Class-AB Speaker Amplifiers 1W+1W Stereo Speaker / Headphone Amplifier BH7884EFV No.10077EAT06 ●Description The BH7884EFV is a low voltage, low noise, high output speaker and headphone amplifier drive, in which a Bi-CMOS process is used. This IC supports: headphone amplifier gain adjustment, active/suspend switching, speaker amplifier stereo/monaural switching, and amplifier mute switching. All functions are controllable from a microcontroller. Built-in digital noise reduction circuits eliminate digital noise and BEEP sounds. ●Features 1) Built-in 1W+1W stereo speaker amplifier (Vcc=5V, RL=8Ω, THD=10%) 2) Built-in stereo headphone amplifier 3) Built-in bass boost function for speaker amplifier 4) Built-in low noise VCA (electronic volume) for headphone 5) Built-in mute circuit 6) Built-in standby circuit 7) Low current consumption specifications (9 mA TYP. in ACTIVE mode, 0.2 μA TYP. in SUSPEND mode) ●Applications Notebook computers, LCD TVs, etc. ●Absolute maximum ratings(Ta=25℃) Parameter Ratings Unit +6.0 V 1100 *1 mW Storage temperature -55 ~ +125 ℃ Operating temperature -10 ~ +70 ℃ Supply voltage Power dissipation *1 Reduced by 11 mW/℃ at 25℃ or higher, when mounting on a 70mmX70mmX1.6mm PCB board). ●Operating Conditions (Ta=25℃) Parameter Supply voltage * Ratings Unit +3.0~+5.5 V This IC is not designed to be radiation-resistant. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/10 2010.06 - Rev.A Technical Note BH7884EFV ●Electrical characteristics (Unless otherwise noted, VCC=3.3V, Ta=25℃, f=1kHz) Limits Parameter Symbol Unit Min. Typ. Max. ■1 CHIP Condition Circuit current ACTV IA - 9.0 18.0 mA No signal ACTIVE Circuit current SPND Is - 0.2 10.0 µA No signal Voltage gain1 GSP1 9.0 12.0 15.0 dB SE, Vin=-18dBV,RL=8Ω Voltage gain2 GSP2 15.2 18.2 21.2 dB BTL, Vin=-18dBV Distortion DSP - 0.1 1.0 % BTL, Vin=-18dBV Maximum output level VOSP 2.2 5.2 - dBV BTL, DSP=1% Output noise level VNSP - -97 -80 dBV SE, DIN-Audio Cross talk CTSP - -90 -80 dBV SE, Vin=-18dBV, DIN-Audio Output level on mute MTSP - -102 -80 dBV BTL, Vin=-18dBV Voltage gain 3 GHP 2.6 5.6 8.6 dB VOL:MAX, RL=10kΩ,Vin=-12dBV Voltage gain 4 GHP -10 -7 -4 dB VOL:MAX, RL=32Ω,Vin=-12dBV Distortion DHP - 0.025 0.1 % VOL:MAX, RL=32Ω,Vin=-8dBV Variable width of volume ΔGHP 70 100 - dB VOL:MIN ~ MAX, RL=32Ω Maximum output level VOHP -2.0 1.0 - dBV VOL:MAX, DHP=1%, RL=10kΩ Output noise level VNHP - -98 -80 dBV VOL:MAX, RL=32Ω, DIN-Audio Cross talk CTHP - -98 -80 dBV Output level on mute MTHP - -110 -80 dBV VBP 0.8 1.25 - Vpp VBIAS 1.4 1.7 2.0 V ACTIVE mode V11H VCC-0.3 - VCC V SUSPEND mode V11L GND - 0.3 V SP/ON mode V2H VCC-0.3 - VCC V SP/OFF mode V2L GND - 0.3 V BASS-BOOST/ON mode V4H VCC-0.7 - VCC V BASS-BOOST/OFF mode V4L GND - 0.7 V STEREO mode V3H VCC-0.7 - VCC V MONO mode V3L GND - 0.7 V ACTIVE mode V10H VCC-0.7 - VCC V MUTE mode V10L GND - 0.7 V GPR - -64 - dBV SUSPEND ■SP AMP ■HP AMP VOL:MAX, RL=32Ω,Vin=-12dBV DIN-Audio VOL:MAX, RL=32Ω,Vin=-12dBV DIN-Audio ■BEEP AMP Output voltage level Vin=1.3dBV, f=1kHz, 20MHzLPF ■BIAS Output voltage level No Signal ■CTRL Active mode. Hold Voltage of 11pin. Suspend mode. Hold Voltage of 11pin. SP / ON mode. Hold Voltage of 2pin. SP/OFF mode. Hold Voltage of 2pin. SP / Bass Boost mode. Hold Voltage of 4pin. SP / Non Boost mode. Hold Voltage of 4pin. SP / STEREO mode. Hold Voltage of 3pin. SP / MONO mode. Hold Voltage of 3pin. HP / Active mode. Hold Voltage of 10pin. HP / MUTE mode. Hold Voltage of 10pin. ■PSRR Ripple rejection ratio www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/10 f=100Hz, 0.3Vpp, SIN Input SPOUT monitor, DIN-Audio 2010.06 - Rev.A Technical Note BH7884EFV ●Block diagram Fig.1 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/10 2010.06 - Rev.A Technical Note BH7884EFV ●Control pin settings SP MUTE PIN:2PIN H SP ACTIVE L SP MUTE SPAMP is in active state SPAMP is in suspend state STEREO/MONO PIN:3PIN H STEREO L MONO For SPAMP, LCH and RCH both are in active state For SPAMP, LCH is in active state and RCH is in suspend state BASSBOOST PIN:4PIN H BASS BOOST For SPAMP, bass is boosted L NON -BOOST For SPAMP, bass is not boosted MUTE PIN:10PIN (The SPAMP mute function is realized by connecting HP_OUT to SP_IN) H ACTIVE HPAMP is in active state L MUTE HPAMP is in mute state SUSPEND PIN:11PIN H ACTIVE The IC is in active state L SUSPEND The IC is in suspend state www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/10 2010.06 - Rev.A Technical Note BH7884EFV ●Equivalent circuit PIN1 SP_IN_LCH PIN2 SP_MUTE 100k PIN5 LINE_IN_LCH PIN6 50 ST/MN 100k BIAS 50k PIN3 100k PIN7 PIN4 100k 100k BEEP_IN HP_VOL PIN10 100k PIN8 LIHE_IN_RCH 47k 16k 50 100k 27k 60k 35k PIN9 BASS BOOST HP_MUTE PIN11 100k SUSPEND 100k PIN12 SP_IN_RCH 100k 100k 100k 1k 100k PIN13 HP_OUT_RCH PIN14 VCC_RCH PIN15 40k 25k 12 7.5k www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. BOOST_R_RCH 5/10 40k 16 15 PIN16 SPOUT1_RCH 25k 7.5k 2010.06 - Rev.A Technical Note BH7884EFV PIN17 PIN21 SPOUT2_RCH PIN18 GND_RCH PIN19 GND_LCH PIN20 SPOUT2_LCH 25k 25k 7.5k 7.5k SPOUT1_LCH PIN22 25k 7.5k BOOST_R_LCH 40k 1 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 40k PIN23 21 VCC_LCH PIN24 HP_OUT_LCH 30k 22 7.5k 6/10 2010.06 - Rev.A Technical Note BH7884EFV ●Application circuit Fig.2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/10 2010.06 - Rev.A Technical Note BH7884EFV ●Description of operations 1) LINEIN (5,8PIN) ~ HPOUT (13,24PIN) voltage gain The voltage gain at EVRMAX is generally calculated by the following equation: 40k GHP = 20 × log （dB） R5(or R8) The above gain attenuates according to the DC voltage of the VOL pin (9PIN). By connecting multiple resistances (R), mixing input can be handled. 2) BEEPIN (7PIN) ~ HPOUT (13,24PIN) When a pulse waveform is input at the BEEPIN pin, a pulse wave is output at HPOUT (24,13PIN). The output level, determined by the resistance of 7PIN, has default values as follows: HP OUT level Vcc=5V Vcc=4V Vcc=3.3V 1Vpp< <56k <91k <120k 0.5Vpp 68k 110k 160k 0.25Vpp 75k 130k 200k *(Unit: Ω) To obtain the default setting output (approx. 1.2 Vpp output), make R7=10 kΩ. The variation in output levels is small. Signals below a certain level are determined to be noise, by IC internals, and are not output at HPOUT. 3) SP IN (1,12PIN) ~ SP OUT (21, 20, 16,17PIN) voltage gain The voltage gain in BASSBOOST is generally calculated by the following equation: 40k + R21-20(or R16-15) (dB) R1(or R12) The cut-off frequency in BASSBOOST is generally calculated by the following equation: 1 fCB= 2πC21～22(or C16～15)×R21～20(or R16～15) The voltage gain in NONBOOST is generally calculated by the following equation: 40k (dB) GSP=20×log R1(or R12) 4) EVR control characteristic HP AMP gain is controlled by the ratio of voltage to resistance