Metal Glaze™ High Power Density Surface Mount Power Resistor Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate MRC Series • 1/2 watt in 1/8 watt package • 1 watt in 1/2 watt package (2010 footprint) • MRC1/2: 0.05 Ω to 1.0 Ω (contact factory for higher values) • 150°C maximum operating temperature • Superior surge handling capability High temperature dielectric coating 60/40 Solder over nickel barrier Environmental Data Size Industry Code1 Footprint C 1206 E 2010 IRC Type Max. Working Power Rating Voltage2 MRC1/2 1/2W @ 70°C MRC1 1W @ 70°C 200 350 Tolerance Max. Resistance TCR (±%)3 (ppm/°C)3 Voltage Range (ohms)3 400 700 Product Catagory 0.1 to 0.99 1,2,5 100 Low Range 1.0 to 10K 1,2,5 50,100 Standard 20 to 10K 0.25, 0.5 50,100 Tight Tolerance 0.05 to 0.099 2,5 200 Low Range 0.10 to 1.0 1,2,5 100 Low Range MRC Applications: The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on a 2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due to high power density and superior surge handling capability, it is also recommended as a direct replacement on existing board designs where standard 1206 and 2010 resistors are marginal or failing. Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±(0.5% + 0.01Ω) MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±(0.25% + 0.01Ω) MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±(1.0% + 0.01Ω) MIL-R-55342E Par 4.7.5 2.5 x √ PxR for 5 seconds High Temperature Exposure ±(0.5% + 0.01Ω) MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±(0.25% + 0.01Ω) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Moisture Resistance ±(0.5% + 0.01Ω) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Life Test ±(1.0% + 0.01Ω) MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent) Terminal Adhesion Strength ±(1% + 0.01Ω) no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds Resistance to Board Bending ±(1% + 0.01Ω) no mechanical damage Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. © IRC Wirewound and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc MRC Series Issue June 2008 Sheet 1 of 2 Metal Glaze™ High Power Density Surface Mount Power Resistor Repetitive Surge Curve Peak Power (watts) 1000 MRC 1 100 MRC 1/2 10 1 0.0001 0.001 0.01 0.1 1 Surge or Pulse Duration (seconds) Note: Use for repetitive pulses where the average power dissipation is not to exceed the component rating at 70°C. Surge handling capacity for low-repetitive surges may be significantly greater than shown above. Contact factory for recommendations. Power Derating Curve Ordering Data Sample Part No. MRC1/2 - 100 - 1000 - F - 13 % Of Rated Power 100 IRC Type (MRC 1/2 & MRC 1) Temperature Coefficient 60 50 ppm, 100 ppm, 200 ppm Resistance Value 0 25 70 150 Ambient Temperature (°C) (100Ω and greater - First 3 significant figures plus 4th digit multiplier) Example: 100Ω = 1000, 1000Ω = 1001, 150,000Ω = 1503 (Less than 100Ω - "R" is used to designate decimal) Example: 51Ω = 51R0, 1Ω = 1R00, 0.25Ω = R250 Tolerance (C = 0.25%, D = 0.5%, F = 1.0%, G = 2.0%, J = 5.0%) Packaging Code* (BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel) © IRC Wirewound and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com MRC Series Issue June 2008 Sheet 2 of 2