AD AD9961-EBZ 10-/12-bit, low power, broadband mxfe Datasheet

10-/12-Bit,
Low Power, Broadband MxFE
AD9961/AD9963
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Dual 10-bit/12-bit, 100 MSPS ADC
SNR = 67 dB, fIN = 30.1 MHz
Dual 10-bit/12-bit, 170 MSPS DAC
ACLR = 74 dBc
5 channels of analog auxiliary input/output
Low power, <425 mW at maximum sample rates
Supports full and half-duplex data interfaces
Small 72-lead LFCSP lead-free package
AUX
ADC
DLLFILT
The high level of integrated functionality, small size, and low
power dissipation of the AD9961/AD9963 make them wellsuited for portable and low power applications.
AUXIN1
AUX
DAC
MUX
AUX
DAC
CLKN
AUXIO2
AUXIO3
INTERNAL
TXCLK
TXIQ/TXnRX
LPF
1/2/4/8
TXD[11:0]
DATA
ASSEMBLER
LPF
1/2/4/8
TRXCLK
TRXIQ
LPF
1/2
TRXD[11:0]
The AD9961/AD9963 are pin-compatible, 10-/12-bit, low
power MxFE® converters that provide two ADC channels with
sample rates of 100 MSPS and two DAC channels with sample
rates to 170 MSPS. These converters are optimized for transmit
and receive signal paths of communication systems requiring low
power and low cost. The digital interfaces provide flexible
clocking options. The transmit is configurable for 1×, 2×, 4×,
and 8× interpolation. The receive path has a bypassable 2×
decimating low-pass filter.
The AD9961 and AD9963 have five auxiliary analog channels.
Three are inputs to a 12-bit ADC. Two of these inputs can be
configured as outputs by enabling 10-bit DACs. The other
two channels are dedicated outputs from two independent
12-bit DACs.
DLL AND
CLOCK
DISTRIBUTION
CLKP
Wireless infrastructure
Picocell, femtocell basestations
Medical instrumentation
Ultrasound AFE
Portable instrumentation
Signal generators, signal analyzers
LPF
1/2
RESET
SDIO
SCLK
SERIAL
PORT
LOGIC
12-BIT
DAC
TXIP
12-BIT
DAC
TXQP
12-BIT
ADC
RXIP
12-BIT
ADC
RXQP
AUX
DAC
DAC12A
AUX
DAC
DAC12B
TXIN
TXQN
RXIN
RXQN
08801-001
RXCML
RXBIAS
LDO
VREGs
AUXADCREF
REFERENCES
AND BIAS
LDO_EN
CS
REFIO
GENERAL DESCRIPTION
TEMPERATURE
SENSOR
TXCML
APPLICATIONS
AD9961/AD9963
Figure 1.
PRODUCT HIGHLIGHTS
1.
High Performance with Low Power Consumption.
The DACs operate on a single 1.8 V to 3.3 V supply.
Transmit path power consumption is <100 mW at 170
MSPS. Receive path power consumption is <350 mW at
100 MSPS from 1.8 V supply. Sleep and power-down
modes are provided for low power idle periods.
2.
High Integration.
The dual transmit and dual receive data converters, five
channels of auxiliary data conversion and clock generation
offer complete solutions for many modem designs.
3.
Flexible Digital Interface.
The interface mates seamlessly to most digital baseband
processors.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
AD9961/AD9963
TABLE OF CONTENTS
Features .............................................................................................. 1
Transmit DAC Operation.......................................................... 40
General Description ......................................................................... 1
Transmit DAC Outputs ............................................................. 42
Functional Block Diagram .............................................................. 1
Device Clocking.............................................................................. 45
Product Highlights ........................................................................... 1
Clock Distribution ..................................................................... 45
Specifications..................................................................................... 3
Driving the Clock Input ............................................................ 46
Absolute Maximum Ratings ............................................................ 8
Clock Multiplication Using the DLL ....................................... 46
Thermal Resistance ...................................................................... 8
Configuring the Clock Doublers .............................................. 47
ESD Caution .................................................................................. 8
Digital Interfaces ............................................................................ 48
Pin Configurations and Function Descriptions ........................... 9
TRx Port Operation (Full-Duplex Mode) ............................... 48
Typical Performance Characteristics ........................................... 13
Single ADC Mode ...................................................................... 48
Terminology .................................................................................... 18
Tx Port Operation (Full-Duplex Mode) ................................. 49
Theory of Operation ...................................................................... 19
Half-Duplex Mode ..................................................................... 50
Serial Control Port .......................................................................... 20
Auxiliary Converters ...................................................................... 52
General Operation of Serial Control Port ............................... 20
Auxiliary ADC ............................................................................ 52
Sub Serial Interface Communications ..................................... 21
Conversion Clock ....................................................................... 52
Configuration Registers ................................................................. 23
Auxiliary DACs........................................................................... 53
Configuration Register Bit Descriptions ................................. 24
Power Supplies ................................................................................ 55
Receive Path..................................................................................... 35
Power Supply Configuration Examples ................................... 55
Receive ADC Operation ............................................................ 35
Power Dissipation....................................................................... 55
Decimation Filter and Digital Offset ....................................... 36
Outline Dimensions ....................................................................... 58
Transmit Path .................................................................................. 38
Ordering Guide .......................................................................... 58
Interpolation Filters.................................................................... 38
REVISION HISTORY
7/10—Revision 0: Initial Version
Rev. 0 | Page 2 of 60
AD9961/AD9963
SPECIFICATIONS
TMIN to TMAX, RX33V = TXVDD = CLK33V = DRVDD = AUX33V = 3.3 V. All LDOs enabled, IOUTFS = 2 mA, DAC sample rate = 125 MSPS. No
interpolation, unless otherwise noted.
Table 1. Tx Path Specifications
Parameter
TxDAC DC CHARACTERISTICS
Resolution
Differential Nonlinearity
Gain Variation (Internal Reference)
Gain Matching
Offset Error
Full-Scale Output Current (Default Setting)
Output Compliance Range
TXVDD = 3.3 V, VTXCML = 0 V
TXVDD = 3.3 V, VTXCML = 0.5 V
TXVDD = 1.8 V, VTXCML = 0 V
Offset Temperature Drift
Gain Temperature Drift (Internal Reference)
Tx REFERENCE (DEFAULT REGISTER SETTINGS)
Internal Reference Voltage (REFIO)
Output Resistance
Temperature Drift
Adjustment Range (TXVDD = 3 V)
Adjustment Range (TXVDD = 1.8 V)
TxDAC AC CHARACTERISTICS
Maximum Update Rate
Spurious-Free Dynamic Range
fOUT = 5 MHz
fOUT = 20 MHz
Two-Tone Intermodulation Distortion
fOUT1 = 5 MHz, fOUT2 = 6 MHz
fOUT1 = 20 MHz, fOUT2 = 21 MHz
Noise Spectral Density
fOUT = 5 MHz
fOUT = 20 MHz
W-CDMA Adjacent Channel Leakage Ratio, 1 Carrier
fDAC = 122.88 MHz, fOUT = 11 MHz
Tx PATH DIGITAL FILTER INPUT RATES
SRRC (8× Interpolation Mode)
INT0 (4× Interpolation Mode)
INT1 (2× Interpolation Mode
Transmit DAC (1× Interpolation Mode)
Min
AD9961
Typ
Max
−10
−2.4
−0.03
10
0.1
0.4
0.4
+10
+2.4
+0.03
Min
−10
−2.4
−0.03
2.0
−0.5
+0.7
−0.5
−0.5
+0.7
−0.5
+10
+2.4
+0.03
+1.0
+1.7
+0.8
0
±40
0
±40
1.02
10
±25
1.02
10
±25
1.2
REFIO
175
Rev. 0 | Page 3 of 60
12
0.3
0.4
0.4
2.0
+1.0
+1.7
+0.8
0.8
0.8
21.875
43.75
87.5
175
AD9963
Typ
Max
0.8
0.8
1.2
REFIO
175
Unit
Bits
LSB
%FSR
%FSR
%FSR
mA
V
V
V
ppm/°C
ppm/°C
V
kΩ
ppm/°C
V
V
MSPS
78
68
81
70
dBc
dBc
85
78
89
80
dBc
dBc
−140
−136
−145
−141
dBm/Hz
dBm/Hz
70
74
dBc
21.875
43.75
87.5
175
MHz
MHz
MHz
MHz
AD9961/AD9963
TMIN to TMAX, RX33V = TXVDD = CLK33V = DRVDD = AUX33V = 3.3 V. All LDOs enabled, ADC sample rate = 100 MSPS. No
decimation, unless otherwise noted.
Table 2. Rx Path Specifications
Parameter
Rx ADC DC CHARACTERISTICS
Resolution
Differential Nonlinearity
Gain Error
Offset Error
Input Voltage Range
Input Capacitance
Rx ADC AC SPECIFICATIONS
Maximum Sample Rate
Spurious Free Dynamic Range
fIN = 10.1 MHz
fIN = 70.1 MHz
Two-Tone Intermodulation Distortion
fIN1 = 10 MHz, fIN2 = 11 MHz
fIN1 = 29 MHz, fIN2 = 32 MHz
Signal-to-Noise Ratio
fIN = 10.1 MHz
fIN = 30.1 MHz
fIN = 70.1 MHz
RXCML OUTPUTS
Output Voltage
Output Current
Rx DIGITAL FILTER CHARACTERISTICS
2× Decimation
Latency (ADC Clock Cycles)
Passband Ripple; fOUT/fDAC (0.4 × fDATA)
Stop-Band Rejection (fDATA ± 0.4 × fDATA)
Min
AD9961
Typ
Max
Min
10
0.1
±1
±0.5
1.56
8
100
AD9963
Typ
Max
Unit
12
0.3
±1
±0.5
1.56
8
Bits
LSB
%FSR
%FSR
V p-p diff
pF
100
MSPS
77
75
77
73
dBc
dBc
78
76
82
80
dBc
dBc
61
60
60
68
67
66
dBFS
dBFS
dBFS
1.4
1.4
0.1
49
0.2
70
Rev. 0 | Page 4 of 60
0.1
49
0.2
70
V
mA
Cycles
fOUT/fDAC
dB
AD9961/AD9963
TMIN to TMAX, RX33V = TXVDD = CLK33V = DRVDD = AUX33V = 3.3 V. All LDOs enabled, unless otherwise noted.
Table 3. Auxiliary Converter Specifications
Parameter
AUXILIARY DAC12A/AUXDAC12B
Resolution
Differential Nonlinearity
Gain Error
Settling Time (±1%)
AUXILIARY DAC10A/DAC10B (Range = 0.5 V to 1.5 V)
Resolution
Differential Nonlinearity
Gain Error
Settling Time (±1%)
AUXILIARY ADC
Resolution
Differential Nonlinearity
Gain Error (Internal Reference)
Input Voltage Range
Maximum Sample Rate
Min
AD9961
Typ
Max
12
Min
AD9963
Typ
Max
12
±0.8
±2.0
1
10
±0.8
±2.0
1
Bits
LSB
%
µs
±1.0
±2.0
10
Bits
LSB
%
µs
10
±1.0
±2.0
10
12
−1.0
−2.0
0
50
+1.0
+2.0
3.2
Rev. 0 | Page 5 of 60
12
−1.0
−2.0
0
50
Units
+1.0
+2.0
3.2
Bits
LSB
%
V
kHz
AD9961/AD9963
fCLK = 125 MHz, fDLL = 250 MHz, DAC sample rate = 125 MSPS, ADC sample rate = 62.5 MSPS, unless otherwise noted.
Table 4. Power Consumption Specifications
Parameter
1.8 V ONLY OPERATION (EXTERNAL 1.8 V)
CLK33V
TXVDD
DRVDD
DVDD18V
CLK18V
DLL18V
RX18V
RX18VF
3.3 V ONLY OPERATION (ON-CHIP REGULATORS)
TXVDD
CLK33V
RX33V
DRVDD
AUX33V
SUPPLY VOLTAGE RANGE
CLK33V, TXVDD (These Supplies Must Be Tied Together)
DRVDD
DVDD18V
CLK18V
DLL18V
RX18V
RX18VF
RX33V
AUX33V (AUXADC Enabled)
AUX33V (AUXADC Disabled)
Min
1.72
1.72
1.72
1.72
1.72
1.72
1.72
2.50
3.14
1.72
Rev. 0 | Page 6 of 60
AD9961
Typ
Max
Min
AD9963
Typ
Max
Unit
1.65
10.7
29.4
21.0
3.84
9.98
79.2
34.3
1.65
10.7
34.9
22.7
3.84
9.98
79.2
34.3
mA
mA
mA
mA
mA
mA
mA
mA
12.1
17.0
113
93
0.55
12.1
17.0
113
108
0.55
mA
mA
mA
mA
mA
3.63
3.63
1.89
1.89
1.89
1.89
1.89
3.63
3.63
3.63
1.72
1.72
1.72
1.72
1.72
1.72
1.72
2.50
3.14
1.72
3.63
3.63
1.89
1.89
1.89
1.89
1.89
3.63
3.63
3.63
V
V
V
V
V
V
V
V
V
V
AD9961/AD9963
Table 5. Digital Logic Level Specifications
Parameter
CMOS INPUT LOGIC LEVEL
VIN Logic High
VIN Logic High
VIN Logic High
VIN Logic Low
VIN Logic Low
VIN Logic Low
CMOS OUTPUT LOGIC LEVEL
VOUT Logic High
VOUT Logic High
VOUT Logic High
VOUT Logic Low
VOUT Logic Low
VOUT Logic Low
DAC CLOCK INPUT
Differential Peak-to-Peak Voltage
Duty Cycle
Slew Rate
DIRECT CLOCKING
Clock Rate
DLL ENABLED
Clock Rate
SERIAL PERIPHERAL INTERFACE
Maximum Clock Rate
Minimum Pulse Width High (tHIGH)
Minimum Pulse Width Low (tLOW)
Setup Time, SDIO (Data In) to SCLK (tDS)
Hold Time, SDI to SCLK (tDH)
Data Valid, SDIO (Data Out) to SCLK (tDV)
Setup Time, CS to SCLK (tS)
Conditions
Min
DRVDD = 1.8 V
DRVDD = 2.5 V
DRVDD = 3.3 V
DRVDD = 1.8 V
DRVDD = 2.5 V
DRVDD = 3.3 V
1.2
1.7
2.0
DRVDD = 1.8 V
DRVDD = 2.5 V
DRVDD = 3.3 V
DRVDD = 1.8 V
DRVDD = 2.5 V
DRVDD = 3.3 V
1.35
2.05
2.4
200
45
0.1
Typ
400
Max
Unit
0.5
0.7
0.8
V
V
V
V
V
V
0.4
0.4
0.4
V
V
V
V
V
V
CLK33V
55
mV p-p diff
%
V/ns
MHz
%
MHz
CLKP/CLKN inputs
0.1
200
DLL delay line output
100
310
50
10
10
5.0
5.0
5.0
5.0
Rev. 0 | Page 7 of 60
MHz
ns
ns
ns
ns
ns
ns
AD9961/AD9963
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
RX33V, AUX33V
TXVDD
DRVDD
CLK33V
RX18V, RX18VF
DVDD18V
CLK18V, DLL18V
RXGND, TXGND, DGND,
TXIP, TXIN, TXQP, TXQN
With
Respect to
RXGND
TXGND
DGND
EPAD
RXGND
EPAD
EPAD
EPAD
TXGND
RXIP, RXIN, RXQP, RXQN
RXGND
CS, SCLK, SDIO, RESET,
DGND
LDO_EN
TRXD[11:0], TXD[11:0], TXIQ,
TRXIQ, TXCLK, TRXCLK
CLKP, CLKN
Junction Temperature
Storage Temperature Range
DGND
EPAD
Rating
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 to +2.1 V
−0.3 to +2.1 V
−0.3 to +2.1 V
−0.3 V to +0.3 V
−1.0 V to TXVDD +
0.3 V
−0.3 V to RX18V +
0.3 V
−0.3V to DRVDD +
0.3 V
−0.3 V to DRVDD +
0.3 V
−0.3 V to CLK33V +
0.3 V
+125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
1 m/sec
0 m/sec
θJA
17.1
20.3
θJB
10.6
θJC
1.0
Unit
°C/W
°C/W
Typical θJA, θJB, and θJC are specified for a JEDEC standard 51-7
High-κ thermal test board. Airflow increases heat dissipation,
effectively reducing θJA. In addition, metal in direct contact with
the package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION
Rev. 0 | Page 8 of 60
AD9961/AD9963
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
AUXIN1
AUXIO2
AUXIO3
DAC12A
DAC12B
TXVDD
TXIN
TXIP
TXGND
REFIO
TXCML
TXVDD
TXQP
TXQN
CLK33V
CLKP
CLKN
CLK18V
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
PIN 1
INDICATOR
AD9961
(TOP VIEW)
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
DLLFILT
DLL18V
DVDD18
DRVDD
NC
NC
TXD0
TXD1
TXD2
TXD3
TXD4
TXD5
TXD6
TXD7
TXD8
TXD9
TXIQ/TXnRX
TXCLK
NOTES
1. EXPOSED PAD MUST BE SOLDERED TO PCB.
2. NC = NO CONNECT.
08801-002
DGND
DRVDD
TRXD9
TRXD8
TRXD7
TRXD6
TRXD5
TRXD4
TRXD3
TRXD2
TRXD1
TRXD0
NC
NC
DRVDD
DGND
TRXIQ
TRXCLK
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
AUX33V
AUXADCREF
RXQP
RXQN
RXGND
RXBIAS
RX18V
RX33V
RX18VF
RXCML
RXGND
RXIN
RXIP
LDO_EN
RESET
SCLK
CS
SDIO
Figure 2. AD9961 Pin Configuration
Table 8. AD9961 Pin Function Descriptions
Pin No.
1
Mnemonic
AUX33V
2
3, 4
5, 11
6
AUXADCREF
RXQP, RXQN
RXGND
RXBIAS
7
8
RX18V
RX33V
9
10
12, 13
14
RX18VF
RXCML
RXIN, RXIP
LDO_EN
15
16
17
18
19, 34
20, 33, 51
21 to 30
31, 32,
49, 50
35
RESET
SCLK
CS
SDIO
DGND
DRVDD
TRXD9 to TRXD0
NC
Description
Analog Supply for the Auxiliary ADC and Auxiliary DACs (3.3 V ± 5%, 1.8 V ± 5% If Auxiliary ADC Is
Powered Down).
Reference Output (Or Input) for Auxiliary ADC.
Differential ADC Q Inputs. The default full-scale input voltage range is 1.56 V p-p differential.
Receive Path Ground.
External Bias Resistor Connection. An optional 10 kΩ resistor can be connected between this pin and the
analog ground to improve the accuracy of the full-scale range of the Rx ADCs.
Output of RX18V Voltage Regulator.
Input to RX18V and RX18VF Voltage Regulators (2.5 V to 3.3 V). If LDOs are not being used, short Pin 8 to
Pin 7.
Output of RX18VF Voltage Regulator.
ADC Common-Mode Voltage Output.
Differential ADC I Inputs. The default full-scale input voltage range is 1.56 V p-p differential.
Control Pin for LDOs (GND = Disable all LDOs, Float = Enable DVDD18 LDO Only, DRVDD = Enable All
LDOs).
Reset. Active low to reset the configuration registers to default values and reset device.
Clock Input for Serial Port.
Active Low Chip Select.
Bidirectional Data Line for Serial Port.
Digital Core Ground.
Input/Output Pad Ring Supply Voltage (1.8 V to 3.3 V).
ADC Output Data in Full Duplex Mode. ADC output data and DAC input data in half-duplex mode.
Not Connected.
TRXIQ
Output Signal Indicating from Which ADC the Output Data Is Sourced.
Rev. 0 | Page 9 of 60
AD9961/AD9963
Pin No.
36
37
38
Mnemonic
TRXCLK
TXCLK
TXIQ/TXnRX
39 to 48
52
53
54
55
56, 57
58
TXD9 to TXD0
DVDD18
DLL18V
DLLFILT
CLK18V
CLKN, CLKP
CLK33V
59, 60
61, 67
62
63
64
65, 66
68
69
70
TXQN, TXQP
TXVDD
TXCML
REFIO
TXGND
TXIP, TXIN
DAC12B
DAC12A
AUXIO3
71
AUXIO2
72
AUXIN1
EPAD
Description
Qualifying Clock for the TRXD Bus.
Qualifying Clock for the TXD Bus. It can be configured as either an input or output.
Dual Function Pin. In half-duplex mode (TXnRX), this pin controls the direction of the TRX port. In fullduplex mode (TXIQ), this input signal indicates to which DAC, I or Q, the TxDAC input data is intended.
TxDAC Input Data.
Digital Core 1.8 V Supply.
Output of DLL18V Voltage Regulator.
DLL Filter Output.
Output of CLK18V Voltage Regulator.
Differential Input Clock.
Input to CLK18V and DLL18V Voltage Regulators (1.8 V to 3.3 V). If LDOs are not being used, short Pin 58
to Pin 55. CLK33V must track TXVDD.
Complementary DAC Q Current Outputs.
Analog Supply Voltage for Tx Path (1.8 V to 3.3 V). TXVDD must track CLK33V.
Common-Mode Input Voltage for the I and Q Tx DACs.
Decoupling Point for Internal DAC 1.0 V Bandgap Reference. Use a 0.1 µF capacitor to AGND.
Transmit Path Ground.
Complementary DAC I Current Outputs.
Auxiliary DAC B Output.
Auxiliary DAC A Output.
Selectable Analog Pin. Programmable to either Input 3 of the auxiliary ADC or to the auxiliary DAC10B
output.
Selectable Analog Pin. Programmable to either Input 2 of the auxiliary ADC or to the auxiliary DAC10A
output.
Input 1 of Auxiliary ADC.
Thermal Pad Under Chip. This must be connected to AGND for proper chip operation. It provides both a
thermal and electrical connection to the PCB.
Rev. 0 | Page 10 of 60
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
AUXIN1
AUXIO2
AUXIO3
DAC12A
DAC12B
TXVDD
TXIN
TXIP
TXGND
REFIO
TXCML
TXVDD
TXQP
TXQN
CLK33V
CLKP
CLKN
CLK18V
AD9961/AD9963
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
PIN 1
INDICATOR
AD9963
(TOP VIEW)
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
DLLFILT
DLL18V
DVDD18
DRVDD
TXD0
TXD1
TXD2
TXD3
TXD4
TXD5
TXD6
TXD7
TXD8
TXD9
TXD10
TXD11
TXIQ/TXnRX
TXCLK
NOTES
1. EXPOSED PAD MUST BE SOLDERED TO PCB.
08801-003
DGND
DRVDD
TRXD11
TRXD10
TRXD9
TRXD8
TRXD7
TRXD6
TRXD5
TRXD4
TRXD3
TRXD2
TRXD1
TRXD0
DRVDD
DGND
TRXIQ
TRXCLK
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
AUX33V
AUXADCREF
RXQP
RXQN
RXGND
RXBIAS
RX18V
RX33V
RX18VF
RXCML
RXGND
RXIN
RXIP
LDO_EN
RESET
SCLK
CS
SDIO
Figure 3. AD9963 Pin Configuration
Table 9. AD9963 Pin Function Descriptions
Pin No.
1
Mnemonic
AUX33V
2
3, 4
5, 11
6
AUXADCREF
RXQP, RXQN
RXGND
RXBIAS
7
8
RX18V
RX33V
9
10
12, 13
14
RX18VF
RXCML
RXIN, RXIP
LDO_EN
15
16
17
18
19, 34
20, 33, 51
21 to 32
35
36
37
38
RESET
SCLK
CS
SDIO
DGND
DRVDD
TRXD11 to TRXD0
TRXIQ
TRXCLK
TXCLK
TXIQ/TXnRX
39 to 50
52
53
TXD11 to TXD0
DVDD18
DLL18V
Description
Analog Supply for the Auxiliary ADC and Auxiliary DACs (3.3 V ± 10%, 1.8 V ± 10% If Auxiliary ADC Is
Powered Down).
Reference Output (or input) for Auxiliary ADC.
Differential ADC Q Inputs. Full-scale input voltage range is 1.56 V p-p differential.
Receive Path Ground.
External Bias Resistor Connection. This voltage is nominally 0.5 V. A 10 kΩ resistor can be connected
between this pin and analog ground to improve the Rx ADC full-scale accuracy.
Output of RX18V Voltage Regulator.
Input to RX18V and RX18VF Voltage Regulators (2.5 V to 3.3 V). If LDOs are not being used, short Pin 8 to
Pin 7.
Output of RX18VF Voltage Regulator.
ADC Common-Mode Voltage Output.
Differential ADC I Inputs. Full-scale input voltage range is 1.56 V p-p differential.
Control pin for LDOs (GND = Disable all LDOs, Float = Enable DVDD18 LDO Only, DRVDD = Enable All
LDOs).
Reset. Active low to reset the configuration registers to default values and reset device.
Clock Input for Serial Port.
Active Low Chip Select.
Bidirectional Data Line for Serial Port.
Digital Core Ground.
Input/Output Pad Ring Supply Voltage (1.8 V to 3.3 V).
ADC Output Data in Full Duplex Mode. ADC output data and DAC input data in half-duplex mode.
Output Signal Indicating from Which ADC the Output Data Is Sourced.
Qualifying Clock for the TRXD Bus.
Qualifying Clock for the TXD Bus. It can be configured as either an input or output.
Dual Function Pin. In half-duplex mode (TXnRX), this pin controls the direction of the TRX port. In fullduplex mode (TXIQ), this input signal indicates to which DAC, I or Q, the TxDAC Input Data is intended.
TxDAC Input Data.
Digital Core 1.8 V Supply.
Output of DLL18V Voltage Regulator.
Rev. 0 | Page 11 of 60
AD9961/AD9963
Pin No.
54
55
56,57
58
Mnemonic
DLLFILT
CLK18V
CLKN, CLKP
CLK33V
59, 60
61, 67
62
63
64
65, 66
68
69
70
TXQN, TXQP
TXVDD
TXCML
REFIO
TXGND
TXIP, TXIN
DAC12B
DAC12A
AUXIO3
71
AUXIO2
72
AUXIN1
EPAD
Description
DLL Filter Output.
Output of CLK18V Voltage Regulator.
Differential Input Clock.
Input to CLK18V and DLL18V Voltage Regulators (1.8 V to 3.3 V). If LDOs are not being used, short Pin 58
to Pin 55. CLK33V must track TXVDD.
Complementary DAC Q Current Outputs.
Analog Supply Voltage for Tx Path (1.8 V to 3.3V). TXVDD must track CLK33V.
Common-Mode Input Voltage for the I and Q Tx DACs.
Decoupling Point for Internal DAC 1.0 V Bandgap Reference. Use a 0.1 µF capacitor to AGND.
Transmit Path Ground.
Complementary DAC I Current Outputs.
Auxiliary DAC B Output.
Auxiliary DAC A Output.
Selectable Analog Pin. Programmable to either Input 3 of the auxiliary ADC or to the auxiliary DAC10B
output.
Selectable Analog Pin. Programmable to either Input 2 of the auxiliary ADC or to the auxiliary DAC10A
output.
Input 1 of Auxiliary ADC.
Thermal Pad Under Chip. This must be connected to AGND for proper chip operation. It provides both a
thermal and electrical connection to the PCB.
Rev. 0 | Page 12 of 60
AD9961/AD9963
TYPICAL PERFORMANCE CHARACTERISTICS
100
95
95
90
90
85
85
IFS = 4mA
80
SFDR (dBc)
SFDR (dBc)
IFS = 2mA
80
75
75
70
IFS = 1mA
70
IFS = 2mA
65
IFS = 1mA
60
65
50
0
10
20
30
40
50
60
fOUT (MHz)
08801-201
60
0
10
20
30
40
50
60
fOUT (MHz)
Figure 4. Second Harmonic Distortion vs. fOUT Over Full-Scale Current,
fDAC = 125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 1.8 V
08801-204
55
Figure 7. Third Harmonic Distortion vs. fOUT Over Full-Scale Current,
fDAC = 125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 3.3 V
90
95
85
90
80
SFDR (dBc)
SFDR (dBc)
85
75
IFS = 2mA
70
IFS = 1mA
65
0dBFS
80
75
–3dBFS
60
70
55
–6dBFS
10
20
30
40
50
60
fOUT (MHz)
65
0
10
20
30
40
50
60
fOUT (MHz)
Figure 5. Third Harmonic Distortion vs. fOUT Over Full-Scale Current,
fDAC = 125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 1.8 V
08801-205
0
08801-202
50
Figure 8. Second Harmonic Distortion vs. fOUT Over Digital Scale,
fDAC = 125 MHz, 1×, Full-Scale Current = 2 mA, TXVDD = 1.8 V
100
90
95
85
90
80
0dBFS
IFS = 4mA
80
SFDR (dBc)
SFDR (dBc)
85
IFS = 2mA
75
70
IFS = 1mA
75
70
65
–6dBFS
65
–3dBFS
60
60
55
55
50
20
30
fOUT (MHz)
40
50
60
0
10
20
30
40
50
60
fOUT (MHz)
Figure 6. Second Harmonic Distortion vs. fOUT Over Full-Scale Current,
fDAC = 125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 3.3 V
Rev. 0 | Page 13 of 60
Figure 9. Third Harmonic Distortion vs. fOUT Over Digital Scale,
fDAC = 125 MHz, 1×, Full-Scale Current = 2 mA, TXVDD = 1.8 V
08801-206
10
08801-203
50
0
AD9961/AD9963
100
–10
95
–20
DIRECT CLOCK
DLL × 25
–30
90
POWER (dBm)
SFDR (dBc)
–40
85
80
0dBFS
75
–3dBFS
–50
–60
–70
70
–80
65
–90
0
10
20
30
40
50
–100
08801-207
60
60
fOUT (MHz)
0
Figure 10. Second Harmonic Distortion vs. fOUT Over Digital Scale,
fDAC = 125 MHz, 1×, Full-Scale Current = 2 mA, TXVDD = 3.3 V
50
100
150
FREQUENCY (MHz)
200
250
08801-210
–6dBFS
Figure 13. Transmit DAC Output Spectrum, Full-Scale Current = 2 mA,
TXVDD = 3.3 V, fOUT = 10 MHz, fDAC = 125 MHz
100
1.0
95
–6 dBFS
90
0.5
80
0 dBFS
DNL (LSB)
SFDR (dBc)
85
75
–3 dBFS
70
0
65
–0.5
60
0
10
20
30
40
50
60
fOUT (MHz)
–1.0
08801-208
50
0
512
1024
1536
2048
2560
3072
3584
4096
3584
4096
SAMPLES
Figure 11. Third Harmonic Distortion vs. fOUT Over Digital Scale,
fDAC = 125 MHz, 1×, Full-Scale Current = 2 mA, TXVDD = 3.3 V
08801-211
55
Figure 14. Auxiliary ADC DNL
–10
1.0
DIRECT CLOCK
DLL x25
–20
–30
0.5
–50
INL (LSB)
POWER (dBm)
–40
–60
0
–70
–80
–0.5
0
50
100
150
FREQUENCY (MHz)
200
250
Figure 12. Transmit DAC Output Spectrum, Full-Scale Current = 2 mA,
TXVDD = 3.3 V, fOUT = 50 MHz, fDAC = 125 MHz
Rev. 0 | Page 14 of 60
–1.0
0
512
1024
1536
2048
2560
3072
SAMPLES
Figure 15. Auxiliary ADC INL
08801-212
–100
08801-209
–90
100
8
95
6
90
4
85
2
80
SFDR (dBc)
10
0
–2
70
–4
65
–6
60
–8
55
50
5
15
25
35
45
55
65
75
85
95
TEMPERATURE (°C)
0
10
20
30
40
50
60
fOUT (MHz)
Figure 16. Typical Die Temperature Readback Error vs. Ambient Temperature
REF –38.23dBm
#AVG
LOG 10dB/
IDAC 3.3V CMOS
THIRD HARMONIC (dBc)
08801-216
–10
–40 –35 –25 –15 –5
IDAC 3.3V CMOS
SECOND HARMONIC (dBc)
75
08801-213
ERROR (°C)
AD9961/AD9963
Figure 19. AD9961, Second and Third Harmonic Distortion vs. fOUT, fDAC =
125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 3.3 V
100
ATTEN 2dB
SFDR (dBFS)
90
EXT REF
DC COUPLED
SNR OR SFDR (dBc, dBFS)
80
SNR (dBFS)
70
60
50
40
SFDR (dBc)
30
20
SNR (dBc)
PAVG
10
W1 S2
CENTER 21.00MHz
#RES BW 30kHz
Figure 17. One-Carrier W-CDMA ACLR Performance, IF = ~21 MHz
0
–80
–60
–50
–40
–30
–20
–10
0
fIN (dBm)
Figure 20. SNR/SFDR vs. Analog Input Level, fIN = 10 MHz, fADC = 100 MSPS
100
100
95
90
SFDR (dBFS)
80
SNR OR SFDR (dBc, dBFS)
90
IDAC 1.8V CMOS
SECOND HARMONIC (dBc)
85
80
75
70
65
IDAC 1.8V CMOS
THIRD HARMONIC (dBc)
60
SNR (dBFS)
70
60
50
40
SFDR (dBc)
30
20
55
SNR (dBc)
10
50
10
20
30
40
50
60
fOUT (MHz)
Figure 18. AD9961, Second and Third Harmonic Distortion vs. fOUT,
fDAC = 125 MHz, 1×, Digital Scale = 0 dBFS, TXVDD = 1.8 V
0
–80
08801-215
0
–70
–60
–50
–40
fIN (dBm)
–30
–20
–10
0
08801-218
SFDR (dBc)
–70
08801-214
RMS RESULTS
CARRIER POWER
–25.07dBm/
3.84000MHz
SPAN 33.84MHz
VBW 300kHz SWEEP 109.8ms (601pts)
LOWER
UPPER
FREQ OFFSET REF BW
dBc
dBm
dBc
dBm
5.000MHz
3.840MHz –73.49 –98.57 –73.85 –98.92
10.00MHz
3.840MHz –72.90 –97.97 –73.11 –98.19
15.00MHz
3.840MHz –73.44 –98.51 –73.56 –98.63
08801-217
10
Figure 21. SNR/SFDR vs. Analog Input Level, fIN = 70 MHz, fADC = 100 MSPS
Rev. 0 | Page 15 of 60
AD9961/AD9963
1.2
100
1.0
90
0.8
IDAC 125MHz
80
0.4
IMD (dB)
0.2
LSB
IDAC 35MHz
INL
DNL
0.6
0
–0.2
70
IDAC 70MHz
60
–0.4
–0.6
50
–0.8
–1.0
512
1024
1536
2048
2560
3072
3584
4096
CODE
08801-219
0
Figure 22. Rx Path ADC, INL and DNL
0
10
20
30
40
50
60
fOUT (MHz)
08801-222
40
–1.2
Figure 25. Intermodulation Distortion vs. fOUT Over fDAC, TXVDD = 3.3 V,
Full-Scale Current = 2 mA
155
100
IDAC, 125MHz, 4mA, 0dB
153
90
151
QDAC, BOARD 4
IDAC, 125MHz, 2mA, 0dB
80
147
IMD (dB)
NSD (–dBm/Hz)
149
145
QDAC, 125MHz, 1mA, 0dB
143
QDAC, BOARD 3
70
QDAC, BOARD 1
60
141
139
50
137
10
20
30
40
50
60
70
fOUT (MHz)
40
Figure 23. Transmit DAC Noise Spectral Density vs. fOUT
Over Full-Scale Current
0
10
20
30
40
50
60
fOUT (MHz)
08801-223
0
08801-220
135
Figure 26. Intermodulation Distortion vs. fOUT , TXVDD = 3.3 V, Full-Scale
Current = 2 mA, Board-to-Board Variation
155
100
153
90
151
IDAC, 125MHz, 2mA, 0dB
80
IDAC, 125MHz, 2mA, –3dB
QDAC –6dB
147
IMD (dB)
NSD (–dBm/Hz)
149
145
143
QDAC –3dB
70
QDAC 0dB
IDAC, 125MHz, 2mA, –6dB
60
141
139
50
0
10
20
30
fOUT (MHz)
40
50
60
Figure 24. Transmit DAC Noise Spectral Density vs. fOUT Over Digital Scale
Rev. 0 | Page 16 of 60
40
0
10
20
30
40
50
60
fOUT (MHz)
Figure 27. Intermodulation Distortion vs. fOUT Over Digital Scale,
TXVDD = 3.3 V, Full-Scale Current = 2 mA
08801-224
135
08801-221
137
AD9961/AD9963
100
–60
95
85
80
75
–65
MIN PIPE SFDR (dBFS)
MID PIPE SFDR (dBFS)
MAX PIPE SFDR (dBFS)
MIN PIPE SNR (dBFS)
MID PIPE SNR (dBFS)
MAX PIPE SNR (dBFS)
THD (dBc)
SNR OR SFDR (dBFS)
90
–70
–75
70
65
60
50
40
30
20
10
0
fIN (dBm)
0
60
80
100
120
140
Figure 31. AD9963 1.8 V CMOS IADC, 100 MSPS Single Tone AC
80
–70
78
–72
SECOND HARMONIC (dBc)
76
74
–74
–76
–78
72
20
40
60
80
100
120
140
fIN (MHz)
0
08801-226
0
20
40
60
80
100
120
140
fIN (MHz)
08801-229
–80
70
Figure 32. AD9963 1.8 V CMOS IADC, 100 MSPS Single Tone AC
Figure 29. AD9963 100 MSPS Single Tone AC
–65
68
–70
THIRD HARMONIC (dBc)
70
66
64
–75
–80
–85
62
–90
0
20
40
60
80
100
120
140
fIN (MHz)
08801-227
60
0
20
40
60
80
100
120
140
fIN (MHz)
Figure 33. AD9963 1.8 V CMOS IADC, 100 MSPS Single Tone AC
Figure 30. AD9963 1.8 V CMOS IADC, 100 MSPS Single Tone AC
Rev. 0 | Page 17 of 60
08801-230
SFDR (dB)
40
fIN (MHz)
Figure 28. SNR/SFDR vs. Analog Input Level Over Full-Scale Input Range,
fIN = 70 MHz, fADC = 100 MSPS
SNR (dB)
20
08801-228
–80
70
08801-225
60
80
AD9961/AD9963
TERMINOLOGY
Linearity Error (Integral Nonlinearity or INL)
Linearity error is defined as the maximum deviation of the
actual analog output from the ideal output, determined by a
straight line drawn from zero scale to full scale.
Spurious Free Dynamic Range (SFDR)
The difference, in decibels, between the peak amplitude of the
output signal and the peak spurious signal between dc and the
frequency equal to half the input data rate.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured fundamental. It is
expressed as a percentage or in decibels.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
The deviation of the output current from the ideal of zero is
called offset error. For TXIN, 0 mA output is expected when the
inputs are all 0s. For TXIP, 0 mA output is expected when all
inputs are set to 1.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the difference between the output
when all inputs are set to 1 and the output when all inputs are
set to 0.
Output Compliance Range
The range of allowable voltage at the output of a current-output
DAC. Operation beyond the maximum compliance limits can
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the
Nyquist frequency, excluding the first six harmonics and dc.
The value for SNR is expressed in decibels.
Adjacent Channel Leakage Ratio (ACLR)
The ratio in dBc between the measured power within a channel
relative to its adjacent channel.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect of
wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
Temperature Drift
Temperature drift is specified as the maximum change from the
ambient (25°C) value to the value at either TMIN or TMAX. For
offset and gain drift, the drift is reported in parts per million of
full-scale range (FSR) per degree Celsius (°C). For reference
drift, the drift is reported in parts per ppm/°C.
Power Supply Rejection
The maximum change in the full-scale output as the supplies
are varied from minimum to maximum specified voltages.
Settling Time
The time required for the output to reach and remain within a
specified error band around its final value, measured from the
start of the output transition.
Rev. 0 | Page 18 of 60
AD9961/AD9963
THEORY OF OPERATION
The AD9961/AD9963 are targeted to cover the mixed-signal
front-end needs of multiple wireless communications systems.
They feature a receive path that consists of dual 10-/12-bit
receive ADCs and a transmit path that consists of dual
10-/12-bit transmit DACs (TxDAC). The AD9961/AD9963
integrate additional functionality typically required in most
systems, such as power scalability, Tx gain control, and clock
multiplication circuitry.
