Hall ICs Omnipolar Detection Hall ICs BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G, BU52051NVX,BU52053NVX,BU52054GWZ,BU52055GWZ, BU52056NVX,BU52061NVX,BD7411G No.10045EFT02 ●Description The omnipolar Hall ICs are magnetic switches that can operate both S-and N-pole, upon which the output goes from Hi to Low. In addition to regular single-output Hall ICs, We offer a lineup of dual-output units with a reverse output terminal (active High). ●Features 1) Omnipolar detection 2) Micro power operation (small current using intermittent operation method)(BD7411G is excluded.) 3) Ultra-compact and thin wafer level CSP4 package (BU52054GWZ, BU52055GWZ) 4) Ultra-compact wafer level CSP4 package (BU52015GUL, BU52001GUL) 5) Ultra-Small outline package SSON004X1216 (BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX) 6) Ultra-Small outline package HVSOF5 (BU52011HFV, BU52021HFV) 7) Small outline package (BU52025G, BD7411G) 8) Line up of supply voltage For 1.8V Power supply voltage (BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX, BU52011HFV) For 3.0V Power supply voltage (BU52001GUL) For 3.3V Power supply voltage (BU52021HFV, BU52025G) For 5.0V Power supply voltage (BD7411G) 9) Dual output type (BU52015GUL) 10) High ESD resistance 8kV (HBM) (6kV for BU52056NVX) ●Applications Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc. ●Lineup matrix Product name Supply voltage (V) Operate point (mT) Output type Package (ms) Supply current (AVG) (A) Hysteresis Period (mT) BU52054GWZ 1.65～3.60 +/-6.3 ※ 0.9 50 5.0µ CMOS UCSP35L1 BU52055GWZ 1.65～3.60 +/-4.1 ※ 0.8 50 5.0µ CMOS UCSP35L1 BU52015GUL 1.65～3.30 +/-3.0 ※ 0.9 50 5.0µ CMOS VCSP50L1 BU52001GUL 2.40～3.30 +/-3.7 ※ 0.8 50 8.0µ CMOS VCSP50L1 BU52061NVX 1.65～3.60 +/-3.3 ※ 0.9 50 4.0µ CMOS SSON004X1216 BU52053NVX 1.65～3.60 +/-3.0 ※ 0.9 50 5.0µ CMOS SSON004X1216 BU52051NVX 1.65～3.30 +/-3.0 ※ 0.9 50 5.0µ CMOS SSON004X1216 BU52056NVX 1.65～3.60 +/-4.6 ※ 0.8 50 5.0µ CMOS SSON004X1216 BU52011HFV 1.65～3.30 +/-3.0 ※ 0.9 50 5.0µ CMOS HVSOF5 BU52021HFV 2.40～3.60 +/-3.7 ※ 0.8 50 8.0µ CMOS HVSOF5 BU52025G 2.40～3.60 +/-3.7 ※ 0.8 50 8.0µ CMOS SSOP5 BD7411G 4.50～5.50 +/-3.4 ※ 0.4 - 2.0m CMOS SSOP5 ※Plus is expressed on the S-pole; minus on the N-pole www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G ●Absolute maximum ratings BU52054GWZ, BU52055GWZ (Ta=25℃) Parameter Symbol Ratings Unit Power Supply Voltage VDD -0.1～+4.5※1 V Output Current IOUT ±0.5 Power Dissipation Pd Operating Temperature Range Storage Temperature Range Technical Note BU52015GUL (Ta=25℃) Parameter Symbol Ratings Unit Power Supply Voltage VDD -0.1～+4.5※3 V mA Output Current IOUT ±0.5 mA 100※2 mW Power Dissipation Pd 420※4 mW Topr -40～+85 ℃ Topr -40～+85 ℃ Tstg -40～+125 ℃ Tstg -40～+125 ℃ Operating Temperature Range Storage Temperature Range ※1. Not to exceed Pd ※2. Reduced by 1.00mW for each increase in Ta of 1℃ over 25℃ (mounted on 24mm×20mm Glass-epoxy PCB) ※3. Not to exceed Pd ※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52001GUL (Ta=25℃) BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX(Ta=25℃) Parameter Symbol Power Supply Voltage VDD Output Current IOUT Power Dissipation Operating Temperature Range Storage Temperature Range Pd Ratings Unit ※5 -0.1～+4.5 ±1 ※6 420 V mA mW Topr -40～+85 ℃ Tstg -40～+125 ℃ Symbol Power Supply Voltage VDD Output Current IOUT Power Dissipation Operating Temperature Range Storage Temperature Range ※5. Not to exceed Pd ※6. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) Pd Ratings Unit ※7 -0.1～+4.5 ±0.5 ※8 2049 V mA mW Topr -40～+85 ℃ Tstg -40～+125 ℃ ※7. Not to exceed Pd ※8. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52011HFV (Ta=25℃) Parameter Symbol Ratings Unit Power Supply Voltage VDD -0.1～+4.5※9 V Output Current IOUT ±0.5 Power Dissipation Pd Operating Temperature Range Storage Temperature Range Parameter BU52021HFV (Ta=25℃) Parameter Symbol Ratings Unit Power Supply Voltage VDD -0.1～+4.5※11 V mA Output Current IOUT ±1 mA 536※10 mW Power Dissipation Pd 536※12 mW Topr -40～+85 ℃ Topr -40～+85 ℃ Tstg -40～+125 ℃ Tstg -40～+125 ℃ Operating Temperature Range Storage Temperature Range ※9. Not to exceed Pd ※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) ※11 Not to exceed Pd ※12. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) BU52025G (Ta=25℃) BD7411G (Ta=25℃) Parameter Symbol Ratings Unit Parameter Symbol Ratings Unit Power Supply Voltage VDD -0.1～+4.5※13 V Power Supply Voltage VDD -0.3～+7.0※15 V Output Current IOUT ±1 mA Output Current IOUT ±1 mA Power Dissipation Pd 540※14 mW Power Dissipation Pd 540※16 mW Topr -40～+85 ℃ Topr -40～+85 ℃ Tstg -40～+125 ℃ Tstg -55～+150 ℃ Operating Temperature Range Storage Temperature Range ※13. Not to exceed Pd ※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Operating Temperature Range Storage Temperature Range ※15. Not to exceed Pd ※16. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) 2/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G ●Magnetic, Electrical characteristics BU52054GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 1.65 1.80 3.60 BopS - 6.3 7.9 BopN -7.9 -6.3 - BrpS 3.5 5.4 - BrpN - -5.4 -3.5 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※17 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※17 Supply Current IDD(AVG) - 5 8 µA Average Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※17 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52055GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 1.65 1.80 3.60 BopS - 4.1 5.5 BopN -5.5 -4.1 - BrpS 1.5 3.3 - BrpN - -3.3 -1.5 BhysS - 0.8 - BhysN - 0.8 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※18 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※18 Supply Current IDD(AVG) - 5 8 µA Average Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※18 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52015GUL (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Max. VDD 1.65 1.80 3.30 BopS - 3.0 5.0 BopN -5.0 -3.0 - BrpS 0.6 2.1 - BrpN - -2.1 -0.6 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 VOH VDD-0.2 - - Technical Note Unit Conditions V mT mT mT ms ※19 V OUT1: BrpN<B<BrpS OUT2: B<BopN, BopS<B IOUT = -0.5mA ※19 VOL - - 0.2 V OUT1: B<BopN, BopS<B OUT2: BrpN<B<BrpS IOUT = +0.5mA Supply Current 1 IDD1(AVG) - 5 8 µA VDD=1.8V, Average Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA VDD=1.8V, During Startup Time Value Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V, During Standby Time Value Supply Current 2 IDD2(AVG) - 8 12 µA VDD=2.7V, Average Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA VDD=2.7V, During Startup Time Value Supply Current During Standby Time 2 IDD2(DIS) - 4.0 - µA VDD=2.7V, During Standby Time Value Output Low Voltage ※19 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52001GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 2.4 3.0 3.3 BopS - 3.7 5.5 BopN -5.5 -3.7 - BrpS 0.8 2.9 - BrpN - -2.9 -0.8 BhysS - 0.8 - BhysN - 0.8 - Tp - 50 100 ms Output High Voltage VOH VDD-0.4 - - V BrpN<B<BrpS IOUT =-1.0mA ※20 Output Low Voltage VOL - - 0.4 V B<BopN,BopS<B IOUT =+1.0mA ※20 Supply Current IDD(AVG) - 8 12 µA Average Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 3.