Holt HI-3182CJI Arinc 429 differential line driver Datasheet

HI-3182, HI-3183, HI-3184
HI-3185, HI-3186, HI-3188
March 2008
ARINC 429 Differential Line Driver
GENERAL DESCRIPTION
The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188
bus interface products are silicon gate CMOS devices designed
as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382
& HI-8383 products, they are also alternate sources for the
HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon)
and a variety of similar line driver products from other manufacturers.
Inputs are provided for clocking and synchronization. These
signals are AND'd with the DATA inputs to enhance system
performance and allow the HI-318X series of products to be
used in a variety of applications. Both logic and synchronization
inputs feature built-in 2,000V minimum ESD input protection as
well as TTL and CMOS compatibility.
The differential outputs of the HI-318X series of products are
programmable to either the high speed or low speed ARINC 429
output rise and fall time specifications through the use of two
external capacitors. The output voltage swing is also adjustable
by the application of an external voltage to the VREF input.
Products with 0, 13 or 37.5 ohm resistors in series with each
ARINC output are available. In addition, the HI-3182 and
HI-3184 products also have a fuse in series with each output.
PIN CONFIGURATION
(Top View)
14 V1
VREF 1
13 CLOCK
GND (See Note * ) 2
12 DATA (B)
SYNC 3
11 CB
DATA (A) 4
10 BOUT
CA 5
9 +V
AOUT 6
8 GND
-V 7
HI-3184PS, HI-3185PS & HI-3186PS
14 - PIN PLASTIC SMALL OUTLINE (ESOIC)** NB
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC Package
(See Page 6 for additional package pin configurations)
FUNCTION
The HI-318X series of line drivers are intended for use where
logic signals must be converted to ARINC 429 levels such as
when using an ASIC, the HI-3282/HI-8282A ARINC 429 Serial
Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the HI-8783 ARINC Interface Device.
Holt
products are readily available for both industrial and military
applications. Please contact the Holt Sales Department for
additional information.
+
_
FEATURES
ARINC 429 DIFFERENTIAL LINE DRIVER
! Low power CMOS
TRUTH TABLE
! TTL and CMOS compatible inputs
! Programmable output voltage swing
! Adjustable ARINC rise and fall times
! Plastic 14 & 16-pin thermally enhanced SOIC
packages available
SYNC CLOCK DATA(A) DATA(B) AOUT
BOUT COMMENTS
X
L
X
X
0V
0V
NULL
L
X
X
X
0V
0V
NULL
! Pin-for-Pin alternative for Intersil/Fairchild
applications
H
H
L
L
0V
0V
NULL
! Operates at data rates up to 100 Kbits
H
H
L
H
-VREF
+VREF
LOW
! Overvoltage protection
H
H
H
L
+VREF
-VREF
HIGH
! Industrial and extended temperature ranges
H
H
H
H
0V
0V
NULL
(Ds3182 Rev. K )
HOLT INTEGRATED CIRCUITS
www.holtic.com
03/09
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
FUNCTIONAL DESCRIPTION
The SYNC and CLOCK inputs establish data synchronization
utilizing two AND gates, one for each data input (figure 2).
Each logic input, including the power enable (STROBE) input,
are TTL/CMOS compatible.
Figure 1 illustrates a typical ARINC 429 bus application.
Three power supplies are necessary to operate the HI-3182;
typically +15V, -15V and +5V. The chip also works with ±12V
supplies. The +5V supply can also provide a reference
voltage that determines the output voltage swing. The
differential output voltage swing will equal 2VREF. If a value of
VREF other than +5V is needed, a separate +5V power supply
is required for pin V1.
With the DATA (A) input at a logic high and DATA (B) input at a
logic low, AOUT will switch to the +VREF rail and BOUT will
switch to the -VREF rail (ARINC HIGH state). With both data
input signals at a logic low state, the outputs will both switch to
0V (ARINC NULL state).
The driver output impedance, ROUT, is nominally 75, 26 or 0
ohms depending on the option chosen. The rise and fall times
of the outputs can be calibrated through the selection of two
external capacitor values that are connected to the CA and CB
input pins. Typical values for high-speed operation
(100KBPS) are CA = CB = 75pF and for low-speed operation
(12.5 to 14KBPS) CA = CB = 500pF.
function is not available in the 14 & 16-pin SOIC package
configurations where the pin is internally connected to
ground.
The ARINC outputs of the HI-3182 and HI-3184 are protected
by internal fuses capable of sinking between 800 - 900 mA for
short periods of time (125ms).
The Vref pin has an internal pull-up resistor to V+, allowing the
use of a simple external zener diode to set the reference
voltage.
POWER SUPPLY SEQUENCING
The power supplies should be controlled to prevent large
currents during supply turn-on and turn-off. The
recommended sequence is +V followed by V1, always
ensuring that +V is the most positive supply. The -V supply
is not critical and can be asserted at any time.
+5V
+15V
VREF
V1
SYNC
CLOCK
DATA (A)
AOUT
+V
INPUTS
TO ARINC BUS
DATA (B)
CA
CB
STROBE
GND
-V
BOUT
The CA and CB pins swing between +5V and ground allowing
the switching of capacitor values with an external singlesupply analog switch.
The ARINC outputs can be put in a tri-state mode by applying
a logic high to the STROBE input pin. If this feature is not
being used, the pin should be tied to ground. The STROBE
VREF
+V
CA
-15V
Figure 1. ARINC 429 BUS APPLICATION
Shorted on
HI-3186, HI-3188
A OUT
DATA (A)
LEVEL SHIFTER
AND SLOPE
CONTROL (A)
CLOCK
24.5W
13W
FA
OUTPUT
DRIVER (A)
CL
SYNC
LEVEL SHIFTER
AND SLOPE
CONTROL (B)
DATA (B)
V1
24.5W
STROBE
GND
-V
FB
OUTPUT
DRIVER (B)
Shorted on
HI-3183, HI-3186
HI-3188
CURRENT
REGULATOR
13W
Shorted on
HI-3183, HI-3185
HI-3186, HI-3188
B OUT
CB
Figure 2. FUNCTIONAL BLOCK DIAGRAM
HOLT INTEGRATED CIRCUITS
2
RL
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
PIN DESCRIPTIONS
SYMBOL
FUNCTION
DESCRIPTION
VREF
ANALOG
Ref. voltage used to determine output voltage swing. Pin sources current to allow use of a zener reference.
STROBE
INPUT
A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally).
SYNC
INPUT
Synchronizes data inputs
DATA (A)
INPUT
Data input terminal A
CA
INPUT
Connection for DATA (A) slew-rate capacitor
AOUT
OUTPUT
ARINC output terminal A
-V
POWER
-12V to -15V
GND
POWER
0.0V
+V
POWER
+12V to +15V
BOUT
OUTPUT
ARINC output terminal B
CB
INPUT
Connection for DATA (B) slew-rate capacitor
DATA (B)
INPUT
Data input terminal B
CLOCK
INPUT
Synchronizes data inputs
V1
POWER
+5V ±5%
ABSOLUTE MAXIMUM RATINGS
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage
Supply Voltage
Voltage Reference
Input Voltage Range
SYMBOL
VDIF
CONDITIONS
For ARINC 429
For Applications other than ARINC
See Note: 1
Output Overvoltage Protection
See Note: 2
Storage Temperature Range
TA
TSTG
Lead Temperature
Junction Temperature
UNIT
40
V
+10.8 to +16.5
-10.8 to -16.5
+5 ±5%
+7
V
V
V
+5 ±5%
1.5 to 6
6
6
V
V
> GND -0.3
< V1 +0.3
V
V
VIN
Output Short-Circuit Duration
Operating Temperature Range
MAXIMUM
Voltage between +V and -V terminals
+V
-V
V1
VREF
OPERATING RANGE
Industrial
Extended
-40 to +85
-55 to +125
°C
°C
Ceramic & Plastic
-65 to +150
°C
Soldering, 10 seconds
TJ
+275
°C
+175
°C
Note 1. Heatsinking may be required for continuous Output Short Circuit at +125°C and for 100KBPS at +125°C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater
than ±12.0V with respect to GND. (HI-3182 & 3184 only)
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
3
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
DC ELECTRICAL CHARACTERISTICS
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
Output Voltage High (Output to Ground)
ICCOP (+V)
ICCOP (-V)
ICCOP (V1)
ICCOP (VREF)
ISC (+V)
ISC (-V)
IOHSC
IOLSC
IIH
IIL
VIH
VIL
VOH
Output Voltage Low (Output to Ground)
Supply Current +V (Operating)
Supply Current -V (Operating)
Supply Current V1 (Operating)
Reference Pin Current VREF (Operating)
Supply Current +V (During Short Circuit Test)
Supply Current -V (During Short Circuit Test)
Output Short Circuit Current (Output High)
Output Short Circuit Current (Output Low)
Input Current (Input High)
Input Current (Input Low)
Input Voltage High
Input Voltage Low
Output Voltage Null
Input Capacitance
CONDITION
No Load
MIN
TYP
(0 - 100KBPS)
No Load
(0 - 100KBPS)
No Load
(0 - 100KBPS)
No Load, VREF = 5V (0 - 100KBPS)
Short to Ground
(See Note: 1)
Short to Ground
(See Note: 1)
Short to Ground
VMIN=0 (See Note: 2)
VMIN=0 (See Note: 2)
Short to Ground
MAX UNITS
+16
-16
-1.0
mA
mA
-0.4
500
µA
-0.15
mA
150
mA
-150
mA
-80
+80
mA
mA
1.0
-1.0
µA
µA
2.0
V
0.5
V
No Load
(0 -100KBPS)
+VREF
-.25
+VREF
+.25
V
VOL
No Load
(0 -100KBPS)
-VREF
-.25
-VREF
+.25
V
VNULL
CIN
No Load
(0-100KBPS)
-250
+250
mV
15
See Note 1
pF
Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter.
Note 2. Interchangeability of force and sense is acceptable.
AC ELECTRICAL CHARACTERISTICS
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX UNITS
Rise Time ( A OUT , B OUT )
tR
C A = C B = 75pF
See Figure 3.
1.0
2.0
µs
Fall Time ( A OUT , B OUT )
tF
C A = C B = 75pF
See Figure 3.
1.0
2.0
µs
Propagtion Delay Input to Output
t PLH
C A = C B = 75pF
See Figure 3.
3.0
µs
Propagtion Delay Input to Output
t PHL
C A = C B = 75pF
See Figure 3.
3.0
µs
DATA (B) 0V
VREF
AOUT 0V
2.0V
0.5V
50%
DATA (A) 0V
50%
2.0V
0.5V
ADJUST
BY CA
+4.75V to +5.25V
ADJUST
BY CA
-VREF
t PHL
+VREF
BOUT 0V
-VREF
50%
50%
t PLH
-4.75V to -5.25V
ADJUST
BY CB
-4.75V to -5.25V
2VREF
tR
+4.75V to +5.25V
ADJUST
BY CB
HIGH
DIFFERENTIAL
OUTPUT 0V
+9.5V to +10.5V
NULL
(AOUT - BOUT)
NOTE: OUTPUTS UNLOADED
tF
-2VREF
LOW
Figure 3. SWITCHING WAVEFORMS
HOLT INTEGRATED CIRCUITS
4
-9.5V to -10.5V
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
HI-318X PACKAGE THERMAL CHARACTERISTICS
MAXIMUM ARINC LOAD
3, 6, 7
JUNCTION TEMPERATURE, Tj
HEAT SINK
ØJA
(°C/W)
SUPPLY CURRENT
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
Unsoldered
82
20 mA
57°C
117°C
157°C
Soldered
65
20 mA
51°C
111°C
151°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
Unsoldered
51
20 mA
45°C
105°C
145°C
Soldered
28
20 mA
36°C
96°C
136°C
N/A
70
25 mA
56°C
110°C
150°C
PACKAGE STYLE
1
28-pin Plastic
AOUT and BOUT Shorted to Ground
2
TA = 25°C TA = 85°C TA = 125°C
3, 4, 5, 6, 7
JUNCTION TEMPERATURE, Tj
HEAT SINK
ØJA
(°C/W)
SUPPLY CURRENT
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
Unsoldered
82
36 mA
57°C
147°C
187°C
Soldered
65
36 mA
78°C
138°C
178°C
14-pin Thermally
Enhanced Plastic
SOIC (ESOIC)
Unsoldered
51
40 mA
64°C
124°C
164°C
Soldered
28
40 mA
53°C
113°C
153°C
N/A
70
63 mA
100°C
150°C
182°C
PACKAGE STYLE
28-pin Plastic
1
2
TA = 25°C TA = 85°C TA = 125°C
Notes:
1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
4. Similar results would be obtained with AOUT shorted to BOUT.
5. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
6. Data will vary depending on air flow and the method of heat sinking employed.
7. Current values listed are for each of the +V and -V supplies.
HEAT SINK - ESOIC PACKAGES
Both the 14-pin and 16-pin thermally enhanced SOIC
packages are used for HI-318X products. These ESOIC
packages include a metal heat sink located on the bottom
surface of the device. This heat sink should be soldered
down to the printed circuit board for optimum thermal
dissipation. The heat sink is electrically isolated from the
chip and can be soldered to any ground or power plane.
However, since the chip’s substrate is at +V, connecting
the heat sink to this power plane is recommended to avoid
coupling noise into the circuit.
HOLT INTEGRATED CIRCUITS
5
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
SYNC
STROBE
N/C
VREF
V1
N/C
N/C
ADDITIONAL PIN CONFIGURATIONS (See page 1 for 14-Pin Small Outline SOIC)
HI-3182PS, HI-3183PS, HI-3188PS
VREF - 1
16 - V1
GND (See Note * ) - 2
4
15 - N/C
SYNC - 3
14 - CLOCK
DATA(A) - 4
13 - DATA(B)
CA - 5
12 - CB
AOUT - 6
11 - BOUT
-V - 7
10 - N/C
GND - 8
N/C
DATA (A)
N/C
N/C
CA
N/C
N/C
3 2 1 28 27 26
5
25
6
24
7
9
HI-3182PJ 23
22
HI-3183PJ 21
10
20
8
19
11
9 - +V
CLOCK
N/C
DATA (B)
CB
N/C
N/C
N/C
16 - PIN PLASTIC SMALL OUTLINE (ESOIC)**
28 - PIN PLASTIC PLCC
N/C
N/C
N/C
N/C
DATA(B)
CB
N/C
N/C
BOUT
SYNC
STROBE
N/C
VREF
V1
N/C
N/C
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC package
N/C
AOUT
-V
GND
+V
BOUT
N/C
12 13 14 15 16 17 18
4
29 28 27 26 25 24 23 22 21
CLOCK
V1
N/C
VREF
STROBE
SYNC
N/C
30
20
31
19
32
HI-3182CJ
HI-3183CJ
1
2
18
17
16
3
15
4
14
8 9 10 11 12 13
3
2
1 28 27 26
5
25
6
24
7
8
9
HI-3182CL
HI-3183CL
23
22
21
10
20
11
19
12 13 14 15 16 17 18
CLOCK
N/C
DATA (B)
CB
N/C
N/C
N/C
N/C
AOUT
-V
GND
+V
BOUT
N/C
7
N/C
DATA (A)
N/C
N/C
CA
N/C
N/C
N/C
N/C
N/C
DATA(A)
CA
N/C
N/C
N/C
AOUT
5 6
N/C
N/C
+V
GND
N/C
-V
N/C
32 - PIN CERQUAD
28 - PIN CERAMIC LCC
VREF 1
STROBE 2
HI-3182CD