In full duplex mode, the AD9961/AD9963 use two 12-bit buses,
along with qualifying clock signals, to transfer Rx path data and
Tx path data. These two buses support either single data rate or
double data rate data transfers. The data bus, along with many
other device options, is configurable through the serial port by
writing internal registers. The device can also be used in a
single-port, half-duplex configuration.
The AD9961/AD9963 minimize both size and power
consumption to address the needs of a range of applications
from the low power portable market to the high performance
femto base station market. The part is provided in a 72-lead
lead frame chip scale package (LFCSP) that has a footprint of
only 10 mm × 10 mm. Power consumption can be optimized to
suit the particular application by incorporating power-down
controls, low power ADC modes, and TxDAC power scaling.
Rev. 0 | Page 19 of 60
AD9961/AD9963
SERIAL CONTROL PORT
Table 10. Byte Transfer Count
The AD9961/AD9963 serial control ports are a flexible,
synchronous, serial communications port that allows an easy
interface with many industry-standard microcontrollers and
microprocessors. The AD9961/AD9963 serial control ports are
compatible with most synchronous transfer formats, including
both the Motorola SPI and Intel® SSR® protocols. The serial
control port allows read/write access to all registers that
configure the AD9961/AD9963. Single or multiple byte
transfers are supported, as well as MSB first or LSB first transfer
formats.
Serial Control Port Pin Descriptions
The serial control port has three pins, SCLK, SDIO, and CS:
•
SCLK (serial clock) is the input clock used to register serial
control port reads and writes. Write data bits are registered
on the rising edge of this clock, and read data bits are
registered on the falling edge. This pin is internally pulled
down by a 30 kΩ resistor to ground.
•
SDIO (serial data input/output) functions as both the
input and output data pin.
•
CS (chip select bar) is an active low control that gates the
read and write cycles. When CS is high, SDIO is in a high
impedance state and SCLK is disabled. This pin is
internally pulled up by a 30 kΩ resistor to DRVDD.
N1
0
0
1
1
N0
0
1
0
1
Bytes to Transfer
1
2
3
Streaming mode
A12 to A0 select the address within the register map that is
written to or read from during the data transfer portion of the
communications cycle. For multibyte transfers, the address is
the starting byte address.
Only Address Bits[A7:A0] are needed to cover the range of
the 0xFF registers used by the AD9961/AD9963. Address
Bits[A12:A8] must always be 0.
Write Transfer
If the instruction header indicates a write operation, the bytes
of data written onto the SDIO line are loaded into the serial
control port buffer of the AD9961/AD9963. Data bits are
registered on the rising edge of SCLK.
The length of the transfer (1 byte, 2 byte, 3 bytes, or streaming
mode) is indicated by two bits (N1:N0) in the instruction byte.
During a write, streaming mode does not skip over unused or
reserved registers; therefore, the user must know what bit
pattern to write to the reserved registers to preserve proper
operation of the part. It does not matter what data is written to
unused registers.
GENERAL OPERATION OF SERIAL CONTROL PORT
Read Transfer
The falling edge of CS, in conjunction with the rising edge of
SCLK, determines the start of a communication cycle. There
are two parts to a communication cycle with the AD9961/
AD9963. The first part writes a 16-bit instruction word into the
AD9961/AD9963, coincident with the first 16 SCLK rising
edges. The instruction word provides the AD9961/AD9963
serial control ports with information regarding the data
transfer, which is the second part of the communication cycle.
The instruction word defines whether the upcoming data
transfer is a read or a write, the number of bytes in the data
transfer, and the starting register address for the first byte of the
data transfer.
If the instruction word is for a read operation, the next N × 8
SCLK cycles clock out the data from the address specified in the
instruction word, where N is 1 to 3 as determined by N1:N0.
If N = 4, the read operation is in streaming mode, and
continues until CS is raised. Streaming mode does not skip over
reserved or unused registers. The readback data is valid on the
falling edge of SCLK.
Instruction Header
The MSB of the instruction word is R/W, which indicates
whether the serial port transfer is a read or a write. The next
two bits, N1:N0, indicate the length of the transfer in bytes. The
final 13 bits are the address (A12 to A0) at which to begin the
read or write operation.
For a write, the instruction word is followed by the number of
bytes of data indicated by Bit N1 to Bit N0 (see Table 10).
MSB/LSB First Transfers
The AD9961/AD9963 instruction word and byte data formats
can be selected to be MSB first or LSB first. The default for the
AD9961/AD9963 is MSB first. When MSB first mode is active,
the instruction and data bytes must be written from MSB to
LSB. Multibyte data transfers in MSB first format start with an
instruction byte that includes the register address of the most
significant data byte. Subsequent data bytes must follow in
order from the high address to the low address. In MSB first
mode, the serial control port internal address generator
decrements for each data byte of the multibyte transfer cycle.
When LSB first is active, the instruction and data bytes must be
written from LSB to MSB. Multibyte data transfers in LSB first
format start with an instruction byte that includes the register
address of the least significant data byte followed by multiple data
bytes. The internal byte address generator of the serial control
port increments for each byte of the multibyte transfer cycle.
Rev. 0 | Page 20 of 60
AD9961/AD9963
Table 11. Streaming Mode (No Addresses Are Skipped)
When LSB first is set by Register 0x00, Bit 2 and Register 0x00,
Bit 6, it takes effect immediately. In multibyte transfers,
subsequent bytes reflect any changes in the serial port
configuration. To avoid problems reconfiguring the serial port
operation, any data written to 0x00 must be mirrored (the eight
bits should read the same, forward or backward). Mirroring the
data makes it irrelevant whether LSB first or MSB first is in
effect. As an example of this mirroring, the default setting for
Register 0x00 is 00011000.
Write Mode
LSB First
MSB First
Address Direction
Increment
Decrement
Stop Sequence
0xFD, 0xFE, 0xFF, stop
0x01, 0x00, 0xFF, stop
SUB SERIAL INTERFACE COMMUNICATIONS
The AD9963/AD9961 have two registers that require a different
communication sequence. These registers are 0x0F and 0x10.
The write sequence for these two registers requires a write to
Register 0x05, a write to the Register (0x0F or 0x10), and then a
write to Register 0xFF. The write takes effect when the write to
Register 0xFF is completed.
Ending Transfers
When the transfer is 1, 2, or 3 bytes, the data transfer ends after
the required number of clock cycles have been received. CS can
be raised after each sequence of eight bits to stall the bus (except
after the last byte, where it ends the cycle). When the bus is
stalled, the serial transfer resumes when CS is lowered. Raising
CS on a non byte boundary resets the serial control port.
For example, to enable the RXCML pin output buffer, the
register write sequence is:
The AD9961/AD9963 serial control port register addresses
decrement from the register address just written toward 0x00
for multibyte I/O operations if the MSB first mode is active
(default). If the LSB first mode is active, the register address of
the serial control port increments from the address just written
toward 0xFF for multibyte I/O operations.
Streaming mode transfers always terminate when CS is raised.
Streaming mode transfers also terminate whenever the address
reaches 0xFF. Note that unused addresses are not skipped
during multibyte I/O operations. To avoid unpredictable device
behavior, do not write to reserved registers.
1.
Write 0x03 into Register 0x05. This addresses both of the
Rx ADCs.
2.
Write 0x02 into Register 0x0F. This sets the RXCML
enable bit.
3.
Write 0x01 into Register 0xFF. This updates the internal
register, which activates the RXCML buffer.
4.
Write 0x00 into Register 0x05. This returns the SPI to the
normal addressing mode.
An example of updating Register 0x10 is given in the ADC
Digital Offset Adjustment section.
Table 12. Serial Control Port, 16-Bit Instruction Word, MSB First
MSB
I15
I14
I13
I12
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
LSB
I0
R/W
N1
N0
0
0
0
0
0
A7
A6
A5
A4
A3
A2
A1
A0
CS
SCLK DON’T CARE
DON’T CARE
A7
A6
A5
A4
A3
A1
A2
A0
D7 D6
16-BIT INSTRUCTION HEADER
D5
D4
D3
D2
D1
D0
REGISTER (N) DATA
D7
D6
D4
D5
D3
D2
D1
D0
DON’T CARE
08801-038
SDIO DON’T CARE R/W N1 N0 A12 A11 A10 A9 A8
REGISTER (N – 1) DATA
Figure 34. Serial Control Port Access—MSB First, 16-Bit Instruction, 2-Byte Data
tDS
tS
tHIGH
tDH
CS
DON’T CARE
SDIO
DON’T CARE
DON’T CARE
R/W
N1
N0
A12
A11
A10
A9
A8
A7
A6
A5
D4
D3
D2
D1
Figure 35. Serial Control Port Write—MSB First, 16-Bit Instruction, Timing Measurements
Rev. 0 | Page 21 of 60
D0
DON’T CARE
08801-040
SCLK
tC
tCLK
tLOW
AD9961/AD9963
CS
SCLK
DATA BIT N
08801-041
tDV
SDIO
SDO
DATA BIT N – 1
Figure 36. Timing Diagram for Serial Control Port Register Read
CS
SCLK DON’T CARE
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9 A10 A11 A12 N0
N1 R/W D0
16-BIT INSTRUCTION HEADER
D1
D2
D3
D4
D5
REGISTER (N) DATA
D6
D7
D0
D1
D2
D3
D4
D5
D6
D7
DON’T CARE
08801-042
SDIO DON’T CARE
DON’T CARE
REGISTER (N + 1) DATA
Figure 37. Serial Control Port Access—LSB First, 16-Bit Instruction, Two Bytes Data
tC
tS
CS
tCLK
tHIGH
tLOW
tDS
SCLK
SDIO
BIT N
BIT N + 1
08801-043
tDH
Figure 38. Serial Control Port Timing—Write
Table 13. Serial Control Port Timing
Parameter
tDS
tDH
tCLK
tS
Timing (Min, ns)
5.0
5.0
20.0
5.0
tC
2
tHIGH
tLOW
tDV
10
10
5.0
Description
Setup time between data and rising edge of SCLK.
Hold time between data and rising edge of SCLK.
Period of the clock.
Setup time between CS falling edge and SCLK rising edge (start of communication
cycle).
Setup time between SCLK rising edge and CS rising edge (end of communication
cycle).
Minimum period that SCLK should be in a logic high state.
Minimum period that SCLK should be in a logic low state.
SCLK to valid SDIO and SDO (see Figure 36).
Rev. 0 | Page 22 of 60
AD9961/AD9963
CONFIGURATION REGISTERS
Table 14. Configuration Register Map
Addr
0x00
0x05
0x0F
0x10
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
Default
0x18
0x00
0x00
0x00
0x3F
0xA7
0xA7
Varies
Varies
0x10
0x08
0x10
0x06
0x00
0x51
0x51
0xF0
0x00
0x09
0x07
0x01
0x41
0x42
0x43
0x44
0x45
0x46
0x47
0x48
0x49
0x4A
0x50
0x51
0x52
0x53
0x54
0x55
0x5C
0x60
0x61
0x62
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x93
0x34
0x5F
0x36
0x08
0x00
0x00
0xF8
0x63
0x66
0x68
0x69
0x6A
0x6B
0x6C
0x6D
0x6E
0x00
0x28
0x00
0x00
0x00
0x00
0x00
0x00
0x40
Bit 7
SDIO
Bit 6
LSB First
Unused
Unused
TX_SDR
TXCKO_INV
RX_SDR
Unused
Unused
FIFO_INIT
Bit 5
Reset
Bit 4
1
Unused
Bit 3
1
Bit 2
Reset
Bit 1
LSB First
ADDRQ
RXCML
Bit 0
SDIO
ADDRI
ADC_OFFSET[5:0]
INT1_BP
INT0_BP
SRRC_BP
TXCLK_EN
RXCLK_EN
TXCLK_MD[1:0]
TXCKI_INV
TXIQ_HILO
TX_IFIRST
TX_BNRY
RXCLK_MD[1:0]
RXCLK_INV
RXIQ_HILO
RX_IFIRST
RX_BNRY
Aligned
ALIGN_ACK
ALIGN_REQ
FIFO_OFFSET[2:0]
FIFO_LVL[7:0]
Unused
SRRC_SCALE[4:0]
Unused
INT0_SCALE[4:0]
Unused
INT1_SCALE[4:0]
Unused
DEC_SCALE[4:0]
RXDLLRST
TXDLLRST
Unused
RXDLL_LKD
TXDLL_LKD
RXDBL_SEL
TXDBL_SEL
TX_UNLOCK[1:0]
TX_LOCK[1:0]
TX_DLYOFS[1:0]
TX_HYST[1:0]
RX_UNLOCK[1:0]
RX_LOCK[1:0]
RX_DLYOFS[1:0]
RX_HYST[1:0]
DBL_TAPDLY[7:0]
Unused
RX_INVQ
RX_INVI
TX_INVQ
TX_INVI
Unused
TX_DBLPW[2:0]
RX_DBLPW[2:0]
Unused
RX_CLK
RX_BUS
SINGLERX
TXCLK_MD
HD_BUSCTL
HD_CLKMD
FULL_DUPLEX
AUXDAC_
DAC_
DAC12B_EN
DAC12A_EN
DAC12B_TOP DAC12A_TOP
Unused
REF
UPDATE
DAC12A[11:4]
Unused
DAC12A[3:0]
DAC12B[11:4]
Unused
DAC12B[3:0]
DAC10B_EN
Unused
DAC10B_TOP[2:0]
DAC10B_RNG[1:0]
DAC10B[9:2]
Unused
DAC10B[1:0]
DAC10A_EN
Unused
DAC10A_TOP[2:0]
DAC10A_RNG[1:0]
DAC10A[9:2]
Unused
DAC10A[1:0]
Unused
TX_PTTRN
TX_INSEL
TX_CONT
TX_START
TX_BISTEN
Unused
RX_PTTRN
RX_INSEL
RX_CONT
RX_START
RX_BISTEN
TXI_CHK[15:8]
TXI_CHK[7:0]
TXQ_CHK[15:8]
TXQ_CHK[7:0]
Chip ID[7:0]
DLL_EN
TXDAC_PD
TXI_SLEEP
TXQ_SLEEP
CLK_PD
RXADC_PD
RXQ_SLEEP
RXI_SLEEP
Unused
DLL_LDO_PD
DLLBIAS_PD
CLK_LDO_PD
RX_LDO_PD
RXF_LDO_PD
AUXADC_PD
AUX_REF_PD
DLL_LDO_
RXF_LDO_
DIG_LDO_
CLK_LDO_STAT RX_LDO_
Unused
Unused
RSET_SEL
STAT
STAT
STAT
STAT
TRXD_DRV
TRXIQ_DRV
TRXCLK_DRV
TXCLK_DRV
TXI_DCLK
TXQ_DCLK
Unused
RXI_DCLK
RXQ_DCLK
DCS_BP
ADCDIV[1:0]
Unused
IGAIN1[5:0]
Unused
IGAIN2[5:0]
Unused
IRSET[5:0]
Unused
QGAIN1[5:0]
Unused
QGAIN2[5:0]
Unused
QRSET[5:0]
Unused
REFIO_ADJ[5:0]
DEC_BP
Rev. 0 | Page 23 of 60
AD9961/AD9963
Addr
0x71
0x72
0x75
0x77
0x78
0x79
0x7A
0x7B
0x7D
0x7E
0x7F
0x80
Default
0x00
0x01
0x00
0x00
Varies
Varies
0x00
0x00
0x00
0x00
0x00
0x00
0x81
0x82
0x00
0x00
0xFF
0x00
Bit 7
ADCCLKSEL
DLL_Locked
Bit 6
DACCLKSEL
Bit 5
Unused
DLLDIV
0
Bit 4
DLL_REF_EN
Unused
Bit 2
Bit 1
N[3:0]
Bit 0
M[4:0]
DLL_RESB
CONV_TIME[1:0]
AUXADC_EN
TMPSNS_EN
Bit 3
AUXADC[3:0]
AUXADC_RESB
Unused
Unused
RXTrim_EN
RXTrim_Fine
0
AUXADC_CH[2:0]
Unused
AUXADC[11:4]
CONV_COMPL
Unused
AUXREF_ADJ[2:0]
AUXCML_EN
RXI_Trim[9:2]
Unused
CHAN_SEL[2:0]
AUXDIV[2:0]
Unused
RX_FSADJ[4:0]
0
RX_DC
RXI_Trim[1:0]
GAINCAL_
ENI
RXQ_Trim[1:0]
GAINCAL_
ENQ
Update
RXQ_Trim[9:2]
Unused
Unused
CONFIGURATION REGISTER BIT DESCRIPTIONS
Table 15.
Register Name
Serial Port Config
Register
Address
0x00
Bit(s)
7, 0
Parameter
SDIO
6, 1
LSB_First
5, 2
RESET
ADC Address
0x05
1:0
ADDRQ, ADDRI
CM Buffer Enable
0x0F
1
RXCML
ADC Offset
0x10
5:0
ADC_OFFSET[5:0]
Digital Filters
0x30
7:6
5
4
3
Unused
DEC_BP
INT1_BP
INT0_BP
Function
0: use SDIO pin as input data only.
1: use SDIO as both input and output data.
0: first bit of serial data is MSB of data byte.
1: first bit of serial data is LSB of data byte.
A transition from 0 to 1 on this bit resets the device. All registers but
Register 0x00 revert to their default values.
Bits are set to determine which device on chip receives ADC specific
write commands. ADC specific write commends include writes to
Registers 0x0F and Register 0x10. These writes also require a rising end
on the Update bit (Register 0xFF, Bit 0).
00: no ADCs are addressed.
01: I ADC is addressed.
10: Q ADC is addressed
11: both I and Q ADCs are addressed.
Enable control for the RXCML output buffer.
Note that updating this bit also requires writing to Register 0x05 and
Register 0xFF as described in the Sub Serial Interface Communications
section.
0: RXCML pin is high impedance.
1: RXCML pin is a low impedance 1.4 V output.
Adds a dc offset to the ADC output of whichever ADC is addressed by
Register 0x05. The offset applied is as follows:
011111: offset = +31 LSBs
…
000001: offset = +1 LSB
000000: offset = 0 LSB
111111: offset = −1 LSB
…
100000: offset = −32 LSBs
1: bypass 2× decimator in Rx path (D0).
1: bypass 2× Half-Band Interpolation Filter 1 (INT1).
1: bypass 2× Half-Band Interpolation Filter 0 (INT0).
Rev. 0 | Page 24 of 60
AD9961/AD9963
Register Name
Tx Data Interface
Register
Address
0x31
Bit(s)
2
Parameter
SRRC_BP
1
0
7
TXCLK_EN
RXCLK_EN
TX_SDR
6
TXCKO_INV
5:4
TXCLK_MD[1:0]
3
TXCKI_INV
2
TXIQ_HILO
1
TX_IFIRST
Function
1: bypass 2× SRRC interpolation filter (SRRC).
The filter chain is SRRC→INT0→INT1.
If SRRC filter is enabled, the other two filters are enabled too.
1: enables data clocks for transmit path.
1: enables data clocks for receive path.
0: chooses DDR clocking mode. Tx data is driven out on both edges of
the TXCLK signal.
1: chooses bus rate clocking mode. Tx data is driven out on one edge of
the TXCLK signal.
This signal inverts the phase of the transmit path output clock signal.
0: transmit path data transitions on the positive edge of the TXCLK signal.
1: transmit path data transitions on the positive edge of the TXCLK signal.
Controls the mode of the TXCLK pin. The TXCLK pin can be configured as
an input or an output. When configured as an output, it can have two
possible sources, the internal TXCLK signal or the DLL output signal.
00: disabled.
01: the TXCLK pin is configured as an input.
10: the TXCLK pin is configured as an output. The source signal is the
transmit path clock signal.
11: the TXCLK pin is configured as an output. The source signal is the DLL
output signal.
Note that the TXCLK signal may appear on either the TXCLK pin or the
TRXCLK pin, depending on the mode of the device. In Half-Duplex 1Clock mode, this signal is present on the TRXCLK pin when TX is active. In
Half-Duplex 2-Clock mode and Full-Duplex mode, this signal is present
on the TXCLK pin.
Selects which edge of the TXCLK signal samples the transmit path data.
0: TXPCLK negative edge latches transmit path data.
1: TXPCLK positive edge latches transmit path data.
Data appears on the TXD bus sequentially but is loaded into the transmit
path in pairs. TXIQ_HILO selects how the TXIQ signal marks each data
pair.
0: each data pair is marked by TXIQ being low then high.
1: each data pair is marked by TXIQ being high then low.
This bit sets the data pairing order of the I and Q samples on transmit
path.
0: selects that Q is first, followed by I.
1: selects that I is first, followed by Q.
Rx Data Interface
0x32
0
TX_BNRY
7
RX_SDR
6
5:4
Unused
RXCLK_MD[1:0]
This bit selects the data format of the transmit path data.
0: selects twos complement.
1: selects straight binary.
0: chooses DDR clocking mode. Rx data is driven out on both edges of
the TRXCLK signal.
1: chooses bus rate clocking mode. Rx data is driven out on one edge of
the TRXCLK signal.
This sets the way the internal RXCLK signal in the chip is driven.
00: disabled.
01: disabled.
10: RXCLK is driven by internal Rx path clock.
Rev. 0 | Page 25 of 60
AD9961/AD9963
Register Name
Register
Address
Bit(s)
Parameter
3
RXCLK_INV
2
RXIQ_HILO
Function
11: RXCLK is driven by the DLL output.
Note that the RXCLK signal is present on the TRXCLK pin with one
exception. In Half-Duplex 1-Clock mode, the RXCLK signal is present on
the TRXCLK pin when Rx is active, but the TXCLK signal appears on the
TRXCLK pin when TX is active.
0: uses TRxCLKIO negative edge to drive out Rxdata.
1: uses TRxCLKIO positive edge to drive out Rxdata.
Data appears on the RXD bus sequentially but is sampled in the Rx path
in pairs. RXIQ_HILO selects how the RXIQ signal marks each data pair.
0: each data pair is marked by RXIQ being low then high.
1: each data pair is marked by RXIQ being high then low.
FIFO Alignment
0x33
1
RX_IFIRST
0
RX_BNRY
7
6
5
4
3
2:0
Unused
FIFO_INIT
Aligned
ALIGN_ACK
ALIGN_REQ
FIFO_OFFSET[2:0]
FIFO Status
0x34
7:0
FIFO_LVL[7:0]
Tx Scale P
0x35
7:5
4:0
Unused
SRRC_SCALE[4:0]
7:5
4:0
Unused
INT0_SCALE[4:0]
Tx Scale 0
0x36
The Rx path I and Q ADCs sample simultaneously producing a pair of
samples. Because the RXD bus is shared, the sampled I and Q data
appears on the TRXD bus sequentially. This bit determines the order of
the paired samples.
0: Q appears first on Rx path.
1: I appears first on Rx path.
0: twos complement on Tx path.
1: straight binary on Tx path.
1: FIFO read and write pointers are aligned after chip reset.
1: FIFO read and write pointers aligned after frame input driven FIFO reset.
1: FIFO read and write pointers aligned after serial port driven FIFO reset.
1: request FIFO read and write pointers alignment via serial port.
Sets the FIFO read and write pointer phase offset following FIFO reset.
Normally this should be set to 4 to set the FIFFO to half full.
000 = 0.
001 = 1.
…
111 = 7.
Indicator of the amount of valid data in the FIFO. Each one indicates a
latched input sample in the FIFO. Ideally, the eight deep FIFO should be
half full, indicating four latched input samples. The indicator is a
thermometer code that can wrap around from LSB to MSB. Some
examples follow:
00011110: indicates that FIFO is half full. The read pointer is 1 and the
write pointer is 5.
10000111: indicates the FIFO is half full. The read pointer is 3 and the
write pointer is 7.
00100000: indicates the FIFO has only one latched sample and is nearly
empty.
01111111: indicates the FIFO has seven latched samples and is nearly
over flowing.
Value of 1.4 multiplier applied to both I and Q channels just after the
SRRC filter.
00000: multiply by 0.0.
00001: multiply by 0.0625.
…
11111: multiply by 1.9375.
Value of 1.4 multiplier applied to both I and Q channels just after
Interpolation Filter 0.
Rev. 0 | Page 26 of 60
AD9961/AD9963
Register Name
Register
Address
Tx Scale 1
Rx Scale
Clock Doubler
Config
TX Clock Doubler
Config
RX Clock Doubler
Config
Clock Doubler
Config
Data Spectral
Inversion
Clock Doubler
Pulse Width
Bit(s)
Parameter
0x37
7:5
4:0
Unused
INT1_SCALE[4:0]
0x38
7:5
4:0
Unused
DEC_SCALE[4:0]
7
RXDLLRST
6
5:4
3
2
1
TXDLLRST
Unused
RXDLL_LKD
TXDLL_LKD
RXDBL_SEL
0
TXDBL_SEL
0x3A
7:4
TX_UNLOCK[1:0]
The Rx clock doubler is locked.
The Tx clock doubler is locked.
0: selects fixed pulse width clock doubler.
1: selects fixed duty cycle clock doubler.
See Table 22 for configuration recommendations.
0: selects fixed pulse width clock doubler.
1: selects fixed duty cycle clock doubler.
See Table 22 for configuration recommendations.
Sets the number of clock cycles for the unlock indicator. Set to 01.
0x3B
3
2
1
7:4
TX_LOCK[1:0]
TX_DLYOFS[1:0]
TX_HYST[1:0]
RX_UNLOCK[1:0]
Sets the number of clock cycles for the lock indicator. Set to 01.
Sets delay line offset of clock doubler. Set to 01.
Sets delay line hysteresis of clock doubler. Set to 01.
Sets the number of clock cycles for the unlock indicator. Set to 01.
0x3C
3
2
1
7:0
RX_LOCK[1:0]
RX_DLYOFS[1:0]
RX_HYST[1:0]
DBL_TAPDLY[7:0]
Sets the number of clock cycles for the lock indicator. Set to 01.
Sets delay line offset of clock doubler. Set to 01.
Sets delay line hysteresis of clock doubler. Set to 01.
Sets the initial tap delay of the Rx and Tx clock doublers. Set to 0x02.
0x3D
7:4
Unused
RX_INVQ
RX_INVI
TX_INVQ
TX_INVI
Unused
1: multiply Rxdata from QADC by −1.
1: multiply Rxdata from IADC by −1.
1: multiply Txdata for QDAC by −1.
1: multiply Txdata for IDAC by −1.
0x3E
3
2
1
0
7:6
5:3
2:0
TX_DBLPW[2:0]
RX_DBLPW[2:0]
Sets the pulse width of the Tx clock doubler. See Table 22 for details.
Sets the pulse width of the Rx clock doubler. See Table 22 for details.
0x39
Function
00000: multiply by 0.0.
00001: multiply by 0.0625.
…
11111: multiply by 1.9375.
Value of 1.4 multiplier applied to both I and Q channels just after
Interpolation Filter 1.
00000: multiply by 0.0.
00001: multiply by 0.0625.
11111: multiply by 1.9375.
Value of 3.2 multiplier applied to both I and Q channels just after the
decimation filter. The value of the gain applied is equal to DEC_SCALE/4.
00000: multiply by 0.0.
00001: multiply by 0.25.
11111: multiply by 7.75.
1: resets the Rx signal path clock doubler.
1: resets the Tx signal path clock doubler.
Rev. 0 | Page 27 of 60
AD9961/AD9963
Register Name
Rx Data Interface
DAC12 Config
Register
Address
0x3F
0x40
Bit(s)
7
6
Parameter
Unused
RX_CLK
5
RX_BUS
4
SINGLERX
3
TXCLK_MD
2
HD_BUSCTL
1
HD_CLKMD
0
FULL_DUPLEX
7
DAC12B_EN
6
DAC12A_EN
5
DAC12B_TOP
4
DAC12A_TOP
3:2
1
Unused
AUXDAC_REF
0
DAC_UPDATE
7:0
7:4
3:0
7:0
7:4
3:0
7
DAC12A[11:4]
Unused
DAC12A[3:0]
DAC12B[11:4]
Unused
DAC12B[3:0]
DAC10B_EN
6:5
4:2
Unused
DAC10B_TOP[2:0]
Function
0: when SINGLERX is active, use Q side clock.
1: when SINGLERX is active, use I side clock.
0: when SINGLERX is active, use the Q ADC.
1: when SINGLERX is active, use the I ADC.
0: use both Rx paths.
1: use only one Rx path.
This bit controls the operation of the TXCLK pin when the chip is
configured in half-duplex 1-clock mode. This bit is otherwise ignored.
0: the TXCLK pin is set to a high impedance output.
1: the DLL clock output is driven onto the TXCLK pin.
0: selects SPI mode to control bus direction in half-duplex mode.
1: selects Pin mode to control bus direction in half-duplex mode.
SPI bit to set Tx or Rx is Register 0x30, Bit 0. Register 0x30, Bit 1 is ignored
in this case.
0: selects 1-clock submode if in half-duplex mode.
1: selects 2-clock submode if in half-duplex mode.
0: configures the digital interface for half-duplex mode (covers both 1clock and 2-clock submodes).
1: configures the digital interface for full-duplex mode.
0: powers down DAC12B.
1: enables DAC12B.
0: powers down DAC12A.
1: enables DAC12A.
0: sets DAC12B range to 3.3 × VAUXDACREF.
1: sets DAC12B range to 1.8 × VAUXDACREF.
0: sets DAC12A range to 3.3 × VAUXACREF.
1: sets DAC12A range to 1.8 × VAUXDACREF.
Selects where the voltage reference for all of the auxiliary DACs is
derived.
0: resistive divider from AUX33V. VAUXDACREF = VAUX33V /3.3.
1: selects the 1.0 V bandgap voltage. VAUXDACREF = 1.0 V.
This bit determines which of the two data words updates all four of the
auxiliary DACs.
0: update DACs after LSB write.
1: update DACs after MSB write.
DAC12A MSBs
DAC12A LSBs
0x41
0x42
DAC12B MSBs
DAC12B LSBs
0x43
0x44
DAC10B Config
0x45
DAC12A voltage control word (upper eight bits).
DAC12A voltage control word (lower four bits).
DAC12B voltage control word (upper eight bits).
DAC12B voltage control word (lower four bits).
0: powers down DAC10B.
1: enables DAC10B.
Sets the DAC output voltage at the top range as follows:
000: 1.0 V.
001: 1.5 V.
Rev. 0 | Page 28 of 60
AD9961/AD9963
Register Name
Register
Address
DAC10BMSBs
DAC10BLSBs
0x46
0x47
DAC10A Config
0x48
DAC10A MSBs
DAC10A LSBs
0x49
0x4A
TX BIST Control
0x50
RX BIST Control
0x51
Bit(s)
Parameter
1:0
DAC10B_RNG[1:0]
7:0
7:2
1:0
7
DAC10B[9:2]
Unused
DAC10B[1:0]
DAC10A_EN
6:5
4:2
Unused
DAC10A_TOP[2:0]
1:0
DAC10A_RNG[1:0]
7:0
7:2
1:0
7:5
4
DAC10A[9:2]
Unused
DAC10A[1:0]
Unused
TX_PTTRN
3
TX_INSEL
2
TX_CONT
1
TX_START
0
TX_BISTEN
7:5
4
Unused
RX_PTTRN
3
RX_INSEL
2
RX_CONT
Function
010: 2.0 V.
011: 2.5 V.
100: 3.0 V.
The total range of the DAC extends from top-of-range, to top-of-range
minus the span. The span is set as:
00: 2.0 V.
01: 1.5 V.
10: 1.0 V.
11: 0.5 V.
DAC10B voltage control word (eight most significant bits).
DAC10Bvoltage control word (two least significant bits).
0: powers down DAC10A.
1: enables DAC10A.
Sets the DAC output voltage at the top range as follows:
000: 1.0 V.
001: 1.5 V.
010: 2.0 V.
011: 2.5 V.
100: 3.0 V.
The total range of the DAC extends from top-of-range to top-of-range
minus the span. The span is set as:
00: 2.0 V.
01: 1.5 V.
10: 1.0 V.
11: 0.5 V.
DAC10A voltage control word (eight most significant bits).
DAC10A voltage control word (two least significant bits).
Unused
Chooses the pattern type for the BIST sequence.
0: selects checker board pattern (0xA5A, 0x5A5, 0xA5A, …).
1: selects PRN output.
0: selects pattern input from internal pattern generator.
1: selects pattern from the external pins of the Tx port.
0: runs the BIST for 512 cycles.
1: runs the BIST continuously.
0: keep the BIST engine in an idle state.
1: start the BIST sequence.
0: disable the BIST engine.
1: enable the BIST engine.
Chooses the pattern type for the BIST sequence.
0: selects checker board pattern (0xA5A, 0x5A5, 0xA5A, …).
1: selects PRN output.
0: selects pattern input from internal pattern generator.
1: selects pattern from the external pins of the Rx path.
0: runs the BIST for 512 cycles.
1: runs the BIST continuously.
Rev. 0 | Page 29 of 60
AD9961/AD9963
Register Name
TXI Check MSB
TXI Check LSB
TXQ Check MSB
TXQ Check LSB
Version
Power Down 0
Power Down 1
LDO Status
Output Drive
Register
Address
0x52
0x53
0x54
0x55
0x5C
0x60
0x61
0x62
0x63
Bit(s)
1
Parameter
RX_START
0
RX_BISTEN
7:0
7:0
7:0
7:0
7:0
7
TXI_CHK[15:8]
TXI_CHK[7:0]
TXQ_CHK[15:8]
TXQ_CHK[7:0]
Chip ID[7:0]
DLL_EN
6
TXDAC_PD
5
4
3
TXI_SLEEP
TXQ_SLEEP
CLK_PD
2
RXADC_PD
1
0
7
6
5
4
3
2
1
0
RXQ_SLEEP
RXI_SLEEP
Unused
DLL_LDO_PD
DLLBIAS_PD
CLK_LDO_PD
RX_LDO_PD
RXF_LDO_PD
AUXADC_PD
AUX_REF_PD
7
6
5
4
3
2
1
0
DLL_LDO_STAT
CLK_LDO_STAT
RX_LDO_STAT
RXF_LDO_STAT
DIG_LDO_STAT
Unused
Unused
RSET_SEL
7:6
TRXD_DRV
5:4
TRXIQ_DRV
Function
0: keep the BIST engine in an idle state.
1: start the BIST sequence.
0: disable the BIST engine.
1: enable the BIST engine.
MSB of the BIST signature value for the I side transmit path.
LSB of the BIST signature value for the I side transmit path.
MSB of the BIST signature value for the Q side transmit path.
LSB of the BIST signature value for the Q side transmit path.
Indicates device hardware revision number. Should read back as 0x08.
0: powers down DLL block.
1: enables DLL block.
1: powers down the bandgap reference voltage common to both
transmit DACs and all of the auxiliary DACs.
1: turns off IDAC output current.
1: turns off QDAC output current.
1: turns off clock receiver. This disables all clocks on the chip except for
the serial port clock.
1: powers down main ADC clock and the bandgap reference voltage
common to both receive ADCs.
1: powers down the Q ADC core.
1: powers down the I ADC core.
1: powers down LDO that supplies the DLL18V voltage rail.
1: powers down bias sub-block inside DLL block.
1: powers down LDO that supplies the CLK18V voltage rail.
1: powers down LDO that supplies the RX18V voltage rail.
1: powers down LDO that supplies the RX18VF voltage rail.
1: powers down AUXADC block.
1: powers down the auxiliary ADC voltage reference, allowing an external
reference to be used.
1: LDO to DLL block is on (read only).
1: LDO to CLOCK block is on (read only).
1: LDO to ADC blocks is on (read only).
1: LDO to FLASH section of ADC is on (read only).
1: LDO to digital core is on (read only).
0: selects internal 10 kΩ to generate 1 V reference.
1: selects external RSET to generate voltage reference.
Controls the drive strength of the TRXD[11:0] pins.
00: 4 mA output drive.
01: 8 mA output drive.
10: 12 mA output drive.
11: not valid.
Controls the drive strength of the TRXIQ pin.
00: 4 mA output drive.
01: 8 mA output drive.
10: 12 mA output drive.
11: not valid.
Rev. 0 | Page 30 of 60
AD9961/AD9963
Register Name
Clock Mode
I DAC Gain Ctrl 0
I DAC Gain Ctrl 1
I DAC Gain Ctrl 2
Q DAC Gain Ctrl 0
Q DAC Gain Ctrl 1
Q DAC Gain Ctrl 2
REFIO Adjust
Register
Address
0x66
0x68
0x69
0x6A
0x6B
0x6C
0x6D
0x6E
Bit(s)
3:2
Parameter
TRXCLK_DRV
1:0
TXCLK_DRV
7
6
5
4
3
2
1:0
TXI_DCLK
TXQ_DCLK
Unused
RXI_DCLK
RXQ_DCLK
DCS_BP
ADCDIV[1:0]
7:6
5:0
Unused
IGAIN1[5:0]
7:6
5:0
Unused
IGAIN2[5:0]
7:6
5:0
Unused
IRSET[5:0]
7:6
5:0
Unused
QGAIN1[5:0]
7:6
5:0
Unused
QGAIN2[5:0]
7:6
5:0
Unused
QRSET[5:0]
7:6
5:0
Unused
REFIO_ADJ[5:0]
Function
Controls the drive strength of the TRXCLK pin.
00: 4 mA output drive.
01: 8 mA output drive.
10: 12 mA output drive.
11: not valid.
Controls the drive strength of the TXCLK pin.
00: 4 mA output drive.
01: 8 mA output drive.
10: 12 mA output drive.
11: not valid.
1: disables internal clock to I DAC.
1: disables internal clock to Q DAC.
1: disables internal clock to I ADC.
1: disables internal clock to Q ADC.
1: disables duty cycle stabilizer block.
00: selects divide by 1. Bypasses internal divider block for RXCLK.
01: selects divide by 1. Bypasses internal divider block for RXCLK.
10: selects divide by 2.
11: selects divide by 4.
Linear in dB adjustment of the full-scale current of IDAC. Provides an
adjustment range of approximately ±6 dB in 0.25 dB steps. See Figure 57
for details.
Linear adjustment of the full-scale current of I DAC. Provides an
adjustment range of approximately ±2.5% in 0.08% steps. See Figure 55
for details.
Linear adjustment of the full-scale current of I DAC. Provides an
adjustment range of approximately ±20% in 0.625% steps. See Figure 55
for details.
Linear in dB adjustment of the full-scale current of Q DAC. Provides an
adjustment range of approximately ±6 dB in 0.25 dB steps. See Figure 56
for details.
Linear adjustment of the full-scale current of Q DAC. Provides an
adjustment range of approximately ±2.5% in 0.08% steps. See Figure 57
for details.
Linear adjustment of the full-scale current of Q DAC. Provides an
adjustment range of approximately ±20% in 0.625% steps. See Figure 55
for details.
Adjusts the on-chip reference voltage and output at REFIO. The transmit
DAC full-scale currents and the auxiliary DAC full-scale voltages are
proportional to the REFIO voltage. The approximate REFIO output
voltage by code is:
000000: VREF = 1.0 V.
000001: VREF = 1.00625 V.
…
011111: VREF = 1.19375 V.
Rev. 0 | Page 31 of 60
AD9961/AD9963
Register Name
Register
Address
Bit(s)
Parameter
DLL Control 0
0x71
7
ADCCLKSEL
6
DACCLKSEL
5
4
3:0
Unused
DLL_REF_EN
N[3:0]
7
6:5
DLL_Locked
DLLDIV[1:0]
4:0
M[4:0]
7:4
3
0
DLL_RESB
2:0
7:6
0
CONV_TIME[1:0]
DLL Control 1
0x72
DLL Control 2
0x75
Aux ADC Config
and Conversion
Start
0x77
Function
100000: VREF = 0.8 V.
100001: VREF = 0.80625 V.
…
111111 : VREF = 0.99375 V.
1: selects DLL output as the ADC sampling clock.
0: selects external clock as the ADC sampling clock.
1: selects DLL output as the DAC sampling clock.
0: selects external clock as the DAC sampling clock.
1: enables the input reference clock to the DLL.
Sets DLL divide ratio (1 to 8) at the output of the DLL.
0000: not valid.
0001: 1.
0010: 2.
…
0110: 6.