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※20 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52061NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 1.65 1.80 3.60 BopS 2.3 3.3 4.7 BopN -4.7 -3.3 -2.3 BrpS 1.2 2.4 3.4 BrpN -3.4 -2.4 -1.2 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※21 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※21 Supply Current 1 IDD1(AVG) - 4 7 µA VDD=1.8V, Average Supply Current During Startup Time 1 IDD1(EN) - 5.0 - mA VDD=1.8V, During Startup Time Value Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V, During Standby Time Value Supply Current 2 IDD2(AVG) - 9 16 µA VDD=3.0V, Average Supply Current During Startup Time 2 IDD2(EN) - 9.0 - mA VDD=3.0V, During Startup Time Value Supply Current During Standby Time 2 IDD2(DIS) - 4.4 - µA VDD=3.0V, During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※21 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52053NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 1.65 1.80 3.60 BopS - 3.0 5.0 BopN -5.0 -3.0 - BrpS 0.6 2.1 - BrpN - -2.1 -0.6 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※22 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※22 Supply Current IDD(AVG) - 5 8 µA Average Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※22 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52051NVX , BU52011HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Unit Min. Typ. Max. Power Supply Voltage Conditions VDD 1.65 1.80 3.30 BopS - 3.0 5.0 BopN -5.0 -3.0 - BrpS 0.6 2.1 - BrpN - -2.1 -0.6 BhysS - 0.9 - BhysN - 0.9 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※23 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※23 Supply Current 1 IDD1(AVG) - 5 8 µA VDD=1.8V, Average Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA VDD=1.8V, During Startup Time Value Supply Current During Standby Time 1 IDD1(DIS) - 1.8 - µA VDD=1.8V, During Standby Time Value Supply Current 2 IDD2(AVG) - 8 12 µA VDD=2.7V, Average Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA VDD=2.7V, During Startup Time Value Supply Current During Standby Time 2 IDD2(DIS) - 4.0 - µA VDD=2.7V, During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※23 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52056NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃) Limits Parameter Symbol Min. Typ. Power Supply Voltage Max. Technical Note Unit Conditions VDD 1.65 1.80 3.60 BopS - 4.6 6.4 BopN -6.4 -4.6 - BrpS 2.0 3.8 - BrpN - -3.8 -2.0 BhysS - 0.8 - BhysN - 0.8 - Tp - 50 100 ms Output High Voltage VOH VDD-0.2 - - V BrpN<B<BrpS IOUT =-0.5mA ※24 Output Low Voltage VOL - - 0.2 V B<BopN, BopS<B IOUT =+0.5mA ※24 Supply Current IDD(AVG) - 5 8 µA Average Supply Current During Startup Time IDD(EN) - 2.8 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 1.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※24 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G BU52021HFV,BU52025G (Unless otherwise specified, VDD=3.0V, Ta=25℃) Limits Parameter Symbol Min. Typ. Max. Power Supply Voltage Technical Note Unit Conditions VDD 2.4 3.0 3.6 BopS - 3.7 5.5 BopN -5.5 -3.7 - BrpS 0.8 2.9 - BrpN - -2.9 -0.8 BhysS - 0.8 - BhysN - 0.8 - Tp - 50 100 ms Output High Voltage VOH VDD-0.4 - - V BrpN<B<BrpS IOUT =-1.0mA ※25 Output Low Voltage VOL - - 0.4 V B<BopN, BopS<B IOUT =+1.0mA ※25 Supply Current IDD(AVG) - 8 12 µA Average Supply Current During Startup Time IDD(EN) - 4.7 - mA During Startup Time Value Supply Current During Standby Time IDD(DIS) - 3.8 - µA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT ※25 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BD7411G (Unless otherwise specified, VDD=5.0V, Ta=25℃) Parameter Symbol Limits Unit Conditions Min. Typ. Max. VDD 4.5 5.0 5.5 BopS - 3.4 5.6 BopN -5.6 -3.4 - BrpS 1.5 3.0 - BrpN - -3.0 -1.5 BhysS - 0.4 - BhysN - 0.4 - Output High Voltage VOH 4.6 - - V BrpN<B<BrpS IOUT =-1.0mA ※26 Output Low Voltage VOL - - 0.4 V B<BopN, BopS<B IOUT =+1.0mA ※26 Supply Current IDD - 2 4 mA Power Supply Voltage Operate Point Release Point Hysteresis V mT mT mT ※26 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Figure of measurement circuit Tp BOP/BRP 200Ω VDD VDD 100µF VDD VDD OUT GND V Bop and Brp are measured with applying the magnetic field from the outside. Fig.1 OUT Oscilloscope GND The period is monitored by Oscilloscope. Fig.2 Bop,Brp mesurement circuit Tp mesurement