HI-3183CD
16 - PIN
CERAMIC
SIDE BRAZED
DIP
SYNC 3
DATA(A) 4
CA 5
AOUT 6
-V 7
GND 8
16 V1
VREF 1
15 N/C
14 CLOCK
13 DATA(B)
12 CB
11 BOUT
STROBE 2
HI-3182CR
HI-3183CR
16 - PIN
CERDIP
10 N/C
9 +V
HOLT INTEGRATED CIRCUITS
6
SYNC 3
DATA(A) 4
CA 5
AOUT 6
-V 7
GND 8
16 V1
15 N/C
14 CLOCK
13 DATA(B)
12 CB
11 BOUT
10 N/C
9 +V
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
ORDERING INFORMATION
HI - 318x x x - xx (Ceramic)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
No
T
-55°C TO +125°C
T
No
M
-55°C TO +125°C
M
Yes
PART
NUMBER
PACKAGE
DESCRIPTION
LEAD
FINISH (Note 1)
CD
16 PIN CERAMIC SIDE BRAZED DIP (16C)
Gold (’M’ Flow: Solder)
CJ
32 PIN J-LEAD CERQUAD (32U) not available with ‘M’ flow
Solder
CL
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) (28S)
Gold (’M’ Flow: Solder)
CR
16 PIN CERDIP (16D) not available with ‘M’ flow
Solder
PART
NUMBER
OUTPUT SERIES
RESISTANCE
FUSE
3182
37.5 Ohms
Yes
3183
13 Ohms
No
HI - 318xxx x x (Plastic)
PART
NUMBER
Blank
F
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
No
T
-55°C TO +125°C
T
No
M (Note 2)
-55°C TO +125°C
M
Yes
PART
NUMBER
PACKAGE
DESCRIPTION
OUTPUT SERIES
RESISTANCE
FUSE
3182PJ
28 PIN PLASTIC J-LEAD PLCC (28J)
37.5 Ohms
Yes
3182PS
16 PIN PLASTIC SMALL OUTLINE - WB ESOIC (16HWE)
37.5 Ohms
Yes
3183PJ
28 PIN PLASTIC J-LEAD PLCC (28J)
13 Ohms
No
3183PS
16 PIN PLASTIC SMALL OUTLINE - WB ESOIC (16HWE)
13 Ohms
No
3184PS
14 PIN PLASTIC SMALL OUTLINE - NB ESOIC (14HNE)
37.5 Ohms
Yes
3185PS
14 PIN PLASTIC SMALL OUTLINE - NB ESOIC (14HNE)
37.5 Ohms
No
3186PS
14 PIN PLASTIC SMALL OUTLINE - NB ESOIC (14HNE)
0 Ohms
No
3188PS
16 PIN PLASTIC SMALL OUTLINE - NB ESOIC (16HNE)
0 Ohms
No
Legend:
ESOIC - Thermally Enhanced Small Outline Package (SOIC with built-in heat sink)
NB
- Narrow Body
WB
- Wide Body
(1) Gold terminal finish is Pb-Free, RoHS compliant.
(2) Only available with ‘3182PJ’.
HOLT INTEGRATED CIRCUITS
7
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3188
REVISION HISTORY
Revision
Date
Description of Change
DS3182, Rev. K
03/19/09 Clarified the temperature ranges, and Note (2) in the Ordering Information.