0111: not valid.
1000: 8.
1001: not valid.
…
1111: not valid.
1: DLL has locked to reference clock (read only).
00: DLL output is directly driven out. Divider is bypassed.
01: DLL output is directly driven out. Divider is bypassed.
10: DLL output is divided by 2.
11: DLL output is divided by 4.
Sets DLL multiplication factor (1 to 32).
00000: 1.
00001: 2.
…
11111: 32.
Set these bits to 0.
Reset DLL. The DLL must be reset by a low to high transition on this bit
each time the DLL configuration is changed or the reference frequency is
changed.
Set these bits to 0.
Sets the number of AUXADCCLK cycles required to perform a conversion.
00: 20 AUXADCCLK cycles.
01: 22 AUXADCCLK cycles.
10: 26 AUXADCCLK cycles.
11: 34 AUXADCCLK cycles.
5:3
2:0
Unused
AUXADC_CH[2:0]
Selects analog input channel to the auxiliary ADC.
000: AUXIN1, Pin 72.
001: AUXIO2, Pin 71.
010: AUXIO3, Pin 70.
011: internal VPTAT voltage.
100: internal VCMLI voltage.
101: internal VCMLQ voltage.
Rev. 0 | Page 32 of 60
AD9961/AD9963
Register Name
Register
Address
Aux ADC MSBs
Aux ADC LSBs
0x78
0x79
Aux ADC CTRL 0
Aux ADC CTRL 1
ADC Full-Scale Adj
0x7A
0x7B
0x7D
Bit(s)
Parameter
7:0
7:4
3
AUXADC[11:4]
AUXADC[3:0]
CONV_COMPL
2:0
CHAN_SEL[2:0]
7
AUXADC_EN
6
AUXADC_RESB
5:3
2:0
Unused
AUXDIV[2:0]
7
6:5
4:2
TEMPSNS_EN
Unused
AUXREF_ADJ[2:0]
1:0
7:5
4:0
Unused
Unused
RX_FSADJ[4:0]
Function
110: RXCML voltage.
111: not connected.
Any write to this register initiates an ADC conversion cycle.
This is the 8 MSBs of the most recent AUXADC conversion result.
This is the 4 LSBs of the most recent AUXADC conversion result.
0: indicates that the request auxiliary ADC conversion is in progress.
1: indicates that the auxiliary ADC conversion result is valid.
Indicates the actual auxiliary ADC input channel selected for the
conversion. This should match the channel that was selected in the write
to Register 0x77 that initiated the conversion.
0: powers down the auxiliary ADC clock.
1: enables the auxiliary ADC clock.
1: resets the AUXADC. A transition from 0 to 1 triggers the reset. The bit
should be returned to 0 after issuing the reset.
Sets the frequency division ratio of the input clock driving the CLKP,
CLKN pins over the AUXADCCLK.
000: 256.
001: 128.
…
110: 4.
111: 2.
The frequency of the AUXADCCLK should be less than 10 MHz. The
sample conversion rate of the AUXADC is determined by the AUXCLK rate
and CONV_TIME.
1: enables the on-chip temperature sensor.
Adjustment for tuning the internal auxiliary ADC reference voltage.
011: +18 mV.
010: +12 mV.
001: +6 mV.
000: default.
111: −6 mV.
110: −12 mV.
101: −18 mV.
100: −24 mV.
This parameter adjusts the full-scale input voltage range of the Rx path
ADCs. The peak-to-peak input voltage range can be set as follows:
10000: 1.25 V.
10001:1.27 V.
10010: 1.29 V.
10011: 1.31 V.
…
11111: 1.54 V.
00000: 1.56 V.
00001: 1.58 V.
…
01110: 1.873 V.
01111: 1.875 V.
Rev. 0 | Page 33 of 60
AD9961/AD9963
Register Name
Rx ADC Trim Ctrl
Register
Address
0x7E
IGAIN CAL MSBs
IGAIN CAL LSBS
0x7F
0x80
IGAIN CAL MSBs
0x81
IGAIN CAL LSBs
0x82
IGAIN CAL LSBS
0xFF
Bit(s)
7
6
5
Parameter
Unused
RXTrim_EN
RXTrim_Fine
4
AUXCML_EN
3:1
0
0
RX_DC
7:0
7:3
2:1
0
7:0
RXI_Trim[9:2]
Unused
RXI_Trim[1:0]
GAINCAL_ENI
RXQ_Trim[9:2]
7:3
2:1
0
7:1
0
Unused
RXQ_Trim[1:0]
GAINCAL_ENQ
Unused
Update
Function
1: enables ADC gain calibration.
1: decreases the step size (increases resolution) of the gain calibration
adjustment.
Controls the buffers of internal bias points within each of the Rx ADCs to
allow for checking of this voltage. These voltages should read back about
0.9 V.
0: disables the buffers.
1: enables the buffers.
Set to 000.
0: the ADC common-mode buffer is active. This sets the ADC inputs to
the desired common-mode voltage through 10 kΩ resistors to each
single sided input.
1: disables the common-mode buffer. The buffer should be disabled
whenever the user DC couples to the ADC inputs.
The RXI_Trim[9:0] word is used to adjust the gain of the receive path I
ADC. These bits have no effect unless the RXTrim_EN bit is set. The
RXTrim_Fine bit reduces the LSB size of the calibration word by ½.
1: enables the gain calibration DAC for the I Rx ADC.
The RXQ_Trim[9:0] word is used to adjust the gain of the receive path Q
ADC. These bits have no effect unless the RXTrim_EN bit is set. The
RXTrim_Fine bit reduces the LSB size of the calibration word by ½.
Bottom two LSBs of RXQ_Trim described in Register 0x81 above.
1: enables the gain calibration DAC for the Q Rx ADC.
Synchronously transfers ADC configuration data from the global register
set to the local ADC register set and activates the changes. A 0-to-1
transition is required to initiate the transfer.
1: transfer ADC parameters to ADC to make changes active.
Rev. 0 | Page 34 of 60
AD9961/AD9963
RECEIVE PATH
RXBIAS
Rx Path General Description
The AD9961/AD9963 Rx paths consist of dual, differential
input, 100 MSPS ADCs followed by an optional 2× decimation
filter. The Rx path also has digital offset and gain adjustments.
I OFFSET
TRXD[11:0]
LPF
1/2
DECIMATION
SCALE
RXQN
DATA
ASSEMBLER
TRXIQ
Q ADC
RXQP
LPF
1/2
TRXCLK
Q OFFSET
Figure 39. Receive Path Block Diagram
RXCML
The RXCML pin of the AD9961/AD9963 provides the user with
a buffered version of the expected ADC common-mode bias
voltage. The RXCML output nominally is at 1.4 V. Bypassing
the RXCML output to analog ground maintains the stability of
the output buffer and lowers the noise. To maintain the
accuracy of the RXCML bias voltage, the current draw from the
pin should be kept below 1 mA.
The dual ADC paths share the same clocking and reference
circuitry to provide optimal matching characteristics. The
ADCs have a multistage differential pipelined switched
capacitor architecture with output error correction logic. The
ADCs support IF sampling frequencies up to 140 MHz, making
them suitable for undersampling receivers. Also, one of the
ADCs can be powered down and the digital interface can be
placed into single ADC mode. This flexibility makes the part
well-suited for sampling real signals as well.
RXIP
2kΩ
IADC
2kΩ
RXIN
REG 0x7E[0]
PD
~1.4V
RXQP
2kΩ
QADC
CMBIAS
2kΩ
RECEIVE ADC OPERATION
RXQN
The Rx path analog inputs look into a nominal differential
impedance of 4 kΩ. The Rx inputs are self-biasing, so they can
be either ac-coupled or direct coupled. The nominal dc bias
level of the inputs is 1.4 volts. A buffered version of the bias
voltage is available at the RXCML pin. This voltage can be used
for biasing external buffer circuits when dc coupling is required.
For optimal dynamic performance, the analog inputs should be
driven differentially. The source impedances driving the Rx
inputs should be matched so that common-mode settling errors
are symmetrical. The Rx inputs can be driven with a singleended source, but SNR and SINAD performance is degraded.
ADC Reference Voltage
An internal differential voltage reference creates positive and
negative reference voltages that define the full-scale input
voltage of the ADCs. This full-scale input voltage range can be
adjusted by means of the RX_FSADJ[4:0] parameter in
configuration Register 0x7D. See the Configuration Registers
section for more details on setting the voltage.
REG 0x0F[1]
~1.4V
RXCML
EN
AD9961/AD9963
08801-012
I ADC
08801-112
RXIP
RXIN
The AD9961/AD9963 provide the user with the option to place
a 10 kΩ resistor between the RXBIAS pin and ground. This
resistor is used to set the master current reference of the ADC
core. The RXBIAS resistor should have a tolerance of 1% or
better to preserve the accuracy of the ADC full-scale range.
Care should be taken in the layout to avoid any noise from
coupling into the RXBIAS pin.
Figure 40. Simplified Schematic of Rx Path Inputs
Differential Input Configurations
Optimum performance is achieved by driving the analog inputs
in a differential input configuration. For baseband applications,
the ADA4937 differential driver provides excellent performance
and a flexible interface to the ADC.
Figure 41 shows an ac-coupled input configuration. The VOCM
pin should be connected to a voltage that provides sufficient
headroom for the output driver of the differential amp. Usually,
setting VOCM to ½ of the amplifier supply voltage is the optimal
setting. Placing source resistance in series with the amplifiers
outputs isolates the amplifier from on-board parasitic capacitances
and leads to more stable operation.
The nominal input voltage range is 1.56 V. In general, a tradeoff
can be made between linearity and SNR. Increasing the input
voltage range leads to higher SNR. Decreasing the input voltage
range leads to better linearity.
Rev. 0 | Page 35 of 60
AD9961/AD9963
Single-Ended Input Configuration
200Ω
ADA4937
33Ω
1kΩ
1kΩ
–VIN
Driving the Rx inputs with a single-ended signal typically limits
the achievable ADC performance. When using this configuration,
best performance is achieved by maintaining a balanced
impedance off each of the Rx inputs as shown in Figure 44.
0.1µF
RXIP
VOCM
RXIN
0.1µF
33Ω
200Ω
0.1µF
C
49.9Ω
200Ω
AD9961/
AD9963
1.25V p-p
08801-013
VCC
The output common-mode voltage of the ADA4937 is set to
match the common-mode voltage required by the ADC by
connecting the RXCML output to the VOCM input of the
amplifier. The RXCML output nominally is at 1.4 V. Bypassing
the RXCML output to analog ground maintains the stability of
the output buffer and lowers the noise.
200Ω
ADA4937
200Ω
33Ω
RXIP
VOCM
RXIN
–VIN
33Ω
200Ω
RXIP
0.1µF
ADC
*CDIFF
25Ω
Figure 41. Differential Input Configuration, AC-Coupled
+VIN
49.9Ω
33Ω
AD9963
33Ω
0.1μF
RXIN
C
08801-016
200Ω
+VIN
*CDIFF IS OPTIONAL.
Figure 44. Single-Ended Input Configuration
Interfacing to the ADF4602 Rx Baseband Outputs
The ADF4602 is an RF transceiver suitable for femtocell and
other wireless communications applications. The ADF4602
Rx baseband outputs have a nominal output common-mode
voltage that can be set to 1.4 V. The ADF4602 can be dccoupled to the AD9963. It is recommended that a first-order
low-pass filter be placed between the two devices to reject
unwanted high frequency signals that may alias into the desired
baseband signal.
200Ω
68pF
RXBBI
ADC
At higher input frequencies, the amplifiers required to maintain
the full dynamic power of the AD9963 requires considerable
supply current. For higher frequency power sensitive applications,
differential transformer coupling is the recommended input
configuration. The signal characteristics must be considered
when selecting a transformer. Most RF transformers saturate at
frequencies below a few megahertz, and excessive signal power
can also cause core saturation, which leads to distortion.
In any configuration, the value of the shunt capacitor, C, is
dependent on the input frequency and may need to be reduced
or removed.
50Ω
C
RXIP
ADC
0.1µF
AD9963
*CDIFF
33Ω
0.1μF
RXIN
C
*CDIFF IS OPTIONAL.
08801-015
1.25V p-p
33Ω
RXIP
AD9963
Figure 42. Differential Input Configuration, DC-Coupled
ADT1-1WT
1:1 Z RATIO
100Ω
RXBBIB
ADF4602
100Ω
RXIN
68pF
08801-118
AD9961/
AD9963
08801-014
RXCML
0.1µF
Figure 45. ADF4602 to AD9963 Receive Interface Circuit
In this application, the ADF4602 is setting the common-mode
input voltage of the AD9963 ADCs. The input common-mode
buffer of the AD9963 should be disabled (set Register 0x7E,
Bit 1 = 1) to avoid contention with the ADF4602 output driver.
DECIMATION FILTER AND DIGITAL OFFSET
Decimation Filter
The I and Q receive paths each have a bypassable 2× decimating
low-pass filter. The half-band digital filter reduces the output
sample rate by a factor of 2 while rejecting aliases that fall into
the band of interest. These low-pass filters provide >7 dB of
stop-band rejection for 40% of the output data rate. When used
with quadrature signals, the complex output band is 80% of the
quadrature output data rate. A graph of the pass-band response
of the decimation filter is shown in Figure 46.
Figure 43. Differential Transformer—Coupled Configuration
Rev. 0 | Page 36 of 60
AD9961/AD9963
ADC Digital Offset Adjustment
0
–60
The Rx paths also have individual digital offsets that can be
applied to the data captured by the ADCs. The offset is a 6-bit
digital value that is added directly to the LSBs of the ADC
output data. The offset values are configured by first addressing
the ADC by setting the appropriate address in Register 0x05,
then writing the desired offset (in LSBs) into Register 0x10. For
example, to set offsets of +6 and −2 to the I and Q channels
respectively, the register write sequence is:
–70
1.
Write 0x01 into Register 0x05. This addresses the I channel
ADC.
2.
Write 0x06 into Register 0x10. This sets the IADC_Offset
value to +6 LSBs.
3.
The filter coefficients of the 2× decimation low-pass are shown
in Table 16.
Write 0x02 into Register 0x05. This addresses the Q
channel ADC.
4.
Table 16.
Write 0xFE into Register 0x10. This sets the QADC_Offset
value to −2 LSBs.
5.
Write 0x01 into Register 0xFF. This updates the data path
registers and applies the offset to the data.
6.
Write 0x00 into Register 0x05. This returns the SPI to the
normal addressing mode.
–10
MAGNITUDE (dBc)
–20
–30
–40
–50
1.00
NORMALIZED FREQUENCY (Relative to fDAC )
08801-119
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0
0.05
–80
Figure 46. Pass-Band Response of the Rx Path Decimation Filter
Lower Coefficient
H(1)
H(3)
H(5)
H(7)
H(9)
H(11)
H(13)
H(15)
H(17)
H(19)
H(21)
H(22)
Upper Coefficient
H(43)
H(41)
H(39)
H(37)
H(35)
H(33)
H(31)
H(29)
H(27)
H(25)
H(23)
Value
12
−32
72
−140
252
−422
682
−1086
1778
−3284
10364
16384
Rev. 0 | Page 37 of 60
AD9961/AD9963
Tx Path General Description
The transmit section consists of two complete paths of
interpolation filters stages, each followed by a high speed
current output DAC. A data assembler receives interleaved data
from one of two digital interface ports, and de-interleaves and
buffers the data before supplying the data samples into the two
datapaths. The interpolation filter bank consists of three stages
that can be completely bypassed or cascaded to provide 2×, 4×,
or 8× interpolation. The supported clock rates for each of the
interpolation filters and the transmit DACs are listed in Table 1.
TXVDD
0
–10
–20
–30
–40
–50
I GAIN
I SCALE
–60
TXIP
I DAC
TX PORT
–70
TXIN
TXQN
1.00
08801-122
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
NORMALIZED FREQUENCY (Relative to fDAC )
Q DAC
LPF
1/2/4/8×
0.20
0
TXQP
TRX PORT
0.15
–80
TXCML
Q SCALE
0.10
LPF
1/2/4/8×
0.05
DATA
ASSEMBLER
AND FIFO
than 70 dB. In 8× interpolation mode, the image rejection is
greater than 65 dB. The usable bandwidth of the filters is
typically limited by the stop-band attenuation they provide,
rather than the passband flatness. The transfer functions of the
interpolation filters configured for 2×, 4×, and 8× interpolation
ratios are shown in Figure 49 through Figure 51.
MAGNITUDE (dBc)
TRANSMIT PATH
Figure 49. Digital Filter Transfer Function for 2× Interpolation
0
Q GAIN
REFIO
Rev. 0 | Page 38 of 60
08801-123
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
–50
–60
–70
NORMALIZED FREQUENCY (Relative to fDAC )
Figure 51. Digital Filter Transfer Function for 8× Interpolation
08801-124
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
–80
0.50
The INT0 and INT1 filters have bandwidths of 40% of the input
data rate. Over their usable bandwidth, the filters have a passband
ripple of less than 0.1 dB. The SRRC has a roll-off factor of 0.22
with a 60 dB stop-band attenuation. In 2× and 4× interpolation
modes, the interpolation filters have an image rejection of greater
–40
0.45
The digital filters should be cascaded such that INT0 is enabled
for an interpolation factor of 2×, INT0 and INT1 should be
enabled for an interpolation factor of 4×, and INT0, INT1, and
the SRRC should be enabled for an interpolation factor of 8×.
–30
0.40
Figure 48. Block Diagram of Transmit Datapath
–20
0.35
INT1_SCALE
0x37[4:0]
–10
0.30
0
0.25
INT0_SCALE
0x36[4:0]
INT1
0
TO
DAC
0.20
0
1
Figure 50. Digital Filter Transfer Function for 4× Interpolation
0.15
SRRC_SCALE
0x35[4:0]
1
INT0
NORMALIZED FREQUENCY (Relative to fDAC )
0.10
0
–80
0
SRRC
–70
MAGNITUDE (dBc)
FROM
FIFO
–60
INT1_BP
0x30[4]
08801-018
1
–50
0.05
INT0_BP
0x30[3]
–40
0
The I and Q transmit paths contain three interpolation filters
designated as INT0, INT1, and SRRC. Each of the interpolation
filters provides a 2× increase in output data rate. The filters can
be completely bypassed or cascaded to provide 2×, 4×, or 8×
upsampling ratios. The interpolation filters effectively increase
the DAC update rate while suppressing the images at the input
date rate. This reduces the requirements on the analog output
reconstruction filter.
–30
0.05
INTERPOLATION FILTERS
–20
MAGNITUDE (dBc)
Figure 47. Transmit Path Block Diagram
SRRC_BP
0x30[2]
–10
08801-017
RFSADJ
AD9961/AD9963
Interpolation Filter Coefficients
The interpolation filters, INT0 and INT1, are half-band filters
implemented with a symmetric set of coefficients. Every other
coefficient (even coefficients) except the center coefficient is
zero. The coefficient values for the three interpolation filters are
listed in Table 17 to Table 19.
Table 17. Coefficient Values for INT0
Lower Coefficient
H(1)
H(3)
H(5)
H(7)
H(9)
H(11)
H(13)
H(15)
H(17)
H(19)
H(21)
H(22)
Upper Coefficient
H(43)
H(41)
H(39)
H(37)
H(35)
H(33)
H(31)
H(29)
H(27)
H(25)
H(23)
Value
12
−32
72
−140
252
−422
682
−1086
1778
−3284
10364
16384
Table 18. Coefficient Values for INT1
Lower Coefficient
H(1)
H(3)
H(5)
H(7)
H(9)
H(10)
Upper Coefficient
H(19)
H(17)
H(15)
H(13)
H(11)
Value
26
−138
466
−1314
5058
8191
Table 19. Coefficient Values for SRRC Filter
Lower Coefficient
H(1)
H(2)
H(3)
H(4)
H(5)
H(6)
H(7)
H(8)
H(9)
H(10)
H(11)
H(12)
H(13)
H(14)
H(15)
H(16)
H(17)
H(18)
H(19)
H(20)
H(21)
H(22)
H(23)
H(24)
H(25)
H(26)
H(27)
Upper Coefficient
H(53)
H(52)
H(51)
H(50)
H(49)
H(48)
H(47)
H(46)
H(45)
H(44)
H(43)
H(42)
H(41)
H(40)
H(39)
H(38)
H(37)
H(36)
H(35)
H(34)
H(33)
H(32)
H(31)
H(30)
H(29)
H(28)
Value
−2
−2
8
−4
−21
10
44
−29
−79
66
123
−127
−183
232
251
−394
−326
642
401
−1034
−469
1704
523
−3160
−560
9996
16383
Data Flow and Clock Generation
The transmit port TXD[11:0] and TXIQ signals are captured
from by the device with an input latch. The data is then
formatted and buffered in an 8-word deep FIFO. The data exits
the FIFO and is processed by whichever interpolation filters are
enabled. The data is then sampled by the transmit DACs.
