Material Content Data Sheet Sales Product Name IPD60R950C6 Issued MA# MA001348744 Package PG-TO252-3-341 20. April 2015 Weight* 388.01 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-22-4 7440-31-5 7439-92-1 2.144 0.55 0.248 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.55 5525 5525 640 0.075 0.02 248.124 63.96 64.04 639483 192 640315 0.476 0.12 0.12 1226 1226 0.391 0.10 1008 11.866 3.06 118.136 30.45 33.61 304469 30581 336058 3.787 0.98 0.98 9760 9760 0.515 0.13 0.13 1328 1328 0.056 0.01 0.045 0.01 2.144 0.55 145 116 0.57 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5527 5788 1000000