ON NCP114AMX210TCG Cmos low dropout regulator Datasheet

NCP114
300 mA CMOS Low Dropout
Regulator
The NCP114 is 300 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP114 employs the
dynamic quiescent current adjustment for very low IQ consumption at
no−load.
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MARKING
DIAGRAMS
Features
• Operating Input Voltage Range: 1.7 V to 5.5 V
• Available in Fixed Voltage Options: 0.75 V to 3.6 V
•
•
•
•
•
•
•
•
•
1
Contact Factory for Other Voltage Options
Very Low Quiescent Current of Typ. 50 mA
Standby Current Consumption: Typ. 0.1 mA
Low Dropout: 135 mV Typical at 300 mA
±1% Accuracy at Room Temperature
High Power Supply Ripple Rejection: 75 dB at 1 kHz
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in UDFN and TSOP Packages
These are Pb−Free Devices
XX M
1
XX = Specific Device Code
M = Date Code
5
TSOP−5
SN SUFFIX
CASE 483
XXXAYWG
G
1
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applicaitons
•
•
•
•
UDFN4
MX SUFFIX
CASE 517CU
PDAs, Mobile phones, GPS, Smartphones
Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee®
Portable Medical Equipment
Other Battery Powered Applications
PIN CONNECTIONS
VIN
EN
IN
3
4
2
1
VOUT
IN
OUT
NCP114
CIN
EN
ON
GND
OFF
COUT
1 mF
Ceramic
GND
OUT
(Bottom View)
Figure 1. Typical Application Schematic
IN
1
GND
2
EN
3
5 OUT
4 N/C
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 15 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
September, 2017 − Rev. 27
1
Publication Order Number:
NCP114/D
NCP114
IN
ENABLE
LOGIC
EN
THERMAL
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP114AMXyyyTCG devices.
yyy denotes the particular VOUT option.
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
(UDFN4)
Pin No.
(TSOP5)
Pin Name
Description
1
5
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this pin to ground to assure stability.
2
2
GND
Power supply ground.
3
3
EN
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
4
1
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
−
4
N/C
−
−
EPAD
Not connected. This pin can be tied to ground to improve thermal dissipation.
Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V or 6 V
V
Input Voltage (Note 1)
tSC
∞
s
TJ(MAX)
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, UDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
RqJA
170
°C/W
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air
RqJA
236
°C/W
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.
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2
NCP114
ELECTRICAL CHARACTERISTICS
−40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V for VOUT options greater than 1.5 V. Otherwise VIN = 2.5 V, whichever is greater; IOUT = 1 mA,
CIN = COUT = 1 mF, unless otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +85°C
respectively (Note 4).
Parameter
Test Conditions
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
−40°C ≤ TJ ≤ 85°C
VOUT ≤ 2.0 V
Symbol
Min
VIN
VOUT
VOUT > 2.0 V
VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V)
Max
Unit
1.7
5.5
V
−40
+40
mV
−2
+2
%
0.01
0.1
%/V
12
30
mV
28
45
RegLINE
Load Regulation − UDFN package