The FIFO absorbs any phase drift between the two clock
domains that drive the transmit data. The data is read from the
FIFO by the RDCLK signal. The RDCLK signal is always the
DACCLK divided by the interpolation ratio, I. Data is written to
the FIFO by the WRCLK signal at the quadrature data input
rate, fDATA. fDATA is equal to one-half the bus speed because the I
and Q samples are interleaved.
Figure 52 shows the block diagram of the transmit path data
flow in full-duplex mode. Also shown in the diagram are the
input data clocking options and the clock doubler selections.
Rev. 0 | Page 39 of 60
AD9961/AD9963
24 BITS
WRITE
POINTER
READ
POINTER
REG 0
REG 1
12
I DATA
PATH
12
12
Q DATA
PATH
12
REG 2
INPUT
LATCH
26
24
DATA
FORMAT
REG 3
REG 4
REG 5
REG 6
TX_BNRY
Reg 0x31[0]
WRCLK
TXIQ_HILO
Reg 0x31[2]
1 0
FIFO_OFFSET
Reg 0x33[2:0]
FIFO_PTR
Reg 0x34[7:0]
EN
TXCLK
0
1
EN
FIFO
RDPTR = 0
TXCKI_INV
Reg 0x31[3]
TX_IFIRST
Reg 0x31[1]
1 0
WRPTR
TXCLK_MD
Reg 0x31[0]
Q DAC
REG 7
RDCLK
÷I
÷2
0
1
FIFO RESET
AND MONITOR
0
1
DOUBLER
TX_SDR
Reg 0x31[7]
TXCLK_MD
Reg 0x31[1]
TXSMPCLK
I=1
* I DENOTES INTERPOLATION RATIO
TXCKO_INV
Reg 0x31[6]
DACCLK
TXDBL_SEL
TX_DBLPW[2:0]
Reg 0x39[0]
Reg 0x3E[5:3]
08801-150
13
TXD[11:0]
TXIQ
I DAC
Figure 52. Transmit Path Data Flow and Clock Generation In Full Duplex Mode
TXVDD
The signal on the TXCLK pin can be configured as either an
input or an output. This is configured by the TXCLK_MD
variable (Register 0x31, Bits[5:4]). Whether configured as an
input or an output, the TXCLK signal has the option of being
inverted by configuring the TXCKI_INV or TXCKO_INV
variables.
100µA
REFIO
REFIO_ADJ[5:0]
0x6E[5:0]
IRSET[5:0]
0x6A[5:0]
The transmit path clock doubler is only used when all of the
interpolation filters are bypassed (I = 1) and the transmit path is
configured in bus rate mode (TX_SDR = 1). For more
information about configuring the clock doubler, see Table 22.
IGAIN1[5:0]
0x68[5:0]
IGAIN2
0x69[5:0]
RREF
RSET
TX1P
TXDATA
IDAC
TXCML
DACCLK
TRANSMIT DAC OPERATION
08801-019
TX1N
Figure 53. Simplified Block Diagram of I DAC Core
Figure 53 shows a simplified block diagram of one of the transmit
path DACs. Each DAC consists of a current source array, switch
core, digital control logic, and full-scale output current control.
The DAC contains a current source array capable of providing a
nominal full-scale current (IOUTFS) of 2 mA. The output currents
from the TXIP and TXIN pins are complementary, meaning that
the sum of the two currents always equals the full-scale current of
the DAC. The digital input code to the DAC determines the
effective differential current delivered to the load.
The DACs are powered through the TXVDD pin and can operate
over a 1.8 V to 3.3 V supply range. To facilitate interfacing the
output of the AD9961/AD9963 directly to a range of commonmode levels, an internal bias voltage is made available through the
TXCML pin.
The DAC full-scale output current is regulated by the reference
control amplifier and is determined by the product of a reference
current, a programmable reference resistor, RREF, an internal
programmable resistor, RSET, and a pair of programmable gain
scaling parameters.
Transmit DAC Transfer Function
The output currents from the TXIP and TXIN pins are
complementary, meaning that the sum of the two currents
always equals the full-scale current of the DAC. The digital
input code to the DAC determines the effective differential
current delivered to the load. TXIP provides maximum output
current when all bits are high. The output currents vs. DACCODE
for the DAC outputs are expressed as:
DACCODE 
I TXIP  
  I OUTFS
2N

(1)
I TXIN  I OUTFS  I TXIP
(2)
where DACCODE = 0 to 2N − 1.
There are a number of adjustments that can be made to scale IOUTFS
to provide programmability in the output signal level.
Rev. 0 | Page 40 of 60
AD9961/AD9963
Transmit Path Gain Adjustment
Table 20. Reference Operation
Adjusting the output signal level is implemented by scaling the
full-scale output current of the transmit DAC. There are four
separate programmable parameters that can be used to adjust
the full-scale output of the DACs; the REFIO voltage, the RSET
resistance, and the fine and coarse gain control parameters.
Reference
Mode
Internal
REFIO Pin
Connect 0.1 μF capacitor
External
Apply external reference
Register Setting
Register 0x60, Bit 6 = 0
(default)
Register 0x60, Bit 6 = 1
(disables internal
reference)
Adjusting the REFIO Voltage
There is a single reference voltage that is used by both the I and
Q channel DACs. The REFIO reference voltage is generated by
an internal 100 μA current source terminated into a programmable
resistor, RREF. The nominal RREF resistance is 10 kΩ resulting in a
1.0 V reference voltage. The resistance can be varied by adjusting
the REFIO_ADJ[5:0] bits in Register 0x6E. This adds or subtracts
up to 20% from the RREF resistance and hence the REFIO voltage
and the DAC full-scale current. A secondary effect to changing
the REFIO voltage is that the full-scale voltage in the auxiliary
DACs also changes by the same magnitude.
Adjusting the Current Scaling Resistor
Each transmit DAC has a resistor that is used to adjust the fullscale current. The nominal resistance is 16 kΩ, which results in
a full-scale current of 2 mA (when VREFIO equals 1.0 V). The
6-bit programmable values, IRSET[5:0] and QRSET[5:0]
(Register 0x6A and Register 0x6D), provide an output current
adjustment range of ±20% as shown in Figure 55.
2.6
2.4
FSC (mA)
The register uses twos complement format in which 011111
maximizes the voltage on the REFIO node and 100000
minimizes the voltage. A curve illustrating the variation of
REFIO voltage vs. REFIO_ADJ value is shown in Figure 54.
1.3
2.2
2.0
1.2
1.8
1.6
0
1.0
8
16
24
32
40
48
56
RSET (Ω)
08801-021
VREF (V)
1.1
Figure 55. Output Current Scaling vs. IRSET and QRSET Values
0.9
Adjusting the GAIN Parameters
0.7
0
8
16
24
32
40
48
56
REFIO ADJ
08801-020
0.8
Figure 54. Typical VREFIO Voltage vs. REFIO_ADJ Value
The REFIO pin should be decoupled to AGND with a 0.1 μF
capacitor. If the voltage at REFIO is to be used for external
purposes, an external buffer amplifier with an input bias current
of less than 100 nA should be used.
Each transmit DAC has coarse and fine gain control parameters
for scaling the full-scale output currents. These adjustments
change only the full-scale current of the DAC and have no
impact on the REFIO voltage. The coarse scale adjust (GAIN1)
allows the nominal output current to be changed by ±6 dB in
approximately 0.25 dB steps. The adjustment range of the fine
scale adjust (GAIN2) is about ±2.5%. Figure 56 and Figure 57
show the resulting gain scaling vs. the GAIN1 and GAIN2
parameters.
An external reference can be used in applications requiring
tighter gain tolerances or lower temperature drift. Also, a variable
external voltage reference can be used to implement a method
for gain control of the DAC output. The external reference is
applied to the REFIO pin. Note that the 0.1 μF compensation
capacitor is not required. The internal reference can be directly
overdriven by the external reference, or the internal reference
can be powered down. The input impedance of REFIO is 10 kΩ
when powered up and 1 MΩ when powered down.
Rev. 0 | Page 41 of 60
AD9961/AD9963
8
RO
6
TXIN
VIN
–
VQP
+
0
TXQP
–2
RO
–4
TXQN
–6
VOUTQ
RO
VQN
–
08801-024
TXCML
Figure 58. Basic Transmit DAC Output Circuit
1
9
17
25
33
41
49
57
GAIN1
Figure 58 shows the most basic DAC output circuitry. A pair of
resistors, RO, are used to convert each of the complementary
output currents to a differential voltage output, VOUTX. Because
the current outputs of the DAC are very high impedance, the
differential driving point impedance of the DAC outputs, ROUT,
is equal to 2 × RO.
08801-022
–8
Figure 56. Typical DAC Full-Scale Current vs. GAIN1 Code
2.06
2.04
Figure 59 illustrates the output voltage waveforms.
2.02
VPEAK
2.00
VCM
1.98
0
VN
1.96
VP
VOUT
1.94
8
16
24
32
40
48
56
GAIN2
08801-023
0
–VPEAK
08801-025
dBFS
2
FULL-SCALE CURRENT (mA)
VOUTI
RO
4
+
VIP
TXIP
Figure 59. Voltage Output Waveforms
Figure 57. Typical DAC Full-Scale Current vs. GAIN2 Code
The common-mode signal voltage, VCM, is calculated as:
TRANSMIT DAC OUTPUTS
The optimum noise and distortion performances of the AD9961/
AD9963 are realized when they are configured for differential
operation. The common-mode error sources of the DAC outputs
are significantly reduced by the common-mode rejection of a
transformer or differential amplifier. These common-mode
error sources include even-order distortion products and noise.
The enhancement in distortion performance becomes more
significant as the frequency content of the reconstructed waveform
increases and/or its amplitude increases. This is due to the firstorder cancellation of various dynamic common-mode distortion
mechanisms, digital feedthrough, and noise.
VCM =
I FS
× RO
2
The peak output voltage, VPEAK, is calculated as:
VPEAK = I FS × RO
With this circuit configuration, the single-ended peak voltage is
the same as the peak differential output voltage.
Setting the TXCML Pin Voltage
The TXCML pin serves to change the DAC bias voltages in the
part, allowing it to operate with higher output signal commonmode voltages. When the output signal common mode is below
0.8 V, the TXCML pin should be tied directly to AGND. When
the output signal common mode is greater then 0.8 V, then the
TXCML pin should be set to 0.5 V. The TXCML pin should be a
low ac impedance source (capacitive decoupling is
recommended).
When the TXVDD supply is 1.8 V, the output signal commonmode voltage should be kept close to 0 V and the TXCML pin
should be connected directly to ground. When the TXVDD
supply is 3.3 V, the output signal common mode can be operated as
high as 1.25 V.
Rev. 0 | Page 42 of 60
AD9961/AD9963
AD9961/AD9963
+
TXIP 65
RL
VOUT
RL
R
TXIN 66
–
C
RCML
08801-030
TXCML 62
Figure 60. Circuit for Setting TXCML Level Using RCML
Transmit DAC Output Circuit Configurations
The following section illustrates some typical output configurations for the AD9961/AD9963 transmit DACs. Unless
otherwise noted, it is assumed that IOUTFS is set to a nominal
2.0 mA. For applications requiring the optimum dynamic
performance, a differential output configuration is suggested.
A differential output configuration can consist of either an RF
transformer or a differential op amp configuration. The transformer configuration provides the optimum high frequency
performance and is recommended for any application that
allows ac coupling. The differential op amp configuration is
suitable for applications requiring dc coupling, signal gain,
and/or a low output impedance.
A single-ended output is suitable for applications where low
cost and low power consumption are primary concerns.
Differential Coupling Using a Transformer
An RF transformer can be used to perform a differential-tosingle-ended signal conversion, as shown in Figure 61. The
distortion performance of a transformer typically exceeds
that available from standard op amps, particularly at higher
frequencies. Transformer coupling provides excellent rejection
of common-mode distortion (that is, even-order harmonics)
over a wide frequency range. It also provides electrical isolation
and can deliver voltage gain without adding noise. Transformers
with different impedance ratios can also be used for impedance
matching purposes. The main disadvantages of transformer
coupling are low frequency roll-off, lack-of-power gain, and
high output impedance.
AD9961/AD9963
TXIP 65
RLOAD
TXIN 66
OPTIONAL RDIFF
08801-031
The circuit shown in Figure 60 shows a typical output circuit
configuration that provides a non zero bias voltage at the
TXCML pin. Resistance values of 499 Ω for RL and 249 Ω for
RCML produces a 2 V p-p differential output voltage swing with a
1.0 V output common-mode voltage and a voltage of 0.5 V
supplied to the TXCML pin. The 2 mA full-scale current flows
through the 249 Ω RCML creating the 0.5 V TXCML voltage. The
decoupling capacitor, assures a low ac driving impedance for
the TXCML pin.
Figure 61. Differential Output Using a Transformer
The center tap on the primary side of the transformer must be
connected to a voltage that keeps the voltages on TXIP and
TXIN within the output common-mode voltage range of the
device. Note that the dc component of the DAC output current
is equal to IOUTFS and flows out of both TXIP and TXIN. The
center tap of the transformer should provide a path for this dc
current. In most applications, AGND provides the most convenient voltage for the transformer center tap. The complementary
voltages appearing at TXIP and TXIN (that is, VIOUTP and
VIOUTN) swing symmetrically around AGND and should be
maintained with the specified output compliance range of the
AD9961/AD9963.
A differential resistor, RDIFF, can be inserted in applications
where the output of the transformer is connected to the load,
RLOAD, via a passive reconstruction filter or cable. RDIFF, as
reflected by the transformer, is chosen to provide a source
termination that results in a low voltage standing wave ratio
(VSWR). Note that approximately half the signal power is
dissipated across RDIFF.
Differential Buffered Output Using an Op Amp
A dual op amp (see the circuit shown in Figure 62) can be used
in a differential version of the single-ended buffer shown in
Figure 63. The same R-C network is used to form a one-pole,
differential, low-pass filter to isolate the op amp inputs from
the high frequency images produced by the DAC outputs.
The feedback resistor, RFB, determines the differential peakto-peak signal swing by the formula
VOUT = 2 × RFB × IFS
The minimum single-ended voltages out of the amplifier are,
respectively,
VMIN = VMAX − RFB × IFS
The common-mode voltage of the differential output is
determined by the formula
Rev. 0 | Page 43 of 60
VCM = VMAX − RFB × IFS
AD9961/AD9963
Interfacing to the ADF4602
CF
AD9961/AD9963
The ADF4602 is an RF transceiver suitable for Femtocell and
other wireless communications applications. The ADF4602 Tx
baseband inputs have a nominal input common-mode voltage
requirement of 1.2 V. The AD9963 can be dc coupled to the
ADF4602 as shown in Figure 64. When configured for a 2 mA
full-scale current, the output swing of the circuit is 1 V ppd
centered at 1.2 V. The TXMCL pin is biased at 0.5 V to increase
the headroom of the DAC outputs. The TXVDD and CLK33V
supplies must be supplied with 3.3 V to support this output
compliance range from the DACs.
RFB
RB
RS
–
TXIP 65
ADA4841-2
+
REFIO 63
VOUT
C
TXGND 64
+
RS
TXIN 66
ADA4841-2
–
CF
TXBBI
Figure 62. Single-Supply Differential Buffer
249Ω
Single-Ended Buffered Output Using an Op Amp
226Ω
249Ω
TXCML
0.1uF
TXBBIB
An op amp such as the ADA4899-1 can be used to perform
a single-ended current-to-voltage conversion, as shown in
Figure 63. The AD9961/AD9963 are configured with a pair
of series resistors, RS, off each output. For best distortion
performance, RS should be set to 0 Ω. The feedback resistor, RFB,
determines the peak-to-peak signal swing by the formula
TXIN
100kΩ
TXBBQ
ADF4602
249Ω
226Ω
AD9963
249Ω
TXQN
TXBBQB
The maximum and minimum voltages out of the amplifier are,
respectively,
AUXIO2
TXQP
249Ω
VOUT = RFB × IFS
100kΩ
AUXIO3
Figure 64. AD9963 to ADF4602 Tx Interface Circuitry
VMAX = VREFIO
The optional 100 kΩ resistors connected between the AUXIO
pins and the TXIN (and TXQN) pins allow a dc offset to be
provided to null out LO feedthrough at the ADF4602 outputs.
VMIN = VMAX − IFS × RFB
CF
RFB
RB
+5V
AD9961/AD9963
RS
–
TXIP 65
ADA4899-1
VOUT
+
REFIO 63
C
RS
–5V
TXGND 64
08801-033
TXIN 66
TXIP
249Ω
Figure 63. Single-Supply Single-Ended Buffer
Rev. 0 | Page 44 of 60
08801-142
08801-032
RFB
RB
AD9961/AD9963
DEVICE CLOCKING
clock duty cycle. The DCS can be bypassed. Recommendations
for using the DCS can be found in the Clock Duty Cycle
Considerations section.
CLOCK DISTRIBUTION
The clock distribution diagram shown in Figure 65 gives an
overview of the clocking options for each of the data converters.
The receive path ADCs and the transmit path DACs can be
clocked directly from the CLKP/CLKN inputs or from the
output of the on-chip DLL. The auxiliary ADC sampling clock
is always a divided down version of the input clock. The
auxiliary DACs are updated synchronously with the serial port
clock and have no relationship with the CLKP/CLKN inputs.
The ADC clock divider and the DLL clock multiplication
supports a variety of ratios between the receive path ADC
sampling clock and the transmit path DAC sampling clock.
Table 21 details the specific values the device supports and
which register bits are require configuration.
Table 21. Clock Tree Configuration Variables
Variable
DCS_BP
ADCDIV
ADCCLKSEL
DACCLKSEL
N
M
DLLDIV
AUXDIV
The best data converter performance is realized when a low
jitter clock source drives the CLKP/CLKN inputs, and this
signal is used directly (or through the on-chip divider) as the
data converter sampling clocks. The ADC and DAC sampling
clocks are independently selected to be derived from either the
CLKP/CLKN input or from the DLL output, DLLCLK. Using
DLLCLK as the data converter sampling clock signal may
degrade the noise and SFDR performance of the converters.
More information is given in the Clock Multiplication Using the
DLL section.
Values
0 or1
1, 2, 4
0 or 1
0 or 1
1 to 6, 8
1, 2, 3,…, 32
1, 2, 4
2J, J = 1 to 8
The receive path ADC has a duty cycle stabilizer (DCS) to help
make the ADC performance insensitive to changes in the input
ADCCLKSEL
÷ADCDIV
DCS_BP
ADC
0
1
CLK_PD
1
DCS
CLKP
0
DLL
÷DLLDIV
M
N
EXTDLLCLK
DAC
DLLCLK
1
DACCLK
0
DACCLKSEL
AUXADC
AUXCLK
÷AUXDIV
Figure 65. Clock Distribution Diagram
Rev. 0 | Page 45 of 60
08801-143
CLKN
ADCCLK
Address
Register
Bit(s)
0x66
2
0x66
[1:0]
0x71
7
0x71
6
0x71
[3:0]
0x72
[4:0]
0x72
[6:5]
0x7A
[2:0]
AD9961/AD9963
DRIVING THE CLOCK INPUT
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515/
AD9516/AD9518
CLK+
0.1µF
CLK_P
CLK–
100Ω
LVDS DRIVER
0.1µF
50Ω*
08801-035
50Ω*
ADC
AD9963
CLK_N
CLK
*50Ω RESISTORS ARE OPTIONAL.
