ON MC74VHC1G01 Single 2-input nand gate with open drain output Datasheet

MC74VHC1G01
Single 2-Input NAND Gate
with Open Drain Output
The MC74VHC1G01 is an advanced high speed CMOS 2−input
NAND gate with an open drain output fabricated with silicon gate
CMOS technology.
The internal circuit is composed of multiple stages, including an
open drain output which provides the ability to set output switching
level. This allows the MC74VHC1G01 to be used to interface 5 V
circuits to circuits of any voltage between VCC and 7 V using an
external resistor and power supply.
The MC74VHC1G01 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage.
www.onsemi.com
MARKING
DIAGRAMS
5
Features
•
•
•
•
•
•
•
M
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
1
V0 M G
G
High Speed: tPD = 3.7 ns (Typ) at VCC = 5 V
Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 62
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IN B
1
5
V0
M
G
V0 M G
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
VCC
PIN ASSIGNMENT
OVT
1
IN A
GND
2
3
4
OUT Y
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
Figure 1. Pinout (Top View)
IN A
IN B
&
Inputs
OUT Y
Output
A
B
Y
L
L
H
H
L
H
L
H
Z
Z
Z
L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
December, 2016 − Rev. 16
1
Publication Order Number:
MC74VHC1G01/D
MC74VHC1G01
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Sink Current, per Pin
ICC
DC Supply Current, VCC and GND Pin
TSTG
Value
Unit
*0.5 to )7.0
V
−0.5 to +7.0
V
*0.5 to VCC )0.5
V
VOUT t GND; VOUT u VCC
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Latchup Performance
mA
mA
25
mA
$25
mA
*65 to )150
°C
260
°C
)150
°C
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
°C/W
SC70−5/SC−88A
TSOP−5
150
200
mW
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
Above VCC and Below GND at 125°C (Note 5)
$500
mA
ESD Withstand Voltage
ILATCHUP
−20
$20
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
7.0
V
Operating Temperature Range
−55
+125
°C
0
0
100
20
ns/V
VOUT
TA
tr , tf
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Input Rise and Fall Time
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
TJ = 80°C
117.8
419,300
TJ = 90°C
1,032,200
90
TJ = 100°C
80
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110°C
Time, Years
TJ = 120°C
Time, Hours
TJ = 130°C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
1000
TIME, YEARS
140
8,900
1.0
Figure 3. Failure Rate vs. Time Junction Temperature
www.onsemi.com
2
MC74VHC1G01
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.5
2.1
3.15
3.85
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
TA v 855C
TA = 255C
Typ
Max
Min
Max
1.5
2.1
3.15
3.85
*555C v TA v
1255C
Min
Max
1.5
2.1
3.15
3.85
Unit
V
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
0.0
0.0
0.0
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
5.5
$5
$10
$10
mA
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
20
40
mA
IOFF
Power Off−Output
Leakage Current
VOUT = 5.5 V
VIN = 5.5 V
0
0.25
2.5
5
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA ≤ 85°C
TA = 25°C
Symbol
tPZL
tPLZ
CIN
Typ
Max
Max
Unit
Maximum Output
Enable Time,
Input A or B to Y
VCC = 3.3 ± 0.3 VCL = 15 pF
RL = RI = 500 WCL = 50 pF
5.5
8.0
7.9
11.4
9.5
13.0
11.0
15.5
ns
VCC = 5.0 ± 0.5 VCL = 15 pF
RL = RI = 500 WCL = 50 pF
3.7
5.2
5.5
7.5
6.5
8.5
8.0
10.0
Maximum Output
Disable Time
VCC = 3.3 ± 0.3 V CL = 50 pF
RL = RI = 500 W
8.0
11.4
13.0
15.5
VCC = 5.0 ± 0.5 V CL = 50 pF
RL = RI = 500 W
5.2
7.5
8.5
10.0
4
10
10
10
Parameter
Min
Test Conditions
Maximum Input
Capacitance
Min
Max
−55 ≤ TA ≤ 125°C
Min
ns
pF
Typical @ 25°C, VCC = 5.0V
18
CPD
Power Dissipation Capacitance (Note 6)
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
www.onsemi.com
3
MC74VHC1G01
VCC
VCC − 7 V
VCC
A or B
50%
OVT
A
GND
RL
tPZL
tPLZ
HIGH
IMPEDANC
B
50% VCC
Y
Figure 4. Output Voltage Mismatch Application
VOL +0.3 V
Figure 5. Switching Waveforms
VCC
VCC x 2
R1
PULSE
GENERATOR
DUT
RT
CL
RL
CL = 50 pF equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 6. Test Circuit
MC74VHC1G01
VCC
VCC
A
2.2 kW
B
MC74VHC1G03
C
B
1
A
2
5
R LED
220 W
A
B
3
E = (A • B) + (C+D)
D
MC74VHC1G01
1.5 V
3.3 V
VCC
Figure 7. Complex Boolean Functions
4
Figure 8. LED Driver
GTL
Figure 9. GTL Driver
ORDERING INFORMATION
Device
Package
Shipping†
SC−88A / SC70−5 / SOT−353
(Pb−Free)
3000 Units / Tape & Reel
TSOP−5 / SOT23−5 / SC59−5
(Pb−Free)
3000 Units / Tape & Reel
MC74VHC1G01DFT1G
NLV74VHC1G01DFT1G*
MC74VHC1G01DFT2G
MC74VHC1G01DTT1G
NLV74VHC1G01DTT1G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
www.onsemi.com
4
MC74VHC1G01
PACKAGE DIMENSIONS
SC−88A
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
www.onsemi.com
5
SCALE 20:1
mm Ǔ
ǒinches
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G01
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE M
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
DIM
A
B
C
D
G
H
J
K
M
S
END VIEW
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74VHC1G01/D
Similar pages