HOLT INTEGRATED CIRCUITS
8
HI-318X PACKAGE DIMENSIONS
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
Top View
Package Type: 14HNE
.0085 ± .001
(.220 ± .029)
.341 ± .004
(8.65 ± .10)
.236 ± .008
(6.00 ± .20)
inches (millimeters)
.270 typ
(6.86)
Bottom
View
.100 typ
(2.54)
.153 ± .003
(3.87 ± .06)
See Detail A
.0165 ± .003
(.419 ± .089)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.055 ± .005
(1.397 ± .13)
.050 BSC
(1.27)
0°° to 8°°
.0025 ± .0015
(.0635 ± .04)
.033 ± .017
(.838 ± .43)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.0086 ±
.0015
.390 ± .004
(9.90 ± .10)
.236 ±.008
(5.99 ±.20)
Top View
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Package Type: 16HNE
.270
typ
(6.86)
.10
typ
(2.54)
.1525 ± .003
(2.87 ± .06)
Bottom
View
See Detail A
.0165 ± .003
(.419 ± .09)
.050
BSC
(1.27)
inches (millimeters)
.061 ± .007
(1.55 ± .18)
0°° to 8°°
.033 ± .017
(.838 ± .43)
Detail A
HOLT INTEGRATED CIRCUITS
9
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.0025 ± .0015
(.0635 ± .04)
HI-318X PACKAGE DIMENSIONS
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
Package Type: 16HWE
.0105 ± .0015
(.2667 ± .038)
.405 ± .008
(10.287 ± .20)
.407 ± .013
(10.34 ± .32)
inches (millimeters)
.240
(6.10) typ
.295 ± .004
(7.49 ± .10)
Top View
.190
typ
(4.83)
Bottom
View
See Detail A
.090 ± .010
(2.286 ± .254)
.050
BSC
(1.27)
.0165 ± .003
(.419 ± .089)
0° to 8°
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.0025 ± .002
(.064 ± .038)
.033 ± .017
(.838 ± .432)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 16C
.810
max
(20.574)
.295 ±.010
(7.493 ±.254)
PIN 1
.200
max
(5.080)
.050 ±.005
(1.270 ±.127)
.035 ± .010
(.889 ±.254)
BASE
PLANE
.125 min
(3.175)
.018 ± .002
(.457 ±.051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.010 ±.002
(.254 ±.051)
SEATING
PLANE
.100
BSC
(2.54)
HOLT INTEGRATED CIRCUITS
10
.300 ± .010
(7.620 ±.254)
HI-318X PACKAGE DIMENSIONS
16-PIN CERDIP
inches (millimeters)
Package Type: 16D
.050 max
(1.27 max)
.790 max
(20.006 max)
.005 min
(.127 min)
.288 ±.005
(7.315 ±.125)
.100
BSC
(2.54)
.056 typ
(1.422 typ)
.310 ±.010
(7.874 ±.254)
.180 max
(4.572 max)
.200 max
(5.080 max)
.015 min
(.381 min)
.018 ±.003
(.457 ±.760)
.125 min
(3.175 min)
0° to 15°
.010 ±.002
(.254 ±.051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
28-PIN PLASTIC PLCC
inches (millimeters)
Package Type: 28J
PIN NO. 1
PIN NO. 1 IDENT
.045 x 45°
.045 x 45°
.050
(1.27) BSC
.453 ± .003
(11.506 ±.076)
SQ.
.490 ± .005
(12.446 ±.127)
SQ.
.031 ±.005
(.787 ±.127)
.017 ±.004
(.432 ±.102)
See Detail A
.010 ± .001
(.254 ± .03)
.173 ±.008
(4.394 ±.203)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.020
(.508) min
.410 ±.020
(10.414 ±.508)
HOLT INTEGRATED CIRCUITS
11
DETAIL A
R
.035
.889
HI-318X PACKAGE DIMENSIONS
28-PIN CERAMIC LEADLESS CHIP CARRIER
inches (millimeters)
Package Type: 28S
.020
INDEX
(.508)
.080 ±.020
(2.032 ±.508)
PIN 1
PIN 1
.050 ±.005
(1.270 ±.127)
.451 ±.009
(11.455 ±.229)
SQ.
.050
BSC
(1.270)
.025 ±.003
(.635 ±.076)
.008R ± .006
(.203R ±.152)
.040 x 45° 3PLS
(1.016 x 45° 3PLS)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
32-PIN J-LEAD CERQUAD
inches (millimeters)
Package Type: 32U
31
32
1
2
.450 ±.008
(11.430 ±.203)
.488 ±.008
(12.395 ±.203)
.420 ±.012
(10.668 ±.305)
.588 ±.008
(14.935 ±.203)
.550 ± .009
(13.970 ± .229)
.190 max
(4.826)
.040
typ
(1.016)
.050
.019 ± .003
BSC
(1.270)
(.483 ± .076)
.520 ±.012
(13.208 ±.305)
.083 ±.009
(2.108 ±.229)
HOLT INTEGRATED CIRCUITS
12
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
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