Figure 66. Differential LVDS Sample Clock
In applications where the receive analog input signals and the
transmit analog output signals are at low frequencies, it is
acceptable to drive the sample clock inputs with a single-ended
CMOS signal. In such applications, CLKP should be driven
directly from a CMOS gate, and the CLKN pin should be bypassed
to ground with a 0.1 μF capacitor in parallel with a 39 kΩ
resistor (see Figure 67). A series termination resistor off the
clock driver output may improve the dynamic response of the
driver.
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515/
AD9516/AD9518
0.1µF
CLK+
CLK
50Ω
CMOS DRIVER
OPTIONAL
100Ω
CLK_P
ADC
CLK
AD9963
0.1µF
CLK_N
39kΩ
08801-036
0.1µF
Figure 67. Single-Ended 1.8 V CMOS Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515/
AD9516/AD9518
CLK+
PECL DRIVER
0.1µF
CLK_N
SCHOTTKY
DIODES:
HSM2812
0.1µF
Figure 69. Transformer Coupled Clock
A 2.5 V CMOS driver may also be used. In this case, the
minimum CLK33V supply voltage should be 2.5 V. The 39 kΩ
resistor should be removed in this case. Connecting CLKN to
ground with just a 0.1 µF capacitor results in the CLKN voltage
being biased to about 1.2 V.
Clock Duty Cycle Considerations
The duty cycle of the input clock should be maintained between
45% and 55%. Duty cycles outside of this range affects the
dynamic performance of the ADC. This is especially true at
sample rates greater than 75 MHz. It is recommended that the
duty cycle stabilizer (DCS) be used at clock rates above 75 MHz
to ensure the sampling clock maintains the proper duty cycle
inside the device. Below 75 MHz, the DCS should be bypassed.
The DCS is bypassed by setting Register 0x66, Bit 2 high.
CLOCK MULTIPLICATION USING THE DLL
The AD9961/AD9963 contain a recirculating DLL, as shown in
Figure 70. This circuit allows the incoming CLK signal
(REFCLK) to be multiplied by a programmable M/N factor.
This provides a means of generating a wide range of DLL output
clock (DLLCLK) frequencies. The DLLCLK signal can be used
for either the receive ADC sampling clock, the transmit DAC
sampling clock, or both. The EXTDLLCLK signal can be
programmed to appear on the TXCLK pin or TRXCLK if
desired.
DLLLOCKED
REG 0x72[7]
DLLBIASPD
REG 0x61[5]
PHASE
DETECTOR
CHARGE
PUMP
DLLFILT
PIN 54
ADC
M[4:0]
REG 0x72[4:0]
AD9963
DLLDIV[1:0]
REG 0x72[6:5]
CLK_N
CLK
50Ω*
ADC
AD9963
CLK_P
100Ω
0.1µF
50Ω*
CLK_P
0.1µF
0.1µF
CLK
CLK–
0.1µF
50Ω
240Ω
÷M
240Ω
*50Ω RESISTORS ARE OPTIONAL.
Figure 68. Differential PECL Sample Clock
÷DLLDIV
08801-037
0.1µF
XFMR
Note that the 39 kΩ resistor shown in the CMOS clock driver
example shifts the CLK_N input to about 0.9 V. This is optimal
when the CMOS driver is supplied from a 1.8 V supply.
0.1µF
CLK
0.1µF
CLK+
EXTDLLCLK
DLL_REF_EN
REG 0x71[4]
1
÷N
REFCLK
0
MCLK
DLLCLK
DELAY LINE
SELECT
LOGIC
M[3:0]
REG 0x71[3:0]
DLL_RESB
REG 0x75[3]
DLL_EN
REG 0x60[7]
Figure 70. Functional Block Diagram of Clock Multiplier DLL
Rev. 0 | Page 46 of 60
08801-148
0.1µF
Mini-Circuits®
ADT1-1WT, 1:1Z
08801-138
For optimum performance, the AD9961/AD9963 clock inputs
(CLKP and CLKN) should be clocked with a low jitter, fast rise
time differential signal. This signal should be ac-coupled to the
CLKP and CLKN pins via a transformer or capacitors. The
CLKP/CLKN inputs are internally biased and require no
external bias circuitry. Figure 66 through Figure 69 show
preferred methods for clocking the AD9961/AD9963.
AD9961/AD9963
The DLL is composed of a ring oscillator made from a
programmable delay line. The ring oscillator output signal is
labeled as MCLK. The MCLK signal is set to oscillate at a
frequency M times greater than the REFCLK signal. The DLL
output clock, DLLCLK, is the MCLK signal divided by a
programmable factor, N. M can be set to values from 1 to 32
and N can be set to values from 1 to 6 and 8.
DLL Frequency Locking Range
The DLL frequency lock range is determined by the output
frequency of the ring oscillator, MCLK. The DLL locks over an
MCLK frequency range of 100 MHz to 310 MHz. Verifying that
the DLL is locked can be done by polling the DLL_Locked bit
(Register 0x72, Bit 7).
DLL Filter Considerations
The DLL requires an external loop filter between the DLLFILT
pin (Pin 54) and ground for stable operation. The circuit
diagram in Figure 71 shows the recommended DLL filter
configuration. The external components should be placed as
close as possible to the device pins. It is important that no noise
be coupled into the filter circuit or DLL output clock jitter
performance is degraded.
DLL Start-Up Routine
To enable the DLL, three bits should be set. The DLL_EN bit
(Register 0x60, Bit 7) and the DLL_REF_EN bit (Register 0x71,
Bit 4) should be set to 1 and the DLLBIAS_PD bit (Register
0x61, Bit 5) should be set to 0.
The CLK input signal should be stable. The DLL_RESB bit
should be asserted low for a minimum of 25 µs, and then
brought inactive (high) to start the frequency acquisition. The
DLL takes several REFCLK cycles to acquire lock. The
DLL_Locked bit can be queried to verify the DLL is locked.
CONFIGURING THE CLOCK DOUBLERS
The receive and transmit data path each have a clock doubler
used for clocking data through the device. These clock doublers
are only used in single data rate clocking mode, when there is
no interpolation or decimation being used.
These doublers should be configured according to the following
guidelines.
Register 0x3A, Register 0x3B, and Register 0x3C configure the
operating points of the doublers and should be initialized with
the following values:
0x3A = 0x55, 0x3B = 0x55, 0x3C = 0x00
RZ
22.5Ω
The clock doubler mode and pulse widths should be configured
based on the DAC and ADC sample rates. These should be
configured according to Table 22.
DLLFILT
CP
CZ
68nF
08801-039
820pF
Figure 71. Recommended DLL Loop Filter
Table 22. Clock Doubler Configuration Guidelines
DACCLK/AUXADCCLK Freq
(MHz)
0 to 15
15 to 30
30 to 45
45 to 55
55 to 65
65 to 70
70 to ≥70
1
2
TXDBLSEL
Register 0x39,
Bit 0
0
1
1
1
1
1
1
TX_DBLPW[2:0]
Register 0x3E,
Bits[5:3]
111
X2
X2
X2
X2
X2
X2
RXDBLSEL
Register 0x39,
Bit 1
0
0
0
0
0
0
1
The DCS_BP bit should be set based on the AUXADCCLK frequency.
X = don’t care.
Rev. 0 | Page 47 of 60
RX_DBLPW[2:0]
Register 0x3E,
Bits[2:0]
111
111
110
101
100
011
X2
DCS_BP 1
Register 0x66,
Bit 2
1
1
1
1
1
1
0
AD9961/AD9963
DIGITAL INTERFACES
options produce the four timing diagrams shown in Figure 73.
In half-duplex mode, the TRx port outputs samples from the
receive path and accepts incoming samples for the transmit
path. The Tx port is disabled. The operation of the digital
interface is detailed in the sections that follow.
TRX PORT OPERATION (FULL-DUPLEX MODE)
In full-duplex mode, the TRX port sources the data from the
AD9961/AD9963 I and Q receive channels. The interface
consists of an output data bus (TRXD[11:0]) that carries the
interleaved I and Q data. The data is accompanied by a
qualifying output clock (TRXCLK) and an output signal
(TRXIQ) that identifies the data as from either the I or Q
channel. The maximum guaranteed data rate is 200 MSPS.
I0
Q0
I1
Q1
I2
Q2
TRXD[11 :0]
Q0
I1
Q1
I2
Q2
RX_IFIRST = 1
I3 RXIQ_HILO = 0
TRXD[11 :0]
Q0
I0
Q1
I1
Q2
RX_IFIRST = 0
I2 RXIQ_HILO = 1
TRXD[11 :0]
I0
Q1
I1
Q2
I2
Q3
RX_IFIRST = 0
RXIQ_HILO = 0
Figure 73. Receive Path Data Pairing Options
The output clock on TRXCLK can also be configured as a
double data rate (DDR) clock. In this mode the output clock is
divided by 2 and samples are placed on the TRXD[11:0] bus on
both the rising and falling edges of the TRXCLK. Figure 74
shows the timing.
tOD2
TRXCLK
The basic timing diagram for the Rx path is shown in Figure 72.
By default, the time-aligned TRXD[11:0] and TRXIQ output
signals are driven on the rising edge of the TRXCLK signal.
The tOD parameters are specified in Table 23.
TRXIQ
TRXD[11:0]
tOD1
TRXCLK
I0
Q0
I1
Q1
Figure 74. Receive Path Timing Diagram (DDR Clock Mode)
Table 23. Maximum Output Delay Between TRXCLK/
TRXD[11:0] and TRXIQ Signals from −40°C to +85°C
I0
Q0
I1
Q1
08801-154
TRXIQ
TRXD[11:0]
RX_IFIRST = 1
RXIQ_HILO = 1
TRXD[11 :0]
08801-045
In full-duplex mode, the TRx and Tx port operate independently.
The TRx port outputs samples from the receive path and the Tx
port accepts incoming samples for the transmit port.
TRXIQ
08801-156
The AD9961/AD9963 have two parallel interface ports, the
Tx port and the TRx port. The operation of the ports depends
on whether the device is configured for full-duplex or halfduplex mode.
Figure 72. Receive Path Timing Diagram (Bus Rate Clock Mode)
An additional configuration bit, RXCLKPH, is available to
invert the TRXCLK. In this case, the TRX data and the TRXIQ
signals are driven out on the falling edge of TRXCLK and tOD is
measured with respect to the falling edge of TRXCLK.
The analog signals are sampled simultaneously, creating a
quadrature pair of data. This creates two possible data pairing
orders on the output bus, I data followed by Q data, or Q data
followed by I data. There are also two possible ways to align the
bus data with the TRXIQ signal, I data aligned with TRXIQ
being high or I data aligned with TRXIQ being low. The IQ
pairing and data to TRXIQ alignment relationships create four
possible timing modes. The AD9961/AD9963 enable any of
these four modes to be sourced from the device. The data
pairing order is controlled by the RX_IFIRST bit. The phase
relationship between the Rx data and the RXIQ signal is
controlled by the RXIQ_HILO bit. The two programming
Parameter
Drive
Strength
tOD1
tOD2
Min
Max
Register 0x63 =
0x00
0.55
0.93
0.42
0.67
Min
Max
Register 0x63 =
0xAA
0.36
0.57
0.20
0.35
Units
ns
ns
SINGLE ADC MODE
The receive port can be operated with only one of the ADCs
operational. In this mode the TRXCLK signal can operate in
either bus rate clock mode or double data rate clock mode. The
TRXIQ pin indicates which ADC is active. Figure 75 to Figure 78
show the timing options available.
Rev. 0 | Page 48 of 60
AD9961/AD9963
TX PORT OPERATION (FULL-DUPLEX MODE)
tOD2
The Tx port operates with a qualifying clock that can be
configured as either an input or an output. The input data
(TXD[11:0]) must be accompanied by the TXIQ signal which
identifies to which transmit channel (I or Q) the data is
intended. By default, the data and TXIQ signals are latched by
the device on the rising edge of TXCLK. The timing diagram is
shown in Figure 79
TRXCLK
TRXD[11:0]
I0
I1
08801-157
TRXIQ
TXCLK
Figure 75. Rx Timing, I ADC Only, Bus Rate Clock Mode
tOD2
TXIQ
TRXCLK
tSU
tHD
TRXIQ
TRXD[11:0]
Q1
Q0
08801-158
Figure 76. Rx Timing, Q ADC Only, Bus Rate Clock Mode
tOD2
TRXCLK
TRXD[11:0]
I1
I0
08801-159
TRXIQ
08801-051
TXD[11:0]
Figure 79. Tx Port Timing Diagram (Data Rate Clock Mode)
The setup and hold time requirements for the Tx port in data
rate clock mode are given in Table 24.
The input samples to the device are assembled to create a
quadrature pair of data. The data can be arranged in two
possible data pairing orders and with two possible data to TXIQ
signal phase relationships. This creates four possible timing
modes. The AD9961/AD9963 can be configured to accept data
in any of these four modes. The data pairing order is controlled
by the TX_IFIRST bit. The data to TXIQ phase relationship is
controlled by the TXIQ_HILO bit. The two programming
options produce the four timing diagrams shown in Figure 80.
TXIQ
Figure 77. Rx Timing, I ADC Only, DDR Clock Mode
TX_IFIRST = 1
TXIQ_HILO = 1
TXD[11 :0]
I0
Q0
I1
Q1
I2
Q2
TXD[11 :0]
Q0
I1
Q1
I2
Q2
TX_IFIRST = 1
I3 TXIQ_HILO = 0
TXD[11 :0]
Q0
I0
Q1
I1
Q2
TX_IFIRST = 0
I2 TXIQ_HILO = 1
TXD[11 :0]
I0
Q1
I1
Q2
I2
Q3
TRXCLK
TRXD[11:0]
Q0
Q1
08801-160
TRXIQ
Figure 78. Rx Timing, Q ADC Only, DDR Clock Mode
In addition to the different timing modes listed in Figure 75 to
Figure 78, the input data can also be delivered from the device
in either unsigned binary or twos complement format. The
format type is chosen via the RX_BNRY configuration bit.
TX_IFIRST = 0
TXIQ_HILO = 0
08801-052
tOD2
Figure 80. Transmit Path Data Pairing Options
In addition to the different timing modes listed above, the input
data can also be accepted by the device in either unsigned
binary or twos complement format. The format type is chosen
via the TX_BNRY configuration bit.
Rev. 0 | Page 49 of 60
AD9961/AD9963
The interleaved digital data for the I and Q DACs is accepted by
the Tx bus (TXD([11:0]). The data must be presented to the
device such that it is stable throughout the setup and hold
times, tS and tH, around both the rising and falling edges of the
TXCLK signal. A detailed timing diagram is shown in Figure 81.
TXCLK
TXIFIRST = 1
TXIQPH = 1
TXD[11 :0]
I0
Q0
I1
Q1
I2
Q2
TXD[11 :0]
Q0
I1
Q1
I2
Q2
TXIFIRST = 1
I3 TXIQPH = 0
TXD[11 :0]
Q0
I0
Q1
I1
Q2
TXIFIRST = 0
I2 TXIQPH = 1
TXD[11 :0]
I0
Q1
I1
Q2
I2
Q3
TXIFIRST = 0
TXIQPH = 0
08801-054
The Tx port has an optional double data rate (DDR) clock
mode. In DDR mode, the transmit data is latched on both the
rising and falling edges of TXCLK. The polarity of the edge
identifies to which channel the input data is intended. In this
mode, the TXIQ signal is not required.
Figure 82. Transmit Path Timing Modes (DDR Mode)
TXCLK
HALF-DUPLEX MODE
tSU
tHD
tSU
tHD
08801-053
TXD[11:0]
Figure 81. Tx Port Timing Diagram (DDR Clock Mode)
In DDR mode, the TXCLK signal is always an input and must
be supplied along with the data. The setup and hold time
requirements for the Tx port in DDR mode are given Table 24
Table 24. Tx Port Setup and Hold Times From −40°C to
+85°C1
Tx Port
Operating Mode
TXCLK_MD = 01
TXCLK_MD = 10,
TXDBLSEL = 1
TXCLK_MD = 10,
TXDBLSEL = 0
1
DRVDD = 1.8 V
tSU
tHD
(Min)
(Min)
−0.02
+2.60
−1.04
+4.24
DRVDD = 3.3 V
tSU
tHD
(Min)
(Min)
+0.29
+1.99
−0.28
+3.92
Unit
ns
ns
−0.61
−0.14
ns
+4.76
+4.82
Specifications are preliminary and subject to change.
The input samples to the device are assembled to create a
quadrature pair of data. The two possible data pairing orders
and two possible data to TXIQ signal phase relationships create
four possible timing modes. The AD9961/AD9963 can be
configured to accept data in any of these four modes. The data
pairing order is controlled by the TX_IFIRST bit. The data to
TXIQ phase relationship is controlled by the TXIQ_HILO bit.
The two programming options produce the four timing
diagrams shown in Figure 82.
The AD9961/AD9963 offer a half-duplex mode enabling a
reduced width digital interface. In half-duplex mode, the
transmit and receive ports are multiplexed onto the TRXD,
TRXIQ, and TRXCLK lines. The direction of the bus can be
controlled by either the TXIQ/TXnRX pin (for the rest of this
section referred to as simply the TXnRX pin) or the serial port
configuration registers.
The operation of the transmit and receive ports in half-duplex
mode is very similar to the way they operate in full-duplex
mode. In half-duplex mode, the interface can be configured to
operate with a single clock pin, or with two clock pins. When in
Rx mode (sourcing data) the TRX port operates the same in
half-duplex mode as it does in full duplex. When in Tx mode,
the TXIQ and TXD[11:0] signals are mapped onto the TRXIQ
and TRXD[11:0] pins respectively. The TXCLK pin is mapped
to the TRXCLK pin in one-clock mode and remains on the
TXCLK pin in two-clock mode. Therefore, in one-clock mode,
the TRXCLK pin carries the RXCLK signal when set in the Rx
direction and the TXCLK signal when set in the Tx direction.
In two-clock mode, the TRX pin carries the RXCLK signal and
the TXCLK pin carries the TXCLK signal regardless of the bus
direction. By default, the clocks sourced by the device are only
present when the corresponding direction of the bus is active.
Setup and hold times for the TRx port are shown in Table 25.
Table 25. TRx Port Setup and Hold Times From −40°C to
+85°C
TRx Port
Operating Mode
TXCLK_MD = 01
TXCLK_MD = 10,
TXDBLSEL = 1
TXCLK_MD = 10,
TXDBLSEL = 0
Rev. 0 | Page 50 of 60
DRVDD = 1.8 V
tSU
tHD
(Min)
(Min)
+0.73
+1.61
−1.66
+5.84
DRVDD = 3.3 V
tSU
tHD
(Min)
(Min)
+0.44
+1.90
−0.96
+4.55
Units
ns
ns
−1.40
−1.15
ns
+6.62
+5.11
AD9961/AD9963
Table 26 shows the operating modes vs. serial port configuration
bits.
tTXRDY
TXnRX
Table 26. TRx Bus Operation via Serial Port
RXEN
0
1
0
1
TRXD Bus
Direction
High-Z
Rx
Tx
Rx
Tx Bus
Function
High-Z
High-Z
High-Z
High-Z
TRXIQ
HIGH-Z
TRXD[11:0]
HIGH-Z
Table 27 shows the operating modes of the TRXD bus as a
function of the TXnRX signal. The Tx bus is high impedance in
half-duplex mode.
Table 27. Rx Bus Operation via TXnRX Pin
TXnRX State
0
1
TRXD Bus
Direction
Rx
Tx
Tx Bus Function
High-Z
High-Z
The timing of the bus turnaround is shown in the Figure 83 and
Figure 84.
TXnRX
tTXRDY
TRXD[11:0]
HIGH-Z
08801-055
HIGH-Z
TRXIQ
Figure 83. Half-Duplex Bus Turnaround, Rx to Tx
Rev. 0 | Page 51 of 60
08801-056
TXEN
0
0
1
1
Figure 84. Half-Duplex Bus Turnaround, Tx to Rx
AD9961/AD9963
AUXILIARY CONVERTERS
The AD9961/AD9963 have two fast settling servo DACs, along
with an analog input and two analog I/O pins. All of the
auxiliary converters run off a dedicated supply pin. The input
and output compliance ranges depend on the voltage supplied.