circuit Product Name VOH VDD VDD OUT 100µF GND Fig.3 IOUT V BU52001GUL, BU52021HFV, BU52025G, BD7411G BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX, BU52011HFV Product Name VDD OUT 100µF GND Fig.4 1.0mA 0.5mA VOH mesurement circuit VOL VDD IOUT IOUT V BU52001GUL, BU52021HFV, BU52025G, BD7411G BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX, BU52011HFV IOUT 1.0mA 0.5mA VOL measurement circuit IDD Product Name A VDD VDD OUT C GND Fig.5 C BU52054GWZ, BU52055GWZ, BU52015GUL, BU52001GUL, BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX, BU52011HFV, BU52021HFV, BU52025G 2200µF BD7411G 100µF IDD measurement circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Technical (Reference) Data BU52054GWZ(VDD=1.65～3.6V type) 8.0 6.0 MAGNETIC FLUX DENSITY [mT] Brp S 4.0 VDD=1.8V 2.0 0.0 -2.0 -4.0 Brp N -6.0 Fig.6 2.0 70 Ta = 25°C -2.0 Brp N -6.0 10 Bop N 1.8 2.2 2.6 0 3.0 3.4 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 60 50 40 30 20 10 0 16.0 12.0 VDD=1.8V 10.0 8.0 6.0 4.0 2.0 14.0 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 1.4 1.8 Fig.11 Fig.10 IDD– Ambient temperature Fig.9 TP– Supply voltage Ta = 25°C 12.0 0.0 1.8 100 Fig.8 TP– Ambient temperature Fig.7 Bop,Brp– Supply voltage AVERAGE SUPPLY CURRENT [µA] 70 1.4 40 SUPPLY VOLTAGE [V] Ta = 25°C 80 50 20 14.0 90 60 30 -4.0 1.4 Bop,Brp– Ambient temperature VDD=1.8V 80 0.0 100 100 PERIOD [ms] 4.0 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 90 Brp S Bop N -8.0 100 Bop S 6.0 AVERAGE SUPPLY CURRENT [µA] MAGNETIC FLUX DENSITY [mT] Bop S PERIOD [ms] 8.0 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 IDD– Supply voltage BU52055GWZ(VDD=1.65～3.6V type) 8.0 VDD=1.8V Bop S 4.0 Brp S 2.0 0.0 -2.0 Brp N -4.0 Bop N -6.0 90 Bop S -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 70 Brp S 2.0 0.0 -2.0 Brp N Fig.12 0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 Fig.13 Bop,Brp– Supply voltage 16.0 Ta = 25°C 80 70 60 50 40 30 20 10 0 VDD=1.8V AVERAGE SUPPLY CURRENT [µA] AVERAGE SUPPLY CURRENT [µA] 90 12.0 10.0 8.0 6.0 4.0 2.0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 Fig.15 TP– Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Ta = 25°C 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0.0 1.4 100 Fig.14 TP – Ambient temperature 14.0 100 40 10 1.4 Bop,Brp– Ambient temperature 50 20 Bop N -6.0 60 30 -4.0 100 VDD=1.8V 80 4.0 -8.0 -8.0 PERIOD [ms] 6.0 PERIOD [ms] 6.0 100 Ta = 25°C MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 Fig.16 IDD– Ambient temperature 14/31 1.4 1.8 Fig.17 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 IDD– Supply voltage 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52015GUL, BU52051NVX, BU52011HFV (VDD=1.65～3.3V type) Ta = 25°C 4.0 MAGNETIC FLUX DENSITY [mT] Bop S 2.0 Brp S 0.0 Brp N -2.0 Bop N -4.0 -6.0 90 6.0 4.0 70 2.0 Brp S 0.0 Brp N -2.0 60 50 40 30 -4.0 Bop N 20 -6.0 10 0 -8.0 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 1.4 100 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 Fig.19 Bop,Brp Supply voltage Fig.18 Bop,Brp– Ambient temperature AVERAGE SUPPLY CURRENT [µA] 90 Ta = 25°C 80 70 60 50 40 30 20 10 0 14.0 12.0 VDD=1.8V 10.0 8.0 6.0 4.0 2.0 12.0 Ta = 25°C 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 0.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 SUPPLY VOLTAGE [V] Fig.21 TP– Supply voltage 100 Fig.20 TP – Ambient temperature 14.0 100 VDD=1.8V 80 Bop S AVERAGE SUPPLY CURRENT [µA] MAGNETIC FLUX DENSITY [mT] 6.0 PERIOD [ms] 100 8.0 VDD=1.8V PERIOD [ms] 8.0 Fig.22 100 1.4 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 Fig.23 IDD – Supply voltage IDD– Ambient temperature BU52001GUL (VDD=2.4～3.3V type) 8.0 6.0 Bop S 4.0 2.0 Brp S 0.0 -2.0 Brp N -4.0 Bop N -6.0 -8.0 90 6.0 Bop S 4.0 Fig.24 70 2.0 Brp S 0.0 -2.0 Brp N -4.