NL27WZ86 Dual 2−Input Exclusive−OR Gate The NL27WZ86 is a high performance dual 2−input Exclusive−OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • http://onsemi.com Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ86 Pb−Free Package is Available A1 1 8 VCC B1 2 7 Y1 Y2 3 6 B2 MARKING DIAGRAM 8 8 1 1 L8 = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. A1 GND 5 4 L8 M G G US8 US SUFFIX CASE 493 =1 Y1 B1 A2 A2 Y2 B2 Figure 2. Logic Symbol Figure 1. Pinout (Top View) PIN ASSIGNMENT Pin Function 1 A1 2 B1 3 Y2 4 GND A B Y 5 A2 L L L 6 B2 L H H 7 Y1 H L H 8 VCC H H L © Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. 3 FUNCTION TABLE Input Output Y=A+B 1 Publication Order Number: NL27WZ86/D NL27WZ86 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85_C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) 260 _C )150 _C 250 _C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum−rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 5.5 V *40 )125 _C 0 0 0 0 20 20 10 5 ns/V Operating Data Retention Only VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NL27WZ86 DC ELECTRICAL CHARACTERISTICS Symbol Parameter TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIH VOL Low−Level Output Voltage VIN = VIL IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Typ *405C v TA v 855C Max Min Max Unit 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Condition V 0.25 VCC 0.3 VCC V 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 V IOH = −100 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 100 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 0 to 5.5 $1.0 $1.0 mA 0 V v VIN v 5.5 V 0.0 1.0 10 mA VIN or VOUT = 5.5 V 1.65 to 5.5 1.0 10 mA VIN = 5.5 V, GND AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) TA = 25_C *40_C v TA v 125_C Condition (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 2.0 7.9 9.0 2.0 10.5 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 1.2 4.1 7.0 1.2 7.5 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 3.0 4.8 0.8 5.2 1.2 3.8 5.4 1.2 5.9 0.5 2.2 3.5 0.5 3.8 0.8 2.9 4.2 1.0 4.6 RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 2.5 pF pF CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ86 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC or GND VCC 90% 50% 10% 10% tPHL OUTPUT INPUT GND RL CL tPLH VOH OUTPUT Y 50% A 1−MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NL27WZ86US NL27WZ86USG Package Type Tape and Reel Size† US8 178 mm, 3000 Units / Tape & Reel US8 (Pb−Free) 178 mm, 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZ86 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE K D H 0.10 (0.004) T N R 0.10 TYP 0.10 (0.004) M T X Y V M DETAIL E F SOLDERING FOOTPRINT* 3.8 0.5 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.8 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.0 0.3 TYP (mm) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NL27WZ86 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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