AUXADCREF pin. The input voltage range for external voltage
references is from 1.0 V to 2.5 V. The input impedance of the
AUXADCREF pin is 100 kΩ. The full-scale input voltage of the
ADC is a function of the voltage reference as:
VAUXFS =
3. 2
× VAUXREF
2. 5
AUXILIARY ADC
Analog Inputs
The auxiliary ADC is a 12-bit SAR converter that is accessed
and controlled through the serial port registers (Register 0x77
through Register 0x7B). The ADC voltage reference and clock
signals are generated on chip. The auxiliary ADC is preceded by
a seven-input multiplexer. The ADC inputs can be connected to
either the AUXIN1, AUXIO2, AUXIO3 input pins, or one of
four internal signals as shown in Figure 85.
The ADC can be configured to sample one of eight analog
inputs. The input is selected through the channels select bits
(Register 0x77, Bits[2:0]). These eight signals are described in
Table 28.
REG 0x77[2:0]
REG 0x7A[2:0]
CLK
/R
AUXADCCLK
SEL 110
100
101
011
111
AUX
DAC
000
AUXREF
2.5V
VRxCML
VCMLI
VCMLQ
VPTAT
VINT
AUXIN1
001
AUXIO2
010
AUXIO3
Table 28. Auxiliary ADC Channel Selections
Channel
Select
000
001
Signal
AUXIN1
AUXIO2
010
AUXIO3
011
VPTAT
AUX
DAC10A
T (C o ) =
08801-057
AUX
DAC10B
Figure 85. Block Diagram of Auxiliary ADC Circuitry
100
101
VCMLI
VCMLQ
110
RXCML
111
GND
CONVERSION CLOCK
The auxiliary ADC conversion clock is generated through a
programmable binary division of the CLK input signal. The
frequency of the ADC conversion clock is programmable and
can be calculated from the following equation:
f AUXCLK =
Description
Pin 72.
Pin 71. The auxiliary DAC10A should be
disabled when using this pin as an input.
Pin 70. The auxiliary DAC10B should be
disabled when using this pin as an input.
Voltage proportional to absolute
temperature scaled to 0.2 °K per LSB.
Therefore, the temperature in degrees C
is:
f CLK
R
where R is programmed through Register 0x7A, Bits[2:0].
For best performance and lowest power consumption, the
conversion clock speed should be set to the lowest speed that
meets the system conversion time requirements. The maximum
allowable auxiliary ADC clock speed is 10 MHz.
Voltage Reference
The auxiliary ADC has an internal, temperature stable, 2.5 V
reference. This results in an input voltage range of 0 V to 3.2 V.
When using the internal voltage reference, the AUXADCREF
pin should be decoupled to AGND through a 0.22 µF capacitor.
The AUXADCREF pin can be used as a reference output to
external devices, but the current load on the pin should be
limited to sourcing less than 5 mA and sinking less than 100 µA.
ADC _ CODE
− 273.2
5
Common mode level of the I and Q Rx
ADC buffers. Should measure
approximately 0.9 V. The buffer must be
enabled (see Configuration Register
0x7E).
The RXCML output voltage on Pin 10. This
should measure approximately 1.4 V.
Should measure 0 V.
When selected, Input Pin 70, Pin 71, and Pin 72 are connected
to the sampling cap of the auxiliary ADC. Therefore, the
circuits driving these inputs need to recover to the desired
accuracy from having a discharged 10 pF capacitor connected
to it at the initiation of the conversion, within the sampling
window. A programmable delay (Register 0x7B, Bits[1:0]) can
be added to the conversion cycle time to allow additional
settling time of the input. If the ADC input is driven from a low
source impedance, like the output of an op amp, a 20-cycle
conversion time should yield good results. Higher impedance
sources may require the 34-cycle conversion time to fully settle.
Where the conversion cycle time is not an issue, it is
recommended that the full 34-cycle conversion time be used.
Conversions where the input multiplexer is switched between
inputs require a longer conversion cycle time than consecutive
conversions from the same multiplexer input.
For systems with tight accuracy requirements, a higher accuracy
external reference can be used to source a voltage into the
Rev. 0 | Page 52 of 60
AD9961/AD9963
Digital Output Coding
It should be noted that after initial power-up or recovery from
power-down, the ADC needs about 100 µS to stabilize. In many
cases, the results of the first conversion should be discarded in
order for the auxiliary ADC to reach an optimum operating
condition.
The digital output coding is straight binary. The ideal transfer
characteristic for the auxiliary ADC is shown in Figure 86.
111 ... 111
111 ... 110
111 ... 101
AUXILIARY DACs
ADC CODE
The AD9963 has two 10-bit auxiliary DACs and two 12-bit
auxiliary DACs suitable for calibration and control functions.
The DACs have voltage outputs with selectable full-scale
voltages and output ranges. The auxiliary DACs are configured
and updated through the serial port interface.
10-Bit Auxiliary DACs
000 ... 010
000 ... 001
The two 10-bit DACs have identical transfer functions and are
output on the AUXIO2 and AUXIO3 pins. The two DACs can
be independently enabled and configured. The DACs have five
selectable top-of-scale voltages and four selectable output
ranges, which result in 20 possible transfer functions.
000 ... 000
08801-058
+VFS – 1 LSB
1 LSB
+VFS – 1.5 LSB
+0.5 LSB
ANALOG INPUT
Figure 86. Auxiliary ADC Transfer Function
AVDD
Auxiliary ADC Conversion Cycle
Figure 87 shows a typical timing scenario for an auxiliary ADC
conversion period. The scenario shows the write that initiates
the conversion, followed by the read that retrieves the conversion
result. In some cases, it may be required to add a wait time
between the write and read to ensure that the conversion is
complete. The wait time depends on the ADC conversion cycle
time and the speed of the serial port clock. The minimum wait
time is calculated as:
DAC10_RNG
DACCODE[9:0]
SERIAL WRITE
PORT INSTR.
DATA
REG
0x77
WAIT
READ
INSTR.
ADC
CONVERSION
AUX ADC CYCLE 2
DATA
REG
0x78
DATA
REG
0x79
WRITE
INSTR.
DATA
REG
0x77
WAIT
ADC
CONVERSION
08801-059
AUX ADC CYCLE 1
16kΩ
DAC10_TOP: 000 = 1.0V = 16kΩ
001 = 1.5V = 8.0kΩ
010 = 2.0V = 5.3kΩ
011 = 2.5V = 4.0kΩ
100 = 3.0V = 3.2kΩ
AUXIO
–
RTOP
+
0.5V
Figure 88. Simplified Circuit Diagram of the 10-Bit Auxiliary DAC
The circuit is most easily analyzed using superposition of two
inputs to the op amp, the 0.5 V reference voltage, and the
programmable current source. The following equation describes
the no-load output voltage:
t wait ≥ (N + 1) × t AUXADCCLK − 7 × t SCLK
where N is the number of auxiliary ADC clock cycles that result
from the conversion time setting in Register 0x7B. tSCLK is the
serial port clock period. A negative wait time indicates no wait
time is required.
ISPAN
DAC10_RNG: 00 = 2.0V = 124µA Ifs
01 = 1.5V = 93µA Ifs
10 = 1.0V = 62µA Ifs
11 = 0.5V = 31µA Ifs
08801-060
A conversion is initiated by writing to SPI Register 0x77. The
conversion starts on the first rising edge of the AUXADCCLK
following a write to Register 0x77 (serial port register writes are
completed on the eighth rising edge of SCLK during the data
word write cycle). The conversion takes from 20 to 34
AUXADCCLK cycles to complete depending on the conversion
time setting programmed in Register 0x77. In most cases, the
ADC throughput is a function of both the serial port clock rate
and the ADC conversion time.
 0.5V  DACCODE 

−
VOUT = 0.5 + 16 kΩ × 
 × I SPAN 

 RTOP  1024

The DACCODE (see Register 0x49 and Register 0x4A for
DAC10A and Register 0x46 and Register 0x47 for DAC10B) is
interpreted such that ISPAN is full scale at 0x000 and zero at 0x3FF.
This leads to an increasing output voltage with increasing code
as shown in Figure 89 and Figure 90. The five selectable gain
setting resistors of 3.2 kΩ, 4.0 kΩ, 5.3 kΩ, 8.0 kΩ, and 16 kΩ
result in full-scale output voltage levels of 3.0 V, 2.5 V, 2.0 V,
1.5 V and 1.0 V respectively. The four selectable full-scale
currents of 31 µA, 62 µA, 93 µA and 124 µA result in voltage
output spans of 0.5 V, 1.0 V, 1.5 V, and 2.0 V, respectively.
Figure 87. Timing Scenario for Auxiliary ADC Conversion Cycle
Rev. 0 | Page 53 of 60
AD9961/AD9963
The curves in Figure 89 represent four of the possible DAC
transfer functions with the full-scale voltage of 3.0 V and spans
of 0.5 V, 1.0 V, 1.5 V, and 2.0 V. The curves in Figure 90
represent four of the possible DAC transfer functions with the
full-scale voltage of 1.5 V and spans of 0.5 V, 1.0 V, 1.5 V, and
2.0 V. Note that the 2.0 V span results in clamping at the lower
end of the scale at 0 V where the equation resultsin negative
output voltages.
AUX33V
AUXDACREF
2.3Ω
1
R
REFIO
0
VREF
DACCODE
0 TO VREF
DAC12
R
DAC12TOP: 0 = RTOP = 0.8R
1 = RTOP = 2.3R
Figure 91. Simplified Schematic of the 12-Bit Auxiliary DAC
2.5
2.0
Note that VREF can be derived from a 1.0 V bandgap reference
or be ratiometric with the AUX33V supply. An additional gain
stage follows the DAC that sets the final full-scale output
voltage . The following equation describes the no load output
voltage:
RNG00
RNG01
RNG10
RNG11
1.5
0.5
0
128
256
384
512
CODE
640
768
896
1024
08801-061
1.0
Figure 89. AUXDAC10 Voltage Output vs. Digital Code, VTOP = 3.0 V
(RTOP = 3.2 kΩ)
where VFS is set with the combination of bits shown in Table 29.
Table 29. 12-Bit Auxiliary DAC Full-Scale Voltage Selection
DAC10x_RNG1
0
1
0
1
AUXDAC_REF
0
0
1
1
2.00
1.75
1.50
OUTPUT VOLTAGE (V)
DACCODE  

VOUT =  VFS × 

1024



1.25
1
1.00
0.75
x = A or B.
The curves in Figure 92 show the two transfer functions when
using the internal 1.0 V bandgap reference.
RNG00
RNG01
RNG10
RNG11
0.50
VFS
AUX33V
0.54 × AUX33V
3.3 V
1.8 V
3.5
0.25
0
128
256
384
512
CODE
640
768
896
1024
Figure 90. AUXDAC10 Voltage Output vs. Digital Code, VTOP = 1.5 V
(RTOP = 8.0 kΩ)
12-Bit Auxiliary DACs
The two 12-bit DACs have similar transfer functions and are
output on the DAC12A and DAC12B pins. The two DACs can
be independently enabled and configured. Figure 91 shows a
simplified schematic of the 12-bit auxiliary DAC.
OUTPUT VOLTAGE (V)
0
08801-062
3.0
2.5
VFS = 3.3V
2.0
1.5
VFS = 1.8V
1.0
0.5
0
0
128
256
384
512
CODE
640
768
896
Figure 92. AUXDAC12 Voltage Output vs. Digital Code
Rev. 0 | Page 54 of 60
1024
08801-064
OUTPUT VOLTAGE (V)
3.0
RTOP
08801-063
3.5
AD9961/AD9963
POWER SUPPLIES
POWER SUPPLY CONFIGURATION EXAMPLES
The AD9961/AD9963 power distributions are shown in Figure 93.
The functional blocks labeled Rx ANLG, Rx ADCs, SPI and
digital core, clocking, and DLL operate from 1.8 V supplies. The
functional blocks labeled Tx DACs, AUX DACs and digital I/O
operate over a supply voltage range from 1.8 V to 3.3 V. The
auxiliary ADC operates from a 3.3 V supply.
TXVDD(2)
Tx DACs
AD9961/AD9963
LDO
TXVDD
CLK33V
CLK18V
DLL18V
DVDD18
DRVDD
CLK18V
Figure 94. 3.3 V Only Supply Configuration
Figure 93. AD9961/AD9963 Power Distribution Block Diagram
Figure 95 shows a power supply configuration where all 1.8 V
voltage rails are powered by external supplies. The LDO_EN
pin is left floating, and all of the internal LDOs except
DVDD18V are disabled. The transmit DAC, auxiliary
converters and I/O pads run from a 3.3 V supply.
The three DRVDD pins are internally connected together,
therefore, these pins must be connected to the same voltage.
The voltage applied to these pins affects the timing of the device
as noted in the Digital Interfaces section.
The TXVDD and AUX33V supplies can operate over a range
from 1.8 V to 3.3 V. It should be noted that the auxiliary ADC
requires AUX33V to be 3.3 V for operation. The performance
of the Tx DACs vary with the TXVDD supply as indicated in
the Table 1 and Figure 4 to Figure 11.
1.8V
AUX33V
3.3V
08801-180
The LDO_EN pin (Pin 14) is a three-state input pin that
controls the operation of the LDOs. When LDO_EN is high, all
of the LDOs are enabled. When LDO_EN is low, all of the
LDOs are disabled. When LDO_EN is floating or approximately
DRVDD/2, only the DVDD18V LDO is enabled. All of the
LDOs except the DVDD18V LDO can be independently
disabled through serial port control as well by writing to
Register 0x61.
TXVDD
When the LDO regulators are used, the RX18V, RX18VF,
DLL18V, CLK18V, and DVDD18V pins should be decoupled to
ground with a 0.1 µF or larger capacitor. The LDO inputs can
operate over a range from 2.5 V to 3.3 V.
RX33V
AD9961/AD9963
LDO_EN
The 1.8 V only blocks can be supplied directly with 1.8 V by
using the RX18V, RX18VF, DLL18V, CLK18V, and DVDD18V
supply pins. In this mode, the on-chip voltage regulators must
be disabled. To provide optimal ESD protection for the device,
the inputs of the LDO regulators should not be left floating.
When unused, the LDO regulator inputs should be tied to one
of the LDO outputs (for example, if RX33V is unused, tie
RX33V to either RX18V or RX18VF).
08801-066
3.3V
CLK33V
AD9961/AD9963
DRVDD
DRVDD(3)
DVDD18
DIGITAL I/O
DVDD18V
LDO
CLK18V
RX18VF
SPI AND
DIGITAL
CORE
DLL18V
Rx ADCs
RX18VF
LDO
LDO_EN
LDO
RX18VF
CLOCKING
RX18V
LDO
RX18V
RX33V
DLL
Rx ANLG
RX33V
AUX DACs
RX18V
REG 0x61 = 0x00
DLL18V
AUX33V
AUX ADCs
Figure 94 shows a 3.3 V only power supply configuration. In
this case, all of the internal circuits that require 1.8 V supplies
are powered from the on-chip regulators. The LDO_EN pin is
set high, and all of the internal LDOs are enabled. The transmit
DAC, auxiliary converters, and I/O pads run from a 3.3 V supply.
08801-065
AUX33V
There are numerous ways of configuring the power supplies
powering the AD9961/AD9963. Two power supply
configuration examples are shown in Figure 94 and Figure 95.
Figure 95. 3.3 V and 1.8 V Supply Configuration
POWER DISSIPATION
The AD9961/AD9963 power dissipation is highly dependent on
operating conditions. Table 30 and Figure 96 to Figure 103 show
the typical current consumption by power supply domain under
different operating conditions.
The current draw from the 1.8 V supplies are independent of
whether they are supplied by the on-chip regulators or by an
external 1.8 V supply. The quiescent current of the LDO regulators
are about 100 µA.
The current drawn from the AUX33V supply by the auxiliary ADC
is typically 350 µA. The 10-bit auxiliary DACs each typically draw
275 µA from the AUX33V supply. The 12-bit auxiliary DACs
typically draw 550 µA each from the AUX33V supply.
Rev. 0 | Page 55 of 60
AD9961/AD9963
7.0
80
70
6.5
60
6.0
ICLK18V (mA)
IRX (mA)
RX18V
50
5.5
5.0
40
4.5
30
4.0
20
20
40
60
80
100
fADC (MHz)
0
08801-181
0
25
50
75
100
125
150
175
fCLK (MHz)
08801-184
RX18VF
Figure 99. ICLKVDD18 vs. fCLK
Figure 96. IRX18V and IRX18VF vs. fADC, Both ADCs Enabled
12
26
fCLK = 20MHz, N = 1
22
IFS = 4mA
18
IDLL18V (mA)
ITXVDD (mA)
10
IFS = 2mA
14
fCLK = 50MHz, N = 1
8
fCLK = 20MHz, N = 5
IFS = 1mA
6
4
6
25
50
75
100
125
150
175
fDAC (MHz)
80
08801-182
0
18
16
16
IDVDD18 (mA)
IFS = 4mA
IFS = 2mA
320
12
2x
8
1x
10
IFS = 1mA
4
0
6
0
25
50
75
100
125
150
175
fDAC (MHz)
0
25
50
75
100
fRXDATA (MHz)
Figure 101. IDVDD18 vs. fRXDATA, 1×, 2× (Rx Only)
Figure 98. ITXVDD vs. fDAC, FSC = 1 mA, 2 mA, 4 mA, TXVDD = 1.8 V
Rev. 0 | Page 56 of 60
125
08801-186
8
08801-183
ITXVDD (mA)
260
Figure 100. IDLL18V vs. fDLL, fCLKIN= 19.2 MHz, 30.72 MHz
20
12
200
fDLL (MHz)
Figure 97. ITXVDD vs. fDAC, FSC = 1 mA, 2 mA, 4 mA, TXVDD = 3.3 V
14
140
08801-185
10
AD9961/AD9963
Power Calculation Example
The following example shows how to estimate the device power
consumption under a typical operating condition.
100
80
IDVDD18 (mA)
Operating conditions:
fCLK = 60 MHz
60
4x
8x
fDLL = 120 MHz
40
fDAC = 120 MHz
fADC = 60 MHz
2x
1x
20
4× interpolation
2× decimation
0
25
50
75
100
125
150
175
fDAC (MHz)
08801-187
0
Figure 102. IDVDD18 vs. fDAC, 1×, 2×, 4×, 8× (Tx only)
TXVDD = CLK33V = AUX33V = 3.3 V
Auxiliary ADC enabled
35
All other supplies powered from external 1.8 V supplies.
30
Table 30. Example Power Supply Currents
25
20
3.3V
2.5V
15
1.8V
10
5
0
0
10
20
30
40
50
60
70
80
90
fDATA (MHz)
Figure 103. IDRVDD vs. fDATA, (Tx Enable and Disabled)
100
08801-188
IDRVDD (mA)
DAC full-scale current = 2 mA
Supply
RX18V
RX18VF
TXVDD
CLKVDD18V
DLL18V
DVDD18V (Rx)
DVDD18V (Tx)
DRVDD
AUX33V
Total (1.8 V)
Total (3.3 V)
Rev. 0 | Page 57 of 60
Typical Current (mA)
74
30
16
5.2
7.5
9
35
5
0.5
169
16
Typical Power (mW)
133
54
53
9.5
13.5
16.2
63
9
1.7
298
55
AD9961/AD9963
OUTLINE DIMENSIONS
10.00
BSC SQ
0.60
0.42
0.24
0.60
0.42
0.24
55
54
72 1
PIN 1
INDICATOR
PIN 1
INDICATOR
9.75
BSC SQ
7.10
BSC SQ
EXPOSEDPAD
(BOTTOM VIEW)
0.50
0.40
0.30
1.00
0.85
0.80
0.80 MAX
0.65 TYP
12° MAX
0.30
0.23
0.18
SEATING
PLANE
18
19
37
36
8.50 REF
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
073108-A
TOP VIEW
0.50
BSC
Figure 104. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD9961BCPZ
AD9961BCPZRL
AD9963BCPZ
AD9963BCPZRL
AD9961-EBZ
AD9963-EBZ
HSC-DAC-EVALCZ
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Evaluation Board
Pattern Generation and Capture Card
CP-72-4
CP-72-4
CP-72-4
CP-72-4
1
Z = RoHS Compliant Part.
Rev. 0 | Page 58 of 60
AD9961/AD9963
NOTES
Rev. 0 | Page 59 of 60
AD9961/AD9963
NOTES
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08801-0-7/10(0)
Rev. 0 | Page 60 of 60