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 0 3.6 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] Fig.25 Bop,Brp– Supply voltage 70 60 50 40 30 20 10 0 14.0 12.0 VDD=3.0V 10.0 8.0 6.0 4.0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6 Fig.27 TP– Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Ta = 25°C 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0.0 2.0 100 Fig.26 TP– Ambient temperature AVERAGE SUPPLY CURRENT [µA] AVERAGE SUPPLY CURRENT [µA] Ta = 25°C 80 40 20 14.0 90 50 10 2.0 100 60 30 Bop N -6.0 100 Bop,Brp–Ambient temperature VDD=3.0V 80 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] PERIOD [ms] 100 Ta = 25°C PERIOD [ms] VDD=3.0V MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 Fig.28 IDD– Ambient temperature 15/31 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6 Fig.29 IDD – Supply voltage 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52061NVX(VDD=1.65～3.6V type) 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 6.0 90 70 2.0 Brp S 0.0 Brp N -2.0 60 50 40 30 -4.0 Bop N 20 -6.0 10 0 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 1.4 Fig.30 Bop,Brp– Ambient temperature 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.8 Fig.32 TP – Ambient temperature Fig.31 Bop,Brp– Supply voltage 100 Ta = 25°C 80 70 60 50 40 30 20 10 14.0 VDD=1.8V AVERAGE SUPPLY CURRENT [µA] AVERAGE SUPPLY CURRENT [µA] 14.0 90 12.0 10.0 8.0 6.0 4.0 2.0 0 12.0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 8.0 6.0 4.0 2.0 0.0 1.4 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.34 IDD– Ambient temperature Fig.33 TP– Supply voltage Ta = 25°C 10.0 0.0 1.4 VDD=1.8V 80 Bop S 4.0 -8.0 PERIOD [ms] Ta = 25°C PERIOD [ms] Bop S 4.0 100 8.0 VDD=1.8V 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 Fig.35 IDD – Supply voltage BU52053NVX (VDD=1.65～3.6V type) 8.0 Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 Bop N -4.0 -6.0 -8.0 90 6.0 4.0 70 2.0 Brp S 0.0 Brp N -2.0 Bop N 0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] AVERAGE SUPPLY CURRENT [µA] 70 60 50 40 30 20 10 0 12.0 16.0 VDD=1.8V 10.0 8.0 6.0 4.0 2.0 0.0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] Fig.38 TP – Ambient temperature 14.0 80 1.4 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 3.8 Fig.37 Bop,Brp– Supply voltage Ta = 25°C 90 3.8 Fig.39 TP– Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 40 10 AVERAGE SUPPLY CURRENT [µA] 100 50 20 -6.0 1.4 Fig.36 Bop,Brp– Ambient temperature 60 30 -4.0 100 VDD=1.8V 80 Bop S -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] PERIOD [ms] 100 Ta = 25°C PERIOD [ms] VDD=1.8V 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 Ta = 25°C 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 Fig.40 IDD– Ambient temperature 16/31 1.4 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 3.8 Fig.41 IDD – Supply voltage 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52056NVX(VDD=1.65～3.6V type) 8.0 6.0 4.0 Brp S 2.0 0.0 -2.0 Brp N -4.0 Bop N -6.0 90 6.0 Bop S 70 Brp S 2.0 0.0 -2.0 Brp N -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] Fig.42 Bop,Brp– Ambient temperature 0 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 70 60 50 40 30 20 10 14.0 VDD=1.8V AVERAGE SUPPLY CURRENT [µA] AVERAGE SUPPLY CURRENT [µA] 80 12.0 10.0 8.0 6.0 4.0 2.0 Ta = 25°C 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0 1.4 1.8 2.2 2.6 3.0 3.4 SUPPLY VOLTAGE [V] 0.