Load Regulation − TSOP−5 package
Load Transient
Dropout Voltage − UDFN package (Note 5)
Dropout Voltage − TSOP package (Note 5)
IOUT = 1 mA to 300 mA
RegLOAD
IOUT = 1 mA to 300 mA or 300 mA to 1 mA
in 1 ms, COUT = 1 mF
TranLOAD
460
VOUT = 1.85 V
245
330
155
230
145
220
VOUT = 3.1 V
140
210
VOUT = 3.3 V
135
200
VOUT = 1.5 V
380
485
VOUT = 1.85 V
260
355
170
255
160
245
155
235
150
225
VOUT = 2.8 V
VOUT = 3.0 V
VDO
VDO
VOUT = 3.1 V
VOUT = 3.3 V
Output Current Limit
mV
365
VOUT = 3.0 V
IOUT = 300 mA
−50/
+30
VOUT = 1.5 V
VOUT = 2.8 V
IOUT = 300 mA
Typ
ICL
IOUT = 0 mA
IQ
50
95
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 5.5 V
IDIS
0.01
1
mA
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
VEN_HI
VEN_LO
EN Pin Input Current
600
mV
VOUT = 90% VOUT(nom)
Ground Current
300
mV
mA
V
VEN = 5.5 V
0.4
1.0
mA
IEN
0.3
PSRR
75
dB
VN
70
mVrms
Power Supply Rejection Ratio
VIN = 3.6 V, VOUT = 3.1 V
IOUT = 150 mA
Output Noise Voltage
VIN = 2.5 V, VOUT = 1.8 V, IOUT = 150 mA
f = 10 Hz to 100 kHz
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Temperature falling from TSD
TSDH
20
°C
VEN < 0.4 V, Version A only
RDIS
100
W
Thermal Shutdown Hysteresis
Active Output Discharge Resistance
f = 1 kHz
0.9
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
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3
NCP114
TYPICAL CHARACTERISTICS
1.210
2.83
IOUT = 1 mA
2.82
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
1.205
1.200
1.195
IOUT = 300 mA
1.190
1.185
1.180
1.175
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
1.170
1.165
1.160
−40 −30 −20 −10 0
10
20 30 40
2.80
2.78
2.77
2.76
2.74
2.73
−40 −30 −20 −10 0
10
20 30 40
50 60 70 80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
VOUT = 1.2 V (UDFN)
Figure 4. Output Voltage vs. Temperature
VOUT = 2.8 V (UDFN)
1000
70
IGND, GROUND CURRENT (mA)
IQ, QUIESCENT CURRENT (mA)
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
2.75
50 60 70 80 90
−40°C
60
85°C
50
25°C
40
30
20
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
10
0.5
1.0 1.5
2.0 2.5
3.0 3.5
4.0 4.5 5.0
5.5
900
800
700
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
600
500
400
300
200
85°C
25°C
−40°C
100
0
0.001
0.01
0.1
1
10
100
1000
VIN, INPUT VOLTAGE (V)
IOUT, OUTPUT CURRENT (mA)
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Ground Current vs. Output Current
1000
0.1
900
IOUT = 300 mA
800
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
700
600
500
400
300
200
IOUT = 1 mA
100
0
−40 −30 −20 −10 0
10 20 30 40 50 60 70
REGLINE, LINE REGULATION (%/V)
IGND, GROUND CURRENT (mA)
IOUT = 300 mA
2.79
80
0
0.0
IOUT = 1 mA
2.81
80 90
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−1
−40 −30 −20 −10 0
VIN = 1.7 V to 5.5 V
VOUT = 1.2 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Ground Current vs. Temperature
Figure 8. Line Regulation vs. Output Current
VOUT = 1.2 V
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4
NCP114
TYPICAL CHARACTERISTICS
20
REGLOAD, LOAD REGULATION (mV)
REGLINE, LINE REGULATION (%/V)
0.1
0.08
0.06
0.04
0.02
0
−0.02
VIN = 3.8 V to 5.5 V
VOUT = 2.8 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
−0.04
−0.06
−0.08
−0.1
−40 −30 −20 −10 0
10
20 30 40
14
12
10
8
VIN = 2.5 V
VOUT = 1.2 V
IOUT = 1 mA to 300 mA
CIN = 1 mF
COUT = 1 mF
6
4
2
10
20 30 40
50 60 70 80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Line Regulation vs. Temperature
VOUT = 2.8 V
Figure 10. Load Regulation vs. Temperature
VOUT = 1.2 V (UDFN)
200
VDROP, DROPOUT VOLTAGE (mV)
REGLOAD, LOAD REGULATION (mV)
16
0
−40 −30 −20 −10 0
50 60 70 80 90
20
18
16
14
12
10
8
VIN = 3.8 V
VOUT = 2.8 V
IOUT = 1 mA to 300 mA
CIN = 1 mF
COUT = 1 mF
6
4
2
0
−40 −30 −20 −10 0
10
20 30
40
180
160
140
120
TJ = 85°C
100
TJ = −40°C
80
60
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
40
TJ = 25°C
20
0
0
50 60 70 80 90
50
100
150
200
250
300
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 11. Load Regulation vs. Temperature
VOUT = 2.8 V (UDFN)
Figure 12. Dropout Voltage vs. Output Current
VOUT = 2.8 V (UDFN)
180
250
160
140
120
100
TJ = 85°C
80
TJ = −40°C
60
VIN = 4.45 V
VOUT = 3.45 V
CIN = 1 mF
COUT = 1 mF
40
20
TJ = 25°C
0
0
50
100
150
200
250
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
18
225
200
175
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
150
125
100
75
IOUT = 100 mA
50
IOUT = 0 mA
25
0
−40 −30 −20 −10 0
300
IOUT = 300 mA
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 13. Dropout Voltage vs. Output Current
VOUT = 3.45 V (UDFN)
Figure 14. Dropout Voltage vs. Temperature
VOUT = 2.8 V (UDFN)
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NCP114
TYPICAL CHARACTERISTICS
140
120
800
VIN = 4.45 V
VOUT = 3.45 V
CIN = 1 mF
COUT = 1 mF
100
80
60
IOUT = 100 mA
40
IOUT = 0 mA
20
0
−40 −30 −20 −10 0
ISC, SHORT−CIRCUIT CURRENT (mA)
750
IOUT = 300 mA
ICL, CURRENT LIMIT (mA)
160
700
650
VOUT = 2.8 V
600
VOUT = 1.2 V
550
500
450
10 20 30 40 50 60 70
300
−40 −30 −20 −10 0
80 90
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 15. Dropout Voltage vs. Temperature
VOUT = 3.45 V (UDFN)
Figure 16. Current Limit vs. Temperature
800
750
700
VOUT = 2.8 V
650
VOUT = 1.2 V
600
550
500
450
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
400
350
300
−40 −30 −20 −10 0
10
20 30 40
800
750
700
650
600
550
500
450
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
400
350
300
50 60 70 80 90
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6
TJ, JUNCTION TEMPERATURE (°C)
VIN, INPUT VOLTAGE (V)
Figure 17. Short−Circuit Current vs.
Temperature
Figure 18. Short−Circuit Current vs. Input
Voltage
1
350
0.9
315
0.8
IEN, ENABLE CURRENT (nA)
VEN, VOLTAGE ON ENABLE PIN (V)
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
400
350
ISC, SHORT−CIRCUIT CURRENT (mA)
VDROP, DROPOUT VOLTAGE (mV)
180
OFF −> ON
0.7
0.6
ON −> OFF
0.5
0.4
0.3
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
0.2
0.1
0
−40 −30 −20 −10 0
10
20 30 40
VEN = 5.5 V
280
245
210
VEN = 0.4 V
175
140
105
35
0
−40 −30 −20 −10 0
50 60 70 80 90
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
70
10
20 30 40
50 60 70 80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Enable Voltage Threshold vs.
Temperature
Figure 20. Current to Enable Pin vs.
Temperature
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NCP114
TYPICAL CHARACTERISTICS
IDIS, DISABLE CURRENT (nA)
100
80
60
40
20
0
−20
−40
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
−60
−80
−100
−40 −30 −20 −10 0
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Disable Current vs. Temperature
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NCP114
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
1
0.01
0.1
IOUT = 10 mA
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
60.93
59.11
10 mA
52.73
50.63
300 mA
52.06
50.17
IOUT = 1 mA
1
100
10
1000
FREQUENCY (kHz)
Figure 22. Output Voltage Noise Spectral Density for VOUT = 1.2 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
IOUT = 10 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
1
0.01
0.1
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
74.66
1 mA
79.23
10 mA
75.03
70.37
300 mA
87.74
83.79
IOUT = 1 mA
1
10
100
1000
FREQUENCY (kHz)
Figure 23. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
1 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 4.7 mF
1
0.01
0.1
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
80.17
75.29
10 mA
81.28
76.46
300 mA
93.23
89.62
IOUT = 10 mA
IOUT = 1 mA
1
10
100
1000
FREQUENCY (kHz)
Figure 24. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 4.7 mF
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NCP114
TYPICAL CHARACTERISTICS
100
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
80
70
60
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0
0.1
1
10
VIN = 3.8 V, VOUT = 2.8 V
CIN = none, COUT = 4.7 mF
MLCC, X7R,
1206 size
90
80
70
60
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0
100
1000
10000
0.1
1
10
100
1000
10000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 25. Power Supply Rejection Ratio,
VOUT = 2.8 V, COUT = 1 mF
Figure 26. Power Supply Rejection Ratio,
VOUT = 2.8 V, COUT = 4.7 mF
100
100
VIN = 4.4 V, VOUT = 3.45 V
CIN = none, COUT = 1 mF
MLCC, X7R,
1206 size
90
80
10
70
UNSTABLE OPERATION
60
ESR (W)
RR, RIPPLE REJECTION (dB)
100
VIN = 3.8 V, VOUT = 2.8 V
CIN = none, COUT = 1 mF
MLCC, X7R,
1206 size
90
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0
0.1
1
10
1
STABLE OPERATION
VIN = 5.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
0.1
0.01
100
1000
10000
0
50
100
150
200
250
FREQUENCY (kHz)
IOUT, OUTPUT CURRENT (mA)
Figure 27. Power Supply Rejection Ratio,
VOUT = 3.45 V, COUT = 1 mF
Figure 28. Output Capacitor ESR vs. Output
Current
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300
NCP114
VOUT
IINRUSH
VOUT
40 ms/div
40 ms/div
1 V/div
VOUT
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VEN
IINRUSH
VOUT
40 ms/div
40 ms/div
Figure 31. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 1 mA
Figure 32. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 300 mA
tRISE = 1 ms
500 mV/div
VIN
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
VOUT
10 mV/div
1 V/div
500 mV/div
500 mV/div
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
IINRUSH
10 mV/div
Figure 30. Enable Turn−on Response,
COUT = 1 mF, IOUT = 300 mA
200 mA/div
500 mV/div
Figure 29. Enable Turn−on Response,
COUT = 1 mF, IOUT = 1 mA
VEN
200 mA/div
VEN
1 V/div
1 V/div
IINRUSH
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VIN
tFALL = 1 ms
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
VOUT
20 ms/div
10 ms/div
Figure 33. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA
Figure 34. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA
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10
200 mA/div
VEN
500 mV/div
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
200 mA/div
500 mV/div
TYPICAL CHARACTERISTICS
NCP114
500 mV/div
tRISE = 1 ms
20 mV/div
VIN
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 10 mF
CIN = 1 mF
IOUT = 300 mA
VOUT
VIN
tFALL = 1 ms
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VOUT
4 ms/div
Figure 36. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 300 mA
100 mA/div
4 ms/div
Figure 35. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 300 mA