between VCC and GND. GSPB = 20×log Note: A resistance (RN), shown above, is the resistance that is connected to pin N. A capacitance (CN), shown above, is the capacitance that is connected to pin N. The numeric values above are design reference values, whose values are not guaranteed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/10 2010.06 - Rev.A Technical Note BH7884EFV ●Operation Notes 1. Numbers and data in entries are representative design values and are not guaranteed values of the items. 2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for sufficient margins when determining circuit constants. 3. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times where the absolute maximum ratings may be exceeded. 4. GND potential Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at any time, regardless of whether it is a transient signal or not. 5. Thermal design Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd) in actual states of use. 6. Short circuit between terminals and erroneous mounting Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other components on the circuits, can damage the IC. 7. Operation in strong electromagnetic field Using the ICs in a strong electromagnetic field can cause operation malfunction. 8. Pop noise when switching power ON/OFF To prevent pop noise when switching VCC ON/OFF or switching SUSPEND ON/OFF, use SUSPEND (11PIN=L), HP MUTE (10PIN=L), and SUSPEND (2PIN=L) for noise control, as shown below. (VCC ON→OFF) (VCC OFF→ON) VCC 1) OFF SPND HPMT SPMT L L L 1) OFF H H H VCC SPND HPMT SPMT 2) ON L L L 2) ON H H L 3) ON H L L 3) ON H L L 4) ON H H L 4) ON L L L 5) ON H H H 5) ON L L L 9. Power supply bypass capacitor Place the bypass capacitor close to the VCC ~ GND pins. 10. Mode switching Do not apply a voltage that exceeds VCC or a voltage that is less than GND, at a control pin. 11. Power package Ensure heat dissipation by connecting the heatsink to the back of the IC and to the GND board. Ensure that the GND area is large. 12. HPOUT Connect resistance (100 Ω is recommended) to the output for SPAMP input level adjustment and to prevent HPAMP oscillation. 13. Capacitive load Do not connect a capacitive load to SPAMP or HPAMP output as it may cause oscillation. 14. Startup time at low temperature and reduced power Use the following methods to eliminate longer start up time at low temperatures (less than about -10℃) and reduced power (less than about 3.0 V): 1) Start in SPMUTE state and then cancel SPMUTE. 2) Add to transistor and resistance, as shown in the application circuit diagram. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/10 2010.06 - Rev.A Technical Note BH7884EFV ●Ordering part number B H 7 Part No. 8 8 4 Part No. E F V - Package EFV: HTSSOP-B24 E 2 Packaging and forming specification E2: Embossed tape and reel HTSSOP-B24 <Tape and Reel information> 7.8±0.1 (MAX 8.15 include BURR) (5.0) 1.0±0.2 0.53±0.15 (3.4) 1 0.325 Tape Embossed carrier tape (with dry pack) Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 12 1PIN MARK +0.05 0.17 -0.03 S 0.08±0.05 0.85±0.05 1.0MAX +6° 4° −4° 13 5.6±0.1 7.6±0.2 24 0.65 0.08 S +0.05 0.24 -0.04 0.08 1pin M Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/10 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.06 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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