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 3.8 Fig.45 TP– Supply voltage 100 Fig.44 TP – Ambient temperature 14.0 Ta = 25°C 90 40 10 Fig.43 Bop,Brp– Supply voltage 100 50 20 Bop N 1.4 100 60 30 -4.0 -6.0 VDD=1.8V 80 4.0 -8.0 -8.0 PERIOD [ms] 100 Ta = 25°C Bop S PERIOD [ms] VDD=1.8V MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 100 1.4 Fig.46 IDD– Ambient temperature 1.8 Fig.47 2.2 2.6 3.0 SUPPLY VOLTAGE [V] 3.4 IDD– Supply voltage BU52021HFV, BU52025G (VDD=2.4～3.6V type) 8.0 VDD=3.0V Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 Fig.48 0.0 Brp N -2.0 80 70 Brp S 2.0 -6.0 0 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE [V] -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 4.0 Fig.49 Bop,Brp– Supply voltage 70 60 50 40 30 20 10 12.0 14.0 VDD=3.0V 10.0 8.0 6.0 4.0 2.0 0.0 0 2.0 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE [V] 4.0 Fig.51 TP – Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 100 Fig.50 TP – Ambient temperature AVERAGE SUPPLY CURRENT [µA] AVERAGE SUPPLY CURRENT [µA] Ta = 25°C 80 40 10 14.0 90 50 20 Bop N 2.0 Bop,Brp–Ambient temperature 60 30 -4.0 100 100 PERIOD [ms] Bop S 4.0 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] VDD=3.0V 90 6.0 PERIOD [ms] 6.0 100 Ta = 25°C MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 Ta = 25°C 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] 100 Fig.52 IDD – Ambient temperature 17/31 2.0 2.4 2.8 3.2 3.6 SUPPLY VOLATAGE [V] 4.0 Fig.53 IDD – Supply voltage 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BD7411G (VDD=4.5～5.5V type) 8.0 6.0 Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 6.0 Ta = 25°C 6.0 VDD=5.0V 5.0 SUPPLY CURRENT [mA] VDD=5.0V MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] 8.0 Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -8.0 -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE [℃] Fig.54 100 Bop,Brp–Ambient temperature 4.0 3.0 2.0 1.0 0.0 4.0 Fig.55 4.5 5.0 5.5 SUPPLY VOLTAGE [V] 6.0 Bop,Brp– Supply voltage -60 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE ［℃］ 100 Fig.56 IDD – Ambient temperature 6.0 SUPPLY CURRENT [mA] 5.0 Ta = 25°C 4.0 3.0 2.0 1.0 0.0 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE [V] 6.0 Fig.57 IDD – Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Block Diagram BU52054GWZ, BU52055GWZ VDD 0.1µF A1 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. TIMING LOGIC × LATCH ELEMENT SAMPLE & HOLD DYNAMIC OFFSET CANCELLATION HALL B1 A2 The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. OUT GND Fig.58 PIN No. PIN NAME FUNCTION A1 GND GROUND A2 GND GROUND B1 VDD POWER SUPPLY B2 OUT OUTPUT A1 COMMENT A2 B1 B2 Surface A2 A1 B1 B2 Reverse BU52015GUL VDD 0.1µF B2 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. A1 OUT1 The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. GND LATCH SAMPLE & HOLD × DYNAMIC OFFSET CANCELLATION TIMING LOGIC HALL ELEMENT VDD A2 OUT2 B1 GND Fig.59 PIN No. PIN NAME FUNCTION A1 OUT1 Output pin (Active Low) A2 OUT2 Output pin (Active High) B1 GND GROUND B2 VDD Power Supply Voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. COMMENT A1 B1 A2 B2 Surface 19/31 A2 A1 B2 B1 Reverse 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52001GUL VDD 0.1µF A1 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH × SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION TIMING LOGIC OUT B1 The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. A2 GND Fig.60 PIN No. PIN NAME FUNCTION A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT OUTPUT B2 N.C. A1 COMMENT OPEN or Short to GND. A2 A2 B1 B2 A1 B2 B1 Reverse Surface BU52061NVX, BU52053NVX, BU52051NVX, BU52056NVX VDD 0.1µF 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH SAMPLE & HOLD × DYNAMIC OFFSET CANCELLATION TIMING LOGIC HALL ELEMENT 1 OUT The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. 2 GND Fig.61 4 PIN No. PIN NAME FUNCTION 1 OUT OUTPUT 2 GND GROUND 3 N.C. 4 VDD OPEN or Short to GND. POWER SUPPLY www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3 3 4 2 1 COMMENT 1 2 Surface 20/31 Reverse 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BU52011HFV, BU52021HFV VDD 0.1µF 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. TIMING LOGIC LATCH SAMPLE & HOLD × The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. DYNAMIC OFFSET CANCELLATION HALL ELEMENT OUT 5 2 GND Fig.62 PIN No. PIN NAME FUNCTION 1 N.C. 2 GND 3 N.C. 4 VDD POWER SUPPLY 5 OUT OUTPUT COMMENT 5 4 4 5 1 2 3 Surface 3 1 2 Reverse OPEN or Short to GND. GROUND OPEN or Short to GND. BU52025G VDD 0.1µF 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. LATCH SAMPLE & HOLD × DYNAMIC OFFSET CANCELLATION TIMING LOGIC HALL ELEMENT 5 2 OUT GND Fig.63 PIN No. PIN NAME FUNCTION 1 N.C. 2 GND 3 N.C. 4 VDD POWER SUPPLY 5 OUT OUTPUT 5 4 4 5 1 2 3 Surface 3 2 1 Reverse COMMENT OPEN or Short to GND. GROUND OPEN or Short to GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 21/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note BD7411G VDD 5 0.1µF Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. TIMING LOGIC connection to the PC, with no external pull-up LATCH × The CMOS output terminals enable direct SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION REG resistor required. 4 2 OUT GND Fig.64 PIN No. PIN NAME 1 N.C. 2 GND 3 N.C. FUNCTION COMMENT 5 4 4 5 1 2 3 Surface 3 2 1 Reverse OPEN or Short to GND. GROUND OPEN or Short to GND. 4 OUT OUTPUT 5 VDD POWER SUPPLY www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 22/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Description of Operations (Micropower Operation) IDD The bipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. Period Startup time Standby time Reference period: 50ms (MAX100ms) Reference startup time: 48µs t Fig.65 (Offset Cancelation) VDD I B× + Hall Voltage － ※BD7411G don’t adopts an intermittent operation method. The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 66 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. GND Fig.66 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 23/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note (Magnetic Field Detection Mechanism) S N S S N S N Magnetic Flux Magnetic Flux Fig.67 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. N S N S S N OUT [V] Magnetic Flux High Magnetic Flux High High Low Low Bop N Brp N N-Pole 0 Magnetic flux density [mT] B Brp S Bop S S-Pole Fig.68 The bipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 24/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Intermittent Operation at Power ON Power ON VDD Startup time Standby time Standby time Startup time Supply current (Intermittentaction) Indefinite interval OUT High (No magnetic field present) Indefinite interval OUT (Magnetic field present) Low Fig.69 The bipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 69. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ※BD7411G don’t adopts an intermittent operation method. ●Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 70 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 71 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. 10 Magnetic flux density [mT] 9 t=3mm 8 t=1mm 7 t=2mm 6 5 4 3 2 7.6mm 1 9.2mm 10.4mm 0 0 2 4 6 8 10 12 14 Magnet Hall IC distance L [mm] 16 18 20 Fig.70 X Magnet t Y X=Y=4mm t=1mm,2mm,3mm Magnet size t Magnet material: NMX-44CH Maker: Hitachi Metals.,LTD L: Variable …Flux density measuring point Fig.71 Magnet Dimensions and Flux Density Measuring Point www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 25/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Position of the Hall Effect IC(Reference) UCSP35L1 SSON004X1216 0.6 VCSP50L1 0.40 HVSOF5 SSOP5 0.6 0.8 0.55 0.2 0.35 0.25 0.8 0.8 0.55 0.40 1.45 0.6 0.2 (UNIT:mm) ●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) UCSP35L1 VCSP50L1 SSON004X1216 SD b3 e SE e Symbol Reference Value e 0.40 b3 Φ0.20 SD 0.20 SE 0.20 HVSOF5 Please avoid having potential overstress from PCB material, strength, mounting positions. If you had any further questions or concerns, please contact your Rohm sales and affiliate. SSOP5 (UNIT:mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 26/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Terminal Equivalent Circuit Diagram OUT , OUT1, OUT2 VDD Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. GND Fig.72 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 27/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Notes for use 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. Magnet Slide Hall IC L Magnetic Flux A S N Fig.73 B Magnetic Flux Magnetic fux density[mT] 6) Slide-by position sensing Fig.73 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.74, the magnetic field runs in opposite directions at Point A and Point B. Since the bipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 75 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. 10 8 6 4 2 0 -2 -4 -6 -8 -10 Reverse Magnetic Field 0 1 2 3 4 5 6 7 8 9 Fig.74 Fig.75 7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10 Horizontal distance from the magnet [mm] 28/31 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note ●Ordering part number B U 5 Part No. BU, BD 2 0 0 1 G Part No. 52054, 52055, 52015 52001,52061, 52053 52051, 52056,52011 52021,52025,7411 U L - Package GWZ : UCSP35L1 GUL : VSCP50L1 NVX : SSON004X1216 HFV : HVSOF5 G : SSOP5 E 2 Packaging and forming specification E2: Embossed tape and reel (UCSP35L1, VSCP50L1) TR: Embossed tape and reel (SSON004X1216,HVSOF5, SSOP5) UCSP35L1(BU52054GWZ) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.4MAX 0.80±0.05 0.1±0.05 0.80±0.05 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4- φ 0.20±0.05 0.05 A B 0.06 0.2±0.05 S S A B 0.4 B A 1 0.2±0.05 2 0.4 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. UCSP35L1(BU52055GWZ) 0.80±0.05 Tape Embossed carrier tape Quantity 3000pcs E2 Direction of feed 0.4MAX 1PIN MARK 0.1±0.05 0.80±0.05 <Tape and Reel information> The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.06 A B B S 0.4 4- φ 0.20±0.05 0.05 A B 0.2±0.05 S A 1 0.2±0.05 2 0.4 1pin (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel 29/31 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note VCSP50L1(BU52015GUL) <Tape and Reel information> 1.10±0.1 0.55MAX 1.10±0.1 0.10±0.05 1PIN MARK Tape Embossed carrier tape Quantity 3000pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.30±0.1 0.08 S 4-φ0.25±0.05 0.05 A B A B A 0.30±0.1 1 2 0.50 0.50 B Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. VCSP50L1(BU52001GUL) <Tape and Reel information> 0.55MAX 1.10±0.1 1.10±0.1 0.10±0.05 1PIN MARK Tape Embossed carrier tape Quantity 3000pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.30±0.1 0.08 S 4-φ0.25±0.05 0.05 A B A B A 0.30±0.1 1 2 0.50 0.50 B Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. SSON004X1216 <Tape and Reel information> 1.6 ± 0.1 1.2±0.1 Embossed carrier tape Quantity 5000pcs Direction of feed 0.6MAX 1PIN MARK 1 2 4 3 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.8 ± 0.1 (0.12) 0.65±0.1 +0.03 0.02 -0.02 S 0.2 ± 0.1 0.08 S +0.05 0.2 -0.04 Tape 1pin 0.75±0.1 Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 30/31 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.12 - Rev.F BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52051NVX, BU52053NVX,BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G Technical Note HVSOF5 4 4 (0.91) 5 0.2MAX (0.3) (0.05) 1.0±0.05 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 5 (0.41) 1.6±0.05 (0.8) TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 3 2 1 1 2 3 1pin 0.13±0.05 S +0.03 0.02 −0.02 0.6MAX 1.2±0.05 (MAX 1.28 include BURR) <Tape and Reel information> 1.6±0.05 0.1 S 0.5 0.22±0.05 0.08 Direction of feed M Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 1.25Max. ) 0.05±0.05 1.1±0.05 S +0.05 0.42 −0.04 0.95 0.1 S Direction of feed Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 31/31 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.12 - Rev.F Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A