flag generated
L
L
VOUT ≤ 4V
L
Output latches OFF
Operating Condition
Low quiescent current standby (OFF) condition
Output turns ON
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
7
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Block Diagram
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
APPLICATION INFORMATION
The LM9070 voltage regulator has been optimized for use in microprocessor based automotive systems. Several
unique design features have been incorporated to address many FMEA (Failure Mode Effects Analysis) concerns
for fail-safe system performance.
FAULT TOLERANT FEATURES
While not specifically ensured due to production testing limitations, the LM9070 has been tested and shown to
continue to provide a regulated output and, not generate an erroneous system reset signal while subjected to
high levels of RF electric field energy (up to 300 V/m signal strength over a 2 MHz to 400 MHz frequency range).
This is very important in vehicle safety related applications where the system must continue to operate normally.
To maintain this immunity to RFI the output bypass capacitor is important (47 μF is recommended).
This regulator is suitable for applications where continuous connection to the battery is required (Refer to the
Figure 21). ON/OFF control of the regulator and system can be accomplished by switching the ON/OFF input to
the battery or ignition supply VIN supply through a SPST switch. If this input becomes open circuited, an internal
pull-down resistor ensures that the regulator turns OFF. When the regulator is switched OFF the current load on
the battery drops to less than 60 μA. With the possibility in many applications for VIN and the ON/OFF input pins
to be connected in a system through long lengths of wire, the ESD protection of these pins has been increased
to 12 kV with the addition of small input bypass capacitors.
Figure 21. Typical Application Circuit
An output bypass capacitor of at least 10 μF is required for stability (47 μF is recommended). The ESR of this
capacitor should be less than 3Ω. An input capacitor of 1 μF or larger is recommended to improve line transient
and noise performance.
With the Keep-Alive input, a system microprocessor has the ability to keep the regulator ON (with a logic “0” on
Keep-Alive) after the ON/OFF input has been commanded OFF. A power-down sequence, when system
variables are typically stored in programmable memory, can be executed and take as much time as necessary.
At the end of the operation the micro then pulls Keep-Alive high and the regulator and system turn OFF and
revert to the low quiescent current standby mode.
For additional system reliability, consideration has been made for the possibility of a short circuited load at the
output of the regulator. When the regulator is switched ON, conventional current limiting and thermal shutdown
protect the regulator. When the regulator is switched OFF however, a grounded VCC supply to the micro (due to
the shorted regulator output) will force the Keep-Alive input to be low and thus try to maintain the Keep-Alive
mode of operation. With a shorted load, the drain on the battery could be as high as 1.5A. A separate internal
circuit monitors the output voltage of the regulator. If VOUT is less than 4V, as would be the case with a shorted
load, the Keep-Alive function is logically disabled to ensure that the regulator turns OFF and reverts to only a 50
μA load on the battery.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
9
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Figure 22. Control Logic Not Used
Conventional load dump protection is built in to withstand up to +60V and −50V transients. A 1 kΩ resistor in
series with the ON/OFF and Keep-Alive inputs are recommended to provide the same level of transient
protection for these pins if required. Protection against reverse polarity battery connections is also built in. With a
reversed battery the output of the LM9070 will not go more negative than one diode drop below ground. This will
prevent damage to any of the 5V load circuits.
For applications where the control logic is not required the logic pins should be configured as shown in Figure 22.
A separate device, called the LM9071, can be used. The LM9071 is available in a 5-lead TO-220 package and
does not provide control logic functions, but still retains all of the protection features of the LM9070.
RESET FLAG
Excessive loading of the output to the point where the output voltage drops by 300 mV to 500 mV will signal a
reset flag to the micro. This will warn of a VCC supply that may produce unpredictable operation of the system.
On power-up and recovery from a fault condition the delay capacitor is used to hold the micro in a reset condition
for a programmable time interval to allow the system operating voltages and
clock to stabilize before executing code. The typical delay time interval can be estimated using the following
equation:
(1)
INPUT STABILITY
Low dropout voltage regulators which utilize a PNP power transistor usually exhibit a large increase in current
when in dropout (VIN < 5.5V). This increase is caused by the saturation characteristics (β reduction) of the PNP
transistor. To significantly minimize this increase in current the LM9070 detects when the PNP enters saturation
and reduces the operating current.
This reduction in input current can create a stability problem in applications with higher load current (> 100 mA)
where the input voltage is applied through a long length of wire, which in effect adds a significant amount of
inductance in series with the input. The drop in input current may create a positive input voltage transient which
may take the PNP out of saturation. If the input voltage is held constant at the threshold where the PNP is going
in and out of saturation, an oscillation may be created.
This is only observed where significant series inductance is present in the input supply line and when the rise
and fall time of the input supply is very slow. If the application and removal of the input voltage changes at a rate
greater than 500 mV/μs, the input voltage moves through the dropout region of operation (VIN of 3V to 5.5V) too
quickly for an oscillation to be established.
MICROPROCESSOR SYSTEM REGULATOR WITH KEEP-ALIVE INTERVAL AT TURN-OFF
Figure 23 illustrates a system application circuit utilizing both of the logic control inputs of the LM9070. Closing
the ON/OFF switch powers ON the system. Once powered, the system controller sets the Keep-Alive line low.
The NPN transistor is used only to signal the controller that the ON/OFF switch has been opened and the system
is to be turned OFF. Upon detecting this high level at the ON/OFF Sense input line, the controller can then
perform a power down routine. The system will remain fully powered until the controller commands total shut
down by taking the Keep-Alive line high. The system then shuts OFF and reverts to a very low current drain
standby condition until switched back on.
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
Figure 23. System Application Circuit and Control Waveforms
THERMAL MANAGEMENT
The LM9070 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220
package. To obtain operation over the highest possible load current and input voltage ranges, care must be
taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold
above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the
TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil
area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce
the junction temperature of the device.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
11
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
The θJ-A value for the TO-263 package (still air, no additional heat sink) is rated at 80°C/W. The effective θJ-A
value of the TO-263 package can be reduced by increasing the printed circuit board area that is connected
(soldered) to the package tab. Using 1 ounce (1.4 mils thick) copper clad with no solder mask, an area of 0.5
square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will reduce θJ-Ato 37°C/W, and an area of
1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the copper clad area
under the solder mask should be increased by at least 50% to maintain a similar θJ-A rating.
The use of a double sided PC board with soldered filled vias between two planes of copper, as shown in
Figure 24, will improve thermal performance while optimizing the PC board surface area required. Using the
double sided PC board arrangement shown in Figure 24, with 1 ounce (1.4 mils thick) copper clad with no solder
mask and solder filled vias, an area of 0.5 square inches on both sides will reduce θJ-A to 43°C/W.
Figure 24. Typical TO-263 PC Board Heatsinking
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
13
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM9070S/NOPB
LIFEBUY
DDPAK/
TO-263
KTW
7
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM9070S
LM9070SX/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM9070S
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM9070SX/NOPB
Package Package Pins
Type Drawing
SPQ
DDPAK/
TO-263
500
KTW
7
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
24.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
14.85
5.0
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM9070SX/NOPB
DDPAK/TO-263
KTW
7
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
KTW0007B
TS7B (Rev E)
BOTTOM SIDE OF PACKAGE
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated