L9662 Octal squib driver and quad Manchester/PSI5 encoded sensor interface ASIC for safety application Datasheet - production data Support PSI5 (Parity) protocol for satellite sensors (reference PSI5 technical specification V 1.2 /14.06.07) Support for Sync pulse and minibus for satellites Supports for variable bit rate detection '!0'03 Independent current limit and fault timer shutdown protection for each satellite output LQFP64 (10x10x1.4mm) Features Short to ground and short to battery detection and reporting for each satellite channel 8 deployment drivers with SPI selectable firing current and times 2 independent SPI interfaces Capability to deploy the squib with 1.2 A (min)/2 ms, 1.75 A (min)/1.0 ms and 1.75 A (min)/0.65 ms between VRES of 7 V to 37 V Satellite message error detection Capability to deploy the squib with 1.5 A (min)/2 ms between VRES of 7 V to 25 V 5.5 MHz SPI interface Hall effect sensor support on satellite channels 3 and 4. Low voltage internal reset Firing capability to deploy all channels simultaneously 2 kV ESD capability on all pins Independently controlled high-side and lowside MOS for diagnosis Technology: ST Proprietary BCD5 Analog output available for resistance measurement Description Package: LQFP64 Squib short to ground, short to battery and MOS diagnostic available on SPI register Capability to deploy the squib the low side MOS is shorted to ground 4 Fire enable inputs Interface with 4 satellite sensors Programmable independent current trip points for each satellite channel Support Manchester 1 or 2 protocol for satellite sensors The device is intended to deploy up to 8 squibs and to interface up to 4 satellites. 2 satellite interfaces can be used to interface Hall sensors. Squib drivers are sized to deploy 1.2 A minimum for 2 ms, 1.75 A minimum for 1 ms and 1.75 A minimum for 0.65 ms during load dump along with 1.5 A minimum for 2 ms for VRES voltages less than 25 V. Full diagnostic capabilities of the squib interface are provided. Satellite interfaces support Manchester 1, 2 and PSI5 decoding with variable bit rate. Table 1. Device summary Order code L9662 L9662TR Amb. temp range, C Package -40 to +85 LQFP64 September 2015 This is information on a product in full production. DocID028325 Rev 1 Packing Tray Tape & Reel 1/80 www.st.com Contents L9662 Contents 1 2 3 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 Absolute maximum degraded operating ratings . . . . . . . . . . . . . . . . . . . . 11 2.3 Operating ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.4.2 Electrical characteristics - Squib deployment drivers and diagnostics . . 14 2.4.3 Electrical characteristics - Satellite interface . . . . . . . . . . . . . . . . . . . . . 19 2.4.4 SPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.2 General functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.3 3.2.1 Power on reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.2.2 RESETB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.2.3 Reference resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.2.4 Loss of ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.2.5 VRESx capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.2.6 Supply voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.2.7 Ground connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.3.1 3.4 2/80 SPI pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Squib drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.4.1 Firing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.4.2 Firing current measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.4.3 Fire enable (FEN) function description . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.4.4 Squib diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.4.5 SPI register definition for squib functions . . . . . . . . . . . . . . . . . . . . . . . 39 3.4.6 Satellite sensor interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 DocID028325 Rev 1 L9662 Contents 3.4.7 4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 4.1 5 SPI register definition for satellite functions . . . . . . . . . . . . . . . . . . . . . . 65 LQFP64 (10x10x1.4 mm) package information . . . . . . . . . . . . . . . . . . . . 77 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 DocID028325 Rev 1 3/80 3 List of tables L9662 List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48. 4/80 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Absolute maximum degraded operating ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Operating ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 General - DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Squib deployment drivers and diagnostics - DC electrical characteristics . . . . . . . . . . . . . 14 Satellite interface - DC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI timing - DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Features that are accessed/controlled for each of the SPIs . . . . . . . . . . . . . . . . . . . . . . . . 28 SPI1 MOSI/MISO response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 How faults shall be interpreted . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 High side safing diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Voltage measurement diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 MISO responses to various events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Command description summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Configuration mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Configuration mode 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Deployment mode 1 bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Deployment mode 2 bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Diagnostic selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Diagnostic mode LS FET selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Diagnostic mode HS FET selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Diagnostic mode HSS selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Diagnostic mode VRESx selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 MOSI diagnostic mode 2 bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 DEPLOY_STATUSx flag and the DEPLOY_SUCCESSx flag conditions. . . . . . . . . . . . . . 51 MOSI monitor mode 2 Bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Current measurement channel selections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 MOSI monitor mode 3 bit definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 MOSI monitor mode 3 bit definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 MCR and CCR settings based on the interfacing to a sensor or satellite . . . . . . . . . . . . . . 64 SPI register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Commands/positions sent out on MOSI along with responses. . . . . . . . . . . . . . . . . . . . . . 66 MOSI MCR bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Sync pulse high time selections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Configuration of the IF3/V3 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 MOSI CCR bit definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 MISO responses with D14=0 (Data register selection). . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Protocol A/B mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PSI5 – parity protocol (Set in MCR D13:D10). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Default speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 On/off condition for satellite and decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Current range supported. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 CCR D14 definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 First response from the ASIC over SPI2e. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 LQFP64 (10x10x1.4 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 DocID028325 Rev 1 L9662 Table 49. List of tables Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 DocID028325 Rev 1 5/80 5 List of figures L9662 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. 6/80 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 MOS settling time and turn-on time 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Sync pulse diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SPI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 MISO Loading for Disable Time Measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 POR timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Deployment drivers diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Driver activation timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Squib diagnostics block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Transmission in asynchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Synchronization pulse timing (single device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Synchronization pulse timing (mini bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 High voltage mode communication. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Manchester-1/2 decoding diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Example of Manchester decoding using satellite protocol . . . . . . . . . . . . . . . . . . . . . . . . . 60 Satellite protocol-A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Generic satellite protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 PSI5 – parity satellite protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Data buffer / data transfer diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Satellite SPI transfer during normal operation diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Combination errors diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 LQFP64 (10x10x1.4 mm) package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 DocID028325 Rev 1 L9662 Block diagram and pin description 1 Block diagram and pin description 1.1 Block diagram Figure 1. Block diagram &6B' 6&/. 026, 0,62 )(1 )(1 )(1 )(1 95(6 95(6 95(6 95(6 63, 95(6 95(6 95(6 95(6 6TXLE'HSOR\PHQW 'LDJQRVWLFV &YUHVB 64+ 64/ *1' 96',$* ) 64+ .ȍ 7R$'& &YUHVB $287 64/ *1' $*1' ) 64+ 9'' ) *1' *1' *1' 3LQ 3LQ 3LQ 'HSOR\PHQW 'ULYHUV 'LDJQRVWLFV 5(6(7 7(67 &6B6 6&/.B6 026,B6 0,62B6 64+ 64/ *1' 63, 64+ 6DWHOOLWH 64/ *1' ,1,76<1& 64+ 96<1& ) 64/ *1' 64/ *1' ) 64+ 96$76 64/ *1' ) ,&+ ,&+ &,&+ ,&+ &,&+ ,&+ &,&+ 6HQVRU ,QWHUIDFH 64+ 64/ *1' &,&+ 9'' ,)9 ,)9 5,5() ,5() *$3*36 DocID028325 Rev 1 7/80 79 Block diagram and pin description 1.2 L9662 Pin description Table 2. Pin description Pin Number Pin name 1 MISO 2 MISO_S 3 FEN1 4 FEN2 5 RESETB 6 GND Ground (Analog & Digital) 7 VDD 8 8/80 Description I/O type Reset state SPI Data Out Output Hi-Z Satellite SPI Data Out Output Hi-Z Fire Enable for Channels 0 and 1 Input Pulldown Fire Enable for Channels 2 and 3 Input Pulldown Reset pin Input Pullup - - VDD Supply Voltage Input - FEN3 Fire Enable for Channels 4 and 5 Input Pulldown 9 FEN4 Fire Enable for Channels 6 and 7 Input Pulldown 10 INITSYNC Initiate Sync Pulse Input Pulldown 11 CS_S SPI Chip Select for Satellite Interface Input Pullup 12 CS_D SPI Chip Select for Deployment Driver Input Pullup 13 MOSI SPI Data In Input Hi-Z 14 MOSI_S Satellite SPI Data In 15 SCLK_S Satellite SPI Clock 16 SCLK SPI Clock 17 GND4 Power Ground for Loop Channel 4 18 SQL4 19 Hi-Z Input Hi-Z - - Low Side Driver Output for Channel 4 Output Pulldown SQH4 High Side Driver Output for Channel 4 Output Hi-Z 20 VRES4 Reserve Voltage for Loop Channel 4 Input - 21 VRES5 Reserve Voltage for Loop Channel 5 Input - 22 SQH5 High Side Driver Output for Channel 5 Output Hi-Z 23 SQL5 Low Side Driver Output for Channel 5 Output Pulldown 24 GND5 Power Ground for Loop Channel 5 - - 25 GND6 Power Ground for Loop Channel 6 - - 26 SQL6 Low Side Driver Output for Channel 6 Output Pulldown 27 SQH6 High Side Driver Output for Channel 6 Output Hi-Z 28 VRES6 Reserve Voltage for Loop Channel 6 Input - 29 VRES7 Reserve Voltage for Loop Channel 7 Input - 30 SQH7 High Side Driver Output for Channel 7 Output Hi-Z 31 SQL7 Low Side Driver Output for Channel 7 Output Pulldown 32 GND7 Power Ground for Loop Channel 7 - - 33 TEST Test pin Input Pulldown DocID028325 Rev 1 L9662 Block diagram and pin description Table 2. Pin description (continued) Pin Number Pin name Description I/O type Reset state 34 VSDIAG Input - 35 NC - - 36 IF3/V3 Current Feedback for channel 3 Raw Or Raw Data output For Channel 3 Output Hi-Z 37 IF2/V2 Current Feedback for channel 2 Raw Or Data output For Channel 2 Output Hi-Z 38 GND Ground (Analog & Digital) - - 39 ICH3 Current Sense Output for Channel 3 Output Hi-Z 40 ICH2 Current Sense Output for Channel 2 Output Hi-Z 41 ICH1 Current Sense Output for Channel 1 Output Hi-Z 42 ICH0 Current Sense Output for Channel 0 Output Hi-Z 43 VSYNC Supply for Satellite Sync Pulse Input - 44 VSATS Supply Voltage for Satellite Interface Input - 45 GND Ground (Analog & Digital) - - 46 IREF External Current Reference Resistor Output - 47 AGND Ground Reference for AOUT - - 48 AOUT Analog Output for Loop Diagnostics Output Hi-Z 49 GND3 Power Ground for Loop Channel 3 - - 50 SQL3 Low Side Driver Output for Channel 3 Output Pulldown 51 SQH3 High Side Driver Output for Channel 3 Output Hi-Z 52 VRES3 Reserve Voltage for Loop Channel 3 Input - 53 VRES2 Reserve Voltage for Loop Channel 2 Input - 54 SQH2 High Side Driver Output for Channel 2 Output Hi-Z 55 SQL2 Low Side Driver Output for Channel 2 Output Pulldown 56 GND2 Power Ground for Loop Channel 2 - - 57 GND1 Power Ground for Loop Channel 1 - - 58 SQL1 Low Side Driver Output for Channel 1 Output Pulldown 59 SQH1 High Side Driver Output for Channel 1 Output Hi-Z 60 VRES1 Reserve Voltage for Loop Channel 1 Input - 61 VRES0 Reserve Voltage for Loop Channel 0 Input - 62 SQH0 High Side Driver Output for Channel 0 Output Hi-Z 63 SQL0 Low Side Driver Output for Channel 0 Output Pulldown 64 GND0 Power Ground for Loop Channel 0 - - Supply for Deployment Driver Diagnostics No Connect DocID028325 Rev 1 9/80 79 Electrical specifications L9662 2 Electrical specifications 2.1 Absolute maximum ratings The following maximum ratings are continuous absolute ratings; exceeding any one of these values may cause permanent damage to the integrated circuit. Table 3. Absolute maximum ratings Symbol Value Unit Supply voltage - 0.3 to 5.5 V VSDIAG Supply voltage for squib diagnostics - 0.3 to 40 V VSATS Satellite supply voltage - 0.3 to 40 V VSYNC Sync supply voltage - 0.3 to 40 V VRESx VRES voltage (VRES0, VRES1, VRES2, VRES3, VRES4, VRES5, VRES6, VRES7) - 0.3 to 40 V SQHx Squib high side drivers (SQH0, SQH1, SQH2, SQH3, SQH4, SQH5, SQH6, SQH7) - 0.6 to 40 V SQLx Squib low side drivers (SQL0, SQL1, SQL2, SQL3, SQL4, SQL5, SQL6, SQL7) - 0.3 to 40 V ICHx Satellite outputs (ICH0, ICH1, ICH2, ICH3) -1 to 40 V TEST Test pin -0.3 to 40 V VI Discrete input voltage (RESETB, DEPEN, CS_D, CS_S, SCLK, SCLK_S, MOSI, MOSI_S, MISO, MISO_S, FEN1, FEN2, FEN3, FEN4, INITSYNC, IREF) - 0.3 to 5.5 V VO Discrete output voltage (MISO, MISO_S, AOUT, IF2V2, IF3V3) - 0.3 to 5.5 V Analog output reference -0.3 to 5.5 V Ground (GND, GND0, GND1, GND2, GND3, GND4, GND5, GND6, GND7) -0.3 to 5.5 V 150 °C VDD AGND GND Tj Parameter Maximum steady-state junction temperature Tamb Ambient temperature -40 to 95 °C Tstg Storage temperature -65 to 150 °C 46 °C/W Rth j amb Thermal resistance-junction-to-ambient The following maximum ratings are up to 48 hours; exceeding any one of these values for longer than a total time of 48 hours may cause permanent damage to the integrated circuit. VDD 10/80 Supply voltage - 0.3 to 6.0 V VI Discrete input voltage (RESETB, DEPEN, CS_D, CS_S, SCLK, SCLK_S, MOSI, MOSI_S, MISO, MISO_S, FEN1, FEN2, FEN3, FEN4, INITSYNC, IREF) - 0.3 to 6.0 V VO Discrete output voltage (MISO, MISO_S, AOUT, IF2V2, IF3V3) - 0.3 to 6.0 V DocID028325 Rev 1 L9662 Electrical specifications Table 3. Absolute maximum ratings Symbol AGND GND Tj Parameter Value Unit Analog output reference -0.3 to 6.0 V Ground (GND, GND0, GND1, GND2, GND3, GND4, GND5, GND6, GND7) -0.3 to 6.0 V 150 °C Maximum steady-state junction temperature Tamb Ambient temperature -40 to 95 °C Tstg Storage temperature -65 to 150 °C 46 °C/W Rth j amb 2.2 Thermal resistance junction-to-ambient Absolute maximum degraded operating ratings Under the following deviations to the ratings indicated in Section 2.3 the device performance will be degraded and not meet the electrical characteristics outlined in Section 2.4. At minimum the SPI and diagnostics will function but not meet specified electrical parameters. Table 4. Absolute maximum degraded operating ratings Symbol VDD Parameter Supply voltage Value Unit 4.5 to 5.5 V VSDIAG Supply voltage for squib diagnostics 7 to 40 V VSATS Satellite supply voltage 7 to 14 V VSYNC Sync supply voltage (VSATS+ 5.5 V) to 40 V VRES VRES voltage (VRES0, VRES1, VRES2, VRES3, VRES4, VRES5, VRES6, VRES7) 7 to 40 V VI Discrete input voltage (RESETB, DEPEN, CS_D, CS_S, SCLK, SCLK_S, MOSI, MOSI_S, MISO, MISO_S, FEN1, FEN2, FEN3, FEN4, INITSYNC) - 0.3 to (VDD +0.3) V Tj Junction temperature -40 to 150 °C Note: The above is provided for informational purposes only and will result in degraded operation. Under the above conditions the SPI will be functional as well as diagnostics, though the electrical performance may not conform to the parameters outlined in Section 2.4. Firing requirements as indicated in Section 2.4 may not be met with the conditions above. DocID028325 Rev 1 11/80 79 Electrical specifications 2.3 L9662 Operating ratings Table 5. Operating ratings Symbol VDD Parameter Supply voltage Value Unit 4.9 to 5.1 V VSDIAG Supply voltage for squib diagnostics 7 to 37 V VSATS Satellite supply voltage 7 to 14 V VSYNC Sync supply voltage (1)) VRESx VRES voltage (VRES0, VRES1, VRES2, VRES3, VRES4, VRES5, VRES6, VRES7) 7 to 37 V VI Discrete input voltage (RESETB, DEPEN, CS_D, CS_S, SCLK, SCLK_S, MOSI, MOSI_S, MISO, MISO_S, FEN1, FEN2, FEN3, FEN4, INITSYNC, IREF) - 0.3 to (VDD +0.3) V -40 to 95 °C 46 °C/W Tamb RTh j-amb Continuous (VSATS + 6) to 25 pulse ≤500 ms (VSATS + 6) to 40 Ambient temperature Thermal resistance junction-to-ambient V 1. For PSI5 the maximum operating voltage is 16.5V as called out in the PSI5 technical specification (V 1.2 /14.06.07). Depending on the sync supply voltage the sync pulse can be as high as 8 V above idle. To ensure the maximum operating voltage of 16.5 V is not exceeded then the VSATS voltage should be limited to 8.5 V. 2.4 Electrical characteristics 2.4.1 General 4.9 V ≤ VDD 5.1 V; 7 V ≤ VRESX ≤ 37 V; 7 V ≤ VSDIAG ≤ 37 V; (VSATS + 6.5 V) ≤ VSYNC ≤ 25 V; 5 V ≤ VSATS ≤ 14 V; FEN1 = FEN2 = FEN3 = FEN4 = VDD; R_REF = 10 kΩ, ±1%, 100 PPM; -40 °C ≤ TA ≤ +95 °C; unless other specified. Table 6. General - DC electrical characteristics Symbol Osc VRST1 VRST2 tPOR IDD 12/80 Parameter Internal oscillator frequency Test condition Min. Typ. Max. Unit 4.75 - 5.25 MHz 4.0 - 4.5 V 2.1 - 3.0 Timer for VRST1 5 - 25 No squib diagnostics. No deployment. Satellite channels disabled. - - 15 Resistance measurement diagnostics with no fault condition present. Satellite channels disabled. - - 17 Tested with 10K, 1%, 100ppm Iref resistor Internal voltage reset VDD VDD level for device to report reset after de-glitch time (tpor) condition -deployment drivers are See Figure 6 disabled Internal voltage reset VDD Guaranteed by design with no de-glitch time See POR De-glitch timer Input current VDD DocID028325 Rev 1 μs mA L9662 Electrical specifications Table 6. General - DC electrical characteristics (continued) Symbol IDD RIREF_H RIREF_L Parameter Input current VDD Resistance threshold IREF VIH_RESETB Input voltage threshold VIL_RESETB RESETB VHYS_RST Test condition Min. Typ. Max. Resistance measurement diagnostics running with no fault condition present. Satellite channels enabled with I_ICHx=10mA and no sync pulse. - - 17 Resistance measurement diagnostics running with no fault condition present. Satellite channels enabled with I_ICHx = 50 mA and no sync pulse. - - 17 Resistance measurement diagnostics running with no fault condition present. Satellite channels enabled with I_ICHx = 50 mA and sync pulse at high voltage level. - - 17 Short to -0.3 V on SQHx. Satellite channels disabled. - - 15 Short to -0.3 V on SQLx. Satellite channels disabled. - - 15 Deployment. Satellite channels disabled. - - 15 Short to GND on SQL; VRCM active Satellite channels enabled with I_ICHx = 50 mA and sync pulse at high voltage level. - - 35 - - - 60.0 - 2.0 - - - - - 0.8 - - 100 - - 3.2 1.0 - 2.5 mA - - 20 mA -10 - -50 μA VIH_TEST Input voltage threshold TEST Guaranteed by design ITESTPD Input pull-down current TEST - IAOUT_SHRT AOUT pin current limit AOUT short to ground during squib resistance diagnostics Unit mA k k 2.0 V V 300 mV V IRESETPU Input pull-up current RESETB RESETB = VIH to GND IVSATS Current consumption VSATS Satellite channels enabled ICH0-3 = 0 A - - 5 mA IVSYNC VSYNC supply current Satellite channels enabled ICH0-3 = 0 A - - 5 mA DocID028325 Rev 1 13/80 79 Electrical specifications L9662 Table 6. General - DC electrical characteristics (continued) Symbol Parameter Test condition Min. Typ. Max. Unit Quiescent current for VRESx during HSS test Current per pin during HSS test excluding selected channel - - 10 μA Input voltage threshold (MOSI, MOSI_S, SCLK, SCLK_S, CS_S, CS_D) Input Logic = 1 - - 2.0 V Input Logic = 0 0.8 - - V VHYST Input hysteresis - 100 - 300 mV Input leakage current MOSI, MOSI_S, SCLK, SCLK_S VIN = VDD - - 1 μA ILKGD VIN = 0 to VIH -1 - - μA IPU_CS Input pull-up current CS_S, VIN = VIH to GND CS_D -10 - -50 μA IPD_IS Input pull-down current INITSYNC 10 - 50 μA IRESx VIH VIL VOH VOL IHI_Z 2.4.2 VIN = VIL to VDD Output voltage MISO, MISO_S IOH = -800 μA VDD– 0.8 - - V IOL = 1.6 mA - - 0.4 V Tri-state current MISO, MISO_S, MISO = VDD - - 1 μA MISO = 0 V -1 - - μA Electrical characteristics - Squib deployment drivers and diagnostics 4.9 V VDD 5. 1V; 7 V VRESX 37 V; 7 V VSDIAG 37 V; (VSATS + 6.5 V) VSYNC 25 V; 7 V VSATS 14 V; FEN1 = FEN2 = FEN3 = FEN4 = VDD; R_REF = 10 kΩ, ±1%, 100 PPM; CVRES0_3≥ 68 nF; CVRES4_7 ≥ 68 nF; -40 °C TA +95 °C; unless other specified. Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit General ILKGSQH Leakage current SQH VSDIAG = VDD = 0, VRES = 37 V, VSQH = 0 V - - 50 μA ILKGVRES Bias current VRESX VSDIAG = 18 V; VDD = 5 V; VRES = 37 V; SQH shorted to SQL - - 10 μA ILKGSQL Leakage current SQL VSDIAG = VDD = 0, VSQL = 18 V -10 - 10 μA IPD Pulldown current SQL VSQL = 1.5 V to 20 V 3.3 - 4.1 mA Diagnostics Bias voltage Nominal 3.6 V -5% VDD*0.72 +5% V 5 - 20 mA VBIAS Short to battery/ground Diagnostics - Rsqb from 0 Ω to Open ISVRCM 14/80 Maximum Diagnostics Bias Current limit Short to battery or ground test active VSQH = 0 V DocID028325 Rev 1 L9662 Electrical specifications Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics Symbol RSTB Parameter Short to Battery Resistance Threshold Test condition Min. Typ. Max. Unit Vbatt = 6.5V see Figure 9 1.92 - 3.42 kΩ Vbatt = 16V see Figure 9 8.61 - 13.98 kΩ Vbatt = 20V see Figure 9 11.42 - 18.42 kΩ ISTB Short to battery current threshold - 0.9 - 1.40 mA RSTG Short to Ground Threshold - 1.2 - 1.8 kΩ ISTG Short to ground current threshold - 2 - 3.3 mA From/CS until Transistor Test Results are Valid, Output voltage change 0V to 3.5 V CSQHx= 0.12 μF CSQLx= 0.12 μF - - 1500 μs tDIAGTIMEOUT Diagnostic Delay Time High side safing diagnostics Diagnostic current into selected VRESx pin during test Normal conditions 710 - 950 μA Current during diagnostic All 8 VRESx pins tied together 710 - 1020 μA Normal resistance range RHSSNORM_th when running high side safing diagnostics All 8 VRESx pins tied together 1.4 - 2.5 kΩ Normal voltage range VHSSNORM_r between VSDIAG and VRESx pin) when running ange high side safing diagnostics All 8 VRESx pins tied together 1.0 - 2.5 V Short voltage threshold VHSSSHORT_th between VSDIAG and VRESx pin) All 8 VRESx pins tied together 0.5 - 1.0 V Open voltage threshold VHSSOPEN_th between VSDIAG and VRESx pin) All 8 VRESx pins tied together 2.5 - 4.0 V tDIAGTIMEOUT Diagnostic delay time From/CS ↑ until transistor test results are valid, CSQHx= 0.12 μF CSQLx= 0.12 μF - - 500 μs - - 50 μA 5.0 - 7 V ISRC_HSS IHSS_8 Voltage measurement diagnostics (VRESx) IRESx VVRESXLO_th Max diagnostic current into VRESx pin Normal conditions Low voltage threshold for VRESx pin - DocID028325 Rev 1 15/80 79 Electrical specifications L9662 Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics Symbol Min. Typ. Max. Unit 13.7 - 18.0 V From/CS ↑ until transistor test results are valid. - - 100 μs MOS test max current Normal conditions guaranteed by design - - ISDIAG mA tSHUTOFF LS/HS MOS turn off under fault condition Time is measured from the valid LS/ HS MOS current > 100mA to the LS/HS turn off - - 4 μs tFETtimeout FET timeout Normal conditions - - 100 μs 1.07 - 2.1 k VVRESXHI_th Parameter High voltage threshold for VRESx pin tDIAGTIMEOUT Diagnostic delay time Test condition - MOS diagnostics I_MOS High Squib resistance diagnostics RSQHIZ IHR High load resistance threshold - High resistance current threshold - tDIAGTIMEOUT MOS diagnostic delay time ISTG mA From/CS ↑ until Transistor test results are valid, CSQHx= 0.12 μF CSQLx = 0.12 μF - - 300 μs High saturation voltage; IAOUT = -500 μA - - VDD0.2V V Low Saturation Voltage; IAOUT = +500 μA - - 0.2 V AOUT = VDD - - 1 μA AOUT = 0 V -1 - - μA - 3.5 - 10.0 Ω 0 RSQB < 3.5 VAOUT0.095V - VAOUT+ 0.095V V 3.5 RSQB 10 VAOUT· 0.95V - VAOUT· 1.05V V Squib resistance diagnostics VOH Output voltage AOUT VOL IZ Tri-State Current AOUT RSQB RANGE Load Resistance Range VAOUT Resistance measurement analog output tolerance VAOUT = 1- + 0.08 R SQB VDD ---- --------------10 ISRC Resistance measurement current source VDD = 5.0 V; VSDIAG = 7.0 V to 37 V 38 - 42 mA ISINK Resistance measurement current sink - 45 - 57 mA ISLEW Rmeas current di/dt 30% - 70% of ISRC 2 - 11 mA-μs Vcmpr Voltage threshold on squib pin to shutdown ISRC - 2.65 - 3.25 V 16/80 DocID028325 Rev 1 L9662 Electrical specifications Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics Symbol Parameter Test condition tisrcshtdwn Time after voltage threshold crossed for squib pin to shutdown IISRC Guaranteed by design VLSDrsqb Voltage threshold on squib pin to shutdown ISRC - tR_WAIT Rmeas wait time 6 Wait time before AOUT voltage is stable for ADC reading Min. Typ. Max. Unit - - 30 μs 0.8 - 2.2 V - - 300 μs FENx Input pins tFENfilter Minimum pulse width - 12 - 16 μs IFENPD Internal pull-down current VIN = VIL to VDD 20 - 50 μA VFENLO Input low voltage threshold - 0.8 - VFENHI Input high voltage threshold - - - 2.0 V TFENLATCH FEN Latch timer - 0 - 512 ms tFLACC FEN latch timer accuracy - - 20% - 20 % 22.5 25 27.5 μs - - 2 LSB IHSX x 0.90 - IHSX x 0.99 A V Deployment drivers TRESOLUTION Diagnostic timing / resolution Guaranteed by design, IHS ≥ IMEAS, 0s ≤ TMEASURE_TIME ≤ 3.7 ms Diagnostic timing TACCURACY CSQUIB _HI = 0.12 μF accuracy CSQUIB _LO = 0.12 μF IMEAS Vbreakdown RDSonTOTAL RDSonHS RDSonLS High side driver current limit detect threshold Guaranteed by design HS or LS breakdown voltage Voltage across driver = 40 V - - 50 μA High side MOS + Total high and low side MOS low side MOS D9:D8=”11”; on resistance VRES = 7 V; I = 1.6A @95 °C - - 2.0 Ω - 0.3 0.8 Ω - 0.6 1.2 Ω High side MOS on resistance D9:D8=”11”; VRES = 7 V; Low side MOS on resistance IVRES = 1.6 A; DocID028325 Rev 1 17/80 79 Electrical specifications L9662 Table 7. Squib deployment drivers and diagnostics - DC electrical characteristics Symbol Parameter Min. Typ. Max. Unit IHS_12A Configuration mode 1 bits D9:D8=”00” SQHx shorted to ground; VRES = 7 to 37 V 1.21 - 1.47 A IHS_15A Configuration Mode 1 bits High side deployment current D9:D8=”01” SQHx shorted to ground; limit VRES = 7 to 25 V 1.51 - 1.85 A IHS_175A Configuration Mode 1 bits D9:D8=”11” SQHx shorted to ground; VRES = 7 to 37 V 1.76 - 2.14 A 90 - 110 μs 2.2 - 4.0 A - - 150 μs 2.15 - 2.5 ms For IHS_175A Firing 1.15 - 1.40 ms VRES = 7 to 37 V For IHS_175A Firing current Measured from CS_D rising edge 0.65 - 0.85 ms tILIM Low side MOS shutdown under short to battery ILS Low side MOS current limit tsettle Firing current settling time tDEPLOY-0.65ms 18/80 Vsqblo=18 V Time from fire command CS_D rising edge to where firing current remains within specified limits CSQUIB _HI = 0 to 0.12 μF CSQUIB _LO = 0 to 0.12 μF VRES = 7 to 37 V@ IHS_12A VRES = 7 to 25 V@ IHS_15A For IHS_12A and IHS_15A Firing Measured from CS_D rising edge tDEPLOY-2ms tDEPLOY-1ms Test condition Deployment time VRES = 7 to 37 V Measured from CS_D rising edge DocID028325 Rev 1 L9662 Electrical specifications Figure 2. MOS settling time and turn-on time 2 ,3($. ,),1$/ ,),1$/ ,),1$/ ,2+ 2.4.3 WVHWWOH *$3*36 Electrical characteristics - Satellite interface 4.9 V ≤ VDD ≤ 5.1 V; 7 V VRESX ≤ 37V; 7 V ≤ VSDIAG ≤ 37 V; (VSATS + 6.5V) ≤ VSYNC ≤ 25 V; 5 V ≤ VSATS ≤ 14 V; FEN1 = FEN2 = FEN3 = FEN4 = VDD; R_REF = 10 kΩ, ±1%, 100 PPM; -40 °C ≤ TA ≤ +95 °C; unless other specified. Table 8. Satellite interface - DC electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit Current limit per channel IICHx_IDLELim during communication voltage level High side short to -0.3 V -75 - -150 mA IICHx_HVLim Current limit per channel during sync voltage level High side short to -0.3 V -100 - -280 mA IVSATS_max VSATS supply current excluding ICHx current All channels with High side short to -0.3V - - 10 mA IVSATSLIM1 VSATS supply current with one channel in current limit during Sync Pulse High side short to -0.3 V - - -40 mA IVSYNCLIM1 VSYNC supply current per channel with channel in High side short to -0.3 V current limit 100 - 375 mA - - 5 mA - - 25 mA - - -1 mA ICHx short to battery V(ICHX)-VSATS > 50 mV 50 mV is the maximum threshold to switch OFF driver, TYP is 30 mV IICHx_SB_OFF Short to battery current when driver is OFF. IICHx_SB_ON Max short to battery Guaranteed by design current when driver is ON. VSATS =18 V IICHxVSATS_LK VSATS leakage current per Vcc = VSYNC = 0 V channel OFF measured @ VSATS DocID028325 Rev 1 19/80 79 Electrical specifications L9662 Table 8. Satellite interface - DC electrical characteristics (continued) Symbol Parameter IICHxVSYNC_LK VSYNC leakage current per channel OFF IOUTLEAK Vhdp IFr Itr Output Leakage Current ICHX High side voltage drop (VSATS-VICHX) Per Channel IF/Iout CH3 & CH4 Low to high transition current threshold Test condition Min. Typ. Max. Unit VSYNC = 25 V Vcc = VSATS = 0 V measured @ VSYNC - - -1 mA VSATS = 18 V measured @ pin under test VSYNC = 25 V Analog interface OFF - - 1 μA I = -150 mA; VSATS = 7 V to 14V guaranteed by design - - 3.0 V I = -70 mA; VSATS = 7 V to 14 V - - 1.5 V I = -50 mA; VSATS = 7 V to 14 V - - 1.0 V I = -25 mA; VSATS = 7 V to 14 V - - 0.5 V Iout = -5 0 mA 460 - 540 μA Iout = -5 mA 46 - 54 μA SPI channel configuration bit <2:0>=111 35.10 - 42.90 mA bit <2:0>=110 28.80 - 34.20 mA bit <2:0>=101 24.85 - 29.15 mA bit <2:0>=100 20.25 - 24.75 mA bit <2:0>=011 17.10 - 20.90 mA bit <2:0>=010 14.85 - 18.15 mA bit <2:0>=001 8.0 - 11.0 mA bit <2:0>=000 1.0 - 4.0 mA 0.95* Vdd - 1.05* Vdd V IF/Vx CH3 & CH4 clamp voltage Rext = 33.0k, 1%; CHx is shorted to GND Ihyst Current Threshold hysteresis Sink current = Ithr at the output (ICHX). Ihyst = trip point high – trip point low 0.05*Itr - 0.15*Itr mA Mdf Manchester Protocol Excluding Osc tolerance; bit<8:7>= 00, De-glitch filter as a 01, 10, 11. bit Time = the function of protocol speed smallest bit time allowed in the selected range. 11.7% *bitTime - 23.5% *bitTime μs VCLAMP 20/80 DocID028325 Rev 1 L9662 Electrical specifications Table 8. Satellite interface - DC electrical characteristics (continued) Symbol Bitr Bitr Idle Parameter Minimum frequency operating range (Incoming messages fall within this operating range is guaranteed to be accepted by the IC) Maximum frequency operating range (Incoming messages fall outside this operating range is guaranteed to be rejected by the IC) Idle time Test condition Min. Typ. Max. Unit Channel configurations bit<8:7> = 00 Test at frq. = 52.33 kHz Test at frq. =13.32 kHz 13.32 - 52.33 kHz bit<8:7> =01Test at frq =110.74 kHz Test at frq. = 26.32 kHz 26.32 - 110.74 kHz bit<8:7> =10 Test at frq =164.20 kHz Test at frq = 43.50 kHz 43.50 - 164.20 kHz bit<8:7>=11 Test at frq. = 250.63 kHz Test at frq. = 62.66 kHz 62.66 - 250.63 kHz Channel configurations bit<8:7> = 00 Test at frq. > 59.14 kHz Test at frq. <11.99 kHz 11.99 - 59.14 kHz bit<8:7> =01 Test at frq > 128.37 kHz Test at frq < 23.57 kHz 23.57 - 128.37 kHz bit<8:7> =10 Test at frq >194.93 kHz Test at frq < 38.71 kHz 38.71 - 194.93 kHz bit<8:7>=11 Test at frq > 309.6 kHz Test at frq < 55.37 kHz 55.37 - 309.6 kHz CRC disabled: The idle bit time is based on the bit time calculated using the start bits based on the last edge of previous message to 1st rising edge (start bit) of new message If an error is detected then the device shall default to 1.5 times the maximum frequency (minimum bit time). No idle time required after enabling channel 1.5*Tbit - - CRC enabled: 1.5*Tbit +4μs - - - 1 - μs - - 0.3 μs Tdl & Tdh IFx/Vx delay Test with 10K 1% Iref resistor check response from changing between the following current levels. High = 0 to 15 mA, Low = 66 to 15 0mA Tdl - Tdh IFx/Vx delay time differential ICHX outputs with a 500 μs symmetrical pulse in and 500us out. DocID028325 Rev 1 μs 21/80 79 Electrical specifications L9662 Table 8. Satellite interface - DC electrical characteristics (continued) Symbol Parameter tFlt _BATT Output fault filter for short to battery tFlt _GND Output fault filter for short to ground Test condition Min. Typ. Max. Unit V(ICHX)-VSATS>50mV 12 - 16 μs I_sensor>I_lim 300 - 360 μs VSAT-1 - VSAT V VICHx +4 - VICHx +8 V - - 2.5 V Receive Mode VICHx Output voltage on pin ICHx (x = 1…4) IICHx= [0…50mA]; 7V VSATS 14V SYNC Mode and High Voltage mode VICHx_HV Output voltage during High Voltage Mode and SYNC Mode High time 7V VSATS 14V (VSATS+6V) VSYNC 25V IICHx = 50mA VREG_DO Regulator Drop Out voltage IICHx = 50mA tSYNCDLY Delay time from rising edge of INITSYNC pin to sync pulse voltage active Measured from INITSYNC pin rising edge to 5% of VHV 2.7 - 6.6 μs All Channels SYNC pulse high time - -7% 20 + 7% μs tSYNC_dlyhigh1 Total delay time from INITSYNC to sync pulse falling edge MCR D9:D8=”00” Measured from INITSYNC pin rising edge to 90% of sync pulse falling edge (V ICHx_HV V ICHx idle) All Channels using default slew rate 20.3 - 28 μs tSYNC_high2 SYNC pulse high time - -7% 30 + 7% μs tSYNC_high3 SYNC pulse high time data “0” pulse width (High voltage mode) -7% 40 + 7% μs tSYNC_high4 SYNC pulse high time data “1” pulse width (High voltage mode) -7% 80 + 7% μs -7% 62 + 7% μs + 7% μs tSYNC_high1 MCR bit D2=0 tRECV_disable Receiver disable time tSYNC_hi ghx MCR bit D2=1 -7% triseslewrate High Voltage rise slew rate MCR bit D3=0 for ICHx MCR bit D3=1 0.9 - 2 0.43 - 1.5 tfallslewrate High Voltage fall slew rate MCR bit D3=0 for ICHx MCR bit D3=1 0.9 - 2 0.43 - 1.5 22/80 DocID028325 Rev 1 typ + 20μs V/μs V/μs L9662 Electrical specifications Table 8. Satellite interface - DC electrical characteristics (continued) Symbol Parameter tHVILIMDLY HV current limit active time following tSYNC_highx CICHX Test condition Min. Typ. Max. Unit - - 12 μs 10 - 47 nF Guaranteed by design Capacitance on satellite ICHx pin to CICHX 70nH; output for stability (per pin) INITSYNC input VINITSYNCLO Input low voltage threshold - 0 - 0.8 V VINITSYNCHI Input high voltage threshold - 2.0 - 1.0 x VDD V IISPD Input pulldown current INITSYNC VIN = VIL to VDD 10 - 50 A - 1.7 - 2.1 s TINITSYNCFLT Minimum pulse width Figure 3. Sync pulse diagram ,1,76<1& W,1,76<1&)/7 ,1,76<1&,QSXW0DVNLQJ W5(&9BGLVDEOH 5HFHLYHUB',6$%/( W6<1&BKLJK W+9,/,0'/< W6<1&BGO\KLJK W6<1&'/< 9,&+[B+9 9B,&+[ 9,&+[B,'/( ,,&+[B,'/(/LP ,,&+[B+9/LP ,,&+[B,'/(/LP *$3*36 DocID028325 Rev 1 23/80 79 Electrical specifications 2.4.4 L9662 SPI timing All SPI timing is performed with a 150 pF load on MISO unless otherwise noted 4.9V VDD 5.1V; 7V VRESX 37V; 7V VSDIAG 37V; (VSATS + 6V) VSYNC 25V; 5V VSATS 14V; FEN1 = FEN2 = FEN3 = FEN4 = VDD; R_REF = 10K, ±1%, 100PPM; 40°C TA +95°C; unless other specified. . Table 9. SPI timing - DC electrical characteristics No. Symbol Min. Typ. Max. Unit - fop Transfer frequency dc - 5.50 MHz 1 tSCK SCLK, SCLK_S period 181 - - ns 2 tLEAD Enable lead time 65 - - ns 3 tLAG Enable lag time 50 - - ns 4 tSCLKHS SCLK, SCLK_S high time 65 - - ns 5 tSCLKLS SCLK, SCLK_S low time 65 - - ns 6 tSUS MOSI, MOSI_S input setup time 20 - - ns 7 tHS MOSI, MOSI_S input hold time 20 - - ns 8 tA MISO, MISO_S access time - - 60 ns 9 tDIS (1) MISO, MISO_S disable time - - 100 ns 10 tVS MISO, MISO_S output valid time - - 60 ns 11 (1) HO MISO, MISO_S output hold time 0 - - ns t Parameter 12 tRO Rise Time (design information) - - 30 ns 13 tFO Fall Time (design information) - - 30 ns 14 tCSN CS_D, CS_S negated time 640 - - ns tCLKN Time between CS rising edge and first transition of SCLK must be higher than tCLKN. It happens when multiple L9662 are connected to the same SCLK and MOSI but with different chip select. 500 - - ns 15 1. Parameters tDIS and tHO shall be measured with no additional capacitive load beyond the normal test fixture capacitance on the MISO pin. Additional capacitance during the disable time test erroneously extends the measured output disable time, and minimum capacitance on MISO is the worst case for output hold time. 24/80 DocID028325 Rev 1 L9662 Electrical specifications Figure 4. SPI timing diagram W/$* &6B[ W &61 W/($' W6&/.+6 I23 W&/.1 6&/.6&/.B6 W 6&/./6 W96 W$ 06%287 0,620,62B6 W686 026,026,B6 W',6 W+2 '$7$ /6%287 '21 7 &$5( W52W )2 W+6 06%,1 /6%,1 '$7$ *$3*36 Figure 5. MISO Loading for Disable Time Measurement 9'' 9 9 0,62 N 9 0,62 9 W',6 N &6 *$3*36 DocID028325 Rev 1 25/80 79 Functional description L9662 3 Functional description 3.1 Overview The device is an integrated circuit to be used in air bag systems. Its main functions include deployment of air bags and switched-power sources to satellite sensors. The device supports 8 deployment loops and 4 satellite-sensor interfaces. 3.2 General functions 3.2.1 Power on reset (POR) The ASIC has a power on reset (POR) circuit, which monitors VDD voltage. When VDD voltage falls below VRST1 for longer than or equal to tPOR, all outputs are disabled and all internal registers are reset to their default condition. A second reset level, VRST2, also monitors VDD but uses no filter time and will disable all outputs and all internal registers are reset to their default condition when VDD falls below the reset threshold. Figure 6. POR timing 7325 0LQ 7325 0LQd7d7325 0D[ 9''0,1 9567 9567 ,17(51$/ 5(6(7 7325 0LQ d 7d7325 0D[ *$3*36 3.2.2 RESETB The RESETB pin is active low. The effects of RESETB are similar to those of a POR event, except during a deployment. When a deployment is in-progress, the ASIC will ignore the RESETB signal. However, it shall shut itself down as soon as it detects a POR condition. When the deployment is completed and RESETB signal is asserted, the device disables its outputs and reset its internal registers to their default states. A de-glitch timer is provided for the RESETB pin. The timer protects this pin against spurious glitches. The ASIC neglects RESETB signal if it is asserted for shorter than tGLITCH. RESETB has an internal pull-up in case of an open circuit. 26/80 DocID028325 Rev 1 L9662 3.2.3 Functional description Reference resistor IREF pin shall be connected to VDD supply through a resistor, RIREF. When the device detects the resistor on IREF pin is larger than RIREF_H or smaller than RIREF_L, it goes into a reset condition. All outputs are disabled and all internal registers are reset to their default conditions. 3.2.4 Loss of ground GND When the GND pin is disconnected from PC-board ground, the ASIC goes in reset condition. All outputs are disabled and all internal registers are reset to their default conditions. GND0-GND7 A loss of power-ground (GND0 – GND7) pin/s disables the respective low side driver/s on SQLx. However, the high side driver of the respective channel will still be able to be turned on. Thus under the scenario where the low side is shorted to ground the device will be able to provide the programmed firing current for the specified time. An open GNDx connection on any channel has no affect on the other channels. An open GNDx condition will be detected using the low side MOS diagnostics. AGND The AGND pin is a reference for AOUT pin. When AGND loses its connection, the voltage on AOUT pin is pulled up to VDD voltage. The rest of functionality and parametric is not affected by a loss of AGND condition. 3.2.5 VRESx capacitance To ensure all diagnostics function properly a typical capacitor of equal to or greater than 68nF is required for every 4 VRESx pins and located close to the supply pins. Thus a capacitor will be placed close to the VRES0, 1,2, and 3 pins and a second capacitor will be close to the VRES4, 5,6, and 7 pins. 3.2.6 Supply voltages The primary current sources for the different functions of the ASIC are as follows: VRESx - Firing currents along with HSS and HS FET diagnostic currents VSDIAG - Squib resistance and HSS diagnostics VSATS - Voltage and current necessary for satellite operation excluding period during sync pulse VSYNC - Sync pulse voltage VDD will be used for all internal functions as well as short to battery/ground and high squib resistance diagnostics. 3.2.7 Ground connections The GND pins (6, 38, and 45) are all common internal to the ASIC. A ground plane is needed to directly connect the GND pins together so that low impedance is maintained between the two pins. This ground plane needs to be isolated from the high current ground for the squib drivers to prevent voltage shifts. DocID028325 Rev 1 27/80 79 Functional description 3.3 L9662 Serial peripheral interface (SPI) The device contains 2 serial peripheral interfaces for control of the satellite and squib functions. The 2 SPI interfaces are completely independent from each other and can be accessed simultaneously. The following table shows the distribution of features that are accessed/controlled for each of the SPIs . Table 10. Features that are accessed/controlled for each of the SPIs Type SPI1 SPI2 Function Pin names Features accessed Squib diagnostic & deployment SPI SCLK MISO MOSI CS_D All Squib Diagnostics Squib related status information Squib Arming and Firing Software Reset Component ID & Revision Satellite SPI SCLK_S MISO_S MOSI_S CS_S Satellite Channel Diagnostics Satellite Communication Data Channel Configuration The software reset accessed over SPI1 will not only reset squib functions but all the satellite functions. The device has a counter to verify the number of clocks in SCLK and SCLK_S. L9662 computes SPI error length flag by counting the number of SCLK/SCLK_S rising edges occurring when CS_D/CS_S is active. If the number of clocks in SCLK is not equal to 16 clocks while CS_D is asserted, it ignores the SPI message and sends a SPI fault response. If the number of clocks in SCLK_S is not equal to 80 clocks while CS_S is asserted it ignores the entire SPI message and a fault will be reported in the SR frame. The MISO output on SPI1 shall hold the 16th bit’s state for SCLK rising edges greater than 16 when CS_D is active, similarly the MISO output on SPI2 shall hold the 80th bit’s state for SCLK_S rising edges greater than 80 when CS_S is active. 3.3.1 SPI pin descriptions Chip select (CS_D, CS_S) Chip-select inputs select the device for serial transfers. CS_D or CS_S can be asserted at any given time and are active low. Both CS_D and CS_S inputs can be selected simultaneously. When chip-select is asserted, the respective MISO/MISO_S pin is released from tri-state mode, and all status information is latched into the SPI shift register. While chip-select is asserted, register data is shifted into MOSI/MOSI_S pin and shifted out of MISO/MISO_S pin on each subsequent SCLK/ SCLK_S. When chip-select is negated, MISO/MISO_S pin is tri-stated. To allow sufficient time to reload the registers chip-select pin shall remain negated for at least tCSN. The chip-select inputs have current sinks which pull these pins to the negated state when there is an open circuit condition. These pins have TTL level compatible input voltages allowing proper operation with microprocessors using a 3.3 to 5.0 volt supply. Serial clock (SCLK, SCLK_S) SCLK/SCLK_S input is the clock signal input for synchronization of serial data transfer. This pin has TTL level compatible input voltages allowing proper operation with microprocessors 28/80 DocID028325 Rev 1 L9662 Functional description using a 3.3 to 5.0 volt supply. When chip select is asserted, both the SPI master and this device shall latch input data on the rising edge of SCLK/SCLK_S. The ASIC shifts data out on the falling edge of SCLK/SCLK_S. Serial data output (MISO, MISO_S) MISO/MISO_S output pins shall be in a tri-state condition when chip select is negated. When chip select is asserted, the MSB is the first bit of the word/byte transmitted on MISO/MISO_S and the LSB is the last bit of the word/byte transmitted. This pin supplies a rail to rail output, so if interfaced to a microprocessor that is using a lower VDD supply, the appropriate microprocessor input pin shall not sink more than IOH(min) and shall not clamp the MISO/MISO_S output voltage to less than VOH(min) while MISO/MISO_S pin is in a logic “1” state. Serial data input (MOSI, MOSI_S) MOSI/MOSI_S inputs take data from the master processor while chip select is asserted. The MSB shall be the first bit of each word/byte received on MOSI/MOSI_S and the LSB shall be the last bit of each word/byte received. This pin has TTL level compatible input voltages allowing proper operation with microprocessors using a 3.3 to 5.0 volt supply. 3.4 Squib drivers 3.4.1 Firing The on-chip deployment drivers are designed to deliver 1.2 A (min) for 2 ms (min) and 1.75 A (min) for 1 ms (min) with VRESx voltages between 7 V and 37 V. In addition the device can provide 1.5 A minimum for 2 ms for VRESx voltages between 7 V and 25 V. The firing condition is selectable via the SPI. At the end of a deployment, a deploy success flag is asserted and can be read using the appropriate SPI command. Each VRESx and GNDx connection is used to accommodate 8 loops that can be deployed simultaneously. Upon receiving a valid deployment condition, the respective SQHx and SQLx drivers are turned on. The only other activation of the SQHx and SQLx drivers is momentarily during a MOS diagnostic. Otherwise, SQHx and SQLx are inactive under any normal, fault, or transient conditions. Upon a successful deployment of the respective SQHx and SQLx drivers, a deploy command success flag is asserted via SPI. Refer to Figure 8 for the valid conditions and the deploy success flag timing. DocID028325 Rev 1 29/80 79 Functional description L9662 Figure 7. Deployment drivers diagram *1' 9'' )(1 )(1 )(1 )(1 /RJLF 026, 0,62 &6B' 95(6 95(6 +6GULYHU +6GULYHU 64+ GLDJQRVWLF GLDJQRVWLF 64+ 64/ 64/ /6GULYHU /6GULYHU *1' *1' 95(6 95(6 +6GULYHU +6GULYHU 64+ GLDJQRVWLF GLDJQRVWLF 64+ 64/ 64/ /6GULYHU /6GULYHU *1' *1' 95(6 95(6 +6GULYHU +6GULYHU 64+ GLDJQRVWLF GLDJQRVWLF 64+ 64/ 64/ /6GULYHU /6GULYHU *1' *1' 95(6 95(6 +6GULYHU +6GULYHU 64+ GLDJQRVWLF GLDJQRVWLF /6GULYHU /6GULYHU *1' *1' ,5() 64+ 64/ 64/ $QDORJVTXLE UHVLVWDQFH PHDVXUHPHQW $287 96',$* $*1' *$3*36 30/80 DocID028325 Rev 1 L9662 Functional description The ASIC shall be protected against inadvertent turn on of the firing drivers unless the appropriate conditions are present. Non-typical conditions shall not cause driver activation. This includes the case where VRESx and/or VSDIAG pins are connected to a supply up to 40V and VDD is between 0V and VDD min. Under these conditions the device shall ensure that driver activation will not occur. No flow of current shall be allowed through the SQHx and SQLx pins. Driver activation The firing of a squib driver requires the appropriate FEN function to be active and two separate sixteen bit writes to be made over the SPI1. The FEN function is defined as the result of the FENx pin OR’d with the internal FENx latch. The FENx pin going high initiates the FEN function. With the FEN 1 function being active and the appropriate Arm and Fire commands sent then Squib_1 & 2 drivers would be activated. With the FEN 2 function being active and the appropriate Arm and Fire commands sent then Squib_3 & 4 drivers would be activated. With the FEN 3 function being active and the appropriate Arm and Fire commands sent then Squib_5 & 6 drivers would be activated. With the FEN 4 function being active and the appropriate Arm and Fire commands sent then Squib_7 & 8 drivers would be activated. The first write is to ARM the drivers in preparation of receiving the fire command. The Arm command will stop on all channels any diagnostics that are active. Any combination of squibs can be armed. The second write is to actually activate the desired driver pairs. If there is a parity mismatch the data bits will be ignored and the squib drivers will not have their status changed, and the two write sequence must then be started again. If there is a mismatch in channels selected then only those channels selected in both the Arm and Fire commands will be activated. During the first write, when the drivers are armed, all diagnostic functions are cleared. The FIRE command must follow the ARM command along with the FEN function active in order for driver activation. If a command is between the ARM and FIRE command then the sequence must be restarted. An error response shall be received for the Fire command if the ARM/FIRE sequence is not followed. The ARM/FIRE commands and FEN function are independent from each other. The device shall begin the tDEPLOY timer once a valid ARM/FIRE sequence has been received. If a valid ARM/FIRE command has been sent and the FEN function is inactive then the drivers will not be activated but the tDEPLOY timer shall start. If the FEN function becomes active before tDEPLOY has expired then the drivers will become active for the full tDEPLOY time. If the FEN does not become active before tDEPLOY has expired then the sequence would need to be restarted. A diagram illustrating this is shown in Figure 8 DocID028325 Rev 1 31/80 79 Functional description L9662 Figure 8. Driver activation timing diagram 7LPH 7'(3/2< 63,&RPPDQGV $ ) $ $ ) )(1)XQFWLRQ 7'(3/2< 7'(3/2< 'ULYHU$FWLYH 7'(3/2< '(3/2<B67$786 )ODJ '(3/2<B68&&(66 )ODJ $ $UP&RPPDQG 'HSO R\PHQW0 RGH ) )LUH&RP PDQG 'HSO R\PHQW 0RGH *$3*36 Only the channels selected in the ARM and, directly following, the FIRE command will be able to be activated. By reading the appropriate registers a status of the deployment is provided. If a valid Arm/Fire sequence has been provided the status flag will become active. This flag shall remain active for as long as the TDEPLOY timer is counting. Depending on the state of the FEN function the DEPLOY_STATUS flag will be active a minimum of TDEPLOY and a maximum of 2 x TDEPLOY. If driver activation did occur (both a valid Arm/Fire sequence and the appropriate FEN function active within the appropriate time) then the DEPLOY_SUCCESS flag will be active. This flag will be active until cleared by software. If a valid Arm/Fire sequence did occur but the FEN function was never activated within the TDEPLOY time then the DEPLOY_SUCCESS flag will remain ‘0’. During driver activation the respective high side (SQHx) and low side (SQLx) drivers will turn on for tDEPLOY. Device driver activation will not occur or, if firing is in process, will terminate under the following conditions: Power On Reset (POR) IREF resistance is larger than RIREF_H or smaller than RIREF_L Loss of ground condition on GND pin The following conditions are ignored when driver activation is in-progress: RESETB Valid soft reset sequences SPI1 commands except as noted below Response for ignored commands will be 0xD009 FEN function 32/80 DocID028325 Rev 1 L9662 Functional description Table 11. SPI1 MOSI/MISO response SPI1 MOSI Configuration Commands Note: SPI1 MISO SPI fault response Response MOSI register mode messages shall be ignored Deployment Commands Command mode Execute for channels not in deployment; no effect to deploying channel Diagnostic Commands SPI fault response MOSI diagnostic mode messages shall be ignored Monitor Commands Status response Execute for all channels SPI MISO sent in the next SPI transmission. The device can only deploy a channel when the FEN function is active. Once the drivers are active the device shall keep the drivers on for the required duration regardless of the FEN state. Once completed, a status bit will be set to indicate firing is complete. 3.4.2 Firing current measurement All channels have a 7 bit current measurement register that is used to measure the amount of time the current is above IMEAS during firing. The maximum measurement for each channel is 3.175 ms nominal based on a bit weight of 25 ms. The current measurement register shall not increment outside the deployment time. The current measurement will begin incrementing once the current has exceeded 95% of the nominal target value. The count will continue to increment from the stored value until either a clear command has been issued for that channel or all ‘1’s are present in the corresponding channel measurement register. If all ‘1’s are present for a channel’s measurement register and another firing sequence has been issued the register shall remain all ‘1’s. Only if a clear command has been issued will that particular register be reset to all ‘0’s. All other channels shall keep the stored measurement count. During firing the current measurement register cannot be cleared. After a clear command has been issued for a channel then the channel is ready to count if the current exceeds the specified level. After a POR or software reset the device shall reset all 8 measurement registers to all ‘0’s. A “real-time” current measurement status of all the channels is available. If a current limit status request is sent then the device shall report in the next SPI transfer whether the current is above or below IMEAS for each of the channels. The current status results can be read at any time and shall correctly report whether current is flowing. The content of the internal current status register is captured on the falling edge of chip select during the SPI response. The internal status register is updated at a nominal sample time of 25 μs and is independent of SPI transfers. For this circuit there is continuously being performed compensation of the comparator to remove offset errors, which is independent from SPI commands. Compensation is performed every 12.8 μs based on the internal clock. 3.4.3 Fire enable (FEN) function description The Fire Enable (FEN) function is the result of the FENx input OR’d with the internal FEN latch. If the FEN latch is not enabled and the FENx pin is low then activation of the FET drivers are disabled except as indicated during the MOS test. All internal diagnostic DocID028325 Rev 1 33/80 79 Functional description L9662 functions, and results, will be available through the serial interface. This pin must be pulled high to initiate the FEN latch function (if programmed) and enable firing of the FET drivers. The FEN function will be considered active when the pin is active (‘1’ or high) for more than 12 microseconds. Tolerance range for the filter to be used will be 12 to 16 μs. When the FENx input is active, ‘1’, the FEN function will be active. When the FENx input state transitions from ‘1’ to ‘0’, the programmable latching function will hold the FEN function active until the timeout of the FEN timer. The programmable latch and hold function will be capable of delays of 0ms, 128ms, 256ms, and 512ms. There are 4 independent timers with the timer for FEN1 associated with channels 1 & 2, timer for FEN2 associated with channels 3 & 4, timer for FEN3 associated with channels 5 & 6, and the timer for FEN4 associated with channels 7 & 8. The timer is reset to the programmed time when the FENx pin transitions from ‘0’ to ‘1’. The programmable counter delay will be set through a SPI command. 3.4.4 Squib diagnostics Overview The ASIC is able to perform the following diagnostics Short to battery and ground on both SQHx and SQLx pins with or without a squib Loop to loop diagnostics Squib resistance measurement Squib High resistance High Side Safing FET diagnostics VRESx voltage status High and Low side FET diagnostics Below is a block diagram showing the components involved in the squib diagnostics. 34/80 DocID028325 Rev 1 L9662 Functional description Figure 9. Squib diagnostics block diagram +LJKVLGH6DILQJ GLDJQRVWLF 96',$* ( +66RSHQ 5+66 FRPS +66VKRUW &/.B+66 ,65& ' Q 95(6 95(6[ 9ROWDJHPHDVXUHPHQWGLDJQRVWLF 6HO 9WKB+ ( 6HO FRPS 95(6[/2 9WKB/ 64+ 6TXLEUHVLVWDQFHGLDJQRVWLF 6HO $ Q 95(6[+, 6HO & 64+[ FRPS 6HO ) 6HO ,65&B+66 &DO 5VTXLE *DLQ $287 & Q 64/ 64/[ 6HO 6HO 6HO 6HO * % 6KRUWWR%DWWHU\*URXQG +LJKVTXLEUHVLVWDQFHGLDJQRVWLFV 6HO PLUURU ,3' ,3' 95&0EORFN 6*6%/+65 ,6,1. *1'[ *1' 9ROW *1' 6% PLUURU *$3*36 Short to battery/ground and loop to loop diagnostics The leakage diagnostic includes a short to battery, a short to ground and a short between loop tests. The test will be run for each SQHx and SQLx pin so that shorts can be detected regardless of the resistance between the squib pins. Normal short to battery/ground diagnostics. For the test the internal VRCM is switched on and connected to the selected pin (SQHx or SQLx). The IPD bit will be selected to be OFF which will deactivate the pulldown current on all the channels. During the test if no leakage is present the voltage on the selected SQHx or SQLx pin will be equal to VBIAS and no current is sunk or sourced by VRCM. If a leakage to ground or battery, the VRCM will sink or source a current less than ISVRCM trying to keep VBIAS. Two current comparators, ISTB and ISTG, will detect the abnormal current flow. Loop to loop diagnostics For this test the same procedure is followed except the pulldown current (IPD) is selected to be ON which will deactivate the pulldown current only on the channel under test with all other channel pulldown currents active. If a short to ground fault is active, assuming it was not active during normal short to battery/ground diagnostics, then that particular channel has a short to another squib loop. To detect loop to loop shorts between ASICs in the system the Stop diagnostics command with IPD enabled needs to be sent to the other ASICs before running the loop to loop diagnostics on the channel to be monitored. If the channel being monitored has a short to ground fault active, assuming it was not active DocID028325 Rev 1 35/80 79 Functional description L9662 during normal short to battery/ground diagnostics, then that particular channel has a short to another squib loop in the system. The following table indicates how faults would be interpreted. Table 12. How faults shall be interpreted Fault condition for channel(1) Channel leakage diagnostics results with IPD ON Channel leakage diagnostics results with IPD OFF No Shorts No Fault No Fault Short to battery STB Fault STB Fault Loop to loop short STG Fault No Fault Short to ground STG Fault STG Fault 1. Condition where 2 open channels have the SQHx pins shorted will not be detected. If one squib is open and the other has a normal squib connection then the fault will be indicated on the channel that is open. Assumes both pins are tested Once the command is issued the state of the comparators shall be captured on the next falling edge of CS_D. The results are valid after TSHORTDIAG time, which is mainly dependent on the external capacitors on the squib lines. Squib resistance measurement During a resistance measurement, both ISRC and ISINK are switched on and connected to the selected SQHx and SQLx channel. A differential voltage is created between the SQHx and SQLx pin based in the ISRC current and resistance between the pins. The analog output pin, AOUT, will provide the resistance-measurement voltage based on the scaling factor indicated in the electrical parameters section. The tri-state output, AOUT, will be connected to an ADC input of a microprocessor. When not running squib resistance diagnostics the AOUT pin will be high impedance. To increase accuracy of the squib resistance measurements the offset of the internal amplifier can be provided on the AOUT pin. This is done by setting the appropriate calibration bit, waiting the required time, and reading the converted AOUT voltage connected to the microprocessor ADC. In test mode, Aout pin can be used as digital/analog output for testing deployment and diagnostics comparators and thresholds. Test mode is reserved for supplier use only. The normal measurement method for squib resistance is to take a single ended analog output measurement for a channel (VAOUT with AMC bit=0) and use the tolerances and equation shown in the parametric table. The device is also capable of improving the tolerance at resistances below 3.5 Ohms by removing the offset of the differential comparator. This method involves taking the single ended analog output results for a channel (VAOUT with AMC bit=0) and subtracting the internal comparator offset measurement of VAOUT_CAL (VAOUT with AMC bit=1). The summary of the equation for this is as follows: AOUT_CAL = (VAOUT – VAOUT_CAL)/VDD AOUT_CAL typical = 0.08 x RSQUIB 36/80 DocID028325 Rev 1 L9662 Functional description High squib resistance diagnostics During a high squib resistance diagnostic, VRCM and ISINK are switched ON and connected to SQHx and SQLx on the selected channel. Current flowing on SQHx will be measured and compared to IHR threshold to identify if resistance is above or below RSQHZ. The results shall be reported in the next SPI message. Once the command is issued the state of the squib resistance shall be valid after THSR captured on the next falling edge of CS_D. The voltage source for this test will be VBIAS which is based on the VDD supply. High and low side FET diagnostics Prior to either the HS or LS FET diagnostics being run it is required to have the VRCM switched ON. Running the leakage diagnostics with the appropriate delay time prior to either the HS or LS FET diagnostics will precondition the squib pin to the appropriate voltage level. When the FET diagnostic command is issued the flags will initially be cleared. Once this is complete there is a check to determine if the VRCM is not active or some leakage is present. If either of these conditions are present then the MOS will not be turned ON, the test will be aborted and the Fault Present (FP) bit will be set. The FEN function must be inactive for the channel under test in order to be able to run the test. The test will not start if FEN function is active on the channel under test and will result in the FP bit to be set. If no leakage is present and FEN function is inactive, the MOS (High side or Low Side) is turned ON. The device shall monitor the current sink or sourced by VRCM. If the MOS is working properly, this current will exceed ISTB (HS test) or ISTG (LS test) and the device shall turn off the driver under test within the specified time TSHUTOFF. If the current does not exceed ISTB or ISTG then the test will be terminated and the MOS will be switched off by the ASIC within TFETTIMEOUT. During the TFETTIMEOUT period the FET Timeout bit will be set (FT=1) and will be cleared at the expiration of the timer. The results must be compared with the leakage diagnostic results to distinguish between a real leakage/short versus a FET fault. For high side FET diagnostics if no faults were indicated in the preceding leakage diagnostics then a normal result would be STB = 1; STG = 0 (with FT = 0; FP = 0). If the returned results for the high side FET test is not STB = 1; STG = 0 (with FT = 0; FP = 0) then either the FET is not functional, a short occurred during the test, or there is a missing VRESx connection for that channel. For low side FET diagnostics if no faults were indicated in the preceding leakage diagnostics then a normal result would be STB = 0; STG = 1 (with FT = 0; FP = 0). If the returned results for the low side FET test is not STB = 0; STG = 1 (with FT = 0; FP = 0) then either the FET is not functional, a short occurred during the test, or there is a missing GNDx connection for that channel. On the next falling edge of CS_D, comparator results are latched and reported in the MISO response. The results will remain latched until the next test is initiated (diagnostic write command). If the test is in progress then a bit is used in the response to indicate the test completion. If the FET under test is working properly then the results shall indicate a “Short to Ground” for LS test and “Short to Battery” for HS test. For all conditions the current on SQHx/SQLx will never exceed ISVRCM. On the squib lines there will be higher transient currents due to the presence of the filter capacitor. DocID028325 Rev 1 37/80 79 Functional description L9662 High side safing diagnostics When the command is received the ASIC will activate IHSS on the selected VRESx. The diagnostics will measure the difference between VSDIAG and VRESx. The internal comparator will detect open, short or normal condition based on the differential voltage between VSDIAG and VRESx. The results shall be reported in the next SPI message using bits HSS1 and HSS0 as indicated in the following table. Once the command is issued the voltages shall be captured on the next falling edge of CS_D. Table 13. High side safing diagnostics Condition Diagnostic Mode HSS Selection HSS1 HSS0 (VSDIAG-VRESx) < VHSSSHORT_th 0 0 VHSSSHORT_th < (VSDIAG-VRESx) < VHSSOPEN_th 0 1 VHSSOPEN_th < (VSDIAG-VRESx) 1 1 Voltage measurement diagnostics (VRESx) When the command is received the ASIC will activate a comparator for the selected channel. A 2 bit indication of the state of the VRESx pins shall be reported as indicated below. The results shall be reported in the next SPI message. Once the command is issued the voltages shall be captured on the next falling edge of CS_D. Table 14. Voltage measurement diagnostics Diagnostic mode 3 VRESx selection Condition VR1 VR0 VRESx < VVRESXLO_th 0 0 VVRESXLO_th < VRESx < VVRESXHI_th 0 1 VVRESXHI_th < VRESx 1 1 Loss of ground When any of the power grounds (GND0 – 7) are lost, no deployment can occur on the respective deployment channels because the low side driver will be inactive. The high side driver for the respective channel can still be activated. A loss of ground condition on one or several channels will not affect the operation of the remaining channels. When a loss of ground condition occurs, the source of the low side MOS will be floating. In this case, no current will flow through the low side driver. This condition will be detected as a fault by a low side MOS diagnostic. No additional faults will be reported from any other diagnostic due to this condition. 38/80 DocID028325 Rev 1 L9662 3.4.5 Functional description SPI register definition for squib functions The SPI provides access to read/write to the registers internal to the device. All commands and responses sent to/from the ASIC on SPI1 shall use set D13 as required for odd parity on the 16 bit word. The responses to the commands are sent in the next valid CS_D. The table below summarizes the MISO register mode response of various events and MOSI messages. After POR event, RESETB negated, and loss of GND, the device sends 0x0000 in MISO for the first SPI transmission. The MISO response shown here is the one received in the next valid SPI transmission after each event or MOSI write. Table 15. MISO responses to various events Event/MOSI message MISO response MOSI Parity error or message error during a deployment 0xD000 MOSI transmission - Incorrect number of clocks/bits 0xD003 Incorrect firing sequence received (Firing Command without 0xD005 a valid Arm Command) Note: Error due to message not allowed during deployment 0xD009 POR 0x0000 RESETB 0x0000 LOSS OF GND 0x0000 RIREF out of range 0x0000 MOSI Write Soft Reset: $AA 0x1X02 MOSI Write Soft Reset: $55 (after $AA) 0x2003 X in software reset response should be interpreted as follows: D11=1;D10=0;D9:D8=CL bits The SPI fault responses (0xD000 or 0xD003) indicate a fault in the last MOSI transmission. The device uses the parity bit to determine the integrity of the MOSI command transmission. Squib SPI commands The following modes are supported by the squib ASIC using SPI1. Configuration mode Deployment mode Diagnostic mode Monitor mode The table below is a summary of the modes and the functions that are achieved by sending the particular MOSI command. The following sections will provide a full description of bit settings for each mode. All commands and responses use D13 to achieve odd parity. DocID028325 Rev 1 39/80 79 Functional description L9662 Table 16. Command description summary Command/mode Mode bits Description D15 D14 D13 D12 D11 D10 D09 D08 D07 - D00 Configuration commands Config. Mode 1 Current limit programming and software reset 0 0 P - - 0 - - - Config. Mode 2 FEN latch time Programming 0 0 P - - 1 - - - Deployment commands Deployment Mode 1 Arming Command 0 1 P 1 1 0 0 1 - Deployment Mode 2 Firing Command 0 1 P 0 0 0 0 0 - Diagnostic commands Diagnostic Mode 1 Disable Diagnostic 1 0 P - 0 0 0 - - Diagnostic Mode 2 Short to battery & ground diagnostics Short between loop diagnostics 1 0 P - 0 0 1 - - Diagnostic Mode 3 VRESx voltage diagnostics 1 0 P - 0 1 0 - - Diagnostic Mode 4 High Side Safing diagnostics 1 0 P - 0 1 1 - - Diagnostic Mode 5 Squib Resistance Diagnostics 1 0 P - 1 0 0 - - Diagnostic Mode 6 High Squib Resistance Diagnostics 1 0 P - 1 0 1 - - Diagnostic Mode 7 LS driver diagnostics 1 0 P - 1 1 0 - - Diagnostic Mode 8 HS driver diagnostics 1 0 P - 1 1 1 - - Monitor Mode 1 Deployment status 1 1 P - 0 0 - - - Monitor Mode 2 Channel current limit measurement information 1 1 P - 0 1 - - - Monitor Mode 3 FENx function status and active current limit status 1 1 P - 1 0 - - - Monitor Mode 4 Revision and device ID 1 1 P - 1 1 - - - Monitor commands P = Parity bit – all commands and responses will use this bit to achieve odd parity Both the satellite and squib circuits can be reset over when sending the appropriate configuration commands via SPI1. Configuration commands Configuration mode 1 Configuration mode 1 main functions are as follows: Set Deployment current for all channels. All channels will be either set to 1.2 A/2 ms, 1.5 A/2 ms (Maximum VRESx Voltage limited to 25 V) 1.75 A/1 ms or 1.75 A/0.65 ms Perform a software reset The SPI message definition for MOSI commands and MISO responses in this mode are defined below. 40/80 DocID028325 Rev 1 L9662 Functional description MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 MOSI Command for Configuration Mode 1 0 0 P R/W SWR 0 CL Set bits Software Reset Sequence bits MISO Response for Configuration Mode 1 (Except for Soft Reset/D11=1 and appropriate pattern) 0 0 P R/W SWR 0 CL Set bits 0 0 0 0 0 0 Table 17. Configuration mode 1 bit D15 D14 D13 MOSI command State 0 0 0 D12 1 0 D11 1 D10 D9 D8 D7 – D2 D1 D0 0 - - MISO response Description Mode bits See above See above Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits Read (default) - When D12=’0’ bits D11 to D0 are ignored R/W bit Write – Allows Soft reset and deployment programming Sets Deployment Condition for ALL channels - When D11=’0’ bits D7 to D0 are ignored See above Soft Reset Sequence (deployment circuit only) – bits D8 and D9 are ignored See above Internal Stored Value CL bits Sets Deployment Conditions 00 = 1.2A/2ms (Default) 01 = 1.5A/2ms 10 = 1.75A/0.65ms 11 = 1.75A/1ms See above Software Reset-sequence see above See above Bit [D9:D8] Bits used to set the firing current/time for all channels. The default state is ‘00’ (1.2A/2ms min.) Bits [D7:D0] The soft reset for the ASIC, which includes deployment driver/diagnostics and satellite functions, is achieved by writing 0xAA and 0x55 within two subsequent 16-bit SPI transmissions. If the sequence is broken, the processor will be required to re-transmit the sequence. The device will not reset if the sequence is not completed within two subsequent 16- bit SPI transmissions. When soft reset command is received, the device reset its deployment driver’s internal logic and timer, satellite internal logic including all internal registers. The effects of a soft reset is the same as a of POR event, except MISO response. Bit D0 used to report the soft reset sequence status. If valid soft reset DocID028325 Rev 1 41/80 79 Functional description L9662 sequences are received, bit D0 is set to ‘1.’ Otherwise, bit D0 is set to ‘0.’ When ASIC receives valid soft reset sequences, it will send a MISO register mode response containing 0x2003 in the next SPI transmission. Configuration mode 2 Configuration mode 2 main function is as follows: Set the latch time for FENx input The SPI message definition for MOSI commands and MISO responses in this mode are defined below. MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Latch bits 0 0 0 0 0 0 0 0 Latch bits 0 0 0 0 0 0 0 0 MOSI Command for Configuration Mode 2 0 0 P R/W 0 1 MISO Response for Configuration Mode 2 0 0 P R/W 0 1 Table 18. Configuration mode 2 Bit D15 D14 D13 D12 MOSI command State 0 0 0 1 0 1 00 = 0ms 01 = 128ms 10 = 256ms D8 11 = 512ms D7 – D0 0 MISO response Description Mode bits See above See above Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits Read (default) - When D12=’0’ bits D11 R/W bit to D0 are ignored Write – FEN latch programming D11 D10 D9 Bits [D9:D8] FEN latch time Internal Stored Value FEN latch bits See above Bits are used to set the period of the FEN latch timer. The device has 4 independent timers. A valid FENx input will start the pulse stretch timer. These bits will set the timer duration. These values default to ‘00’ after a POR event. Deployment commands The deployment mode is used to activate the drivers. Two consecutive commands are required to activate the drivers. Any combination of channels can be fired as long as the prerequisite conditions are met as indicated in the previous section. 42/80 DocID028325 Rev 1 L9662 Functional description The SPI message definition for MOSI commands and MISO responses in Deployment Mode are defined below. MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 1 Arming Channel Select 0 1 Armed Channels 0 0 Firing Channel Select 0 0 Channels activated or channels waiting for FEN input MOSI Command for Deployment Mode 1 0 1 P 1 1 0 MISO Response for Deployment Mode 1 0 1 P 1 1 0 MOSI Command for Deployment Mode 2 0 1 P 0 0 0 MISO Response for Deployment Mode 2 0 1 P 0 0 0 Table 19. Deployment mode 1 bit definition Bit MOSI command State D15 0 D14 1 D13 D12 – D8 D7 D6 D5 D4 D3 D2 D1 D0 MISO response Description See above Mode bits See above Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits Arm pattern See above 0 Channel 7 Idle (default) 1 Arm Channel 7 0 Channel 6 Idle (default) 1 Arm Channel 6 0 Channel 5 Idle (default) 1 Arm Channel 7 0 Channel 4 Idle (default) 1 Arm Channel 4 0 Channel 3 Idle (default) 1 Arm Channel 3 0 Channel 2 Idle (default) 1 Arm Channel 2 0 Channel 1 Idle (default) 1 Arm Channel 1 0 Channel 0 Idle (default) 1 Arm Channel 0 DocID028325 Rev 1 Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status 43/80 79 Functional description L9662 Table 20. Deployment mode 2 bit definition MOSI command MISO response Bit State D15 0 D14 1 D13 D12 – D8 D7 D6 D5 D4 D3 D2 D1 D0 Description Mode bits See above See above Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits Arm pattern See above 0 Channel 7 Idle (default) 1 Arm Channel 7 0 Channel 6 Idle (default) 1 Arm Channel 6 0 Channel 5 Idle (default) 1 Arm Channel 7 0 Channel 4 Idle (default) 1 Arm Channel 4 0 Channel 3 Idle (default) 1 Arm Channel 3 0 Channel 2 Idle (default) 1 Arm Channel 2 0 Channel 1 Idle (default) 1 Arm Channel 1 0 Channel 0 Idle (default) 1 Arm Channel 0 Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status Internal Deploy Status The Deploy Status becomes ‘1’ when there is a valid fire sequence. Once active it will become ‘0’ when the time out has expired waiting FEN activation or when squib driver has turned off for fire completion. The same information is available when receiving a response from Monitor Mode 1. For the drivers to be fire capable the command mode 1 (Arming) must be sent followed by command mode 2 (Firing). With this sequence valid and FEN active then firing will begin. A break in the sequence will require the process to be restarted. All other bit patterns for D12D8 shall be ignored. To begin a deployment 2 consecutive commands need to be sent along with the FEN active (external or internal latch). An example of a firing sequence for channel 0 would be as follows FENx active or inactive TX – 0x5901 – ARM Channel 0 RX – Based on previous command 44/80 DocID028325 Rev 1 L9662 Functional description TX – 0x5901 – ARM Channel 0 RX – 0x5901 TX – 0x5901 – ARM Channel 0 RX – 0x5901 TX – 0x6001 – Firing on Channel 0 is started on if FEN is active RX – 0x5901 TX – 0x6001 – Command ignored – sequence is not allowed RX – 0x6001 TX – 0x6001 – Command ignored RX – 0xD005 Alternatively, if the sequence is broken the response shall be as in the following example FENx active TX – 0x5901 – ARM Channel 0 RX – Based on previous command TX – 0x2000 – Read of Register Mode 1 RX – 0x5901 TX – 0x6001 – Command ignored – sequence is not allowed RX – contents of register TX – 0x6001 – Command ignored – sequence is not allowed RX – 0xD005 If, for example, channel 0 and 1 bits are set in the Arm command and channel 0 and 7 bits are set in the fire command then the result will be the drivers on channel 0 will be activated (assuming FEN function is active) and there will be no effect on channel 7. During a deployment, any commands directed to the channel that are in deployment are ignored and the response shall be 0xD009. Diagnostic commands Diagnostic Mode 1 Diagnostic mode main functions are as follows: Normal Squib Resistance Diagnostics High Squib Resistance Diagnostics Squib short to battery/ground diagnostics Loop to loop diagnostics High side safing diagnostics VRESx measurement LS and HS FET Test The SPI message definition for MOSI commands and MISO responses in Diagnostic Mode are defined below. DocID028325 Rev 1 45/80 79 Functional description L9662 Write commands definition MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 0 0 0 D4 D3 D2 D1 D0 MOSI Command for Diagnostic Mode Execution 1 0 P 1 Diag. Selection bits 0 IPD_DIS AMC Channel Selection MISO Response for Diagnostic Mode, Stop Diagnostic Selection (MOSI D11:D9=000) 1 0 P 1 0 0 0 0 0 0 0 IPD_DIS 0 000 0 Channel Selection 0 Channel Selection MISO Response for Short to Battery/Ground Selection (MOSI D11:D9=001) 1 0 P 1 0 0 1 STB STG 0 SQP IPD_DIS MISO Response for Diagnostic Mode, Vresx Selection (MOSI D11:D9=010) 1 0 P 1 0 1 0 VR1 VR0 0 0 IPD_DIS MISO Response for Diagnostic Mode, High Side Safing Selection (MOSI D11:D9=011) 1 0 P 1 0 1 1 HSS1 HSS0 0 0 IPD_DIS 0 Channel Selection MISO Response for Diagnostic Mode, Squib Resistance Selection (MOSI D11:D9=100) 1 0 P 1 1 0 0 0 0 0 0 IPD_DIS AMC Channel Selection MISO Response for Diagnostic Mode, High Squib Resistance Selection (MOSI D11:D9=101) 1 0 P 1 1 0 1 HSR 0 0 0 IPD_DIS 0 Channel Selection MISO Response for Diagnostic Mode, Low Side FET Test Selection (MOSI D11:D9=110) 1 0 P 1 1 1 0 STB STG FP FT IPD_DIS 0 Channel Selection MISO Response for Diagnostic Mode, High Side FET Test Selection (MOSI D11:D9=111) 1 0 P 1 1 1 1 STB STG FP FT IPD_DIS 0 Channel Selection Read commands definition MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 000 X X IPD_DIS X Channel Selection Internal State MOSI Command for Diagnostic Mode, READ command 1 0 P 0 0 0 0 1 1 MISO Response for Diagnostic Mode, READ command 1 0 P 0 Diag. Selection bits internal state X X Bits D13 Parity bit. Command and response will use odd parity Bits D12 R/W 1 = Write (execute command) 0= Read For bits D11:D09 the following table shall be used for diagnostic selection. 46/80 DocID028325 Rev 1 L9662 Functional description Table 21. Diagnostic selection Bits D11 D10 D9 Current source active Stop Diagnostic 0 0 0 NO NO Short to Battery/Ground 0 0 1 Y (VMRC) Y (Comp ISTB/ISTG) VRESx Diagnostic 0 1 0 N Y (Comp VRESx) High Side Safing Diagnostics 0 1 1 Y (IHSS) Y (Comp HSS) Squib Resistance Diagnostics 1 0 0 Y (ISRC/ISINK) Y (Ampli) High Squib Resistance Diagnostics 1 0 1 Y (VMRC) Y (Comp IHR) LS FET test 1 1 0 Y (VMRC) Y (Comp ISTB/ISTG) HS FET test 1 1 1 Y (VMRC) Y (Comp ISTB/ISTG) Diagnostic Comparator or amplifier STB/STG bit Definition with MOSI D11:D9=001 (Leakage Test) STB bit Bit used for indicating leakage to battery. 0 = No leakage to battery 1 = Short to battery / HS Driver test pass STG bit Bit used for indicating leakage to ground. 0 = No leakage to battery 1 = Short to ground / LS Driver test pass STB/STG bit Definition with MOSI D11:D9=110 (LS FET) STB, STG bits see table below Table 22. Diagnostic mode LS FET selection Condition STB STG Test in Process (FT=1); Fault (FP=1); or LS FET/GNDx open fault (FP=0,FT=0) 0 0 Short to battery occurred during test 1 0 Test Pass if leakage diagnostics did not indicate a short to GND 0 1 STB/STG bit definition with MOSI D11:D9=111 (HS FET) STB, STG bits see table below Table 23. Diagnostic mode HS FET selection Condition STB STG Test in Process (FT=1); Fault (FP=1); or HS FET/VRESx open fault (FP=0,FT=0) 0 0 Test Pass if leakage diagnostics did not indicate a short to battery 1 0 Short to ground occurred during test 0 1 DocID028325 Rev 1 47/80 79 Functional description L9662 STB/STG bit definition with MOSI D11:D9=011 (High side safing) HSS1:HSS0 bits, see table below Table 24. Diagnostic mode HSS selection Condition HSS1 HSS0 (VSDIAG-VRESx) < VHSSSHORT_th 0 0 VHSSSHORT_th < (VSDIAG-VRESx) < VHSSOPEN_th 0 1 VHSSOPEN_th < (VSDIAG-VRESx) 1 1 STB/STG bit definition with MOSI D11:D9=010 (VRESx supply voltage) VR1:VR0 bits, see table below Table 25. Diagnostic mode VRESx selection Condition VR1 VR0 VRESx < VVRESXLO_th 0 0 VVRESXLO_th < VRESx < VVRESXHI_th 0 1 VVRESXHI_th < VRESx 1 1 STB/STG bit definition with MOSI D11:D9=101 (High squib resistance) HSR bit Bit used for indicating leakage to ground. 0 = Squib Resistance below RSQHIZ 1 = Squib Resistance above RSQHIZ 48/80 Bits D6 Fault present prior to running LS FET or HS FET test (diagnostics aborted) 0 = Normal 1 = Test not run - Fault present (FEN in incorrect state, short to battery or ground) Bits D5 Bit definition based on diagnostic selection. FT bit Read Only - Used for LS FET or HS FET diagnostics and is the status of the FET timer 0 = FET timer not active 1 = FET timer active SQP bit: Squib Pin to be tested during short to battery/ground diagnostics 0 = SQBLx pin test 1 = SQBHx pin test Bits D4 Used to disable IPD on all channels 0 = IPD active as indicated; – Active for all channels except the one under test when running Short to Battery/Ground and short between loops Diagnostics and LS/HS FET test – Active for all channels when running Stop Diagnostic, DocID028325 Rev 1 L9662 Functional description resistance Diagnostics, High Squib Resistance Diagnostics, HSS Diagnostic and VRESx Diagnostics 1 = IPD disabled on all channels Bit used for resistance measurement amplifier calibration. Only valid when squib resistance diagnostics is selected, otherwise this bit will be ignored and a 0 will be reported in the response 0 = No calibration (Normal squib resistance measurements) 1 = Calibration The following table shall be used for channel selection. Bits D3 For bits D2:D0 Table 26. Channel selection Note: Channel Bit D2 Bit D1 Bit D0 0 0 0 0 1 0 0 1 2 0 1 0 3 0 1 1 4 1 0 0 5 1 0 1 6 1 1 0 7 1 1 1 Except for short to battery /ground diagnostics and loop to loop test the state of IPD (D4) will not affect the test Monitor commands Monitor Mode 1 Monitor mode main information: Deployment status The SPI message definition for MOSI commands and MISO responses in Monitor Mode 1 are defined below. MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 0 0 DS Channel Selection Status Request 0 0 DS Channel Status D0 MOSI Command for Monitor Mode 1 1 1 P 0 0 MISO Response for Monitor Mode 1 1 1 P 0 0 DocID028325 Rev 1 49/80 79 Functional description L9662 Table 27. MOSI diagnostic mode 2 bit definition Bit MOSI Command State D15 1 D14 1 D13 MISO Response Description Mode bits See above for state Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits See above for state D12 0 D11 0 Monitor Mode selection bits See above for state D10 0 Monitor Mode selection bits See above for state D9 0 D8 D7 D6 D5 D4 D3 D2 D1 D0 See above for state See above for state 0 Report Deploy Success Flag (default) 1 Report Deploy Status 0 Keep Deploy Success Flag Channel 7 (default) 1 Clear Deploy Success Flag Channel 7 0 Keep Deploy Success Flag Channel 6 (default) 1 Clear Deploy Success Flag Channel 6 0 Keep Deploy Success Flag Channel 5 (default) 1 Clear Deploy Success Flag Channel 5 0 Keep Deploy Success Flag Channel 4 (default) 1 Clear Deploy Success Flag Channel 4 0 Keep Deploy Success Flag Channel 3 (default) 1 Clear Deploy Success Flag Channel 3 0 Keep Deploy Success Flag Channel 2 (default) 1 Clear Deploy Success Flag Channel 2 0 Keep Deploy Success Flag Channel 1 (default) 1 Clear Deploy Success Flag Channel 1 0 Keep Deploy Success Flag Channel 0 (default) 1 Clear Deploy Success Flag Channel 0 Internal state of report setting Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS7 or DEPLOY_SUCCESS7 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS6 or DEPLOY_SUCCESS6 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS5 or DEPLOY_SUCCESS5 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS4 or DEPLOY_SUCCESS4 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS3 orDEPLOY_SUCCESS3 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS2 or DEPLOY_SUCCESS62 Deploy Information for channel based on bit D8Will Either be DEPLOY_STATUS1 or DEPLOY_SUCCESS1 Deploy Information for channel based on bit D8 Will Either be DEPLOY_STATUS0 or DEPLOY_SUCCESS0 The DEPLOY_SUCCESSx flag indicates if the corresponding channel’s drivers were activated and that the activation period has completed. This bit is set when the activation period has expired. The DEPLOY_SUCCESSx flag will be ‘1’ until it is cleared by writing a ‘1’ to the appropriate channel(s) (bits D7-D0). The DEPLOY_STATUSx bit will become ‘1’ when there is a valid Arm and Fire sequence for the corresponding channel. The DEPLOY_STATUSx bit transitioning from a ‘0’ to a ‘1’ does not depend on the state of the FEN function. It will become ‘0’ when time out has expired. 50/80 DocID028325 Rev 1 L9662 Functional description Depending on the state of FEN the DEPLOY_STATUSx flag could be ‘1’ for a minimum of 1x tDEPLOY and a maximum of up to 2 x tDEPLOY (see Figure 8). The Deployment status is captured on the falling edge of CS_D. Bit D8 is used to select the meaning of bit D7 through bit D0 in the status response message. When this bit is set to ‘1,’ bits D7 through D0 in the status response message will report the state of the DEPLOY_STATUSx flag. When this bit is ‘0,’ bit D7 through bit D0 in the status response message will report the DEPLOY_SUCCESSx flag. The following table 16 shows the conditions for the DEPLOY_STATUSx flag and the DEPLOY_SUCCESSx flag. Table 28. DEPLOY_STATUSx flag and the DEPLOY_SUCCESSx flag conditions DEPLOY_STATUSx flag DEPLOY_SUCCESSx flag 0 0 0 1 1 1 0 1 Description No Deployment in process or has been initiated since POR or since last Clear of Success flag Deployment has successfully completed Deployment in process Deployment terminated / LSD shutdown Once the Deploy Success Flag is set, it will inhibit the subsequent deployment command until a SPI command to clear this deployment success flag is received. Bits D7 through bit D0 are used to clear/keep the deploy success flag. When these bits are set to ‘1,’ the flag can be cleared. Otherwise, the state of these flags is not affected. The Success flag must be cleared to allow re-activation of the drivers Monitor mode 2 Monitor mode main information: Current limit measurement of channels The SPI message definition for MOSI commands and MISO responses in Monitor Mode 2 are defined below. MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 0 MOSI Command for Monitor Mode 2 1 1 P CLR 0 1 Current Measurement Channel Select 1 Current Measurement Channel MISO Response for Monitor Mode 2 1 1 P 0 0 DocID028325 Rev 1 Current Measurement Data 51/80 79 Functional description L9662 Table 29. MOSI monitor mode 2 Bit definition MOSI command MISO response Bit State D15 1 D14 1 Description Mode Bits See above for state See above for state D13 Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits 0 Keep timer measurements See above for state 1 Clear “current measurement time” stored on the register of channel selected by D9:D7 See above for state D11 0 Monitor Mode selection bits See above for state D10 1 D12 D9 D8 D7 D6:D0 0 Monitor Mode selection bits See above for state Channel selected for current measurement See Table 30 Internal Stored channel selections bits - Current measurement of selected channel Bits [D9:D7]. Used when sending the MOSI command to select the channel to be measured. The MISO response shall echo the MOSI command. Table 30. Current measurement channel selections Channel Bit D9 Bit D08 Bit D07 0 1 2 3 4 5 6 7 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Bits [D6:D0]. Current measurement data of selected squib channel. Bit weight is nominally 25 μs for a total measurement time 3.175 ms. Monitor mode 3 Monitor mode main information: Status of FENx Function - FENx pin OR’d with Internal FENx latch Status of current for each channel The SPI message definition for MOSI commands and MISO responses in Monitor Mode 3 are defined below. 52/80 DocID028325 Rev 1 L9662 Functional description MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 CFS 0 0 0 0 0 0 0 0 0 CF5 CF4 CF3 CF2 CF1 CF0 MOSI Command for Monitor Mode 3 1 1 P 0 1 0 MISO Response for Monitor Mode 3 1 1 P 0 1 0 CFS POR CF7 CF6 STAT Table 31. MOSI monitor mode 3 bit definition MOSI command MISO response Bit State D15 1 D14 1 D13 Description See above for state Mode Bits See above for state Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits D12 0 See above for state D11 1 See above for state D10 0 See above for state Status Type 0 = Current limit status 1 = FEN function status D09 D08 0 D7:D0 0 0 = current measurement status reported in bit D7:D0 1 = FEN function status reported in D7:D0 POR status Current measurement status of channels or FEN status as indicated below Bit [D10] POR status 0= Reset occurred. Bit cleared when read 1= Normal With Bit D9 = 1 Bit D7:D4 ‘0000’ Bit D3: 0 = FEN4 input or FEN4 latch timer inactive 1 = FEN4 input or FEN4 latch timer active Bit D2 0 = FEN3 input or FEN3 latch timer inactive 1 = FEN3 input or FEN3 latch timer active Bit D1: 0 = FEN2 input or FEN2 latch timer inactive 1 = FEN2 input or FEN2 latch timer active Bit D0: 0 = FEN1 input or FEN1 latch timer inactive DocID028325 Rev 1 53/80 79 Functional description L9662 1 = FEN1 input or FEN1 latch timer active Note: The FEN status is the result of the state of the FEN input pin OR’d with the FEN latch timer. The FEN latch timer will remain inactive until a transition of ‘1’ to ‘0’ on the FEN input (assuming the pin was high for a minimum of 16μs). At that time the FEN latch timer will be active and keep the internal FEN signal active based on the programmed time (0ms, 128ms, 256ms or 512ms) for that particular FEN function. With Bit D9 = 2 Bit D7: 0 = Current through channel 7 is below IMEAS 1 = Current through channel 7 is above IMEAS Bit D6: 0 = Current through channel 6 is below IMEAS 1 = Current through channel 6 is above IMEAS Bit D5: 0 = Current through channel 5 is below IMEAS 1 = Current through channel 5 is above IMEAS Bit D4: 0 = Current through channel 4 is below IMEAS 1 = Current through channel 4 is above IMEAS Bit D3: 0 = Current through channel 3 is below IMEAS 1 = Current through channel 3 is above IMEAS Bit D2: 0 = Current through channel 2 is below IMEAS 1 = Current through channel 2 is above IMEAS Bit D1: 0 = Current through channel 1 is below IMEAS 1 = Current through channel 1 is above IMEAS Bit D0: 0 = Current through channel 0 is below IMEAS 1 = Current through channel 0 is above IMEAS Note: current status for channel is captured on the falling edge of chip select Monitor mode 4 Monitor mode main information: Revision Device ID The SPI message definition for MOSI commands and MISO responses in Monitor Mode 4 are defined below . MSB D15 LSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 0 0 0 0 1 ID3 ID2 ID1 ID0 R5 R4 R3 R2 R1 R0 MOSI Command for Monitor Mode 4 1 1 P 0 1 MISO Response for Monitor Mode 4 1 54/80 1 P 0 1 DocID028325 Rev 1 L9662 Functional description Table 32. MOSI monitor mode 3 bit definition MOSI command MISO response Bit State D15 1 D14 1 D13 3.4.6 Description See above for state Mode Bits See above for state Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits D12 0 See above for state D11 1 Mode selection See above for state D10 1 Mode selection See above for state D9-D6 ‘0001’ shall be device L9662 D5:D0 Revision Information: Upper 3 bits will reflect full pass Lower 3 bits will reflect metal/minor change First pass device will be indicated as “001 000” 0 Satellite sensor interface The device provides four currents limited to I_Lim each through outputs ICH1, ICH2, ICH3 and ICH4. The voltage at these four channels is supplied by the VSATS input. Channels 1, 2, 3 and 4 serve as switched power sources to remote mounted satellite sensors. The device will monitor the current flow from its output pin and “demodulate” the current to be decoded using Manchester protocol. Decoded satellite message is communicated to an external microprocessor via SPI2. Both the satellite and squib circuits can be reset over when sending the appropriate configuration commands via SPI1 (16 bit SPI). For operation using a sync pulse a capacitor between 10 nF to 47 nF is required to be within 70 nH of the respective ASIC pin for signal stability. In case of loss of VCC all outputs will remain off. Satellite operation modes Each receiver channel provides different modes of operation that can be programmed by SPI command. Receive mode (asynchronous data transfer) In Receive Mode the sensor interface operates in asynchronous mode. The specified data messages from each channel will be continuously received every tasync. (Design Information only). The Sensor Interface supplies satellites and receives current modulated data. In this mode, the channels are supplied via pin VSATS. A voltage VICHxmin+Vhdp_max(I=75mA@105°C) at this input pin is required to provide the regulated voltage of VICHxmin at the satellite outputs [ICH0]...[ICH3]. DocID028325 Rev 1 55/80 79 Functional description L9662 Figure 10. Transmission in asynchronous mode 9 ,&+[ W$6<1& , ,&+[ '$7$)5$0( '$7$)5$0( , 6$7BLGOH *$3*36 High voltage mode and satellite SYNC mode In High Voltage Mode and SYNC Mode the ICHx outputs are regulated to a higher output voltage (VICHx_HV) than in Receive mode. In this case, the channel power supply is taken from a separate input pin (VSYNC). Both modes are activated and deactivated by the same SPI command. The start of the SYNC impulse is arbitrary and is created by a signal from the μC using the INITSYNC input pin. The Sync pulse shall be initiated for all satellites based on the rising edge of the INITSYNC input after a tSYNCDLY delay. The duration of the sync pulse shall be based on the programmed sync pulse high time based on [D9:D8] in the MCR. If the sync timing register has not been written the default pulse high time shall be tSYNC_high1. The absence of an INITSYNC input rising edge does not prevent processing of incoming messages when in HV or SYNC mode. For Sync mode the valid sync time selections would be tSYNC_high1 and tSYNC_high2. For High Voltage Mode the valid sync time selections would be tSYNC_high3 and tSYNC_high4. The time selections of tSYNC_high3 and tSYNC_high4 cannot be used in normal operation because the time duration will be longer than the receive disable time, resulting in improper communication with the satellites. For HV mode (used only in the manufacturing or supplier facility) if there is a short to battery flag is set then the message must be ignored. At the start of a sync pulse there is a short period before the actual start of the sync pulse for a channel where the current is limited to 20mA typical. This low current limit will start after the tINITSYNCFLT time and last for 200 ns. The satellite current requirements in conjunction with the capacitance on the pins should be verified so that the minimum satellite voltage can be maintained. SYNC mode During the receiver disable time a sync pulse cannot be initiated and any change on the INITSYNC pin will be ignored by the ASIC.The satellite SYNC mode is used to generate automatic sync pulses for synchronous data transmission. In this mode, the output operates in Receive Mode, but is periodically switched to a higher output voltage VICHx_HV. Thus, the receiver decoder blocks are deactivated for the duration of the Sync pulse. To avoid disturbance in the data flow during re-settling of the output voltage to the receive-mode level, the receiver decoder block is deactivated for time tRECV_disable. 56/80 DocID028325 Rev 1 L9662 Functional description The receiver disable time, tRECV_disable, is started from the rising edge of the INITSYNC input. When operating in sync mode the valid sync time selections would be tSYNC_high1 and tSYNC_high2. In synchronous communication mode it is possible to communicate with a maximum of two (2) satellites on one channel. This is done using a simple form of time division multiplexing where each device transmit its data during a known time slot. The figure below shows examples for 1 or 2 satellites on a channel. Figure 11. Synchronization pulse timing (single device) W6<1&BSHULRGB 9 ,&+[ W6\QFB'/< W6\QF , ,&+[ 5HFHLYHU LVGLVDEOHG 5HFHLYHULVHQDEOHG W5(&9BGLVDEOH '$7$)5$0( ,1,76<1& *$3*36 Figure 12. Synchronization pulse timing (mini bus) W6<1&BSHULRGB 9 ,&+[ W6\QFB'/< W6\QF , ,&+[ 5HFHLYHU LVGLVDEOHG 5HFHLYHULVHQDEOHG W5(&9BGLVDEOH WGO\ '$7$)5$0( '$7$)5$0( ,1,76<1& *$3*36 DocID028325 Rev 1 57/80 79 Functional description L9662 High voltage mode The High Voltage Mode is based on the SYNC Mode and will be used to communicate with the external satellites via voltage modulation. When in this mode the valid sync time selections would be tSYNC_high3 and tSYNC_high4. During the High Voltage Mode it is necessary to disable the receiver of the sensor interface until a complete data frame is sent. After sending a data frame the receiver must be enabled again to receive the expected answer from the satellites. The microcontroller will control the enabling and disabling of the receiver along with Sync pulse high time (tSYNC_highx) the over SPI2 for each bit of the data frame. Figure 13. High voltage mode communication ,1,76<1& W6<1&BKLJK WLE WLE WLE W6<1&BKLJK W6<1&BKLJK 9 +9 9 ,&+[ 'DWD5HFHLYHG )URP6DWHOOLWH *$3*36 Satellite message decoding The device is configurable for decoding of satellite messages based on either Manchester-1 or Manchester-2 decoding. Each of the four satellite channels has a Manchester decoder that can be enabled or disabled through the CCR register. For Manchester-1 decoding a logic 0 is defined as a signal transition from 1 to 0 at 50% Duty cycle, logic 1 is defined as a signal transition from 0 to 1 at 50% Duty cycle. For Manchester-2 decoding a logic 0 is defined as a signal transition from 0 to 1 at 50% Duty cycle, logic 1 is defined as a signal transition from 1 to 0 at 50% Duty cycle. An example of Manchester-1 and Manchester-2 decoding is given below. Figure 14. Manchester-1/2 decoding diagram 0DQFKHVW HU 0DQFKHV WHU 6WDUW%LWV 6WDUW%L WV , ,&+[ /RJLF /RJLF /RJLF /RJLF , ,&+[ /RJLF /RJLF /RJLF /RJLF *$3*36 58/80 DocID028325 Rev 1 L9662 Functional description The device is capable of different bit rates, which can be programmed via SPI2 based on the operating frequency of the satellite bus. For the first message and all subsequent messages the ASIC uses the Start Bits’ time to decode the rest of the bits in the message. In case the measured bit rate obtained using the 2 Start bits doesn’t fall within the range selected by the SPI as defined the device declares a bit time error and waits for idle. The idle time between messages is 1.5 times the measured start bits time of the previous message unless a message error is detected. If an error is detected then the device shall default to 1.5 times the maximum frequency (minimum bit time). The initial idle time (after a POR or reset) is 0 bit times. The decoder uses a counter to track the high to low and low to high transitions at the bit center. Figure 15 is an example that illustrates how the ASIC performs the decoding. A transition is considered a bit center only when an edge is detected 75% to 125% of the reference bit time after de-glitch filter. The de-glitch filter can modify bit time if the noise on is not symmetric on each transition. When a single edge occurs below 75% of the reference bit time it is considered to be a bit edge but it is ignored. When the decoder detects a second edge below 75% of the reference bit time the device declares a bit time error via SPI, revert to the minimum bit time of the selected range, and wait for idle. When a valid bit center is detected the counter will reset and start counting again until another edge is detected. If the message is not complete and no edge is detected in the range of 75% to 125% of measured bit time, the device declares a bit time error via SPI, revert to the minimum bit time of the selected range, and wait for idle. The idle time is defined as 150% of the minimum bit time of the selected protocol speed range. If there is no bit transition detected for that period of time and the correct number of bits was received, the message is considered complete. Bit time error and too many bits faults are stored directly into the data register once they are selected without the need to wait till an idle time. Since a bit time error is reported directly once it is detected before Idle time, too few bits error may never be reported since bit time error is detected first. Bit time errors and too many bits errors will cause the decoder to revert to the minimum bit time of the selected range, and discard the message. In case of a message containing multiple errors only one error code is reported per message, errors detected in the decoding phase have the following reporting priority; bit time errors, too many bits errors then communication errors (CRC/Parity). DocID028325 Rev 1 59/80 79 Functional description L9662 Figure 15. Example of Manchester decoding using satellite protocol V\QF V\QF ' ' ' ' ' ' ,06!RU 1 V\QF ,)9 6DWWHOLWH&XUUHQW /HYHO V\QF V\QF ' V\QF V\QF ' ' ,06!RU 1 ' ),/7B'$7$ ,06!RU 1 V\QF V\QF 1 1 1 1 1 1 1 1 1 1 1 1 1 1 %LWB7LPHB&RXQWHU! WR%LW&HQWHU $OO7UDQVLWLRQV %LW&HQWHU7UDQVLWLRQV $OO7UDQVLWLRQVDIWHU ,06B'HWHFW %LWB&RXQW! %LWB7LPHB5HJLVWHU! 1 1 1 1 1 *$3*36 Communication protocols In order to support the various satellite sensors, the device supports two different communication standards (MS and PSI5 Mode). The Manchester standard consists of two protocols (CRC / Even Parity), while the PSI5 standard consists of one protocol (Even Parity) for a total of three communication protocols. The three protocols which are described in this section are: 1) Protocol A - CRC. 2) Protocol B Generic – Parity: to support Bosch PAS3 and PAS4 sensors. 3) Protocol C: PSI5 – Parity: support for various sensors. Bit D3 of the MCR configures the device for either MS or PSI5 communication standard. Bits D10 to D13 in the MCR register are used to configure the specific device channel (Ch. 0,1,2,3) to use any of these specified protocols. This version of the device supports the following PSI5 Operational Modes. PSI5-A8P-250/1L PSI5-A10P-250/1L PSI5-P10P-250/1L PSI5-P10P-500/2L 60/80 DocID028325 Rev 1 L9662 Functional description Protocol A The data received from satellite receiver block has to be decoded in the digital block. The data is received LSB first. The protocol format is defined below for the 4 different message lengths. Figure 16. Satellite protocol-A 0DQFKHVWHU ELW0HVVDJH 6WDUWELWV &5& ELW0HVVDJH 6WDUWELWV &5& ELW0HVVDJH 6WDUWELWV &5& ELW0HVVDJH 6WDUWELWV &5& 69 'DWD 69 'DWD 'DWD 'DWD *$3*36 The default for the device is to perform CRC decoding on all messages. The device has the option not to perform the CRC decoding and pass the satellite message, excluding the 2 start bits, over the MISO. CRC decoding can be disabled/enabled by writing to the appropriate bit in the CCR register. For the CRC mode the error detection code used for processing the message is based on the polynomial x3 + x1 + x0. If the device is in CRC mode it will process all incoming messages and report an error via SPI2 in case of a CRC mismatch. The CRC is performed after a complete message is received and, in case of CRC error, the device sets a fault code in the SR word. The message data sent over SPI2 is MSB first. Protocol B: generic variable length protocol The data received from satellite receiver block has to be decoded in the digital block. The data is received LSB first. The protocol format is defined below for the 4 different message lengths. Figure 17. Generic satellite protocol 0DQF KHVWHU EL W0HVVDJH 6WDUWELWV 69 EL W0HVVDJH 6WDUWELWV 69 EL W0HVVDJH 6WDUWELWV 'DWD EL W0HVVDJH 6WDUWELWV 'DWD 'DWD 3 'DWD 3 3 3 *$3*36 DocID028325 Rev 1 61/80 79 Functional description L9662 The ASIC shall supports a Satellite Protocol-B, which is based on Bosch sensors PAS3/PAS4 protocols. The default for the device is to perform parity decoding on all messages. The device has the option not to perform the CRC decoding and pass the satellite message, excluding the 2 start bits, over the MISO. Parity decoding can be disabled/enabled by writing to the appropriate bit in the CCR register. For the parity mode the error detection code used for processing the message is even. If the device is in CRC mode it will process all incoming messages and report an error via SPI2 in case of a parity mismatch. The parity check is performed after a complete message is received and, in case of an error, the device sets a fault code in the SR word. The message data sent over SPI2 is MSB first. Protocol C: PSI5 mode - parity protocol The data received from satellite receiver block has to be decoded in the digital block. The data received from the satellite is LSB first followed by the Parity bit. The protocol format is defined below for the 4 different message lengths. Figure 18. PSI5 – parity satellite protocol 36,3DULW\ ELW0HVVDJH 6WDUWELWV 'DWD ELW0HVVDJH 6WDUWELWV 'DWD ELW0HVVDJH 6WDUWELWV 'DWD ELW0HVVDJH 6WDUWELWV 'DWD 3 3 3 3 *$3*36 When the PSI5 parity protocol is selected, the ASIC performs a parity check then passes the satellite message, excluding the 2 start bits and parity bit over the MISO on SPI2. For parity protocol, the error detection code used for processing the message is even. The parity check is performed and in case of an error, the device sets a fault code in the SR word. When commanded, the message data excluding the start bits and parity bit is sent over SPI2 MSB first. 62/80 DocID028325 Rev 1 L9662 Functional description DATA buffer/DATA transfer The IC includes 4 internal DATA registers; one for each output channel, each one is 16 bits and one deep. Figure 19. Data buffer / data transfer diagram 63,7UDQVIHU %XIIHU VWDJHÄ5HJLVWHU³ )RU6DW'DWD 7UDQVIHU'DWDLID³UHDGUHJLVWHU´ &RPPDQGIRUWKHFKDQQHOLV UHFHLYHGYLD63, 1RWH7UDQVIHU GDWDDWIDOOLQJHGJHRI&6 RIIROORZLQJ63,WUDQVIHU 0DQFKHVWHU6DW 'HFRGHU 7UDQVIHU'DWDLIDYDOLGIUDPHRI 6DW'DWDLVUHFHLYHG 'DWDLQUHJLVWHUZLOOEHRYHUZULWWHQ *$3*36 Once the data is transferred to the SPI transfer buffer the satellite data register is cleared. If there is no incoming satellite message before the next SPI data read a register empty flag will be indicated assuming no other fault conditions exist. Current sensor description Each output channel senses the current drawn by the remote satellite sensor. The circuit modulates the load current into logic voltage levels for post processing by a Manchester decoder. Each channel has an internal comparator with a programmable currents trip points selectable through the appropriate setting in the CCR Register for each of the 4 satellite channels. For determining the appropriate current threshold setting the total current, idle plus signal, must be taken into account. The current sense comparator also provides hysteresis, which can be enabled through appropriate setting in the CCR Register. Each comparator output have a de-glitch filter as a function of the protocol speed. Satellite short conditions Each channel has a short circuit protection by independent current limit. When a short to ground occurs the output becomes current limited to 150 mA maximum when the voltage is at idle and 280 mA maximum during the sync pulse for a total period of tFlt _GND. After time tFlt _GND the output will shut off and a leakage to ground fault shall be reported in the SR word. The output will remain off until re-enabled via SPI and if the short is not present then the outputs shall return to normal operation. All channels that do not have a short condition shall not be affected. When the output is shorted to battery, an internal comparator senses the output voltage level then turns off an internal series transistor to provide blocking diode for the current going through the output channel. The output will be OFF only when fault condition is present. As soon as the fault disappears, the interface will become ON again. A leakage to battery fault will be set and reported in the SR word after it has been present for tFlt _BATT. Once read it shall be cleared and if the condition is still present the flag will be set. The comparators have 20 to 50 mV input offset to prevent turning off the output under an open circuit condition. DocID028325 Rev 1 63/80 79 Functional description L9662 IFx/Vx output configuration The IFx/Vx pins are high impedance by writing to D7 and D6 of the MCR and setting the bits to 0. When the pins are enabled and if the pin is shorted to ground then the device can source up to 100mA from VDD. Analog output Channels 2 and 3 of the device can by used to provide an analog feed back current as a 1/100th ratio of the sense current in this mode internal data register and decoder are bypassed. This will allow the IF2/V2 and IF3/V3 pins to be connected to a resistor to ground and provide an analog voltage equivalent to the sense current to be read by an A/D port. These two pins have an internal clamp as protection. This feature is available for Channels 2 and 3. Digital output Channels 2 and 3 can be configured as a logic level output with the level reflecting if the current is above or below the selected internal current threshold. See Table 33 for MCR and CCR bit settings for this mode. The output voltage has a reversed polarity to the satellite current such that when the current drawn by the satellite is below the current detection threshold, the IFx/Vx signal level transitions into a high state, on the other hand if the current drawn by the satellite exceeds the current detection threshold, IFx/Vx signal transitions into a low state. Channel 2 and 3 mode selection These channels can be configured to decode satellite messages or Hall Effect sensors and provide results through the SPI and/or the IFx/Vx pins. The following Table 33 shows the settings for the MCR and CCR based on the interfacing to a sensor or satellite. Table 33. MCR and CCR settings based on the interfacing to a sensor or satellite Register settings MCR MCR D7/D6 D5/D4 Bits Bits Functions active Information available CCR D5:D4 Bits Channel (ICHx) Decoder SPI DATA register IFx/Vx pin 0 0 00 OFF (ICHx HiZ) OFF Empty OFF (HiZ) 0 1 00 OFF (ICHx HiZ) OFF Empty OFF (HiZ) 1 0 00 OFF (ICHx HiZ) OFF Empty ON (1) 1 1 00 OFF (ICHx HiZ) OFF Empty VDD 0 0 01 ON OFF Empty OFF (HiZ) Data will reflect if ICHx current is above/below threshold setting 0 1 01 ON (1) OFF OFF (HiZ) D0 = 0 (above thres.) D0 = 1 (below thres.) 1 64/80 0 01 ON OFF DocID028325 Rev 1 Empty Analog Output (I_Sat/100) L9662 Functional description Table 33. MCR and CCR settings based on the interfacing to a sensor or satellite (continued) Register settings MCR MCR D7/D6 D5/D4 Bits Bits CCR D5:D4 Bits Functions active Channel (ICHx) Information available SPI DATA register Decoder IFx/Vx pin Data will reflect if ICHx current is above/below threshold setting 1 1 01 ON (1) OFF Digital Output D0 = 0 (above thres.) D0 = 1 (below thres.) 0 0 10 ON ON Satellite Data OFF (HiZ) 0 1 10 ON ON Satellite Data OFF (HiZ) 1 0 10 ON ON Empty Analog Output (I_Sat/100) 1 1 10 ON ON Satellite Data Digital Output 0 0 11 ON OFF Empty OFF (HiZ) 0 1 11 ON OFF Empty OFF (HiZ) 1 0 11 ON OFF Empty Analog Output (I_Sat/100) 1 1 11 ON OFF Empty Digital Output 1. IFx/Vx Pin is set as Analog Output (I_Sat/100) but since ICHx is off (HiZ) the IFx/Vx output will look like it is HiZ 3.4.7 SPI register definition for satellite functions The SPI provides access to read/write to the registers internal to the device. All commands sent to the ASIC shall use set D15 as required for odd parity on the 16 bit word. The total message length when CS_S is active is 80 bits. The response to the command is sent in the next valid CS_S. Table 34. SPI register definition Registers for satellite communication Description Module Configuration Register MCR Global configuration for all channels Channel Configuration Registers CCR1 CCR2 CCR3 CCR4 Used to configure individual channels and receive satellite information Internal pointer incremented to each channel register Status Register SR Status of channels Channel leakage to ground/battery/open faults Message faults (Start bits, Other) The following diagram shows the satellite SPI transfer during normal operation. The satellite data is uploaded based on CS_S going active. All the register data for the channels will be loaded at the same time. DocID028325 Rev 1 65/80 79 Functional description L9662 Figure 20. Satellite SPI transfer during normal operation diagram 6DWHOO LWH 'DWD/RDGH G2Q)DOO LQJ (GJH RI &6B6 'DWD%DVHGR Q/DV W026,ELW0 HVVDJH &6B6 6&/. FONV FONV FONV 026, 0VJ 1 0VJ 1 0VJ 1 0,62 5HVS'DWD 1 5HVS'DWD 1 5HVS'DWD 1 &6B6 1RZ DLWWLPHUHTXLUH G FRQWLQXRXV63 ,&ORF NV 6&/. ELWV ELWV ELWV ELWV ELWV 026, :RUG 1 :RUG 1 :RUG 1 :RUG 1 :RUG 1 :RUG 1 5HVSRQVH :RUG 1 5HVSRQVH 0HVVDJH1 0,62 :RUG 1 5HVSRQVH :RUG 1 5HVSRQVH :RUG 1 5HVSRQVH *$3*36 Based on the above format the micro must send the commands in a specific order. The following table represents the allowable commands/positions sent out on MOSI along with responses. Table 35. Commands/positions sent out on MOSI along with responses 1. Word position Allowable MOSI Commands MISO reponses Word (N,1) MCR MCR(1) or SR Word (N,2) CCR1 CCR1 or Data Word (N,3) CCR2 CCR2 or Data Word (N,4) CCR3 CCR3 or Data Word (N,5) CCR4 CCR4 or Data Only allowed if Words 2-5 are CCRs. When the device is set to report the MCR in the MISO response it must be done only when reporting all CCRs. If Data is reported with the MCR in the MISO response then the data status information is lost. When the MCR is in MISO word 1 then there is no indicator whether a response in words 2 to 5 are CCR or Data. If the SR is returned in the MISO response with a CCR then the status information for that word will not change until the next SR with Data. The SR bits will indicate which words are CCR and Data. 66/80 DocID028325 Rev 1 L9662 Functional description The MOSI input takes data from the master microprocessor while CS_S is asserted. The MSB is the first bit of each word received on MOSI and the LSB is the last bit of each word received on MOSI. This pin has TTL level compatible input voltages allowing proper operation with microprocessors using a 3.3 to 5.0 volt supply. When data is transmitted for any of the first 4 words on MISO then the SR will be the 5th word. This is required to identify good vs. bad data since, depending on the data mode, all 16 bits from a satellite can be data. Satellite module configuration register (MCR) This register defines the global configuration to the satellite module. The MCR will be the 1st word in the message of the MOSI transfer. The micro MUST never write the MCR in the wrong position because it will be recognized by the ASIC as a CCR. The SPI message definition for MOSI commands and MISO responses for the MCR are defined below. Command/ Mode MOSI Bit Definition D15 D14 D13 D12 D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 MOSI Command MCR 0 0 CH4P CH3P CH2P CH1P SPL1 SPL0 IV4EN IV3EN IV4SEL IV3SEL SW RD 0 odd 0 CH4P CH3P CH2P CH1P SPL 0 odd MISO Response MCR 0 SPL IV4EN IV3EN IV4SEL IV3SEL SW RD Table 36. MOSI MCR bit definition Bit MOSI Command MS – Mode‘D3’=0 State MOSI Command PSI5 – Mode‘D3’=1 Description D15 0 D14 0 Register Selection (SR/MCR) D13 0 1 CH3 Protocol A Mode (default) CH3 Protocol B Mode Not valid PSI5 Parity D12 0 1 CH2 Protocol A Mode (default) CH2 Protocol B Mode Not valid PSI5 Parity D11 0 1 CH1 Protocol A Mode (default) CH1 Protocol B Mode Not valid PSI5 Parity D10 0 1 CH0 Protocol A Mode (default) CH0 Protocol B Mode Not valid PSI5 Parity D9 0 D8 0 Sync Pulse length Sync Pulse length Disable IF3/V3 pin (default) Disable IF3/V3 pin (default) Enable IF3/V3 pin D7 D6 D5 0 1 Enable IF3/V3 pin 0 Disable IF2/V2 pin (default) Disable IF3/V3 pin (default) Enable IF3/V3 pin IF3/V3 Output Selection IF3/V3 Output Selection DocID028325 Rev 1 67/80 79 Functional description L9662 Table 36. MOSI MCR bit definition (continued) Bit MOSI Command MS – Mode‘D3’=0 State Description D4 D3 0 1 D2 D1 MOSI Command PSI5 – Mode‘D3’=1 IF2/V2 Output Selection IF2/V2 Output Selection MS Mode (Prot a\Prot B) Default PSI5 Mode MS Mode (Prot a\Prot B) Default PSI5 Mode Receiver Disable Time Selection Receiver Disable Time Selection Odd Parity – Includes all 16 bits Odd Parity – Includes all 16 bits X D0 The following describes the bit usage for both MS & PSI5 Satellite Modes: Bit [D15] If during the previous received request a SPI communication error occurred or invalid message was received, the device shall set bit D15 indicating that the whole data frame of 80 bit is not valid. Bits [D13:D10] These bits are used to configure the output channels for either CRC or Parity sensor protocols. When in MS Mode the default configuration is the protocol A. For PSI5 mode these bits must be set to 1's. Bits [D09:D08] Sync Pulse high time Table 37. Sync pulse high time selections SPL1 SPL0 0 0 20μs (default) 0 1 30μs 1 0 40μs 1 1 80μs Bit [D7:D5] Description These bits control the configuration of the IF3/V3 pin. Table 38. Configuration of the IF3/V3 pin 68/80 D7/D6 D5/D4 Description 0 0 IFx/Vx pin is HiZ 0 1 IFx/Vx pin is HiZ 1 0 IFx/Vx pin will source an analog current that is 1/100 of the sensor current 1 1 IFx/Vx pin will be a digital output indicating if the current is above or below the selected threshold. When a channel (ICHx) is off this pin will be high (~VDD). DocID028325 Rev 1 L9662 Functional description Bit [D3] Satellite Communication Protocol Selection 0 = MS Protocol 1 = PSI5 Protocol Bit [D2]. Receiver disable time selection 0 = Receiver disable time is 62s typical 1 = Receiver disable time is (Tsynchighx time + 20s) Channel configuration registers (CCR1, CCR2, CCR3, CCR4) The SPI message definition for MOSI commands and MISO responses for the CCR/Data are defined below. Command/ Mode from Master MOSI Bit Definition D15 D14 D13 D12 D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 MOSI Command CCR odd RS R/W MAN CRC PC1 PC0 SYNC BT1 BT0 EN1 EN0 IHYS I_Threshold R/W MAN CRC PC1 PC0 SYNC BT1 BT0 EN1 EN0 IHY S I_Threshold MISO Response (CCR) CCR (D14=1 in MOSI) odd 1 MISO Response (Data) CCR (D14=1 in MOSI) See Table 40 for MISO Responses Table 39. MOSI CCR bit definition Bit State MS Mode PSI5 Mode (1) MS / PSI5 Mode MS / PSI5 Mode MOSI Command MOSI Command MISO Response for CCR Mode MISO Response for Data Mode Description Odd Parity – Includes all 16 bits Same as MS Mode Odd Parity – Includes all 16 bits 0 1 Register Selection: CCR (1) / DATA (0) Same as MS Mode 1= CCR response 0 Read Same as MS Mode R/W 1 WRITE (only valid if CCR request) D15 D14 D13 DocID028325 Rev 1 See Table 40 69/80 79 Functional description L9662 Table 39. MOSI CCR bit definition (continued) Bit State MS Mode PSI5 Mode (1) MS / PSI5 Mode MS / PSI5 Mode MOSI Command MOSI Command MISO Response for CCR Mode MISO Response for Data Mode Description D12 0 Manchester 2 1 Manchester 1 0 Checksum calculation enabled (default) – Target is to use Not Used checksum calculated by ASIC 1 Checksum calculation disabled Note: Checksum for MS only not PSI5 D11 Not Used Manchester Selection PSI5 mode – don’t care Checksum calculation Status PSI5 mode – don’t care 1 D10 0 MS Message Length See Table 40 1 D9 PSI5 Message Data length Status Length See Table 40 0 D8 0 Sync pulse disabled (default) 1 Sync pulse enabled D7 D6 D5 D4 Same as MS Mode Sync pulse Status Bit time selection Same as MS Mode Bit time selection Satellite/Decoder Control Same as MS Mode Satellite/Decoder Control Same as MS Mode Current Trip Point Hysteresis Status Same as MS Mode Current Trip Point threshold 0 Current Trip Point Hysteresis Disabled (default) 1 Current Trip Point Hysteresis Enabled D3 See Table 40 D2 D1 Current Trip Point threshold D0 1. MISO Response shown in Table 40. Table 40. MISO responses with D14=0 (Data register selection) MOSI Bit Setting MISO Bit Definition D11 D10 D09 D15 D14 D13 D12 D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 MISO Data Response in MS Mode: MERAS Protocol 0 0 0 odd D9 D8 D7 D6 D5 D4 D3 D2 0 0 1 odd D7 D6 D5 D4 D3 D2 D1 D0 70/80 DocID028325 Rev 1 D1 D0 SV2 SV1 SV0 SV2 SV1 SV0 0 0 0 0 0 0 L9662 Functional description Table 40. MISO responses with D14=0 (Data register selection) (continued) MOSI Bit Setting MISO Bit Definition D11 D10 D09 D15 D14 D13 D12 D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 0 1 0 odd D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 odd D7 D6 D5 D4 D3 D2 D1 D0 0 0 1 0 0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 0 D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 0 D9 D8 D7 D6 D5 D4 D3 D2 1 1 1 0 D7 D6 D5 D4 D3 D2 D1 D0 CRC2 CRC1 CRC0 0 0 0 0 0 0 0 0 0 SV2 SV1 SV0 CRC2 CRC1 CRC0 SV2 SV1 SV0 CRC2 CRC1 CRC0 0 D0 CRC2 CRC1 CRC0 0 0 0 0 0 0 D1 0 0 MISO Data Response in MS Mode: Generic Protocol 0 0 0 odd D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 1 odd D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 odd D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 1 1 odd D7 D6 D5 D4 D3 D2 D1 D0 0 0 1 0 0 P D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 1 P D7 D6 D5 D4 D3 D2 D1 D0 1 1 0 P D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 1 1 P D7 D6 D5 D4 D3 D2 D1 D0 0 0 SV2 SV1 SV0 SV2 SV1 SV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 SV2 SV1 SV0 SV2 SV1 SV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 MISO Data Response in PSI5 Mode: Parity Protocol X 0 0 odd D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 X 0 1 odd D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 X 1 0 odd D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 X 1 1 odd D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 0 MISO Data Response in Raw Data Mode 0 X X odd 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Data 1 X X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Data MISO Data Response in Hall Effect Mode 0 X X odd 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 X X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Note: With CHxSF2:CHxSF0 = '000', '001, or '101' When transferring data if the CRC check is disabled on the ASIC then there is no parity bit and the CRC bits will be present along with the data bits on the MISO line. The following describes the bit usage for the CCR command Bits [D11]. Used to enable/disable checksum calculations in MS satellite mode (D11 is ignored in PSI5). DocID028325 Rev 1 71/80 79 Functional description L9662 0 = Checksum performed by ASIC 1 = Checksum calculation disabled Bits [D10:D09]. These bits are used to configure the number of bits in the MS and PSI5 Modes. MS Mode: For these bits to execute on any given channel, the channel has to be configured for generic protocol B / protocol A through bits <D13:D10> in the MCR register. If the checksum calculation is disabled the ASIC does not perform a parity check on the incoming message and will be included in the data field. Table 41. Protocol A/B mode configuration D10 Protocol-A Mode Protocol -B Mode (Set in MCR – D13:D10) (Set in MCR – D13:D10) D09 Message Length Message Length Data Report Length D11=0 D11=1 Data Report Length D11=0 D11=1 0 0 18 bits 13 bits (default) 16 bits 16 bits 13 bits (default) 14 bits) 0 1 16 bits 11 bits 14 bits 14 bits 11 bits 12 bits 1 0 15 bits 10 bits 13 bits 13 bits 10 bits 11 bits 1 1 13 bits 8 bits 11 bits 11 bits 8 bits 9 bits PSI5 Mode: For these bits to execute on any given channel, the channel has to be configured for PSI5 - Parity protocol through bits <D13:D10> in the MCR register. In PSI5 mode, the checksum calculation is always done by the ASIC, thus, bit D11 is ignored and parity bits are not included in the MISO response. Table 42. PSI5 – parity protocol (Set in MCR D13:D10) D10 D09 Message Length Data Report 0 0 16 bits 13 bits (default) 0 1 14 bits 11 bits 1 0 13 bits 10 bits 1 1 11 bits 8 bits Bits [D7:D6]. 72/80 These bits shall configure speed selection for any of the satellite channels. Upon power up or reset the protocol configuration shall initialize to the default speed as shown in the table below. DocID028325 Rev 1 L9662 Functional description Table 43. Default speed D7 D6 Guaranteed frequency operating range (kHz) 0 0 62.66 to 238.66 (default) 0 1 43.50 to 158.97 1 0 26.32 to 106.04 1 1 13.3 to 51.25 Bits [D5:D4]. These bits are used to enable the satellite channels and the internal decoders to be commanded on or off according to the following table. If both the satellite and decoder are to be enabled then the channel needs to be enabled first and in a following command the decoder would be enabled. This is to prevent erroneous/spurious data to be read. Table 44. On/off condition for satellite and decoder Definition D5 SPI DATA Register (For appropriate wordx) D4 0 0 Satellite Decoder ICH0/ICH1 OFF (default) OFF (default) Empty ICH2/ICH3 0 1 ON OFF Data will reflect if ICHx current is above/below threshold setting (1) D0 = 0 (above thres.) D0 = 1 (below thres.) 1 0 ON ON Sat. Data 1 1 ON OFF Empty See Table 33 Bit D3 All incoming satellite signals are processed through deglitch filter before reaching the decoder. D3 enables a hysteresis around the current threshold for added noise immunity. Bits [D2:D0] These bits program the threshold for the current demodulation affecting each individual channel. The current ranges supported are showed in table below. Table 45. Current range supported D2 D1 D0 Current Threshold (mA) min/max 0 0 0 1.0/4.0(default) 0 0 1 8.0/11.0 0 1 0 14.85/18.15 DocID028325 Rev 1 73/80 79 Functional description L9662 Table 45. Current range supported D2 D1 D0 Current Threshold (mA) min/max 0 1 1 17.10/20.90 1 0 0 20.25/24.75 1 0 1 24.85/29.15 1 1 0 28.80/34.20 1 1 1 35.10/42.90 Status registers (SR) The definition for the Status Register is valid for all four protocols. The SR will always be the 1st word in the message of the MOSI frame The message faults and data/channel information are indicated using 3 bits per channel (SF2, SF1 and SF0). These bits represent the actual highest priority state of the ICHxreceiver, i.e. any change in a state will overwrite the previous value with the highest priority fault being reported if more than one fault exists. Command/ Mode from Master MOSI Bit Definition D15 D14 D13 D12 D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00 0 0 0 0 0 0 0 0 0 0 0 odd CH1 SF1 CH1 SF0 POR STAT odd MOSI Command 0 1 0 0 MISO Response SR SPI ERR 1 CH4 CH4 CH4 CH3 CH3 SF2 SF1 SF0 SF2 SF1 CH3 SF0 CH2S CH2S CH2S CH1S SF2 SF1 SF0 SF2 The following describes the bit usage Bit [D15] If during the previous received request a SPI communication error occurred or invalid message was received, the device shall set bit D15 and this means that the whole data frame of 80 bit is not valid. Bits [D13:D02] Fault Codes Definition Supporting Satellite Interface, Hall Effect, and raw data modes Table 46. CCR D14 definition Priority CHxSF2 CHxSF1 CHxSF0 Description CCR D14=0 74/80 7 0 0 0 Good Data from satellite on word ‘x’ 6 0 0 1 Two or more good data received from satellite, i.e. there are some data lost. DocID028325 Rev 1 L9662 Functional description Table 46. CCR D14 definition (continued) Priority CHxSF2 CHxSF1 CHxSF0 Description 5 0 1 0 Register empty. No data received from satellite 4 0 1 1 Not valid data received i.e. – Start bit time outside valid range – Frame length – Bit time error – CRC/Parity error on sat received message (in this case there should be “register empty”) 3 1 0 0 Leakage to Supply Voltage at ICHx port and Not Good Data (data lost or register empty or not valid data) 2 1 0 1 Leakage to Supply at ICHx port & Good Data 1 1 1 0 Leakage to ground at ICHx port; (Over current detected switched OFF ICHx analog port, it can be still OFF if micro never wrote on CCR.D5:D4 to switch ON port) 1 1 1 CCR report is present on word ‘x’: Channel status is the response selected with bit D14 on CCR command CCR D14=1 NA Codes are prioritized with the highest being 1 and the lowest being 7. Error code 011 is an “or-ed”combination of the following errors: Start bit error outside of selected operating range Data length error or stop bit error CRC/Parity Error of received Satellite Message Bit time error outside 75% 125% of start bit If in Hall Effect mode the status register under normal conditions will report a Register Empty (CHxSF2:CHxSF0='010'). If a fault is on the channel then either a Leakage to supply and no good data (CHxSF2:CHxSF0='101') or Leakage to ground (CHxSF2:CHxSF0='110') would be present. If in Raw data mode the status resister under normal conditions will report Register Empty (CHxSF2:CHxSF0='010'). If decoder is on then satellite data will be present (See Table 40 under protocol A or Protocol B) If decoder is off then D0 will contain data If a fault is on the channel then either a Leakage to supply and no good data (CHxSF2: CHxSF0='101') or Leakage to ground (CHxSF2:CHxSF0='110') would be present. Bit [D00] POR status 0 = Reset occurred. Bit cleared when read 1 = Normal DocID028325 Rev 1 75/80 79 Functional description L9662 Figure 21. Combination errors diagram &6 63, 5HTXHVW 5HVSRQVH 6563,7UDQVIHU(UURU &RPSOHWHIUDPHQRWYDOLG *$3*36 This error is an”or-ed” combination of the following errors: Parity Length If a SPI error is detected by the ASIC the response shall be a SR followed by all Data Words. Following a POR the first response from the ASIC over SPI2 shall be as follows: Table 47. First response from the ASIC over SPI2e 76/80 Word Position Register Type Data Word 1 SR $5248 Word 2 Data $8000 Word 3 Data $8000 Word 4 Data $8000 Word 5 Data $8000 DocID028325 Rev 1 L9662 4 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. LQFP64 (10x10x1.4 mm) package information Figure 22. LQFP64 (10x10x1.4 mm) package outline 6($7,1* 3/$1( & $ $ $ 3,1 ,'(17,),&$7,21 FFF & ' ' E ' H $ F ( ( ( / / 4.1 . *$3*36 DocID028325 Rev 1 PP *$*(3/$1( B+B: 77/80 79 Package information L9662 Table 48. LQFP64 (10x10x1.4 mm) package mechanical data Dimensions Ref Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A - - 1.60 - - 0.0630 A1 0.05 - 0.15 0.0020 - 0.0059 A2 1.350 1.40 1.45 0.0531 0.0551 0.0571 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 c 0.09 - 0.20 0.0035 - 0.0079 D 11.80 12.00 12.20 0.4646 0.4724 0.4803 D1 9.80 10.00 10.20 0.3858 0.3937 0.4016 D3 - 7.50 - - 0.2953 - E 11.80 12.00 12.20 0.4646 0.4724 0.4803 E1 9.80 10.00 10.20 0.3858 0.3937 0.4016 E3 - 7.50 - - 0.2953 - e - 0.50 - - 0.0197 - L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 - 1.00 - - 0.0394 - - 0.0031 K ccc 0° (min.), 3.5° (typ.) 7° (max.) - - 0.08 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 78/80 DocID028325 Rev 1 L9662 5 Revision history Revision history Table 49. Document revision history Date Revision 08-Sep-2015 1 Changes Initial release. DocID028325 Rev 1 79/80 79 L9662 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 80/80 DocID028325 Rev 1