100 mA/div
20 mV/div
500 mV/div
TYPICAL CHARACTERISTICS
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
IOUT
tFALL = 1 ms
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
tRISE = 1 ms
COUT = 1 mF
20 mV/div
COUT = 4.7 mF
COUT = 4.7 mF
COUT = 1 mF
VOUT
4 ms/div
20 ms/div
Figure 37. Load Transient Response − Rising
Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 38. Load Transient Response − Falling
Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
IOUT
tRISE = 1 ms
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
100 mA/div
100 mA/div
20 mV/div
VOUT
tFALL = 1 ms
COUT = 1 mF
COUT = 1 mF
20 mV/div
20 mV/div
VOUT
COUT = 4.7 mF
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 4.7 mF
VOUT
4 ms/div
10 ms/div
Figure 39. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 40. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
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11
NCP114
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
100 mA/div
100 mA/div
TYPICAL CHARACTERISTICS
tRISE = 1 ms
tFALL = 1 ms
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN = 3.8 V
20 mV/div
VIN = 5.5 V
VIN = 3.8 V
VOUT
VIN = 5.5 V
2 ms/div
10 ms/div
Figure 41. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
VIN = 3.8 V, 5.5 V
Figure 42. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
VIN = 3.8 V, 5.5 V
VIN = 5.5 V
VOUT = 2.8 V
IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN
Full Load
200 mA/div
20 mV/div
VOUT
VOUT
Overheating
VIN = 5.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
Thermal Shutdown
1 V/div
500 mA/div
VOUT
TSD Cycling
4 ms/div
10 ms/div
Figure 43. Turn−on/off − Slow Rising VIN
Figure 44. Short−Circuit and Thermal
Shutdown
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12
NCP114
APPLICATIONS INFORMATION
General
The NCP114 is a high performance 300 mA Low Dropout
Linear Regulator. This device delivers very high PSRR
(over 75 dB at 1 kHz) and excellent dynamic performance
as load/line transients. In connection with very low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. The device is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP114 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Input Capacitor Selection (CIN)
Output Current Limit
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. /max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Output Current is internally limited within the IC to a
typical 600 mA. The NCP114 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 630 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Output Decoupling (COUT)
The NCP114 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP114 is designed to
remain stable with minimum effective capacitance of
0.22mF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0402 the effective capacitance drops
rapidly with the applied DC bias.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Power Dissipation
As power dissipated in the NCP114 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP114 can handle
is given by:
Enable Operation
P D(MAX) +
The NCP114 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
VOUT is pulled to GND through a 100 W resistor. In the
ƪ125° C * T Aƫ
q JA
(eq. 1)
The power dissipated by the NCP114 for given
application conditions can be calculated from the following
equations:
P D [ V INǒI GND@I OUTǓ ) I OUTǒV IN * V OUTǓ
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13
(eq. 2)
NCP114
qJA, JUNCTION−TO−AMBIENT
THERMAL RESISTANCE (°C/W)
240
PD(MAX), TA = 25°C, 2 oz Cu
0.9
220
PD(MAX), TA = 25°C, 1 oz Cu
200
180
0.8
0.7
qJA, 1 oz Cu
160
0.6
140
qJA, 2 oz Cu
0.5
120
100
0
100
200
300
400
500
600
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
1
260
0.4
700
COPPER HEAT SPREADER AREA (mm2)
450
0.9
400
0.75
350
PD(MAX), TA = 25°C, 2 oz Cu
300
PD(MAX), TA = 25°C, 1 oz Cu
250
qJA, 1 oz Cu
200
150
0
qJA, 2 oz Cu
100
200
300
400
500
600
0.6
0.45
0.3
0.15
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
qJA, JUNCTION−TO−AMBIENT
THERMAL RESISTANCE (°C/W)
Figure 45. qJA vs. Copper Area (uDFN4)
0
700
COPPER HEAT SPREADER AREA (mm2)
Figure 46. qJA vs. Copper Area (TSOP−5)
Reverse Current
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT and TA.
For example typical value for VOUT = 1.2 V, COUT = 1 mF,
IOUT = 1 mA and TA = 25°C is 90 ms.
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
Power Supply Rejection Ratio
The NCP114 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz − 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
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14
NCP114
ORDERING INFORMATION
Voltage
Option
Marking
Marking
Rotation
NCP114AMX075TCG
0.75 V
AW
0°
NCP114AMX080TCG
0.80 V
AT
0°
NCP114AMX090TCG
0.9 V
AP
0°
NCP114AMX100TCG
1.0 V
6
180°
NCP114AMX105TCG
1.05 V
R
0°
NCP114AMX110TBG
1.1 V
F
180°
NCP114AMX110TCG
1.1 V
F
180°
NCP114AMX115TCG
1.15 V
AM
0°
NCP114AMX120TBG
1.2 V
T
0°
NCP114AMX120TCG
1.2 V
T
0°
NCP114AMX125TCG
1.25 V
A
180°
Device
NCP114AMX130TCG
1.3 V
AA
0°
NCP114AMX135TCG
1.35 V
AN
0°
NCP114AMX150TCG
1.5 V
V
0°
NCP114AMX160TCG
1.6 V
2
180°
NCP114AMX180TBG
1.8 V
J
180°
NCP114AMX180TCG
1.8 V
J
180°
NCP114AMX185TCG
1.85 V
Y
0°
NCP114AMX210TCG
2.1 V
L
180°
NCP114AMX220TCG
2.2 V
Q
180°
NCP114AMX240TCG
2.4 V
AH
0°
NCP114AMX250TBG
2.5 V
AF
0°
NCP114AMX250TCG
2.5 V
AF
0°
NCP114AMX260TCG
2.6 V
T
180°
NCP114AMX270TCG
2.7 V
AJ
0°
NCP114AMX280TBG
2.8 V
2
0°
NCP114AMX280TCG
2.8 V
2
0°
NCP114AMX285TCG
2.85 V
3
0°
NCP114AMX290TCG
2.9 V
AZ
0°
NCP114AMX300TCG
3.0 V
4
0°
NCP114AMX310TBG
3.1 V
5
0°
NCP114AMX310TCG
3.1 V
5
0°
NCP114AMX320TCG
3.2 V
AG
0°
NCP114AMX330TBG
3.3 V
6
0°
NCP114AMX330TCG
3.3 V
6
0°
NCP114AMX345TCG
3.45 V
AC
0°
NCP114AMX350TCG
3.5 V
4
180°
NCP114AMX360TCG
3.6 V
AU
0°
Option
Package
Shipping†
With active output
discharge function
UDFN4
(Pb-Free)
3000 / Tape & Reel
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15
NCP114
ORDERING INFORMATION
Voltage
Option
Marking
Marking
Rotation
NCP114BMX075TCG
0.75 V
CW
0°
NCP114BMX100TCG
1.0 V
6
270°
NCP114BMX120TCG
1.2 V
T
90°
NCP114BMX150TCG
1.5 V
V
90°
NCP114BMX180TCG
1.8 V
J
270°
NCP114BMX250TCG
2.5 V
CF
0°
NCP114BMX280TCG
2.8 V
2
90°
NCP114BMX300TCG
3.0 V
4
90°
NCP114BMX330TCG
3.3 V
6
90°
Device
Option
Package
Shipping†
Without active output
discharge function
UDFN4
(Pb-Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
ORDERING INFORMATION
Device
Voltage Option
Marking
NCP114ASN080T1G
0.8 V
CAY
NCP114ASN120T1G
1.2 V
CAC
1.5 V
CAX
1.8 V
CAD
2.5 V
CAG
Option
Package
Shipping†
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP114ASN120T2G
NCP114ASN150T1G
NCP114ASN150T2G
NCP114ASN180T1G
NCP114ASN180T2G
NCP114ASN250T1G
With output active
discharge function
NCP114ASN250T2G
NCP114ASN260T1G
2.6 V
CAQ
NCP114ASN270T1G
2.7 V
CAV
NCP114ASN280T1G
2.8 V
CAH
NCP114ASN290T1G
2.9 V
CAU
NCP114ASN300T1G
3.0 V
CAK
NCP114ASN330T1G
3.3 V
CAL
3.3 V
CDL
NCP114ASN280T2G
NCP114ASN330T2G
NCP114BSN330T1G
Without output
active discharge
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
16
NCP114
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
NOTE 5
2X
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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17
NCP114
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517CU
ISSUE A
A
B
D
PIN ONE
REFERENCE
2X
0.05 C
2X
0.05 C
ÉÉ
ÉÉ
C0.27 x 0.25
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.03 AND 0.07
FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
3X C0.18
X 45 5
L2
DETAIL A
DIM
A
A1
A3
b
D
D2
E
e
L
L2
TOP VIEW
A
0.10 C
(A3)
A1
0.05 C
NOTE 4
C
SIDE VIEW
MILLIMETERS
MIN
MAX
−−−
0.60
0.00
0.05
0.15 REF
0.20
0.30
1.00 BSC
0.38
0.58
1.00 BSC
0.65 BSC
0.20
0.30
0.27
0.37
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
e
e/2
DETAIL A
1
2
3X
2X
0.65
PITCH
L
0.58
3X
DETAIL B
0.43
PACKAGE
OUTLINE
D2
45 5
D2
4
4X
0.23
1.30
3
4X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
0.53
1
4X
0.30
NOTE 3
3X 0.10
DETAIL B
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP114/D
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